A laser punch for power electronic components

Abstract

The present disclosure relates to the technical field of electronic component processing, and an embodiment of the present disclosure provides a laser punching machine for power electronic components, which comprises a processing table, a laser head arranged on the processing table, a material clamping assembly arranged on the upper end face of the processing table, and a processing cleaning assembly arranged on the processing table; the material clamping assembly comprises a clamping disc, a driving gear is meshingly connected with a driving rack, and the driving rack is embedded in the inside of a driving cavity. Through the above technical scheme, the problem that the traditional punching method such as mechanical punching occupies a dominant position in the processing of power electronic components in the prior art is solved. The mechanical punching usually relies on a punch press and other equipment, and a die is used to stamp the material to form a hole. However, this method has many limitations. On the one hand, mechanical punching belongs to contact processing, and the friction and impact force between the die and the material can easily cause scratches, deformation and other defects on the surface of the material.

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