A high-brightness large-angle light-emitting LED packaging structure

Abstract

This utility model relates to the field of LED packaging technology, and in particular to a high-brightness, wide-angle LED packaging structure, including a bracket with a cup-shaped groove on the bracket. A stepped protrusion is provided at the bottom of the cup-shaped groove to increase the LED's emission angle. Positive and negative electrode functional areas are provided on the stepped protrusion, and a chip is mounted on the positive and negative electrode functional areas in a flip-chip configuration. A reflective lens is tightly fitted to the cup wall of the cup-shaped groove to enhance the LED's brightness. This high-brightness, wide-angle LED packaging structure solves the problem of the small emission angle of traditional LED packaging structures, better meeting the needs of scenarios requiring wide-angle lighting, broadening the product's application range, significantly improving LED brightness, fully utilizing the LED chip's luminous potential, and improving the overall poor luminous efficiency.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, specifically to a high-brightness, wide-angle light-emitting LED packaging structure. Background Technology

[0002] In the field of LED packaging technology, LEDs are widely used in various lighting scenarios due to their practicality. However, existing LED packaging structures have many problems that need improvement in practical applications:

[0003] Firstly, brightness performance is limited by the inherent structure of the reflector cup in the LED holder; the beam angle of conventional LED packaging structures is typically only 120° (e.g., Figure 2 As shown in the figure, 2 is the existing LED packaging structure, 21 is the cup-shaped groove, 22 is the positive / negative electrode functional area, 23 is the chip, 24 is the gold wire, and 25 is the colloid. As shown in the figure, the chip is located at the innermost side of the cup-shaped groove, and its light emission angle is limited by the cup-shaped groove, which makes it difficult to meet the needs of some scenarios that require large-angle lighting, thus limiting its application range.

[0004] Secondly, the side light extraction efficiency is low. A large amount of light is lost inside the packaging structure due to unreasonable side design and fails to be effectively emitted outward, resulting in poor overall light efficiency and failing to fully realize the light-emitting potential of the LED chip.

[0005] Furthermore, in existing packaging structures, when attempting to expand the light emission angle by improving the structure, if a wire bonding chip is used in a positive mounting configuration, its height will exceed the height of the cup. Since the height of the gold wire is much higher than the chip height, this will cause the gold wire to extend beyond the colloid, making packaging difficult and unable to adapt to the needs of structural improvement, further restricting the development of LED packaging structures in terms of performance improvement. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides a high-brightness, wide-angle LED packaging structure, which solves the technical problems in conventional LED packaging structures, such as brightness being limited by the bracket reflector structure (the emission angle is usually 120°), low side light extraction efficiency, and difficulties in packaging caused by the height of the upright wire bonding chip exceeding the cup when the structure is improved.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a high-brightness, wide-angle light-emitting LED packaging structure, including a bracket, wherein the bracket is provided with a cup-shaped groove, and a stepped protrusion is provided at the bottom of the cup-shaped groove to increase the light-emitting angle of the LED;

[0008] The step protrusion is provided with positive / negative electrode functional areas, and a chip is installed on the positive / negative electrode functional areas. The chip is flip-chip mounted on the step protrusion.

[0009] Preferably, the cup wall of the bowl-shaped groove is tightly fitted with a reflective lens to enhance the brightness of the LED.

[0010] Preferably, the chip is provided with positive / negative contacts, and the chip is connected to the positive / negative functional area through the positive / negative contacts to realize circuit conduction.

[0011] Preferably, the bowl-shaped groove is filled with a colloid that is flush with the surface of the bowl-shaped groove. The colloid is specifically a light-transmitting epoxy resin, used for encapsulating the chip and the reflective lens.

[0012] Preferably, the stepped protrusion and the support are an integrated structure.

[0013] Preferably, the size of the chip is adapted to the size of the stepped protrusion to ensure that the chip is stably mounted on the stepped protrusion.

[0014] Preferably, the cross-sections on both sides of the stepped protrusion are right-angled trapezoids to improve the light-emitting range of the chip.

