A gene chip separating and loading device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI SINOCHIPS BIOSCIENCE CO LTD
- Filing Date
- 2025-07-10
- Publication Date
- 2026-06-23
Smart Images
Figure CN224394854U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of gene chip production technology, and in particular to a gene chip wafer breaking and loading device. Background Technology
[0002] Gene chips are miniature carriers that immobilize a large number of DNA probes, primarily used for detecting gene expression, mutations, and molecular hybridization, aiding in biological research and medical diagnosis. A gene chip substrate is a base material used to fabricate gene chips. It has multiple parallel horizontal and vertical etched lines. These etched lines are perpendicular to each other. By breaking the substrate along these etched lines, multiple gene chips can be formed. In the gene chip production process, workers use specialized tools to first break the substrate segment by segment along the horizontal etched lines to form multiple strips. Then, workers break these strips segment by segment along the vertical etched lines to obtain multiple gene chips, completing the chip-breaking process. Finally, workers load the multiple gene chips onto a loading carrier to complete the mounting process. This manual chip-breaking and mounting method is inefficient, thus hindering the improvement of gene chip production efficiency. Utility Model Content
[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a gene chip wafer-breaking and mounting device, which is beneficial to improving the production efficiency of gene chips.
[0004] The gene chip chip splitting and loading equipment according to an embodiment of the present invention includes a frame, a first chip splitting device, a first conveying device, a second chip splitting device, and a second conveying device.
[0005] The frame is equipped with a first conveying device, a second conveying device, and a third conveying device. The first conveying device is used to convey substrates from back to front, the second conveying device is used to convey strip plates from right to left, and the third conveying device is used to convey carriers from front to back. A first breaking device is provided on the frame and is used to break the substrates on the first conveying device so that the substrates break at multiple horizontal scribbles and form multiple strip plates. A first transport device is provided on the frame and is used to transport multiple strip plates from the front end of the first conveying device to the right end of the second conveying device in sequence. A second breaking device is provided on the frame and is used to break the strip plates on the second conveying device so that the strip plates break at multiple vertical scribbles and form multiple gene chips. A second transport device is provided on the frame and is used to transport multiple gene chips from the left end of the second conveying device to the carrier at the front end of the third conveying device in sequence.
[0006] It has at least the following beneficial effects:
[0007] When substrates need to be split, workers place the substrate to be processed at the rear end of the first conveyor and place an empty carrier at the front end of the third conveyor, ensuring that the horizontal and vertical scribes on the substrate are parallel to the left-right and front-back directions, respectively, preparing for the subsequent splitting process. After the substrate is placed, the first conveyor transports the substrate from back to front. When the substrate is transported to the corresponding position of the first splitting device, the first splitting device performs a splitting operation on the substrate on the first conveyor, acting on multiple horizontal scribes on the substrate, causing the substrate to break sequentially along the horizontal scribes to form multiple strips. These strips are then transported forward by the first conveyor until they reach the front end of the first conveyor. Next, the first transport device sequentially picks up the strips from the front end of the first conveyor and transports them one by one to the right end of the second conveyor, ensuring that the vertical scribes on the strips are parallel to the front-back direction. After placing the strips at the right end of the second conveyor, the second conveyor transports the strips from right to left. When the strip plate is conveyed to the corresponding position of the second splitting device, the second splitting device breaks the strip plate by acting on multiple vertical grooves on the strip plate, causing the strip plate to break sequentially along the grooves and form multiple gene chips, thus completing the gene chip splitting process. Multiple gene chips are conveyed to the left by the second conveying device until they reach the left end of the second conveying device. At this point, the second transport device sequentially picks up the multiple gene chips from the left end of the second conveying device and transports them one by one to the carrier at the front end of the third conveying device, so that the carrier is full of gene chips, thus completing the gene chip mounting process. After the carrier is full of gene chips, the third conveying device conveys the carrier backward, moving the carrier to the subsequent gene chip processing equipment. The gene chip breaking and loading equipment automatically transports the chips through a first conveying device, a second conveying device, and a third conveying device. The first and second breaking devices automatically break the chips, and the first and second handling devices automatically transfer the strip plates and gene chips. This replaces the manual breaking and loading method, significantly improving the breaking and loading efficiency of gene chips, and thus helping to improve the production efficiency of gene chips.
[0008] According to the gene chip chip fragmentation and loading equipment of this utility model embodiment, the first conveying device includes a suction cup mechanism, a lifting drive mechanism, and a linear drive mechanism. The front end of the first conveying device is located behind the right end of the second conveying device. The linear drive mechanism is used to drive the suction cup mechanism to move in the front-back direction. The lifting drive mechanism is used to drive the suction cup mechanism to rise and fall. The suction cup mechanism is used to adsorb or release the strip plate so that the suction cup mechanism can transport the strip plate on the first conveying device to the second conveying device.
[0009] According to the gene chip chip breaking and loading device of the present invention, the second transport device includes a second suction cup manipulator and a second image recognition mechanism. The second image recognition mechanism is electrically connected to the second suction cup manipulator. The second image recognition mechanism is used to identify the gene chip on the left end of the second transport device and the carrier on the front end of the third transport device, so that the second suction cup manipulator can transport the gene chip onto the carrier.
[0010] The gene chip wafer-breaking and mounting equipment according to an embodiment of the present invention further includes a first image recognition mechanism, a third conveying device, and a turntable. The turntable is rotatably connected to the frame and is used to support the substrate. The first image recognition mechanism is electrically connected to the turntable and is used to identify the substrate on the turntable so that the turntable can drive the substrate to rotate and make the horizontal and vertical scratches on the substrate parallel to the left-right and front-back directions, respectively. The third conveying device is used to convey the substrate on the turntable to the rear end of the first conveying device.
