An electronic device

Abstract

The application relates to an electronic device, which comprises a shell, a screen, a circuit board, a circuit board support, a first heat-conducting member and a first electric connection structure. The screen is mounted on the shell, the circuit board support is located in a cavity surrounded by the shell, the circuit board is arranged on the circuit board support, and the circuit board and the screen are electrically connected. The first heat-conducting member is arranged between the circuit board support and the circuit board. By arranging the first heat-conducting member between the circuit board support and the circuit board, the first heat-conducting member can directly contact the circuit board, so that the heat dissipation efficiency of the circuit board is improved, and the service life of the electronic device and the heating device on the circuit board is prolonged. In addition, the circuit board is provided with a first connector, the first connector is connected with the circuit board support through the first electric connection structure to realize grounding, the isolation degree between the first connector and an antenna can be improved, and the risk of interference between the first connector and the antenna is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] Electronic devices consist of a housing and a screen mounted on the housing. The housing forms a cavity within the electronic device to house the electronic components. During operation, some of the electronic components within the cavity generate heat. This heat is primarily conducted to the back cover or screen via heat-conducting components, and then dissipated into the air through the back cover or screen, preventing the internal temperature of the electronic device from becoming too high. Improving the heat dissipation efficiency of electronic devices is a pressing issue that needs to be addressed. Utility Model Content

[0003] This application provides an electronic device that improves the heat dissipation efficiency of the electronic device by improving the way the heat-conducting components are arranged in the electronic device.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] A first aspect of this application provides an electronic device, which may include: a housing, a screen, a circuit board, a circuit board bracket, a first heat-conducting element, and a first electrical connection structure. The screen is mounted on the housing, the circuit board bracket is located within a cavity enclosed by the housing, the circuit board is disposed on the circuit board bracket, and the circuit board and screen are electrically connected. The first heat-conducting element is disposed between the circuit board bracket and the circuit board, and the circuit board has a first connector, which is connected to the circuit board bracket via the first electrical connection structure.

[0006] This embodiment of the application improves the heat dissipation efficiency of the circuit board and extends the lifespan of the electronic device and the heat-generating components on the circuit board by placing the first heat-conducting element between the circuit board bracket and the circuit board, allowing the first heat-conducting element to directly contact the circuit board. However, placing the first heat-conducting element between the circuit board bracket and the circuit board may prevent the first connector on the circuit board from connecting to the circuit board bracket and using the circuit board bracket as a reference ground. This could lead to a decrease in the isolation between the first connector and the antenna and an increased risk of interference. Therefore, this embodiment of the application also connects the first connector and the circuit board bracket through a first electrical connection structure, improving the isolation between the first connector and the antenna and reducing the risk of interference between the first connector and the antenna.

[0007] In one possible implementation, the housing includes a mid-frame and a back cover, with the screen mounted on the mid-frame. Along the thickness direction of the electronic device, the back cover and screen are located on either side of the mid-frame. In this case, the electronic device can be a mobile phone or a tablet.

[0008] In one possible implementation, the electronic device may further include a second electrical connection structure electrically connected to the first connector and electrically connected to the screen. The second electrical connection structure can be used to transmit screen signals, outputting signals from the first connector to the screen.

[0009] The first electrical connection structure may be implemented in various ways.

[0010] In some embodiments, the first thermal conductive element includes a first surface and a second surface disposed opposite to each other, the first surface facing the circuit board and the second surface facing the circuit board support. The first thermal conductive element includes a mounting hole that extends through the first surface and the second surface. A first electrical connection structure is disposed in the mounting hole. The side of the first electrical connection structure facing the circuit board is connected to a first connector, and the side of the first electrical connection structure facing the circuit board support is electrically connected to the circuit board support.

[0011] In other embodiments, the first electrical connection structure includes a first metal layer disposed on a first surface, a second metal layer disposed on a second surface, and a third metal layer connecting the first metal layer and the second metal layer. The first metal layer is electrically connected to a first connector, and the second metal layer is electrically connected to a circuit board support.

[0012] In one possible implementation, the first metal layer is in direct contact with the first connector, and the second metal layer is in direct contact with the circuit board bracket. Electrical connection between the first connector and the circuit board bracket can be achieved without setting up additional connection lines, which can simplify the assembly steps.

