An integrated micro-channel cooled LED lighting aluminum substrate

Abstract

The utility model discloses an integrated micro -channel cooling's LED lighting aluminum base plate, including the casing, the top of casing is provided with aluminum base plate main part, is provided with the circuit board on the aluminum base plate main part, the top of circuit board is provided with a plurality of LED lighting mechanism, is provided with refrigeration pipe in the casing, is provided with a plurality of radiating flat -tube on refrigeration pipe, the bottom of aluminum base plate main part is provided with a plurality of heat exchange fins corresponding with a plurality of radiating flat -tube, the opposite both sides of aluminum base plate main part all are provided with mounting plate, and mounting plate is L -shaped, and the bottom of mounting plate is provided with mounting hole, and the opposite both sides of casing all are provided with positioning slot, and two mounting plates correspond with two positioning slots respectively, and is provided with the clamping component between casing and aluminum base plate main part. The utility model discloses the radiating flat -tube that sets up, can make a plurality of radiating flat -tubes inside circulation cold gas, makes a plurality of radiating flat -tubes respectively to a plurality of heat exchange fins in the casing heat dissipation, thereby can effectively take away the heat of heat exchange fin, improved the efficiency of heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of aluminum substrate technology, specifically to an LED lighting aluminum substrate with integrated microchannel cooling. Background Technology

[0002] As electronic devices develop towards miniaturization and high performance, the number of electronic components and power density on printed circuit boards has increased significantly, leading to a corresponding increase in heat generation. To ensure the stable and reliable operation of electronic devices, effective thermal management has become crucial. Among numerous thermal management solutions, aluminum substrates are widely used in high-power electronic components due to their excellent thermal conductivity and relatively low cost.

[0003] Currently, aluminum substrates dissipate heat to the outside through thermal conduction, mainly relying on natural external heat dissipation, which is often slow and needs to be improved. Furthermore, the installation process of aluminum substrates is also relatively complicated due to the need to consider heat dissipation. There is an urgent need to design an LED lighting aluminum substrate with integrated microchannel cooling to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide an LED lighting aluminum substrate with integrated microchannel cooling to address the aforementioned shortcomings in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An integrated microchannel cooling LED lighting aluminum substrate includes a housing, an aluminum substrate body on the top of the housing, a circuit board on the aluminum substrate body, multiple LED lighting mechanisms on the top of the circuit board, a cooling pipe inside the housing with multiple heat dissipation flat tubes on the cooling pipe, multiple heat exchange fins corresponding to the multiple heat dissipation flat tubes on the bottom of the aluminum substrate body, mounting plates on opposite outer sides of the aluminum substrate body, the mounting plates being L-shaped with mounting holes at their bottoms, positioning grooves on opposite outer sides of the housing, two mounting plates corresponding to two positioning grooves respectively, and a snap-fit ​​assembly between the housing and the aluminum substrate body.

[0007] Furthermore, the snap-fit ​​assembly includes four snap rods respectively disposed at the four corners of the bottom of the aluminum substrate body and four snap slots respectively opened at the four corners of the top of the housing, with the snap rods corresponding to the four snap slots respectively.

[0008] Furthermore, the slot is a through hole, and a gasket is provided protruding from the bottom of the slot.

[0009] Furthermore, the cooling pipe is U-shaped, and multiple heat dissipation flat tubes are disposed inside the cooling pipe, with microchannels disposed inside the heat dissipation flat tubes.

[0010] Furthermore, each of the two positioning slots has a sliding groove on its two outer sides, and each of the two mounting plates has a slider on its two sides. The two sliders slide in cooperation with the two sliding grooves respectively, and both the sliding grooves and the sliders are T-shaped.

[0011] Furthermore, an embedding groove is formed on the top of the aluminum substrate body, the circuit board is disposed in the embedding groove, and an insulating layer is disposed between the circuit board and the embedding groove.