[0015] By employing the above technical solution, this utility model provides a high-brightness, wide-angle LED packaging structure, which has at least the following beneficial effects:

[0016] 1. This high-brightness, wide-angle LED packaging structure effectively overcomes the limitation of conventional bracket reflector structures on the light emission angle by setting stepped protrusions in the cup groove of the bracket. It significantly increases the light emission angle of the LED, solves the problem of small light emission angle in traditional LED packaging structures, and can better meet the needs of scenarios requiring wide-angle lighting, thus broadening the application range of the product.

[0017] 2. This high-brightness, wide-angle LED packaging structure, by embedding a reflective lens in the cup-shaped groove of the bracket, can significantly improve the extraction efficiency of side light, reduce light loss inside the packaging structure, and enable more light to be effectively emitted outward, significantly improving the brightness of the LED, fully utilizing the light-emitting potential of the LED chip, and improving the overall poor light efficiency.

[0018] 3. This high-brightness, wide-angle LED packaging structure adopts a flip-chip design, thus eliminating the need for gold wire connections. This avoids the packaging difficulties caused by the height of the upright wire bonding chip exceeding the cup height after setting the stepped protrusion, ensuring the packaging feasibility of the improved structure. It also simplifies the packaging process, which is conducive to improving production efficiency and product reliability. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:

[0020] Figure 1This is a schematic diagram of the overall planar structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the prior art of this utility model.

[0022] Figure label:

[0023] 1. Bracket; 11. Bowl / cup groove; 12. Step protrusion; 121. Positive / negative functional area; 131. Positive / negative contact point; 13. Chip; 14. Reflective lens; 15. Colloid. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] LED packaging structure refers to the integrated structure that combines the LED chip 13 with external circuits, optical components, heat dissipation components, etc. Its core functions are to protect the chip 13 from environmental influences, achieve electrical connection between the chip 13 and the external circuit, optimize the direction and intensity of light output through optical designs such as lenses and brackets 1, and dissipate the heat generated by the chip 13 during operation through heat dissipation structures to ensure stable and efficient light emission of the LED device. Common packaging structures typically include the chip 13, electrode leads, bracket 1, encapsulating adhesive, and lenses. Different structural designs directly affect the luminous efficiency, heat dissipation performance, lifespan, and application scenarios of the LED.

[0026] Due to the limitations of existing technology, such as brightness being limited by the reflector cup structure of bracket 1 (the emission angle is typically 120°), low side light extraction efficiency, and difficulties in packaging due to the height exceeding the cup size during structural improvements when using the upright bonding chip 13, please refer to [reference needed]. Figure 1This embodiment provides a high-brightness, wide-angle LED packaging structure that effectively overcomes the limitations of conventional bracket 1 reflector cup structures on the light emission angle, significantly increasing the LED's light emission angle and solving the problem of small light emission angle in traditional LED packaging structures. This better meets the needs of scenarios requiring wide-angle lighting, broadens the product's application range, and significantly improves LED brightness, fully utilizing the LED chip's light emission potential and improving overall poor luminous efficiency. The packaging structure includes a bracket 1 with a cup-shaped groove 11 on it, and a stepped protrusion 1 at the bottom of the cup-shaped groove 11. 2. To increase the light-emitting angle of the LED; a positive / negative electrode functional area 121 is provided on the stepped protrusion 12, and a chip 13 is installed on the positive / negative electrode functional area 121. The chip 13 is flip-mounted on the stepped protrusion 12. Furthermore, the cross-sections on both sides of the stepped protrusion 12 are right trapezoids to improve the light-emitting range of the chip 13. By setting the stepped protrusion 12 in the cup-shaped groove 11, and the right trapezoidal cross-sections on both sides of the stepped protrusion 12, the limitation of the light-emitting angle by the traditional structure is effectively broken, the light-emitting angle and light-emitting range of the LED are significantly increased, and the application of the product in large-angle lighting scenarios is broadened.

[0027] Existing LED packaging structures have low side light extraction efficiency, with a large amount of light being lost internally and unable to be fully emitted, resulting in insufficient overall brightness. To address this issue, a reflective lens 14 is tightly attached to the cup wall of the cup groove 11 to improve the brightness of the LED. The reflective lens 14 embedded in the cup groove 11 can efficiently reflect side light, reduce light loss inside the packaging structure, significantly improve the side light extraction efficiency, and allow more light to be effectively emitted outward, thus significantly enhancing the brightness of the LED and fully realizing the light-emitting potential of the chip 13.