[0013] In one possible implementation, the vertical projection of the first connector onto the first heat-conducting element at least partially overlaps with the vertical projection of the first metal layer onto the first heat-conducting element. This facilitates direct contact between the first connector and the first metal layer, enabling electrical connection between them.

[0014] There are several ways to connect the third metal layer to the first and second metal layers.

[0015] In some embodiments, the third metal layer penetrates through the first and second surfaces of the first heat-conducting element to achieve the connection between the first metal layer and the second metal layer.

[0016] In other embodiments, the first heat-conducting element further includes a side surface connecting the first surface and the second surface, and a third metal layer is at least partially disposed on the side surface to achieve the connection between the first metal layer and the second metal layer.

[0017] In some embodiments, the electronic device further includes a protective film connected to a third metal layer, a first metal layer, and a second metal layer. The protective film can reduce the risk of wear on the third metal layer, at least a portion of the first metal layer, and at least a portion of the second metal layer to which it is connected.

[0018] In some embodiments, a first groove is provided on the first surface, and a first metal layer is disposed in the first groove, which can reduce the space occupied by the first electrical connection structure along the thickness direction of the electronic device and is beneficial to the compact design of the electronic device.

[0019] In some embodiments, a second groove is provided on the second surface, and a second metal layer is disposed in the second groove, which can further reduce the space occupied by the first electrical connection structure along the thickness direction of the electronic device.

[0020] In some embodiments, the first electrical connection structure is connected to the first thermally conductive element via an adhesive layer. The adhesive layer can fix the connection position between the first electrical connection structure and the first thermally conductive element, reducing the risk of slippage of the first electrical connection structure.

[0021] In some embodiments, the first electrical connection structure includes copper foil. Copper is ductile and inexpensive, and can be made into copper foil, allowing the first electrical connection structure to have a small dimension along the thickness direction of the electronic device. Furthermore, copper is conductive, enabling electrical connection between the first connector and the circuit board support.

[0022] In some embodiments, the electronic device further includes a battery, a wireless charging coil, a second heat-conducting element, and a third heat-conducting element. The battery is disposed within a cavity enclosed by the housing, and the third heat-conducting element is disposed between the battery and the wireless charging coil, serving to dissipate heat from the battery. The first, second, and third heat-conducting elements are integrated, and heat can be conducted between them, resulting in a more uniform temperature inside the electronic device.

[0023] In some embodiments, the first heat-conducting element includes at least one of a graphite sheet, a graphene film, a boron carbide heat dissipation film, and a heat spreader. Attached Figure Description

[0024] Figure 1 An exploded view of an electronic device provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0026] Figure 3 A schematic diagram of the structure of an electronic device provided for related technologies;

[0027] Figure 4 This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application;

[0028] Figure 5 This is a schematic diagram of the structure of a first heat-conducting component provided in an embodiment of this application;

[0029] Figure 6 This is a partial exploded view of an electronic device provided in an embodiment of this application;

[0030] Figure 7 This is a schematic diagram of a first electrical connection structure provided in an embodiment of this application;

[0031] Figure 8 This is a schematic diagram of another first electrical connection structure provided in an embodiment of this application;

[0032] Figure 9 for Figure 8 AA section view;

[0033] Figure 10 This is a schematic diagram of a first connector and a first electrical connection structure provided in an embodiment of this application, projected vertically onto a first heat-conducting component.

[0034] Figure label:

[0035] 100 - Screen; 200 - Back cover; 300 - Mid-frame; 400 - Battery; 500 - Circuit board; 510 - Circuit board; 511 - First connector; 520 - Small board; 521 - Fourth connector; 530 - Second electrical connection structure; 531 - Second connector; 532 - Third connector; 540 - First electrical connection structure; 541 - First metal layer; 542 - Second metal layer; 543 - Third metal layer; 550 - Protective film; 560 - Adhesive layer; 561 - First adhesive layer; 562 - Second adhesive layer; 600 - Camera; 710 - First thermal conductive component; 711 - First thermal conductive element; 712 - Second thermal conductive element; 713 - Third thermal conductive element; 720 - Second thermal conductive element; 800 - Circuit board bracket; 801 - Circuit board bracket; 802 - Small board bracket; 901 - Wireless charging coil; 902 - NFC antenna. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0037] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0038] Furthermore, in the embodiments of this application, directional terms such as "upper" and "lower" are defined relative to the orientation in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation in which the components are placed in the accompanying drawings.

