A patch copper bar for a printed circuit board and a printed circuit board
By designing notches and raised structures on the surface mount copper strips of printed circuit boards and utilizing the seepage holes to form an anchoring effect, the problem of positional displacement of surface mount copper strips caused by thermal stress and mechanical vibration during reflow soldering was solved, achieving stable soldering of copper strips, improving product yield and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 浙江巨江新能源科技有限责任公司
- Filing Date
- 2025-05-26
- Publication Date
- 2026-06-19
AI Technical Summary
During the reflow soldering process of printed circuit boards, the surface mount copper strips are prone to displacement due to thermal stress and mechanical vibration, leading to problems such as poor soldering, short circuits, or cold solder joints. Existing methods have limited effectiveness and may introduce other process defects.
Design a surface mount copper strip for printed circuit boards, which adopts a long strip structure with notches and protrusions at both ends. The notches and protrusions are adapted to each other and form an anchoring effect through seepage holes to achieve mechanical interlocking between the copper strips and limit their positional displacement.
It effectively prevents the positional displacement of surface mount copper strips during reflow soldering due to thermal stress and mechanical vibration, is compatible with existing processes, does not require changes to pad structure or parameter adjustments, reduces costs and improves product yield.
Smart Images
Figure CN224385810U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component manufacturing technology, specifically to a surface mount copper strip for printed circuit boards. Background Technology
[0002] In the manufacturing process of printed circuit boards (PCBs), surface mount copper strips are typically fixed to the substrate using a reflow soldering process. Traditional surface mount copper strips have a rectangular structure, with both ends in direct contact with the PCB pads. To accommodate different PCB sizes, surface mount copper strips are often assembled in segments. However, during high-temperature reflow soldering, due to the fluidity of the molten solder and the small contact area between the surface mount copper strip and the pads, the strip is susceptible to displacement caused by thermal stress or mechanical vibration. This can lead to poor soldering, short circuits, or cold solder joints, severely impacting product yield and reliability.
[0003] In existing technologies, the misalignment problem is usually mitigated by increasing the amount of solder paste or optimizing the soldering parameters, but such methods have limited effectiveness and may introduce other process defects. Utility Model Content
[0004] The purpose of this utility model is to solve the problem that existing surface mount copper strips used for printed circuit boards are prone to misalignment when reflow soldering onto the substrate.
[0005] The technical solution provided by this utility model is as follows:
[0006] A surface mount copper strip for a printed circuit board includes an elongated main body segment. A first end of the main body segment has an opening facing away from the main body segment, and a protrusion protruding in the opposite direction from the main body segment is provided at the other end. The inner edge shape of the opening matches the outer edge shape of the protrusion.
[0007] During soldering, surface-mount copper strips of the same specifications are arranged end-to-end and then reflow soldered. The surface-mount copper strips restrain each other, making it difficult for them to shift position. Alternatively, the surface-mount copper strips can be soldered sequentially, so that the later-soldered strips are restrained by the already-soldered strips, preventing them from shifting position due to thermal stress and mechanical vibration.
[0008] Preferably, the inner edge of the notch and the outer edge of the protrusion are both rectangular. Rectangular notches and protrusions have simple structures and are easy to manufacture.
[0009] Preferably, the inner edge of the notch and the outer edge of the protrusion are both trapezoids with their short sides parallel to the main body segment. The parallel long side of the trapezoid faces away from the main body segment.
[0010] Preferably, both the inner edge of the notch and the outer edge of the protrusion are dovetail-shaped. This allows the patch copper strip to be mutually constrained in more directions.
[0011] Preferably, seepage holes are provided near both ends of the main body section. During welding, molten solder seeps into the seepage holes to form an anchoring effect, creating a "rivet" type fixing structure.
[0012] A printed circuit board includes pads on which a plurality of surface-mount copper strips for printed circuit boards are disposed. The surface-mount copper strips are connected end-to-end through the engagement of notches and protrusions. The width of the pads matches the width of the surface-mount copper strips, enabling the surface-mount copper strips to be compatible with existing processes and reducing improvement costs.
[0013] Compared with the prior art, the present invention has the following beneficial effects:
[0014] It has strong anti-displacement performance. Adjacent surface mount copper strips are connected by notches and protrusions, thus forming a mechanical interlock, which prevents the surface mount copper strips from shifting due to thermal stress or mechanical vibration during reflow soldering.