[0011] According to the gene chip chip breaking and mounting equipment of this utility model embodiment, the turntable is provided with a positioning groove, which is used to accommodate the substrate.
[0012] The gene chip wafer assembly device according to an embodiment of the present invention further includes a vacuum rotary joint and a vacuum pump. The turntable is provided with a vacuum chamber, and a plurality of adsorption holes are evenly distributed on the bottom wall of the positioning groove. The plurality of adsorption holes are all connected to the vacuum chamber. The output end of the vacuum pump is connected to the vacuum chamber through the vacuum rotary joint, so that the vacuum pump can create a negative pressure in the vacuum chamber and the plurality of adsorption holes, and adsorb the substrate onto the bottom wall of the positioning groove.
[0013] According to the gene chip chip fragmentation and loading equipment of this utility model embodiment, the first conveying device includes a first belt, the first fragmentation device includes a first extrusion belt and a first extrusion roller, the first belt and the first extrusion belt are rotatably connected to the frame, the first belt is used to convey the substrate from back to front, the first extrusion belt is located above the first belt, the gap between the first extrusion belt and the first belt is used for the substrate to move, the first extrusion belt and the first belt rotate at the same speed, the first extrusion belt and the first belt have the same conveying direction on opposite sides, a portion of the lower side of the first extrusion belt can abut against the substrate, the first extrusion roller is parallel to the left and right direction and rotatably connected to the frame, the first extrusion roller is disposed in the area enclosed by the first extrusion belt, the first extrusion roller is used to press a portion of the lower side of the first extrusion belt onto the first belt, so that when the substrate passes the first extrusion roller, the substrate can break at multiple horizontal grooves and form multiple strip plates.
[0014] According to the gene chip chip breaking and loading equipment of the present invention, the first chip breaking device further includes a first support roller parallel to the left-right direction. The first support roller is rotatably connected to the frame. The first support roller is located in the area enclosed by the first extrusion belt. The first support roller is located behind the first extrusion roller. The axis of the first support roller is located above the first extrusion roller. The first support roller is used to abut against the substrate through the first extrusion belt. The diameter of the first extrusion roller is smaller than the spacing of the horizontal grooves.
[0015] According to the gene chip fragmentation and loading equipment of this utility model embodiment, the second conveying device includes a second belt, and the second fragmentation device includes a second extrusion belt and a second extrusion roller. The second belt and the second extrusion belt are rotatably connected to the frame. The second belt is used to convey the strip plate from right to left. The second extrusion belt is located above the second belt. The gap between the second extrusion belt and the second belt is used for the strip plate to move. The second extrusion belt and the second belt rotate at the same speed. The conveying directions of the opposite sides of the second extrusion belt and the second belt are the same. A portion of the lower side of the second extrusion belt can abut against the strip plate. The second extrusion roller is parallel to the front-back direction and rotatably connected to the frame. The second extrusion roller is located in the area enclosed by the second extrusion belt. The second extrusion roller is used to press a portion of the lower side of the second extrusion belt onto the second belt, so that when the strip plate passes through the second extrusion roller, the strip plate can break at multiple vertical grooves and form multiple gene chips.
[0016] According to the gene chip chip breaking and loading equipment of this utility model embodiment, the second chip breaking device further includes a second support roller parallel to the front-back direction. The second support roller is rotatably connected to the frame. The second support roller is located in the area enclosed by the second extrusion belt. The second support roller is located to the right of the second extrusion roller. The axis of the second support roller is located above the second extrusion roller. The second support roller is used to abut against the strip plate through the second extrusion belt. The diameter of the second extrusion roller is smaller than the spacing of the vertical grooves.
[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0019] Figure 1 This is a schematic diagram of the substrate;
[0020] Figure 2 This is a schematic diagram of a strip plate;
[0021] Figure 3 This is a schematic diagram of a gene chip wafer dicing and mounting device;
[0022] Figure 4 yes Figure 3 A magnified view of a section at point A in the middle;
[0023] Figure 5 This is a schematic diagram of the structure of the first conveying device;
[0024] Figure 6 This is a schematic diagram of the second conveying device;
[0025] Figure 7 This is a structural schematic diagram of the first extrusion belt, the first extrusion roller, the third roller body, and the first support roller;
[0026] Figure 8 This is a side view of the first belt, the first extrusion belt, and the first extrusion roller;
[0027] Figure 9 This is a side view of the second belt, the second extrusion belt, and the second extrusion roller;
[0028] Figure 10 This is a top view of the turntable;
[0029] Figure 11 This is a schematic diagram of the second conveying device;
[0030] Icon labels:
[0031] First conveying device 100; first belt 110; first motor 120; first roller 130;
[0032] Second conveyor 200; second belt 210; second motor 220; second roller 230;
[0033] Third conveying device 300;
[0034] First splitting device 400; first extrusion belt 410; first extrusion roller 420; first support roller 430; third roller body 440;
[0035] Second splitting device 500; second extrusion belt 510; second extrusion roller 520; second support roller 530; fourth roller body 540;
[0036] First conveying device 600; suction cup mechanism 610; lifting drive mechanism 620; linear drive mechanism 630;
[0037] Second handling device 700; Second suction cup robot 710; Second image recognition mechanism 720;
[0038] Frame 800; Turntable 810; Positioning slot 811; Adsorption hole 812;
[0039] Substrate 10; Horizontal scribing 11; Vertical scribing 12; Strip plate 20. Detailed Implementation
[0040] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0041] In the description of this utility model, the use of "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features or the order of the technical features.
[0042] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0043] refer to Figures 1 to 3This utility model discloses a gene chip chip breaking and loading device, including a frame 800, a first chip breaking device 400, a first transport device 600, a second chip breaking device 500, and a second transport device 700.