[0039] This application provides an electronic device, which may include a mobile phone, tablet computer, personal digital assistant (PDA), smart wearable products (e.g., smartwatches, smart bracelets), virtual reality (VR) devices, augmented reality (AR) devices, drones, and other terminal devices. Alternatively, it may be a base station, television, router, automobile, or other similar devices. This application does not impose any special limitations on the specific form of the electronic device; for ease of explanation, the following description uses a mobile phone as an example.

[0040] like Figure 1 The diagram shown is an exploded view of an electronic device according to an embodiment of this application. The electronic device may include a housing and a screen 100 mounted on the housing. The housing may include a mid-frame 300 and a back cover 200, with the screen 100 mounted on the mid-frame 300. Along the thickness direction (Z-direction) of the electronic device, the back cover 200 and the screen 100 are located on opposite sides of the mid-frame 300. The mid-frame 300 provides support for the screen 100.

[0041] For ease of explanation, Figure 1 A coordinate system is established. When a user holds the electronic device (usually vertically facing the screen 100), the device is positioned with top, bottom, left, and right sides. The direction from the bottom of the device to the top is the X-axis, the direction from the right side to the left is the Y-axis, and the direction from the back cover 200 to the screen 100 is the Z-axis. The coordinate system definitions in subsequent figures are similar and will not be repeated.

[0042] The screen 100 can be a liquid crystal display (LCD), an organic light emitting diode (OLED) screen, a micro (or mini) light-emitting diode (LED) screen, or a quantum dot light emitting diode (QLED) screen, etc. This application does not limit the type of the screen mentioned above.

[0043] The aforementioned electronic device may also include at least one of the following: a processor electrically connected to the screen 100, a sensor, a memory, a charging management module, a power management module, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, a headphone jack, and a camera 600, all electrically connected to the processor.

[0044] Continue as Figure 1 As shown, the electronic device may also include a circuit board 500, on which electronic components such as the processor, memory, charging management module, and power management module in the above examples can be integrated. In some electronic devices, the circuit board 500 may include a circuit board 510 and a small board 520. Some electronic components in the above examples are disposed on the circuit board 510, while others are disposed on the small board 520. In some examples, the circuit board 510 is the motherboard of the electronic device. In some examples, such as... Figure 2 As shown, the antenna can be integrated on the circuit board 510, and the antenna is, for example, a near field communication (NFC) antenna 902.

[0045] The NFC antenna 902 is a component used to enable short-range wireless communication, typically operating at 13.56 MHz. The NFC antenna allows devices to exchange data with other devices or tags at very close range (usually within a few centimeters).

[0046] To secure the circuit board 500 within the electronic device, the device may further include a circuit board bracket 800, which connects to the mid-frame 300 and the circuit board 500. The circuit board bracket 800 may include a circuit board bracket 801 and a small board bracket 802. The circuit board bracket 801 is connected to the circuit board 510, and the small board bracket 802 is connected to the small board 520.

[0047] In order to achieve electrical connection between screen 100 and processor on circuit board 510, such as Figure 2As shown, the circuit board 510 may include a first connector 511. The electronic device may include a second electrical connection structure 530, which is electrically connected to the first connector and to the screen 100 (see...). Figure 1 Electrical connection. The second electrical connection structure 530 can be used to transmit screen signals, outputting signals from the first connector 511 to the screen.

[0048] In some examples, such as Figure 2 As shown, the second electrical connection structure 530 may include a flexible printed circuit (FPC). This flexible printed circuit may include a first end near the circuit board 510 and a second end near the small board 520. A second connector 531 is disposed at the first end, and a third connector 532 is disposed at the second end. A fourth connector 521 is disposed on the small board 520. The first connector 511 and the second connector 531 are electrically connected, and the third connector 532 and the fourth connector 521 are electrically connected. The small board 520 may include components that connect to the screen 100 (see...). Figure 1 The metal traces for electrical connection. The screen signal is transmitted from the processor through the metal traces in the first connector 511, the second connector 531, the third connector 532, the fourth connector 521 and the small board 520, and finally to the screen 100.

[0049] In one possible implementation, the second electrical connection structure 530 may include a mobile industry processor interface (MIPI) signal line.

[0050] In one possible implementation, the first connector 511, the second connector 531, the third connector 532, and the fourth connector 521 include board-to-board (BTB) connectors. In some examples, the first connector 511 is electrically connected to the circuit board bracket 801, so that the circuit board bracket 801 can provide a reference ground for the first connector 511, allowing for better transmission of screen signals. In some examples, the first connector 511 achieves electrical connection through contact with the circuit board bracket 801.

