LED thermoelectric separation aluminum substrate structure

Abstract

The utility model discloses a kind of LED thermoelectric separation aluminium substrate structure, including aluminium substrate, recess is opened in aluminium substrate upper surface, recess is provided with insulating layer, insulating layer is sleeved with conductive layer, aluminium substrate top is provided with LED lamp pearl, electrode of LED lamp pearl is welded at conductive layer, aluminium substrate bottom outer surface is provided with radiating fin aluminium substrate upper surface is daubed with solder resist ink.The utility model is provided with aluminium substrate, the convex block formed in the recess opened in aluminium substrate upper surface, top and LED lamp pearl bottom surface are closely combined, further optimize heat conduction path, so that heat can be more directly, efficiently transmitted, simultaneously, set up radiating fin, substantially increase the radiating area, can quickly emit the heat generated by LED lamp pearl, effectively reduce the working temperature of LED, set recess and convex block, realize the effective separation of heat conduction path and electric conduction path, reduce the mutual interference between heat and electricity, further improve the performance and stability of LED device.

Description

Technical Field

[0001] This utility model relates to the field of thermoelectric separation aluminum substrate technology, and specifically to an LED thermoelectric separation aluminum substrate structure. Background Technology

[0002] The LED thermoelectric separation aluminum substrate structure is a substrate structure specifically designed to solve the problem of heat dissipation and electrical conductivity separation in LED devices. Its core feature is that the heat conduction path and the electrical conduction path are completely independent, thereby greatly improving the heat dissipation efficiency and working stability of LEDs.

[0003] Traditional aluminum substrates have a multi-layered structure, with conductive and insulating layers separating the heat-generating circular LED beads from the heat dissipation substrate. Heat must penetrate through the insulating and conductive layers, resulting in high thermal resistance. Furthermore, thermoelectric separation is ineffective, and the mutual interference between heat and electricity affects the overall performance of the LED device. Therefore, there is an urgent need to design an LED thermoelectric separation aluminum substrate structure to solve these problems. Utility Model Content

[0004] The purpose of this invention is to provide an LED thermoelectric separation aluminum substrate structure to overcome the aforementioned shortcomings in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An LED thermoelectric separation aluminum substrate structure includes an aluminum substrate, a groove is formed on the upper surface of the aluminum substrate, an insulating layer is disposed in the groove, a conductive layer is sleeved inside the insulating layer, an LED bead is disposed on the top of the aluminum substrate, the electrodes of the LED bead are soldered to the conductive layer, heat dissipation fins are disposed on the outer surface of the bottom of the aluminum substrate, and solder resist ink is coated on the upper surface of the aluminum substrate.

[0007] In a preferred embodiment of this utility model, a protrusion is formed in the middle of the groove on the aluminum substrate, the top of the protrusion is closely attached to the bottom surface of the LED bead, and a fully penetrating mounting hole is provided at the four corners of the aluminum substrate.

[0008] In a preferred embodiment of this utility model, a slot is formed in the insulating layer, and the conductive layer is sleeved in the slot.

[0009] In a preferred embodiment of this utility model, the conductive layer includes a positive conductive strip and a negative conductive strip, and the positive and negative electrodes of the LED lamp bead are respectively welded to the positive conductive strip and the negative conductive strip.

[0010] In a preferred embodiment of this utility model, the heat dissipation fins are provided with a plurality of fixing holes around their perimeter, and screws are inserted into the fixing holes. The heat dissipation fins are fixed to the aluminum substrate by the screws cooperating with the fixing holes.

[0011] In a preferred embodiment of this invention, the insulating layer is made of polyimide material.

[0012] In a preferred embodiment of this utility model, the surface of the solder resist ink is provided with a UV-curable transparent protective coating.

[0013] In the above technical solution, the LED thermoelectric separation aluminum substrate structure provided by this utility model has the following beneficial effects:

[0014] (1) By setting an aluminum substrate, the protrusion formed in the middle of the groove on the aluminum substrate fits tightly with the bottom surface of the LED lamp bead, further optimizing the heat conduction path, so that heat can be transferred more directly and efficiently. At the same time, the heat dissipation fins are set, which greatly increases the heat dissipation area, which can quickly dissipate the heat generated by the LED lamp bead and effectively reduce the working temperature of the LED.

[0015] (2) By setting grooves and bumps, the heat conduction path and the electrical conduction path are effectively separated, reducing the mutual interference between heat and electricity, further improving the performance and stability of LED devices, and meeting the strict requirements of heat and electricity separation in high-power LED application scenarios.

