A low-voltage reactive power compensation controller

CN224401169UActive Publication Date: 2026-06-23GUANGDONG HUIZHIHUA ELECTRIC CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG HUIZHIHUA ELECTRIC CO LTD
Filing Date
2025-06-25
Publication Date
2026-06-23

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Abstract

The utility model discloses a kind of low-voltage reactive power compensation controllers, including control casing, mainboard, heat-conducting paste and air cooler. The mainboard is arranged in the inside of control casing, heat-conducting paste is attached on the surface heating device of mainboard, air cooler is installed in the outside of control casing. Air cooler includes duct pipe, motor, air cooling cabin, cooling coil, rectifier blade and air wheel, motor is installed in motor sleeve seat and drives air wheel rotation, air cooling cabin is arranged in the both ends of motor sleeve seat, is equipped with the cooling coil that is communicated with heat-conducting paste, air cooling cabin both ends are communicated with motor outer periphery by air gap, form ventilation path. Cooling coil and heat-conducting paste are equipped with capillary circulation flow channel and inject cooling liquid, airflow passes through coil and takes away heat. Rectifier blade and guide vane direct airflow discharged by air wheel to axial direction, improve heat dissipation efficiency. The utility model has the advantages of compact structure, high heat dissipation efficiency, good sealing, suitable for long time stable operation scene.
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Description

Technical Field

[0001] This utility model relates to the field of reactive power compensation controller cooling technology, specifically a low-voltage reactive power compensation controller. Background Technology

[0002] Low-voltage reactive power compensation controllers are widely used in power distribution systems to adjust the system power factor, suppress voltage fluctuations, and improve power quality. During long-term continuous operation, the control chips, power electronic switches, and power modules on the controller's internal mainboard generate a large amount of heat. If this heat is not dissipated in time, it will seriously affect the normal operation of the components and the stability of the overall system, and may even cause control failure or equipment burnout.

[0003] Currently, the most common low-voltage reactive power compensation controllers generally employ the following heat dissipation methods:

[0004] One approach is to directly mount heatsinks or fans on the motherboard, achieving heat exchange through convection or forced air cooling. This type of structure is acceptable when the power of components is low, but as power density increases and components are centrally located, the problem of insufficient heat dissipation becomes more prominent, while also resulting in issues such as loud fan noise and easy dust accumulation.

[0005] Secondly, the air duct is designed inside the controller housing, with an internal fan guiding air circulation to cool the motherboard and internal components. While this method enhances airflow, it compromises the housing's seal, allowing dust and moisture from the outside air to enter the device. This can lead to risks such as circuit board dampness, corrosion, and dust short circuits, seriously affecting the controller's safety and reliability.

[0006] In addition, some structures use external cooling fins or liquid cooling components, but such solutions are mostly costly, complex in structure, and difficult to install and maintain, making them difficult to promote and use, especially in situations where space is limited or where environmental protection requirements are high.

[0007] In summary, existing low-voltage reactive power compensation controllers still have significant shortcomings in terms of heat dissipation structure design, particularly in achieving a balance between high thermal conductivity, high efficiency, and airtight protection, where technical bottlenecks exist. Therefore, there is an urgent need to provide a low-voltage reactive power compensation controller that is compact, has high heat dissipation efficiency, excellent sealing performance, and is suitable for high-power-density applications, in order to improve the overall stability and adaptability of the equipment. Utility Model Content

[0008] This utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0009] Therefore, the technical solution adopted by this utility model is as follows: a low-voltage reactive power compensation controller, comprising: a control housing, an air cooler, a thermal conductive patch, and a main board. The main board is disposed inside the control housing, and the thermal conductive patch is attached to the surface of the heat-generating components on the main board to guide heat to external heat dissipation components. The air cooler is fixedly installed on one side of the control housing, forming a heat exchange bridge between the heat of the main board and the external environment. Specifically, this structure extends the heat conduction path from the surface of the components to the outside of the housing, and in conjunction with the forced air cooling system, significantly improves heat dissipation efficiency while preventing external airflow from directly entering the housing, ensuring the stable operation of the electrical system.

[0010] In a preferred example, the air cooler includes a duct, an air-cooled compartment, rectifier blades, and a turbine. The duct is a hollow flow channel structure with a motor housing inside, housing a motor to drive the turbine's rotation. Air-cooled compartments are located at both ends of the motor housing, with an air gap connecting the motor and the housing to form an annular cooling air path. Cooling coils are located within the air-cooled compartment to receive heat conducted from the thermal pads. Specifically, the motor drives the turbine to rotate at high speed, generating an axial main airflow that propels air through the cooling coil area, accelerating heat removal and creating a highly efficient air-cooling path.