[0044] The frame 800 is equipped with a first conveying device 100, a second conveying device 200, and a third conveying device 300. The first conveying device 100 is used to convey the substrate 10 from back to front, the second conveying device 200 is used to convey the strip plate 20 from right to left, and the third conveying device 300 is used to convey the carrier from front to back. A first breaking device 400 is provided on the frame 800. The first breaking device 400 is used to break the substrate 10 on the first conveying device 100 so that the substrate 10 breaks at multiple horizontal scratches 11 and forms multiple strip plates 20. A first handling device 600 is provided on the frame 800. A conveying device 600 is used to sequentially convey multiple strip plates 20 on the front end of the first conveying device 100 to the right end of the second conveying device 200; a second breaking device 500 is disposed on the frame 800, and the second breaking device 500 is used to break the strip plates 20 on the second conveying device 200 so that the strip plates 20 break at multiple vertical grooves 12 and form multiple gene chips; a second conveying device 700 is disposed on the frame 800, and the second conveying device 700 is used to sequentially convey multiple gene chips on the left end of the second conveying device 200 to the carrier on the front end of the third conveying device 300.
[0045] In this embodiment of the utility model, reference is made to Figure 1 and Figure 2The spacing between any two adjacent horizontal scribbles 11 is equal, and the spacing between any two adjacent vertical scribbles 12 is equal. The horizontal scribbles 11 are parallel to the left-right direction, and the vertical scribbles 12 are parallel to the front-back direction. In this embodiment, the carrier is evenly distributed with multiple receiving slots for accommodating gene chips, enabling the second transport device 700 to sequentially transport multiple gene chips from the left end of the second transport device 200 into the multiple receiving slots on the carrier. In this embodiment, after the first breaking device 400 breaks the substrate 10 on the first transport device 100 along the multiple horizontal scribbles 11, the first transport device 100 can transport the multiple strip plates 20 formed by the breakage from back to front. When the strip plates 20 move to the front end of the first transport device, the first transport device 600 can transport the strip plates 20 on the front end of the first transport device to the right end of the second transport device 200, so that the second transport device 200 transports the strip plates 20 from right to left. Similarly, after the second chip-breaking device 500 breaks the strip plate 20 on the second conveying device 200 along multiple vertical grooves 12, the second conveying device 200 can transport the multiple broken gene chips from right to left. When the gene chips move to the left end of the second conveying device, the second transport device 700 can transport the strip plate 20 on the left end of the second conveying device to the carrier at the front end of the third conveying device 300.
[0046] In this embodiment of the invention, both the first splitting device 400 and the second splitting device 500 can be common cutter-type splitting devices. The first splitting device 400 includes an upper cutter and a lower cutter. The first splitting device 400 can transport the substrate 10 from back to front, so that the multiple horizontal scratches 11 on the substrate 10 move sequentially between the upper cutter and the lower cutter. After the horizontal scratches 11 on the substrate 10 move between the upper cutter and the lower cutter, the first conveying device 100 stops conveying, the upper cutter descends, and the lower cutter supports the substrate 10, so that the upper cutter and the lower cutter together cut the horizontal scratches 11 on the substrate 10, causing it to break at the horizontal scratches 11 and form a strip 20. The first conveying device 100 then continues conveying, causing the next horizontal notch 11 to enter between the upper and lower cutters and forward conveying the strip 20. This allows the broken strip 20 to move to the front end of the first conveying device 100, so that the first transporting device 600 can transport the strip 20 from the front end of the first conveying device 100 to the right end of the second conveying device 200. The second breaking device 500 and the second conveying device 200 cooperate in the same way to break the strip 20 as the first breaking device 400 and the first conveying device 100, which will not be described further here.
[0047] Understandably, when the substrate 10 needs to be split, the worker can place the substrate 10 to be processed at the rear end of the first conveying device 100 and place an empty carrier at the front end of the third conveying device 300, so that the horizontal scratches 11 and vertical scratches 12 on the substrate 10 are parallel to the left-right direction and the front-back direction, respectively, to prepare for the subsequent splitting process. After the substrate 10 is placed, the first conveying device 100 conveys the substrate 10 from back to front. When the substrate 10 is conveyed to the position corresponding to the first splitting device 400, the first splitting device 400 performs a splitting operation on the substrate 10 on the first conveying device 100. It acts on the multiple horizontal scratches 11 on the substrate 10, causing the substrate 10 to break sequentially along the horizontal scratches 11 to form multiple strip plates 20. The multiple strip plates 20 are conveyed forward under the action of the first conveying device 100 until the multiple strip plates 20 reach the front end of the first conveying device 100. Next, the first conveying device 600 sequentially grasps multiple strip plates 20 from the front end of the first conveying device 100 and transports them one by one to the right end of the second conveying device 200, ensuring that the vertical grooves 12 on the strip plates 20 are parallel to the front-back direction. After placing the strip plates 20 at the right end of the second conveying device 200, the second conveying device 200 conveys the strip plates 20 from right to left. When the strip plates 20 are conveyed to the corresponding position of the second breaking device 500, the second breaking device 500 breaks the strip plates 20 by acting on the multiple vertical grooves 12 on the strip plates 20, causing the strip plates 20 to break sequentially along the vertical grooves 12 and form multiple gene chips, thus completing the gene chip breaking process. The multiple gene chips are conveyed to the left by the second conveying device 200 until they reach the left end of the second conveying device 200. At this point, the second conveying device 700 sequentially picks up multiple gene chips from the left end of the second conveying device 200 and transports them one by one to the carrier at the front end of the third conveying device 300, filling the carrier with gene chips to complete the gene chip mounting process. After the carrier is full of gene chips, the third conveying device 300 transports the carrier backward, moving it to the subsequent gene chip processing equipment. This gene chip breaking and mounting equipment automatically conveys the chips through the first conveying device 100, the second conveying device 200, and the third conveying device 300; the first breaking device 400 and the second breaking device 500 automatically break the chips; and the first conveying device 600 and the second conveying device 700 automatically transfer the strip plate 20 and the gene chips. This replaces the manual breaking and mounting method, significantly improving the breaking and mounting efficiency of gene chips, thereby contributing to increased gene chip production efficiency.