[0028] In traditional structures, if a conventional wire-bonded chip 13 is used to improve the light emission angle, its height will exceed the cup, leading to packaging difficulties. Furthermore, the gold wire connection of the conventional chip 13 may block light, affecting luminous efficiency. To address this issue, positive / negative contacts 131 are provided on the chip 13. The chip 13 is connected to the positive / negative functional area 121 through the positive / negative contacts 131 to achieve circuit conduction. The flip-chip 13 is directly connected to the functional area through the positive / negative contacts 131, eliminating the need for gold wires. This avoids the packaging problem of the conventional chip 13 exceeding the cup in height and adapts to the structural improvement of the stepped protrusion 12. At the same time, reducing the blocking of light by gold wires reduces light loss, further improving luminous efficiency, and also simplifies the packaging process and improves production reliability.

[0029] Existing packaging structures may obstruct light transmission due to improper packaging materials or filling methods. To address this issue, the cup-shaped groove 11 is filled with a colloid 15 that is flush with the surface of the cup-shaped groove 11. The colloid 15 is specifically a light-transmitting epoxy resin used to encapsulate the chip 13 and the reflective lens 14. The light-transmitting epoxy resin colloid 15 is flush with the surface of the cup, which can stabilize the encapsulation of the chip 13 and the reflective lens 14, and reduce the refraction loss of light in the packaging material, ensuring efficient light emission.

[0030] In traditional structures, if the chip 13 is not sized correctly, it is prone to loosening, affecting the stability of light emission. To address this issue, the stepped protrusion 12 and the bracket 1 are integrated into one structure, and the size of the chip 13 is compatible with the size of the stepped protrusion 12, ensuring that the chip 13 is stably installed on the stepped protrusion 12. The integrated structure enhances the connection strength between the stepped protrusion 12 and the bracket 1, improving the overall structural stability. The size compatibility between the chip 13 and the stepped protrusion 12 ensures that the chip 13 is firmly installed, reducing light efficiency fluctuations caused by loosening and ensuring stable product performance.

[0031] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-brightness wide-angle light emitting LED package structure, characterized in that, Includes a bracket (1), on which a bowl-shaped groove (11) is provided, and a stepped protrusion (12) is provided at the bottom of the bowl-shaped groove (11) to increase the light-emitting angle of the LED; The step protrusion (12) is provided with a positive / negative electrode functional area (121), and a chip (13) is installed on the positive / negative electrode functional area (121). The chip (13) is flip-mounted on the step protrusion (12).

2. The high-efficiency wide-angle light emitting LED package structure of claim 1, wherein: The cup wall of the bowl-shaped groove (11) is tightly fitted with a reflective lens (14) to enhance the brightness of the LED.

3. The high-efficiency wide-angle light emitting LED package structure of claim 1, wherein: The chip (13) is provided with positive / negative contacts (131). The chip (13) is connected to the positive / negative functional area (121) through the positive / negative contacts (131) to realize circuit conduction.

4. The high-efficiency wide-angle light-emitting LED package structure according to claim 2, wherein: The bowl-shaped groove (11) is filled with a colloid (15) that is flush with the surface of the bowl-shaped groove (11). The colloid (15) is specifically a light-transmitting epoxy resin used to encapsulate the chip (13) and the reflective lens (14).

5. The high-efficiency wide-angle light emitting LED package structure of claim 1, wherein: The stepped protrusion (12) and the support (1) are an integrated structure.

6. The high-efficiency wide-angle light emitting LED package structure of claim 1, wherein: The size of the chip (13) is adapted to the size of the step protrusion (12) to ensure that the chip (13) is stably installed on the step protrusion (12).

7. The high-efficiency wide-angle light emitting LED package structure of claim 1, wherein: The cross-sections on both sides of the stepped protrusion (12) are right trapezoids to improve the light emission range of the chip (13).

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