[0011] In a preferred embodiment, both the thermal pad and the cooling coil are equipped with capillary circulation channels and filled with coolant. Through the capillary motion and phase change mechanism of the liquid within the channels, a closed-loop thermal circulation system is formed. Specifically, heat is transferred from the motherboard to the cooling coil via the thermal pad, and then carried away by forced airflow, achieving rapid heat release and preventing localized temperature rise.

[0012] In a preferred example, the motor, air-cooled compartment, and turbine are coaxially arranged on the axis of the duct. Two sets of rectifier blades and two sets of turbine are located at both ends of the duct, with opposite rotation directions. Specifically, this structure forms an air inlet at one end of the duct and an exhaust outlet at the other, ensuring that airflow enters from one side and exits from the other, thereby improving overall airflow capacity and cooling efficiency.

[0013] In a preferred example, the air-cooled chamber is a metal mesh barrel structure with a gap between its outer periphery and the inner wall of the duct. The length of the outer blades of the rectifier vanes is equal to the width of the gap between the air-cooled chamber and the duct. Specifically, this structure can effectively control the airflow path, enhance the heat exchange surface area, and maintain structural strength and permeability.

[0014] In a preferred embodiment, the cooling coil includes two manifolds and several cooling pipes arranged obliquely in a spiral pattern inside the air-cooled chamber. The manifolds are connected to both ends of the flow channels of the thermal conductive pad. Specifically, the spiral pipe arrangement significantly increases the cooling area per unit volume, promotes uniform flow of coolant, and improves heat exchange efficiency.

[0015] In a preferred example, the rectifier blade surface is provided with guide vanes and additional rectifier vanes. The guide vanes cover the outer periphery of the impeller to help guide the radial airflow discharged from it forward, while the rectifier vanes further adjust the airflow to an axial path. Specifically, this configuration optimizes the airflow direction and velocity, avoids turbulence interference, and improves heat exchange stability and air-cooling system performance.

[0016] In summary, the low-voltage reactive power compensation controller of this utility model, through the design of external air cooling, internal heat conduction and structural airflow linkage, not only achieves efficient heat dissipation of the device, but also ensures the sealing of the shell and the cleanliness of the interior. It is suitable for intelligent power distribution systems with high requirements for operational stability, thermal management and environmental adaptability, and has good prospects for promotion and application.

[0017] The beneficial effects achieved by this utility model are as follows:

[0018] 1. In this utility model, by forming a closed cooling channel with the thermal conductive patch and the cooling coil, and combining it with the air-cooled structure composed of the impeller, rectifier blades and duct, efficient heat conduction and forced heat dissipation are achieved. This can effectively reduce the operating temperature of the heat-generating components on the motherboard, improve system stability and service life, and eliminate the need for an internal air duct, thereby maintaining the sealed and protected state of the internal electrical components and preventing dust and moisture corrosion.

[0019] 2. In this utility model, the air-cooled chamber is set at both ends of the motor and is connected to the coolant channel through the air gap. Combined with the symmetrically arranged double air turbines and rectifier blades, a symmetrical airflow structure is formed, which makes the airflow circulation in the duct smoother and the heat exchange efficiency higher. Especially in application scenarios with limited space or high sealing requirements, it has good adaptability and thermal management performance. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the present utility model;

[0021] Figure 2 This is a schematic diagram of the connection structure between the air cooler and the thermal conductive patch according to one embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the cross-sectional structure of an air cooler according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the motor housing, rectifier blades, and turbine structure according to one embodiment of the present invention.

[0024] Figure label:

[0025] 100. Control housing; 110. Mainboard;

[0026] 200. Air cooler; 210. Ductwork; 220. Air-cooled compartment; 230. Rectifier blade; 240. Air turbine; 250. Cooling coil; 211. Motor housing; 212. Motor; 213. Air gap;

[0027] 300. Thermal pad. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features of the present utility model can be combined with each other.

[0029] It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this invention.

[0030] The following describes, with reference to the accompanying drawings, some embodiments of a low-voltage reactive power compensation controller provided by this utility model.

[0031] Combination Figures 1-4 As shown, the present invention provides a low-voltage reactive power compensation controller, comprising: a control housing 100, an air cooler 200 and a thermal conductive pad 300, and a main board 110 disposed inside the control housing 100.