[0016] (3) By setting mounting holes and fixing holes, the mounting holes at the four corners of the aluminum substrate facilitate the fixing and installation of the substrate. The fixing holes on the sides of the heat dissipation fins, together with screws, can firmly fix the heat dissipation fins to the aluminum substrate, thereby enhancing the stability of the overall structure. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0018] Figure 1 This is a three-dimensional view of the thermoelectric separation aluminum substrate structure provided in an embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of the conductive layer structure provided in an embodiment of the LED thermoelectric separation aluminum substrate structure of this utility model.

[0020] Figure 3 This is a perspective view of the heat dissipation fin structure provided in an embodiment of the LED thermoelectric separation aluminum substrate structure of this utility model.

[0021] Figure 4This is an exploded view of the thermoelectric separation aluminum substrate structure provided in an embodiment of the present invention.

[0022] 1. Aluminum substrate; 2. Solder resist ink; 3. LED beads; 4. Heat sink fins; 5. Mounting holes; 6. Conductive layer; 61. Positive conductive strip; 62. Negative conductive strip; 7. Insulating layer; 8. Fixing holes; 9. Screws; 10. Groove; 11. Slot; 12. Protrusion. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0024] like Figure 1-4 As shown in the figure, the present invention provides an LED thermoelectric separation aluminum substrate structure, including an aluminum substrate 1, a groove 10 is formed on the upper surface of the aluminum substrate 1, an insulating layer 7 is disposed in the groove 10, a conductive layer 6 is sleeved in the insulating layer 7, an LED bead 3 is disposed on the top of the aluminum substrate 1, the electrodes of the LED bead 3 are soldered to the conductive layer 6, a heat dissipation fin 4 is disposed on the outer surface of the bottom of the aluminum substrate 1, and a solder resist ink 2 is coated on the upper surface of the aluminum substrate 1.

[0025] In this embodiment, a groove 10 is formed on the upper surface of the aluminum substrate 1, and an LED bead 3 is disposed on the top of the aluminum substrate 1. The electrodes of the LED bead 3 are soldered to the conductive layer 6. The upper surface of the aluminum substrate 1 is coated with solder resist ink 2. The environmentally friendly photosensitive solder resist ink 2 has excellent chemical corrosion resistance and wear resistance. A protrusion 12 is formed in the middle of the groove 10 on the aluminum substrate 1. The top of the protrusion 12 is in close contact with the bottom surface of the LED bead 3. This design greatly enhances the heat conduction efficiency between the LED bead 3 and the aluminum substrate 1, so that the heat generated by the LED bead 3 can be quickly transferred to the aluminum substrate 1. Fully penetrating mounting holes 5 are formed at the four corners of the aluminum substrate 1, which facilitates fixing the aluminum substrate 1 to various devices and realizes modular installation and disassembly.

[0026] In this embodiment, a slot 11 is provided in the insulating layer 7, and the conductive layer 6 is sleeved in the slot 11. The insulating layer 7 wraps the conductive layer 6 to prevent the conductive layer 6 from contacting the aluminum substrate 1 and causing leakage, thus ensuring electrical safety and stability.

[0027] In this embodiment, an insulating layer 7 is fitted with a conductive layer 6, which includes a positive conductive strip 61 and a negative conductive strip 62. The conductive layer 6 is made of high-purity copper, which has low resistivity and can significantly reduce losses during current transmission. The electrodes of the LED bead 3 are firmly welded to the positive and negative conductive strips through a high-precision welding process. This welding method not only ensures good electrical connection but also has high mechanical strength, which can effectively resist external vibration and impact.

[0028] In this embodiment, a heat dissipation fin 4 is provided on the bottom outer surface of the aluminum substrate 1. The heat dissipation fin 4 is made of aluminum alloy with high thermal conductivity and is formed by precision die casting process. Several fixing holes 8 are provided on the four sides of the heat dissipation fin 4. Screws 9 are inserted into the fixing holes 8. The heat dissipation fin 4 is fixed on the aluminum substrate 1 by the screws 9 and the fixing holes 8, so as to ensure a tight connection between the heat dissipation fin 4 and the aluminum substrate 1 and reduce the contact thermal resistance.

[0029] In this embodiment, an insulating layer 7 is provided in the groove 10. The insulating layer 7 is made of polyimide material, which has excellent electrical insulation properties and can withstand high temperatures of up to 400°C. While effectively isolating the conductive layer 6 from the aluminum substrate 1, it can also adapt to the high heat environment generated when the LED beads 3 are working, ensuring electrical safety and stability.