[0051] Continue as Figure 1 As shown, the electronic device may also include a battery 400, which can power some components in the electronic device. The battery 400 is disposed between the screen 100 and the back cover 200.

[0052] To achieve wireless charging functionality, in some embodiments, such as Figure 1 As shown, the electronic device also includes a wireless charging coil 901, which is disposed on the side of the battery 400 facing the rear cover 200.

[0053] During the operation of the electronic device, the processor on the circuit board 510 generates heat, and the battery 400 also generates heat during charging. To dissipate the heat generated by the operating components and the charging process of the battery 400 into the air, preventing the internal temperature of the electronic device from becoming too high, in some examples, the heat from the heat-generating components is first conducted to the mid-frame 300, back cover 200, and screen 100, and then dissipated into the air through these components. Since the back cover 200 and screen 100 have a larger area than the mid-frame 300, heat is primarily dissipated into the air through the back cover 200 and screen 100; that is, the back cover 200 and screen 100 serve as two heat dissipation surfaces for the electronic device. The heat-generating components may include the battery 400, the processor on the circuit board 510, etc.

[0054] In order to conduct the heat generated by the heat-generating components to the back cover 200 and the screen 100, continue as follows Figure 1 As shown, the electronic device may further include a first heat-conducting component 710 and a second heat-conducting component 720. The first heat-conducting component 710 is located on the side of the heat-generating device facing the rear cover 200, and is used to conduct the heat generated by the heat-generating device to the rear cover 200. The second heat-conducting component 720 is located on the side of the heat-generating device facing the screen 100, and is used to conduct the heat generated by the heat-generating device to the screen 100.

[0055] The first heat-conducting component 710 and the second heat-conducting component 720 may each include at least one of graphite sheet, graphene film, boron carbide heat dissipation film, heat spreader, and copper foil. For example, the first heat-conducting component 710 is a graphite sheet, and the second heat-conducting component 720 is a copper foil.

[0056] In related technologies, such as Figure 3 As shown, the first heat-conducting component 710 is located on the side of the circuit board bracket 801 facing the rear cover 200, while the heat-generating device is located on the circuit board 510. The first heat-conducting component 710 cannot directly contact the heat-generating device, resulting in inadequate heat dissipation for the electronic device. Furthermore, the first heat-conducting component 710 is located between the battery 400 and the wireless charging coil 901. To prevent the wireless charging coil 901 from slipping, it can be adhered to the first heat-conducting component 710. In the event of a drop, the first heat-conducting component 710 may be pulled by the wireless charging coil 901, causing it to tear, thereby affecting the heat dissipation performance and reliability of the electronic device.

[0057] To improve the heat dissipation efficiency of electronic devices, embodiments of this application provide an electronic device, such as... Figure 4As shown, the electronic device may include: a housing, a screen 100, a circuit board 510, a circuit board bracket 801, and a first heat-conducting component 710. The housing may include a mid-frame 300 and a screen 100, which can be mounted on the housing. The circuit board bracket 801 is located within a cavity enclosed by the housing, and the circuit board 510 is disposed on the circuit board bracket 801, with the circuit board 510 and screen 100 electrically connected. The first heat-conducting component 710 may include a first heat-conducting element 711, which is disposed between the circuit board bracket 801 and the circuit board 510.

[0058] The first heat-conducting component 711 includes at least one of graphite sheet, graphene film, boron carbide heat dissipation film, and heat spreader. By placing the first heat-conducting component 711 between the circuit board support 801 and the circuit board 510, the first heat-conducting component 711 can directly contact the circuit board 510, thereby improving the heat dissipation efficiency of the circuit board 510 and extending the service life of the electronic equipment and the heat-generating devices on the circuit board 510.

[0059] In addition, continue as Figure 4 As shown, since the circuit board bracket 801 and the wireless charging coil 901 are located on the same side of the first heat-conducting component 710, the wireless charging coil 901 can be connected to the circuit board bracket 801 without being bonded to the first heat-conducting component 710, thereby reducing the risk of the first heat-conducting component 710 tearing in the event of an electronic device being dropped.