[0012] In the above technical solution, the LED lighting aluminum substrate with integrated microchannel cooling provided by this utility model has the following beneficial effects:

[0013] The design incorporates heat dissipation flat tubes, allowing cool air to circulate within them. These tubes then dissipate heat from multiple heat exchange fins within the housing, effectively removing heat and improving heat dissipation efficiency. The mounting plates align with the two positioning slots, enabling the aluminum substrate to be mounted on top of the housing. This allows the heat dissipation flat tubes to correspond to the heat exchange fins, facilitating rapid assembly of the heat dissipation structure and minimizing concerns about its impact on the aluminum substrate installation process. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0015] Figure 1 This is a schematic diagram of the aluminum substrate structure provided for an embodiment of an LED lighting aluminum substrate with integrated microchannel cooling according to the present invention.

[0016] Figure 2 This is a schematic diagram of the housing structure provided for an embodiment of an LED lighting aluminum substrate with integrated microchannel cooling according to the present invention.

[0017] Figure 3 This is a schematic diagram of the cooling pipe structure provided in an embodiment of an LED lighting aluminum substrate with integrated microchannel cooling according to the present invention.

[0018] Figure 4 This is a schematic diagram of the circuit board structure provided for an embodiment of an LED lighting aluminum substrate with integrated microchannel cooling according to the present invention.

[0019] 1. Housing; 2. Aluminum substrate body; 3. Circuit board; 4. Cooling pipe; 5. Heat dissipation flat tube; 6. Heat exchange fin; 7. Mounting plate; 8. Mounting hole; 9. Positioning groove; 10. Locking rod; 11. Locking slot; 12. Gasket; 13. Micro channel; 14. Slide groove; 15. Slider; 16. Embedded groove; 17. Insulation layer. Detailed Implementation

[0020] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0021] like Figure 1-4 As shown in the figure, this utility model provides an integrated microchannel cooling LED lighting aluminum substrate.

[0022] The device includes a housing 1, an aluminum substrate body 2 on the top of the housing 1, a circuit board 3 on the aluminum substrate body 2, multiple LED lighting mechanisms on the top of the circuit board 3, a cooling pipe 4 inside the housing 1, multiple heat dissipation flat pipes 5 on the cooling pipe 4, multiple heat exchange fins 6 corresponding to the multiple heat dissipation flat pipes 5 on the bottom of the aluminum substrate body 2, mounting plates 7 on both opposite outer sides of the aluminum substrate body 2, the mounting plates 7 are L-shaped, and mounting holes 8 are opened at the bottom of the mounting plates 7. Positioning grooves 9 are opened on both opposite outer sides of the housing 1, and the two mounting plates 7 correspond to the two positioning grooves 9 respectively. A snap-fit ​​assembly is provided between the housing 1 and the aluminum substrate body 2.

[0023] Reference Figure 2 The snap-fit ​​assembly of this embodiment includes four snap-fit ​​rods 10 respectively disposed at the four corners of the bottom of the aluminum substrate body 2, and four snap-fit ​​slots 11 respectively disposed at the four corners of the top of the housing 1. The snap-fit ​​rods 10 correspond to the four snap-fit ​​slots 11. By means of the snap-fit ​​rods 10, the snap-fit ​​rods 10 can be inserted into the corresponding snap-fit ​​slots 11 to fix the aluminum substrate body 2.

[0024] Reference Figure 2 In this embodiment, the slot 11 is a through hole, and a gasket 12 is provided protruding from the bottom of the slot 11. The gasket 12 can block the slot 11 while supporting the bottom of the housing 1.

[0025] Reference Figure 3 In this embodiment, the cooling pipe 4 is U-shaped, and multiple heat dissipation flat tubes 5 are arranged inside the cooling pipe 4. Microchannels 13 are arranged inside the heat dissipation flat tubes 5. Through the microchannels 13, cold air can flow along the microchannels 13, thereby improving the flow efficiency of cold air and enabling the cold air in the microchannels 13 to exchange heat with the heat exchange plates 6.

[0026] Reference Figure 3-4In this embodiment, each of the two positioning grooves 9 has a sliding groove 14 on its two outer sides, and each of the two mounting plates 7 has a slider 15 on its two outer sides. The two sliders 15 slide in contact with the two sliding grooves 14 respectively. Both the sliding grooves 14 and the sliders 15 are T-shaped. By using the sliders 15, the sliders 15 can be aligned with the sliding grooves 14 before they can enter the sliding grooves 14, allowing the mounting plates 7 to enter the positioning grooves 9 vertically. This design provides a foolproof and convenient installation effect.