[0015] It is compatible with existing processes, requires no changes to the structure design of the solder pads, no adjustment of welding parameters or additional procedures, and can be directly applied to existing production lines;
[0016] It is inexpensive, easy to modify, does not increase material costs, and reduces scrap losses caused by misalignment. Attached Figure Description
[0017] Figure 1 This is a three-dimensional schematic diagram of Embodiment 1 of the present utility model;
[0018] Figure 2 This is a top view of Embodiment 1 of the present utility model;
[0019] Figure 3 This is a top view of Embodiment 2 of the present invention;
[0020] Figure 4 This is a top view of Embodiment 3 of the present invention;
[0021] Figure 5 This is a top view of Embodiment 4 of the present invention. Detailed Implementation
[0022] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.
[0023] Example 1, as Figure 1 and Figure 2 As shown, a surface mount copper strip for printed circuit boards includes a long strip-shaped main body segment 11. A notch 12 with an opening facing away from the main body segment 11 is provided at one end of the main body segment 11, and a protrusion 13 protruding in the opposite direction from the main body segment 11 is provided at the other end. The inner edge shape of the notch 12 matches the outer edge shape of the protrusion 13. Both the inner edge shape of the notch 12 and the outer edge shape of the protrusion 13 are rectangular. The rectangular notch 12 and protrusion 13 have a simple structure and are easy to manufacture. Drainage holes 14 are also provided near both ends of the main body segment 11. During soldering, molten solder seeps into the drainage holes 14 to form an anchoring effect, creating a "rivet"-like fixing structure.
[0024] During soldering, surface-mount copper strips of the same specifications are arranged end-to-end and then reflow soldered. The surface-mount copper strips restrain each other, making it difficult for them to shift position. Alternatively, the surface-mount copper strips can be soldered sequentially, so that the later-soldered strips are restrained by the already-soldered strips, preventing them from shifting position due to thermal stress and mechanical vibration.
[0025] Example 2, as Figure 3 As shown, unlike Embodiment 1, the inner edge shape of the notch 12 and the outer edge shape of the protrusion 13 are both trapezoids with their short sides close to the main body segment 11.
[0026] Example 3, as Figure 4 As shown, unlike Embodiment 1, the inner edge shape of the notch 12 and the outer edge shape of the protrusion 13 are both dovetail-shaped. This causes the patch copper strip to be mutually constrained in more directions.
[0027] It must be pointed out that the inner edge shape of the notch 12 and the outer edge shape of the protrusion 13 can also be semi-circular or other shapes.
[0028] Example 4, as Figure 5 As shown, a printed circuit board includes pads 2, on which a plurality of surface-mount copper strips 1, as described in Embodiment 1, are disposed. The surface-mount copper strips 1 are connected end-to-end through the engagement of notches 12 and protrusions 13. The width of the pads 2 matches the surface-mount copper strips 1, enabling the surface-mount copper strips 1 to be compatible with existing processes and reducing improvement costs. Furthermore, the surface-mount copper strips 1 used in this embodiment can also adopt the inner edge shape of the notch 12 and the outer edge shape of the protrusion 13 as described in Embodiments 2, 3, or others.
[0029] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.
Claims
1. A surface mount copper strip for printed circuit boards, characterized in that, It includes a long strip-shaped main body segment (11), with a notch (12) at the first end of the main body segment (11) facing away from the main body segment (11), and a protrusion (13) at the other end facing away from the main body segment (11). The inner edge shape of the notch (12) matches the outer edge shape of the protrusion (13).
2. The surface mount copper strip for printed circuit boards according to claim 1, characterized in that, The inner edge shape of the notch (12) and the outer edge shape of the protrusion (13) are both rectangular.
3. The surface mount copper strip for printed circuit boards according to claim 1, characterized in that, The inner edge shape of the notch (12) and the outer edge shape of the protrusion (13) are both trapezoids with their short sides close to the main body segment (11).
4. The surface mount copper strip for printed circuit boards according to claim 1, characterized in that, The inner edge shape of the notch (12) and the outer edge shape of the protrusion (13) are both swallowtail-shaped.
5. The surface mount copper strip for printed circuit boards according to any one of claims 1-4, characterized in that, The main body section (11) is also provided with seepage holes (14) near both ends.
6. A printed circuit board, characterized in that, Includes pads (2), on which are provided a plurality of surface mount copper strips (1) for printed circuit boards as described in any one of claims 1-5, the surface mount copper strips (1) being connected end to end in sequence through the cooperation of the notch (12) and the protrusion (13).