[0060] To achieve battery heat dissipation, in some embodiments, the following continues... Figure 4 As shown, the electronic device also includes a battery 400 and a wireless charging coil 901. The first heat-conducting component 710 may include a second heat-conducting element 712 and a third heat-conducting element 713. The battery 400 is disposed within the cavity enclosed by the housing, and the third heat-conducting element 713 is disposed between the battery 400 and the wireless charging coil 901, and the third heat-conducting element 713 can be used to dissipate heat from the battery 400.

[0061] In this case, the first heat-conducting element 711, the second heat-conducting element 712 and the third heat-conducting element 713 are integrated into one unit, and the heat between the first heat-conducting element 711, the second heat-conducting element 712 and the third heat-conducting element 713 can be conducted to each other, so that the temperature inside the electronic device is more uniform.

[0062] Since the heights of the first circuit board 510 and the battery may differ, in some embodiments, such as Figure 5 As shown, the extension direction (X direction) of the first heat-conducting element 711 is the same as that of the third heat-conducting element 713, and the extension directions of the second heat-conducting element 712 and the first heat-conducting element 711 (or the third heat-conducting element 713) intersect.

[0063] However, the first heat-conducting element 711 is located between the circuit board support 801 and the circuit board 510, which may cause the first connector 511 on the circuit board 510 (see...) Figure 2 Unable to connect to circuit board bracket 801, with circuit board bracket 801 as the reference ground.

[0064] Due to the NFC antenna 902 (see...) Figure 1 Both the NFC antenna 902 and the first connector 511 are located on the circuit board 510. The close proximity of the NFC antenna 902 and the first connector 511 may reduce the isolation between them and increase the risk of interference. For example, if the harmonic components of the screen signal transmitted by the first connector 511 fall into the operating frequency band of the NFC antenna 902, it may interfere with the operation of the NFC antenna 902. Furthermore, the second electrical connection structure 530 connected to the first connector 511 may act as an antenna, receiving energy radiated by the NFC antenna 902, thus degrading the quality of the screen signal transmitted by the first connector 511 and the second connection structure 530.

[0065] In some embodiments, to connect the first connector 511 and the circuit board bracket 801, holes may be drilled in the first heat-conducting element 711 so that the first connector 511 passes through the first heat-conducting element 711 and connects with the circuit board bracket 801. However, drilling holes in the first heat-conducting element 711 reduces the area of ​​the first heat-conducting element 711, which may reduce the heat dissipation performance of the first heat-conducting element 711.

[0066] To ensure the performance of the first heat-conducting component, and in order to connect the first connector 511 and the circuit board bracket 801, in some embodiments, such as... Figure 6 The diagram shown is an exploded view of another electronic device provided in this application embodiment. The electronic device also includes a first electrical connection structure 540, through which a first connector 511 is connected to a circuit board support 801. Connecting the first connector 511 and the circuit board support 801 via the first electrical connection structure 540 improves the isolation between the first connector 511 and the NFC antenna 902, reducing the risk of interference between them.

[0067] To verify the effectiveness of the first electrical connection structure 540, the isolation between the first connector 511 and the NFC antenna 902 was simulated at 800MHz. The isolation between the first connector 511 and the NFC antenna 902 was improved from -52dB to -64dB, reducing the risk of interference between the first connector 511 and the NFC antenna 902.

[0068] Isolation refers to the ratio of the signal received by one device after transmitting a signal to the signal received by another device. Isolation is a physical quantity used to measure the degree of mutual coupling between devices. Assuming two devices form a two-port network, the isolation between them can be represented by the parameters S21 and S12. S21 and S12 are typically negative. The smaller the S21 and S12 parameters, the greater the isolation between the devices, the less mutual coupling, and the lower the risk of interference between them.

[0069] The material of the first electrical connection structure 540 in this embodiment is not limited; the first electrical connection structure 540 can be any conductive material. For example, the material of the first electrical connection structure 540 may include copper. The first electrical connection structure 540 includes copper foil. Copper has good ductility and is relatively inexpensive, and can be made into copper foil, allowing the first electrical connection structure 540 to have a small dimension along the thickness direction (Z direction) of the electronic device. Furthermore, copper has conductive properties and can electrically connect the first connector 511 and the circuit board support 801.