[0048] refer to Figure 3 and Figure 4The first conveying device 600 includes a suction cup mechanism 610, a lifting drive mechanism 620, and a linear drive mechanism 630. The front end of the first conveying device 100 is located behind the right end of the second conveying device 200. The linear drive mechanism 630 drives the suction cup mechanism 610 to move in the front-back direction, and the lifting drive mechanism 620 drives the suction cup mechanism 610 to move up and down. The suction cup mechanism 610 is used to attract or release the strip plate 20 so that it can transport the strip plate 20 on the first conveying device 100 to the second conveying device 200. It can be understood that after the strip plate 20 moves to the front end of the first conveying device 100, the linear drive mechanism 630 drives the suction cup mechanism 610 to move backward, so that the suction cup mechanism 610 moves above the front end of the first conveying device 100. Next, the lifting drive mechanism 620 drives the suction cup mechanism 610 to descend, causing the suction cup mechanism 610 to lift after adsorbing the strip plate 20 on the front end of the first conveying device 100. Then, the linear drive mechanism 630 drives the suction cup mechanism 610 to move forward, causing the suction cup mechanism 610 to move above the right end of the second conveying device 200. Finally, the lifting drive mechanism 620 drives the suction cup mechanism 610 to descend, releasing the strip plate 20, which can then be transported onto the second conveying device 200. This process is repeated, allowing the suction cup mechanism 610 to sequentially transport multiple strip plates 20 from the front end of the first conveying device 100 to the right end of the second conveying device 200. In this embodiment of the invention, the linear drive mechanism 630 is mounted on the frame 800, and its output end is connected to the lifting drive mechanism 620, which in turn is connected to the suction cup mechanism 610. Specifically, the linear drive mechanism 630 can be a common electric slide rail, the lifting drive mechanism 620 can be a common lead screw and nut drive mechanism, and the suction cup mechanism 610 can be a common suction cup picking mechanism, which will not be elaborated further here.
[0049] refer to Figure 3 and Figure 11The second transport device 700 includes a second suction cup manipulator 710 and a second image recognition mechanism 720. The second image recognition mechanism 720 is electrically connected to the second suction cup manipulator 710. The second image recognition mechanism 720 is used to identify the gene chip on the left end of the second transport device 200 and the carrier on the front end of the third transport device 300, so that the second suction cup manipulator 710 can transport the gene chip onto the carrier. It can be understood that after the second chip-breaking device 500 breaks the strip plate 20, multiple gene chips are transported to the left by the second transport device 200, so that the multiple gene chips reach the left end of the second transport device 200. Then, the second image recognition mechanism 720 can take pictures of the multiple gene chips at the left end of the second transport device 200 and the carrier on the front end of the third transport device 300, and perform image recognition on the pictures to identify the relative positions between the multiple gene chips and the carrier. Then, the second image recognition mechanism 720 can send the relative position information between the gene chip and the carrier to the second suction cup robot 710, enabling the second suction cup robot 710 to accurately place multiple gene chips into multiple receiving slots on the carrier in sequence. The second image recognition mechanism 720 is a common industrial camera-type image recognition mechanism, and the second suction cup robot 710 is also a common picking robot, which will not be described further here. On the other hand, the second image recognition mechanism 720 and the second suction cup robot 710 work together to perform a screening function. The second image recognition mechanism 720 can identify scrap materials, and the second suction cup robot 710 can transport the scrap materials to a waste box for collecting waste materials, which will not be described further here. The left end of the second conveying device 200 is located to the right of the front end of the third conveying device 300, and the second image recognition mechanism 720 is located above the right end of the second conveying device 200 and the front end of the third conveying device 300.
[0050] refer to Figure 1 and Figure 10The gene chip wafer breaking and loading equipment also includes a first image recognition mechanism (not shown in the figure), a third transport device (not shown in the figure), and a turntable 810. The turntable 810 is rotatably connected to the frame 800 and is used to support the substrate 10. The first image recognition mechanism is electrically connected to the turntable 810 and is used to identify the substrate 10 on the turntable 810 so that the turntable 810 can drive the substrate 10 to rotate and make the horizontal scratches 11 and vertical scratches 12 on the substrate 10 parallel to the left-right and front-back directions, respectively. The third transport device is used to transport the substrate 10 on the turntable 810 to the rear end of the first conveying device 100. It can be understood that when the substrate 10 needs to be broken, the worker can place the substrate 10 to be broken on the turntable 810. Then, the first image recognition mechanism can take a picture of the substrate 10 on the turntable 810 and perform image recognition on the picture to identify the deflection angle of the horizontal scratches 11 and vertical scratches 12 on the substrate 10. Then, the first image recognition mechanism can send the deflection angle information of the horizontal scratches 11 and vertical scratches 12 on the substrate 10 to the third transport device. The turntable 810 can rotate a certain angle accordingly, so that the turntable 810 drives the substrate 10 to rotate, thereby making the horizontal scratches 11 and vertical scratches 12 on the substrate 10 on the turntable 810 parallel to the left-right direction and the front-back direction, respectively, so that the first splitting device 400 and the second splitting device 500 can split smoothly. After the turntable 810 completes the adjustment of the substrate 10, the third transport device can transport the substrate 10 on the turntable 810 to the rear end of the first transport device 100. In this embodiment of the present invention, the turntable 810 is located behind the first transport device 100, and the third transport device is used to transport the substrate 10 on the turntable 810 to the rear end of the first transport device 100 from back to front.