[0032] The thermal pad 300 is fixedly adhered to the surface of the motherboard 110, preferably made of a high thermal conductivity metal material, which enables rapid heat dissipation from the heat-generating components of the motherboard 110. The air cooler 200 is fixedly installed on one side of the control housing 100 to efficiently dissipate the heat conducted by the thermal pad 300 to the external environment, thereby preventing the internal temperature from becoming too high.

[0033] The air cooler 200 specifically includes: a duct 210, an air-cooled chamber 220, rectifier blades 230, and a turbine 240. The duct 210 is a hollow structure used to form a directional airflow channel, and a motor housing 211 is fixedly installed inside it. The motor housing 211 is a hollow cylindrical structure used to support and fix the motor 212. The motor 212 is installed inside the motor housing 211 and is connected to the turbine 240 via an output shaft, driving the turbine 240 to rotate at high speed to form an active airflow.

[0034] The air-cooled chamber 220 is fixedly installed at both ends of the motor housing 211, forming the ventilation path of the cooling fluid channel. An annular air gap 213 is provided between the inner wall of the motor housing 211 and the outer periphery of the motor 212. The air gap 213 is connected to the air-cooled chamber 220 at both ends, and is used to guide cold air through the space between the motor 212 and the motor housing 211 to form ventilation and cooling.

[0035] A cooling coil 250 is installed inside the air-cooled chamber 220, and the cooling coil 250 is connected to the thermal conductive pad 300 to form a closed-loop cooling circuit. The cooling coil 250 has several capillary circulation channels inside and is filled with coolant to receive heat conducted by the thermal conductive pad 300 and exchange heat through air cooling. A rectifier blade 230 is fixedly installed on one side of the air-cooled chamber 220 and works in conjunction with the air turbine 240 to rectify the radial airflow generated by the air turbine 240 into axial airflow, thereby enhancing airflow penetration.

[0036] The output shaft of the motor housing 211 passes through the air-cooled compartment 220 and the rectifier blade 230, and is fixedly connected to the central shaft of the air turbine 240, for transmitting the rotational torque of the motor 212.

[0037] In a preferred embodiment, both the cooling coil 250 and the thermal pad 300 have several capillary circulation channels inside and are filled with coolant. The coolant forms a natural thermal circulation through capillary force, conducting heat from the thermal pad 300 to the cooling coil 250, and dissipating the heat with the help of airflow. The thermal pad 300 is made of a high thermal conductivity metal material, such as copper or aluminum alloy, to enhance heat dissipation efficiency. The thermal pad 300 is attached to the surface of the power devices on the motherboard 110, and the air cooler 200 is installed on the outside of the control housing 100, forming a thermal isolation between the inside and outside of the housing, thereby achieving a sealed structure of the control housing 100, preventing the intrusion of external dust and moisture, and ensuring the safe operation of internal components.

[0038] In another preferred embodiment, the motor 212, the air-cooled chamber 220, and the turbine 240 are arranged collinearly on the axis of the duct 210. There are two sets of rectifier blades 230 and two sets of turbines 240, respectively located at both ends of the duct 210, with the blades of the two sets of rectifier blades 230 and turbines 240 rotating in opposite directions. This structure forms an active air inlet at one end of the duct 210 and an exhaust outlet at the other end, ensuring stable airflow along the direction of the duct 210 and thus achieving continuous and efficient heat dissipation for the cooling coil 250.

[0039] Furthermore, the air-cooled chamber 220 has a metal mesh barrel structure, which has good thermal conductivity and air permeability. An annular gap is reserved between the outer periphery of the air-cooled chamber 220 and the inner wall of the duct 210 to form an airflow channel. The length of the outer blades of the rectifier blade 230 is equal to the width of the outer periphery gap of the air-cooled chamber 220, allowing the airflow to pass smoothly through the gap in the metal mesh barrel after rectification, thus improving heat exchange efficiency.

[0040] In another preferred configuration, the cooling coil 250 includes two manifold rings and a plurality of cooling pipes arranged between the two manifold rings. The two manifold rings are respectively connected to both ends of the inner flow channel of the thermal conductive patch 300, and the plurality of cooling pipes are arranged obliquely in a spiral direction inside the air-cooled chamber 220 to form a serpentine channel that enhances the heat exchange surface area, which helps to improve the heat exchange effect of the coolant.

[0041] In addition, the surface of the rectifier blade 230 is further provided with guide vanes and rectifier blades located on the outer periphery of the turbine 240. The guide vanes are used to collect and guide the airflow discharged from the turbine 240, and the rectifier blades further adjust the airflow to flow along the axial direction of the duct 210, thereby enhancing the airflow stability and cooling capacity.

