A PCB package module for a headset connector
By designing a compatible packaging structure on the PCB board, electrical connections between plug-in and surface-mount headphone connectors are achieved, solving the problem of production limitations, improving production efficiency and electrical performance, and making it suitable for various market demands.
CN224400895UActive Publication Date: 2026-06-23SHENZHEN ZHAOCHI DIGITAL TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN ZHAOCHI DIGITAL TECH CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-06-23
Smart Images
Figure CN224400895U_ABST
Abstract
The utility model discloses a kind of PCB packaging modules of earphone connector, it includes PCB board, plug-in earphone connector and patch earphone connector, plug-in earphone connector and patch earphone connector are electrically connected with PCB board by compatible packaging structure;The compatible packaging structure includes: plug-in pin pad, patch pad and wire connection structure, wire connection structure is electrically connected with plug-in pin pad and patch pad, so that plug-in earphone connector and patch earphone connector can share same PCB packaging module, realize the conduction and transmission of signal;The patch pad array is arranged on the two sides of PCB board, and the plug-in pin pad is located in the middle position of PCB board.The PCB packaging module realized by the above scheme, the foundry can select appropriate production mode according to own equipment, even mix two kinds of packaging modes on the same board;Compatible with the installation of plug-in earphone connector and patch earphone connector, suitable for a variety of market demand.
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