[0051] In this embodiment of the invention, the structure and principle of the third conveying device are the same as those of the first conveying device 600. It is also a suction cup-type linear conveying device, which prevents the substrate 10 from deflecting during the conveying process and ensures that the horizontal and vertical scratches 11 on the substrate 10 of the first conveying device 10 are always parallel to the left-right and front-back directions, respectively. The first image recognition mechanism is a common industrial camera-type image recognition mechanism, which will not be further described here. In this embodiment of the invention, the gene chip wafer-breaking and loading equipment also includes a fifth motor (not shown in the figure). The fifth motor is mounted on the frame 800 and is electrically connected to the first image recognition mechanism. The output end of the fifth motor is connected to the turntable 810 for transmission. The fifth motor can drive the turntable 810 to rotate by a corresponding angle according to the signal sent by the first image recognition mechanism, which will not be further described here.
[0052] refer to Figure 10The turntable 810 is equipped with a positioning groove 811 for accommodating the substrate 10. Understandably, a worker can place the substrate 10 to be diced into the positioning groove 811 on the turntable 810, and the inner wall of the positioning groove 811 can position the substrate 10. The gene chip dicing and loading equipment also includes a vacuum rotary joint and a vacuum pump. The turntable 810 has a vacuum chamber, and the bottom wall of the positioning groove 811 has multiple adsorption holes 812 evenly distributed, all of which are connected to the vacuum chamber. The output end of the vacuum pump is connected to the vacuum chamber through the vacuum rotary joint, so that the vacuum pump can create a negative pressure in both the vacuum chamber and the multiple adsorption holes 812, causing the substrate 10 to be adsorbed onto the bottom wall of the positioning groove 811. After the worker places the substrate 10 into the positioning groove 811 on the turntable 810, the vacuum pump is activated. The vacuum pump creates negative pressure in the vacuum chamber and multiple suction holes 812, causing the substrate 10 to be firmly adsorbed onto the bottom wall of the positioning groove 811. This allows the turntable 810 to stably rotate the substrate 10. After adjusting the substrate 10, the turntable 810 stops rotating. Simultaneously, the vacuum pump stops operating as the third transport device contacts the substrate 10, allowing the third transport device to smoothly remove the substrate 10 from the positioning groove 811. Vacuum pumps and vacuum rotary joints are common components in the field of vacuum technology and will not be described further here.
[0053] refer to Figures 5 to 9 The first conveying device 100 includes a first belt 110, and the first splitting device 400 includes a first extrusion belt 410 and a first extrusion roller 420. Both the first belt 110 and the first extrusion belt 410 are rotatably connected to the frame 800. The first belt 110 is used to convey the substrate 10 from back to front. The first extrusion belt 410 is located above the first belt 110. The gap between the first extrusion belt 410 and the first belt 110 is used for moving the substrate 10. The first extrusion belt 410 and the first belt 110 rotate at the same speed. With the same conveying direction as the side opposite to the first belt 110, a portion of the lower side of the first extrusion belt 410 can abut against the substrate 10. The first extrusion roller 420 is parallel to the left and right direction and rotatably connected to the frame 800. The first extrusion roller 420 is located in the area enclosed by the first extrusion belt 410. The first extrusion roller 420 is used to press a portion of the lower side of the first extrusion belt 410 onto the first belt 110, so that when the substrate 10 passes through the first extrusion roller 420, the substrate 10 can break at multiple horizontal grooves 11 and form multiple strip plates 20.
[0054] refer to Figures 5 to 9The second conveying device 200 includes a second belt 210, and the second slitting device 500 includes a second extrusion belt 510 and a second extrusion roller 520. Both the second belt 210 and the extrusion belt 510 are rotatably connected to the frame 800. The second belt 210 is used to convey the strip plate 20 from right to left. The second extrusion belt 510 is located above the second belt 210. The gap between the second extrusion belt 510 and the second belt 210 allows the strip plate 20 to move. The second extrusion belt 510 rotates at the same speed as the second belt 210. The conveying direction is the same as that of the second belt 210 on the opposite side. A portion of the lower side of the second extrusion belt 510 can abut against the strip plate 20. The second extrusion roller 520 is parallel to the front-back direction and rotatably connected to the frame 800. The second extrusion roller 520 is located in the area enclosed by the second extrusion belt 510. The second extrusion roller 520 is used to press a portion of the lower side of the second extrusion belt 510 onto the second belt 210 so that when the strip plate 20 passes through the second extrusion roller 520, the strip plate 20 can break at multiple vertical grooves 12 and form multiple gene chips.
[0055] In this embodiment of the utility model, reference is made to Figures 5 to 9 The first conveying device 100 further includes a first motor 120 and two first rollers 130; the second conveying device 200 further includes a second motor 220 and two second rollers 230; the first splitting device 400 further includes a third motor and two third rollers 440; and the second splitting device 500 further includes a fourth motor and two fourth rollers 540. Both the two first rollers 130 and the two third rollers 440 are rotatably connected to the frame 800, and both are parallel to the left-right direction. A first belt 110 is wound around the two first rollers 130, and a first extrusion belt 410 is wound around the two third rollers 440. The distance between the two third rollers 440 is less than the distance between the two first rollers 130, meaning the length of the first extrusion belt 410 is less than the length of the first belt 110. Two second rollers 230 and two fourth rollers 540 are rotatably connected to the frame 800. The two second rollers 230 and two fourth rollers 540 are parallel to the front-back direction. The second belt 210 is wound around the two second rollers 230, and the second extrusion belt 510 is wound around the two fourth rollers 540. The distance between the two fourth rollers 540 is less than the distance between the two second rollers 230, that is, the length of the second extrusion belt 510 is less than the length of the second belt 210.