[0030] In this embodiment, the surface of the solder resist ink 2 is provided with a UV-curable transparent protective coating. The UV-curable transparent protective coating on the surface is further provided, which is rapidly cured by ultraviolet irradiation to form a dense protective film. It can not only effectively prevent the conductive layer 6 from oxidizing and getting damp, but also improve the surface hardness and resist external scratches. At the same time, the coating has high light transmittance and will not affect the light emission effect of the LED.

[0031] Working steps: 1. A groove 10 is formed on the upper surface of the aluminum substrate 1, and a protrusion 12 is formed in the middle of the groove 10. The insulating layer 7 is placed in the groove 10. Then, the conductive layer 6, namely the positive electrode conductive strip 61 and the negative electrode conductive strip 62, are respectively sleeved in the slot 11 to achieve reliable insulation between the conductive layer 6 and the aluminum substrate 1.

[0032] 2. Heat dissipation fins 4 are placed on the bottom outer surface of the aluminum substrate 1. By inserting screws 9 into the fixing holes 8 and tightening them with the aluminum substrate 1, the heat dissipation area of ​​the aluminum substrate 1 is greatly increased.

[0033] 3. Place the LED bead 3 on top of the aluminum substrate 1, so that the bottom surface of the LED bead 3 is in close contact with the top of the bump 12. Then, solder the positive and negative electrodes of the LED bead 3 to the positive electrode conductive strip 61 and the negative electrode conductive strip 62 respectively to complete the circuit connection.

[0034] 4. Apply solder resist ink 2 to the upper surface of aluminum substrate 1, and set a UV-curable transparent protective coating on the surface of solder resist ink 2 to protect the conductive layer 6 and prevent its oxidation.

[0035] 5. After completing the installation steps, power is supplied to the LED thermoelectric separation aluminum substrate 1 structure. The LED beads 3 obtain electrical energy through the conductive layer 6 and start to work and emit light. The heat generated during the operation is quickly conducted to the aluminum substrate 1 through the bottom that is in close contact with the bump 12, and then dissipated to the surrounding environment through the heat dissipation fins 4 to achieve efficient heat dissipation. At the same time, the insulating layer 7 ensures the safe operation of the circuit and avoids the risk of leakage.

[0036] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An LED thermoelectric separation aluminum substrate structure, comprising an aluminum substrate (1), characterized in that, The aluminum substrate (1) has a groove (10) on its upper surface. An insulating layer (7) is provided in the groove (10). A conductive layer (6) is sleeved in the insulating layer (7). An LED bead (3) is provided on the top of the aluminum substrate (1). The electrodes of the LED bead (3) are soldered to the conductive layer (6). A heat dissipation fin (4) is provided on the bottom outer surface of the aluminum substrate (1). Solder resist ink (2) is applied to the upper surface of the aluminum substrate (1).

2. The LED thermoelectric separation aluminum substrate structure according to claim 1, characterized in that, A protrusion (12) is formed in the middle of the groove (10) opened on the aluminum substrate (1). The top of the protrusion (12) is closely attached to the bottom surface of the LED bead. A fully penetrating mounting hole (5) is opened at the four corners of the aluminum substrate (1).

3. The LED thermoelectric separation aluminum substrate structure according to claim 1, characterized in that, The insulating layer (7) has a slot (11) inside, and the conductive layer (6) is sleeved in the slot (11).

4. The LED thermoelectric separation aluminum substrate structure according to claim 1, characterized in that, The conductive layer (6) includes a positive conductive strip (61) and a negative conductive strip (62), and the positive and negative electrodes of the LED beads are respectively welded to the positive conductive strip (61) and the negative conductive strip (62).

5. The LED thermoelectric separation aluminum substrate structure according to claim 1, characterized in that, The heat dissipation fins (4) have several fixing holes (8) around their sides. Screws (9) are inserted into the fixing holes (8). The heat dissipation fins (4) are fixed to the aluminum substrate (1) by the screws (9) and the fixing holes (8).

6. The LED thermoelectric separation aluminum substrate structure according to claim 1, characterized in that, The insulating layer (7) is made of polyimide material.

7. The LED thermoelectric separation aluminum substrate structure according to claim 1, characterized in that, The surface of the solder resist ink (2) is provided with a UV-curable transparent protective coating.

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