[0027] Reference Figure 4 In this embodiment, the top of the aluminum substrate body 2 is provided with an embedding groove 16, the circuit board 3 is disposed in the embedding groove 16, and an insulating layer 17 is provided between the circuit board 3 and the embedding groove 16. Through the embedded groove 16, the circuit board 3 can be installed in the embedding groove 16, so that the aluminum substrate body 2 can conduct heat and cool down. The insulating layer 17 is electronic fiberglass cloth, which has the functions of heat conduction and insulation.

[0028] Working principle: In use, the circuit board 3 is first placed on the aluminum substrate body 2, and then the aluminum substrate body 2 is installed on the top of the housing 1, so that the two mounting plates 7 are aligned with the two positioning slots 9 respectively. Then, the two mounting plates 7 slide into the two positioning slots 9 respectively to position the aluminum substrate body 2, so that the snap-fit ​​component between the housing 1 and the aluminum substrate body 2 is snapped. At the same time, multiple heat dissipation flat tubes 5 correspond to multiple heat exchange plates 6 in the housing 1 respectively. Then, the mounting plates 7 are fixed with the mounting holes 8 to install and fix the housing 1 and the aluminum substrate body 2. After the cooling pipe 4 is connected to the external cooling mechanism, the cooling pipe 4 will cool, and cold air will flow in the heat dissipation flat tubes 5, so that the heat dissipation flat tubes 5 exchange heat with the heat exchange plates 6.

[0029] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An LED lighting aluminum substrate with integrated microchannel cooling, comprising a housing (1), characterized in that, The top of the housing (1) is provided with an aluminum substrate body (2), a circuit board (3) is provided on the aluminum substrate body (2), a plurality of LED lighting mechanisms are provided on the top of the circuit board (3), a cooling pipe (4) is provided inside the housing (1), a plurality of heat dissipation flat pipes (5) are provided on the cooling pipe (4), a plurality of heat exchange plates (6) corresponding to the plurality of heat dissipation flat pipes (5) are provided at the bottom of the aluminum substrate body (2), a mounting plate (7) is provided on both opposite outer sides of the aluminum substrate body (2), the mounting plate (7) is L-shaped, a mounting hole (8) is opened at the bottom of the mounting plate (7), a positioning groove (9) is opened on both opposite outer sides of the housing (1), the two mounting plates (7) correspond to the two positioning grooves (9) respectively, and a snap-fit ​​assembly is provided between the housing (1) and the aluminum substrate body (2).

2. The LED lighting aluminum substrate with integrated microchannel cooling according to claim 1, characterized in that, The snap-fit ​​assembly includes four snap rods (10) respectively located at the four corners of the bottom of the aluminum substrate body (2) and four snap slots (11) respectively located at the four corners of the top of the housing (1). The snap rods (10) correspond to the four snap slots (11).

3. The LED lighting aluminum substrate with integrated microchannel cooling according to claim 2, characterized in that, The slot (11) is a through hole, and a gasket (12) is provided protruding from the bottom of the slot (11).

4. The LED lighting aluminum substrate with integrated microchannel cooling according to claim 1, characterized in that, The cooling pipe (4) is U-shaped, and multiple heat dissipation flat tubes (5) are arranged inside the cooling pipe (4). The heat dissipation flat tubes (5) are provided with micro channels (13).

5. The LED lighting aluminum substrate with integrated microchannel cooling according to claim 1, characterized in that, The two positioning grooves (9) are provided with sliding grooves (14) on their opposite outer sides, and the two mounting plates (7) are provided with sliders (15) on their opposite sides. The two sliders (15) are respectively slidably engaged with the two sliding grooves (14). Both the sliding grooves (14) and the sliders (15) are T-shaped.

6. The LED lighting aluminum substrate with integrated microchannel cooling according to claim 1, characterized in that, An embedding groove (16) is provided on the top of the aluminum substrate body (2), the circuit board (3) is disposed in the embedding groove (16), and an insulating layer (17) is provided between the circuit board (3) and the embedding groove (16).

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