[0056] The first motor 120, the second motor 220, the third motor (not shown in the figure), and the fourth motor (not shown in the figure) are all mounted on the frame 800. The output end of the first motor 120 is driven to one of the first rollers 130, so that the first motor 120 can drive the first belt 110 and the two first rollers 130 to rotate. The output end of the second motor 220 is driven to one of the second rollers 230, so that the second motor 220 can drive the second belt 210 and the two second rollers 230 to rotate. The output end of the third motor is driven to one of the third rollers 440, so that the third motor can drive the first extrusion belt 410 and the two third rollers 440 to rotate. The output end of the fourth motor is driven to one of the fourth rollers 540, so that the fourth motor can drive the second extrusion belt 510 and the two fourth rollers 540 to rotate. Further details are omitted here. In this embodiment of the invention, the first extrusion belt 410 and the first belt 110 rotate at the same speed, and the conveying directions of the opposite sides of the first extrusion belt 410 and the first belt 110 are the same, that is, a portion of the lower side of the first extrusion belt 410 is conveyed from back to front, so that the substrate 10 can move smoothly from back to front between the first extrusion belt 410 and the first belt 110; the second extrusion belt 510 and the second belt 210 rotate at the same speed, and the conveying directions of the opposite sides of the second extrusion belt 510 and the second belt 210 are the same, that is, a portion of the lower side of the second extrusion belt 510 is conveyed from right to left, so that the strip plate 20 can move smoothly from back to front between the second extrusion belt 510 and the second belt 210.
[0057] In this embodiment of the utility model, reference is made to Figure 8 and Figure 9 The first extrusion roller 420 presses a portion of the lower side of the first extrusion belt 410 onto the first belt 110, causing the lower portion of the first extrusion belt 410 to bulge slightly downwards and the upper portion of the first belt 110 to sag slightly downwards. The second extrusion roller 520 presses a portion of the lower side of the second extrusion belt 510 onto the second belt 210, causing the lower portion of the second extrusion belt 510 to bulge slightly downwards and the upper portion of the second belt 210 to sag slightly downwards. In this embodiment of the present invention, reference is made to... Figure 7 The spacing between any two adjacent horizontal scribbles 11 is equal, and the spacing between any two adjacent vertical scribbles 12 is equal. The horizontal scribbles 11 are parallel to the left-right direction, and the vertical scribbles 12 are parallel to the front-back direction. It should be explained that the opposite sides of the first belt 110 and the first compression belt 410 are respectively the upper side of the first belt 110 and the lower side of the first compression belt 410. Similarly, the opposite sides of the second belt 210 and the second compression belt 510 are respectively the upper side of the second belt 210 and the lower side of the second compression belt 510.
[0058] Understandably, the worker first places the substrate 10 to be split into the positioning groove 811 on the turntable 810. After the horizontal scratches 11 on the substrate 10 are parallel to the left-right direction and the vertical scratches 12 are parallel to the front-back direction, the third conveying device transports the substrate 10 in the positioning groove 811 to the rear end of the first belt 110. After placement, the first belt 110 continuously conveys the substrate 10 from back to front. At the same time, the first pressing belt 410 located above the first belt 110 rotates synchronously with the first belt 110 at the same speed and in the same conveying direction. As the substrate 10 is conveyed forward with the first belt 110, the substrate 10 will move between the first belt 110 and the first pressing belt 410. A portion of the lower side of the first extrusion belt 410 abuts against the substrate 10, creating a clamping effect between the upper and lower portions of the first belt 110 and the first extrusion belt 410. This allows the substrate 10 to move stably between the first belt 110 and the first extrusion belt 410, preventing deflection and ensuring that the horizontal scribbles 11 on the substrate 10 are always parallel to the left-right direction and the vertical scribbles 12 are always parallel to the front-back direction. Within the area enclosed by the first extrusion belt 410, the first extrusion roller 420, which rotates parallel to the left-right direction and is connected to the frame 800, presses a portion of the lower side of the first extrusion belt 410 onto the first belt 110, causing the lower portion of the first extrusion belt 410 to bulge downwards and the upper portion to concave downwards. Because multiple horizontal scribbles 11 are pre-etched on the substrate 10, the material strength at these scribbles 11 is relatively low. When the substrate 10 passes under the first extrusion roller 420, stress concentration occurs at the transverse scribbles 11 under the combined action of the clamping force of the first extrusion belt 410 and the first belt 110, and the vertical pressure applied by the first extrusion roller 420. As the substrate 10 continues to move forward, the stress accumulates, eventually causing the substrate 10 to break at multiple transverse scribbles 11, thereby forming multiple strip plates 20. These strip plates 20 are conveyed by the first belt 110, leaving the gap between the first belt 110 and the first extrusion belt 410 and moving to the front end of the first belt 110.
[0059] The first conveying device 600 sequentially transports multiple strip plates 20 from the front end of the first belt 110 to the right end of the second belt 210. The second belt 210 continuously conveys the strip plates 20 from right to left. Simultaneously, the second extrusion belt 510, located above the second belt 210, rotates synchronously with the second belt 210 at the same speed and in the same conveying direction. As the strip plates 20 are conveyed forward with the second belt 210, they move between the second belt 210 and the second extrusion belt 510. A portion of the lower side of the second extrusion belt 510 abuts against the strip plates 20, creating a clamping effect between the upper and lower sides of the second belt 210 and the second extrusion belt 510. This ensures that the strip plates 20 can move stably between the second belt 210 and the second extrusion belt 510, preventing deflection and ensuring that the vertical grooves 12 on the strip plates 20 remain parallel to the front-back direction. Within the area enclosed by the second extrusion belt 510, the second extrusion roller 520 presses a portion of the lower side of the second extrusion belt 510 onto the second belt 210, causing the lower portion of the second extrusion belt 510 to bulge downwards and the upper portion of the second belt 210 to concave downwards. Because the strip plate 20 has multiple vertical grooves 12, the material strength at these grooves 12 is relatively weak. When the strip plate 20 passes under the second extrusion roller 520, stress concentration occurs at the vertical grooves 12 under the clamping force of the second extrusion belt 510 and the second belt 210, as well as the vertical pressure applied by the second extrusion roller 520. As the strip plate 20 moves continuously to the left, the stress gradually increases, eventually causing the strip plate 20 to break at the multiple vertical grooves 12, thus forming multiple gene chips. This completes the continuous chip-breaking operation of the gene chip substrate 10. Finally, the second transport device 700 removes the gene chips and places them in the positioning groove 811 on the carrier.