[0042] Through the coordinated operation of the above structures, this utility model can effectively dissipate heat from the internal heat source of the low-voltage reactive power compensation controller and prevent external pollution from entering, thereby improving the stability and lifespan of the system.

[0043] Working principle and usage process of this utility model:

[0044] This invention integrates a high-efficiency air-cooling structure onto the outside of the control housing, achieving indirect cooling of the motherboard's heat-generating components and system sealing protection. Its core principles include the following: The main heat-generating components on the motherboard 110 surface dissipate heat through a thermally conductive metal patch 300. The thermally conductive patch 300 contains capillary channels, where coolant forms a capillary circulation, enabling rapid heat absorption. The thermally conductive patch 300 is connected to the cooling coil 250, which also features a capillary circulation structure. The internal coolant flow forms a closed-loop thermal circulation, transferring heat to the air-cooled chamber 220 area. A turbine 240 is installed inside the duct 210, driven to rotate by a motor 212. Rectifier blades 230 at both ends form an airflow channel with air intake at one end and exhaust at the other. Guided by the guide blades, this airflow flows at high speed in the air-cooled chamber 220 area, thereby efficiently dissipating heat from the cooling coil 250. The radial airflow generated by the rotation of the turbine 240 is transformed into axial flow under the guidance of the rectifier blades 230. After passing through the surface of the coil, the airflow is discharged outside the equipment, realizing continuous air-cooling circulation. The air cooler 200 is completely located outside the control housing 100, forming a closed space inside the controller to prevent the intrusion of external dust, moisture, etc., and to protect the stable operation of the device.

[0045] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0046] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A low-voltage reactive power compensation controller, characterized in that, include: The control housing (100), air cooler (200), and thermal pad (300), and a main board (110) located inside the control housing (100), wherein the thermal pad (300) is fixedly attached to the surface of the main board (110), and the air cooler (200) is fixedly installed on one side of the control housing (100). The air cooler (200) includes: a duct (210), an air-cooled chamber (220), a rectifier blade (230), and a turbine (240). A motor housing (211) is fixedly installed inside the duct (210), and a drive mechanism is fixedly installed inside the motor housing (211). The motor (212) that rotates the air turbine (240) has the air-cooled chamber (220) fixedly installed at both ends of the motor housing (211), and the inner side of the motor housing (211) and the outer periphery of the motor (212) are provided with an air gap (213) for communication between the two air-cooled chambers (220). The inner side of the air-cooled chamber (220) is provided with a cooling coil (250) that communicates with the thermal pad (300). The rectifier blade (230) is fixed to one side of the air-cooled chamber (220). The output end of the motor housing (211) passes through the air-cooled chamber (220) and the rectifier blade (230) and is fixedly connected to the air turbine (240).

2. The low-voltage reactive power compensation controller according to claim 1, characterized in that, The cooling coil (250) and the heat-conducting pad (300) are provided with several capillary circulation channels and filled with coolant for heat conduction between the turbine (240) and the heat-conducting pad (300). The heat-conducting pad (300) is a component made of a high thermal conductivity metal material.

3. The low-voltage reactive power compensation controller according to claim 1, characterized in that, The motor (212), air-cooled chamber (220) and turbine (240) are located on the axis of the duct (210). There are two sets of rectifier blades (230) and turbines (240), which are located at both ends of the inner cavity of the duct (210). The blades on the surfaces of the two sets of rectifier blades (230) and turbines (240) rotate in opposite directions.

4. The low-voltage reactive power compensation controller according to claim 1, characterized in that, The air-cooled chamber (220) is a metal mesh barrel structure, and there is a gap between the outer periphery of the air-cooled chamber (220) and the inner wall of the duct pipe (210). The length of the outer blade of the rectifier blade (230) is equal to the width of the gap on the outer periphery of the air-cooled chamber (220).

5. The low-voltage reactive power compensation controller according to claim 1, characterized in that, The cooling coil (250) includes two collector rings and several cooling pipes arranged between the two collector rings. The two collector rings are respectively connected to the two ends of the flow channel in the heat-conducting patch (300). The several cooling pipes are arranged in a spiral oblique direction and located inside the air-cooled chamber (220).

6. The low-voltage reactive power compensation controller according to claim 1, characterized in that, The surface of the rectifier blade (230) is provided with guide vanes located on the outer periphery of the turbine (240) and rectifier blades located on the outer periphery of the rectifier blade (230), which are used to guide the radial airflow generated by the operation of the turbine (240) into axial airflow.