[0060] refer to Figures 7 to 9The first splitting device 400 also includes a first support roller 430 parallel to the left and right direction. The first support roller 430 is rotatably connected to the frame 800. The first support roller 430 is located in the area enclosed by the first extrusion belt 410. The first support roller 430 is located behind the first extrusion roller 420. The axis of the first support roller 430 is located above the first extrusion roller 420. The first support roller 430 is used to abut against the substrate 10 through the first extrusion belt 410. The diameter of the first extrusion roller 420 is smaller than the spacing of the horizontal scratches 11. The second splitting device 500 further includes a second support roller 530 parallel to the front-rear direction. The second support roller 530 is rotatably connected to the frame 800. The second support roller 530 is located within the area enclosed by the second extrusion belt 510, to the right of the second extrusion roller 520, and its axis is above the second extrusion roller 520. The second support roller 530 is used to abut against the strip plate 20 via the second extrusion belt 510. The diameter of the second extrusion roller 520 is smaller than the spacing of the vertical notches 12. In this embodiment of the present invention, the first support roller 430 has the same diameter as the first extrusion roller 420, and its axis is above the axis of the first extrusion roller 420; the second support roller 530 has the same diameter as the second extrusion roller 520, and its axis is above the axis of the second extrusion roller 520.
[0061] Understandably, the first support roller 430 and the second support roller 530 can provide stable support for the substrate 10 and the strip plate 20 respectively, optimizing the stress state during the extrusion process. The first support roller 430 is located behind the first extrusion roller 420 and cooperates with the first extrusion roller 420. Together with the first extrusion belt 410, it acts on the substrate 10, keeping the substrate 10 flat before passing the first extrusion roller 420. This prevents uneven extrusion caused by the substrate 10 being suspended or deformed, ensuring the stress concentration effect at the horizontal scratch 11. The second support roller 530 is located to the left of the second extrusion roller 520, and similarly, it can ensure the stability of the strip plate 20 when it is broken at the vertical scratch 12. The gene chip wafer loading equipment includes two first support rollers 430 and two second support rollers 530. The two first support rollers 430 are respectively located on the front and rear sides of the first extrusion roller 420, and the two second support rollers 530 are respectively located on the left and right sides of the second extrusion roller 520. Both first support rollers 430 abut against the substrate 10 through the first extrusion belt 410, and both second support rollers 530 abut against the strip plate 20 through the second extrusion belt 510. Further details are omitted here.
[0062] Understandably, setting the diameter of the first extrusion roller 420 to be smaller than the distance between any two adjacent horizontal scribbles 11, and the diameter of the second extrusion roller 520 to be smaller than the distance between any two adjacent vertical scribbles 12, ensures that the first extrusion roller 420 and the second extrusion roller 520 apply pressure only to a single scribbled area. In this way, when the substrate 10 or strip plate 20 passes through the first extrusion roller 420 or the second extrusion roller 520, the pressure can be precisely applied to a single scribbled area, avoiding pressure dispersion and weakened stress concentration due to the first extrusion roller 420 and the second extrusion roller 520 crossing multiple scribbles. This ensures that each scribbles can generate effective stress concentration under sufficient pressure, achieving reliable fracture, improving the precision and success rate of chip breaking, and preventing situations where the substrate 10 or strip plate 20 is not completely broken or the fracture position is deviated, thereby ensuring the chip breaking quality of this gene chip chip breaking and mounting equipment.
[0063] In another embodiment of this utility model, the gene chip wafer mounting device further includes a first vacuum pump and a second vacuum pump. A plurality of first adsorption holes are evenly distributed on the first belt 110. The first vacuum pump creates a negative pressure in the area enclosed by the first belt 110 and the frame 800, allowing the substrate 10 to be adsorbed onto the first belt 110, ensuring that the substrate 10 does not shift during movement, thus guaranteeing that the horizontal scratches 11 and vertical scratches 12 on the substrate 10 are always parallel to the left-right and front-back directions, respectively. A plurality of second adsorption holes are evenly distributed on the second belt 210. The second vacuum pump creates a negative pressure in the area enclosed by the second belt 210 and the frame 800, allowing the strip plate 20 to be adsorbed onto the second belt 210, ensuring that the strip plate 20 does not shift during movement, thus guaranteeing that the vertical scratches 12 on the strip plate 20 are always parallel to the front-back direction. In another embodiment of this utility model, both the first belt 110 and the second belt 210 are common vacuum adsorption belts, which will not be described further here. In this embodiment of the invention, the positions of the first extrusion roller 420 and the second extrusion roller 520 in the vertical direction can be adjusted to accommodate substrates 10 of different thicknesses. The third conveying device 300 has the same structure as the first conveying device 100, and will not be described further here.
[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0065] Of course, this utility model is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.
Claims
1. A gene chip wafer splitting and mounting device, characterized in that, include: The frame is equipped with a first conveying device, a second conveying device and a third conveying device. The first conveying device is used to convey a substrate from back to front, the second conveying device is used to convey a strip plate from right to left, and the third conveying device is used to convey a carrier from front to back. A first breaking device is provided on the frame. The first breaking device is used to break the substrate on the first conveying device so that the substrate breaks at multiple horizontal grooves and forms multiple strip plates. A first conveying device is disposed on the frame. The first conveying device is used to sequentially convey multiple strip plates on the front end of the first conveying device to the right end of the second conveying device. The second chip-breaking device is provided on the frame. The second chip-breaking device is used to break the strip plate on the second conveying device so that the strip plate breaks at multiple vertical grooves and forms multiple gene chips. The second transport device is disposed on the frame and is used to transport multiple gene chips on the left end of the second transport device to the carrier on the front end of the third transport device in sequence.
2. The gene chip wafer splitting and mounting device according to claim 1, characterized in that: The first conveying device includes a suction cup mechanism, a lifting drive mechanism, and a linear drive mechanism. The front end of the first conveying device is located behind the right end of the second conveying device. The linear drive mechanism is used to drive the suction cup mechanism to move in the front-back direction. The lifting drive mechanism is used to drive the suction cup mechanism to rise and fall. The suction cup mechanism is used to adsorb or release the strip plate so that the suction cup mechanism can transport the strip plate on the first conveying device to the second conveying device.
3. The gene chip wafer splitting and mounting device according to claim 1, characterized in that: The second transport device includes a second suction cup manipulator and a second image recognition mechanism. The second image recognition mechanism is electrically connected to the second suction cup manipulator. The second image recognition mechanism is used to identify the gene chip on the left end of the second transport device and the carrier on the front end of the third transport device, so that the second suction cup manipulator can transport the gene chip onto the carrier.
4. The gene chip wafer splitting and mounting device according to claim 1, characterized in that: It also includes a first image recognition mechanism, a third conveying device, and a turntable. The turntable is rotatably connected to the frame and is used to support the substrate. The first image recognition mechanism is electrically connected to the turntable and is used to recognize the substrate on the turntable so that the turntable can drive the substrate to rotate and make the horizontal and vertical scratches on the substrate parallel to the left-right and front-back directions, respectively. The third conveying device is used to convey the substrate on the turntable to the rear end of the first conveying device.
5. The gene chip wafer splitting and mounting device according to claim 4, characterized in that: The turntable is provided with a positioning groove, which is used to accommodate the substrate.
6. The gene chip wafer splitting and mounting device according to claim 5, characterized in that: It also includes a vacuum rotary joint and a vacuum pump. The turntable is provided with a vacuum chamber. Multiple adsorption holes are evenly distributed on the bottom wall of the positioning groove. The multiple adsorption holes are all connected to the vacuum chamber. The output end of the vacuum pump is connected to the vacuum chamber through the vacuum rotary joint, so that the vacuum pump can create a negative pressure in the vacuum chamber and the multiple adsorption holes, and adsorb the substrate onto the bottom wall of the positioning groove.
7. The gene chip wafer-breaking and mounting device according to claim 1, characterized in that: The first conveying device includes a first belt, and the first breaking device includes a first extrusion belt and a first extrusion roller. Both the first belt and the first extrusion belt are rotatably connected to the frame. The first belt is used to convey the substrate from back to front. The first extrusion belt is located above the first belt. The gap between the first extrusion belt and the first belt is used to allow the substrate to move. The first extrusion belt and the first belt rotate at the same speed. The conveying directions of the opposite sides of the first extrusion belt and the first belt are the same. A portion of the lower side of the first extrusion belt can abut against the substrate. The first extrusion roller is parallel to the left-right direction and rotatably connected to the frame. The first extrusion roller is located in the area enclosed by the first extrusion belt. The first extrusion roller is used to press a portion of the lower side of the first extrusion belt onto the first belt, so that when the substrate passes through the first extrusion roller, the substrate can break at multiple horizontal grooves and form multiple strip plates.
8. The gene chip wafer-breaking and mounting device according to claim 7, characterized in that: The first splitting device further includes a first support roller parallel to the left-right direction. The first support roller is rotatably connected to the frame. The first support roller is located in the area enclosed by the first extrusion belt. The first support roller is located behind the first extrusion roller. The axis of the first support roller is located above the first extrusion roller. The first support roller is used to abut against the substrate through the first extrusion belt. The diameter of the first extrusion roller is smaller than the spacing of the horizontal scratches.
9. The gene chip wafer-breaking and mounting device according to claim 1, characterized in that: The second conveying device includes a second belt, and the second breaking device includes a second extrusion belt and a second extrusion roller. Both the second belt and the second extrusion belt are rotatably connected to the frame. The second belt is used to convey the strip plate from right to left. The second extrusion belt is located above the second belt. The gap between the second extrusion belt and the second belt is used for the movement of the strip plate. The second extrusion belt and the second belt rotate at the same speed. The conveying directions of the opposite sides of the second extrusion belt and the second belt are the same. A portion of the lower side of the second extrusion belt can abut against the strip plate. The second extrusion roller is parallel to the front-back direction and rotatably connected to the frame. The second extrusion roller is located in the area enclosed by the second extrusion belt. The second extrusion roller is used to press a portion of the lower side of the second extrusion belt onto the second belt, so that when the strip plate passes through the second extrusion roller, the strip plate can break at multiple vertical grooves and form multiple gene chips.
10. The gene chip wafer-breaking and mounting device according to claim 9, characterized in that: The second splitting device further includes a second support roller parallel to the front-back direction. The second support roller is rotatably connected to the frame and is located within the area enclosed by the second extrusion belt. The second support roller is located to the right of the second extrusion roller, and its axis is located above the second extrusion roller. The second support roller is used to abut against the strip plate via the second extrusion belt. The diameter of the second extrusion roller is smaller than the spacing of the vertical grooves.