[0070] The first electrical connection structure 540 may be implemented in various forms. In some embodiments, such as Figure 7 As shown, the first heat-conducting element 711 includes a first surface S1 and a second surface S2 disposed opposite to each other, with the first surface S1 facing the circuit board 510 (see Figure 1). Figure 6 The second side S2 faces the circuit board bracket 801 (see...). Figure 6 The first heat-conducting element 711 includes a mounting hole that extends through the first surface S1 and the second surface S2. A first electrical connection structure 540 is disposed in the mounting hole. The side of the first electrical connection structure 540 facing the circuit board 510 and the first connector 511 (see...) Figure 6 The first electrical connection structure 540 is electrically connected to the circuit board support 801 on the side facing the circuit board support 801.

[0071] However, the process of drilling holes in the first heat-conducting element 711 to embed the first electrical connection structure 530 is relatively complex. In other embodiments, such as... Figure 8 As shown, the first electrical connection structure 540 includes a first metal layer 541 disposed on a first surface S1, a second metal layer 542 disposed on a second surface S2, and a third metal layer 543 connecting the first metal layer 541 and the second metal layer 542. The first metal layer 541 is connected to the first connector 511 (see...). Figure 6 Electrical connection, the second metal layer 542 and the circuit board bracket 801 (see) Figure 6 Electrical connection.

[0072] To facilitate the connection of the third metal layer 543 to the first metal layer 541 and the second metal layer 542, such as Figure 8As shown, in some examples, the third metal layer 543 penetrates the first surface S1 and the second surface S2 of the first heat conductor 711. In other examples, the first heat conductor 711 also includes a side surface S3 connecting the first surface S1 and the second surface S2, the third metal layer 543 is at least partially disposed on the side surface S3, and the first metal layer 541 and the second metal layer 542 are disposed near the edge of the first heat conductor 711.

[0073] To simplify the assembly process, in one possible implementation, such as Figure 9 As shown, is Figure 8 In the AA cross-sectional view, the first metal layer 541 is in direct contact with the first connector 511, and the second metal layer 542 is in direct contact with the circuit board bracket 801. The electrical connection between the first connector 511 and the circuit board bracket 801 can be achieved without setting up additional connection lines.

[0074] To facilitate direct contact between the first connector 511 and the first metal layer 541, in one possible implementation, such as Figure 10 As shown, the vertical projection M1 of the first connector 511 on the first heat-conducting element 711 at least partially overlaps with the vertical projection M2 of the first metal layer 541 on the first heat-conducting element 711. In some examples, the vertical projection M1 of the first connector 511 on the first heat-conducting element 711 is located within the range of the vertical projection M2 of the first metal layer 541 on the first heat-conducting element 711.

[0075] To reduce the risk of wear on the first heat-conducting element 711, in some embodiments, such as Figure 9 As shown, the electronic device also includes a protective film 550, which is connected to a third metal layer 543, at least a portion of a first metal layer 541, and at least a portion of a second metal layer 542. In some examples, the protective film 550 may include polyethylene terephthalate (PET), which has good mechanical strength, insulation, and heat resistance, thus protecting the first heat-conducting element 711 without interfering with its electrical connection.

[0076] For a compact internal design of the electronic device, the space occupied by the first electrical connection structure 540 along the thickness direction (Z direction) of the electronic device can be reduced. In some embodiments, such as Figure 9 As shown, a first groove 01 is provided on the first surface S1, and a first metal layer 541 is disposed within the first groove 01. In some embodiments, such as Figure 9 As shown, a second groove 02 is provided on the second surface S2, and a second metal layer 542 is disposed in the second groove 02.

[0077] To fix the relative positions of the first electrical connection structure 540 and the first heat-conducting element 711, in some embodiments, such as Figure 9 As shown, the first electrical connection structure 540 and the first heat-conducting component 711 are connected by an adhesive layer 560. The adhesive layer 560 can fix the connection position between the first electrical connection structure 540 and the first heat-conducting component 711, reducing the risk of slippage of the first electrical connection structure 540.

[0078] The materials of the adhesive layer 560 are not limited in this application embodiment. The adhesive layer 560 may include epoxy resin-based thermally conductive adhesive, silicone thermally conductive adhesive, acrylate pressure-sensitive adhesive (PSA), or polyurethane thermally conductive adhesive. In some examples, the adhesive layer 560 may have insulating properties.

[0079] In some examples, adhesive layer 560 may include a first adhesive layer 561, through which the first metal layer 541 is connected to the first thermally conductive element 711. In some examples, adhesive layer 560 may include a second adhesive layer 562, through which the second metal layer 542 is connected to the first thermally conductive element 711.

[0080] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0081] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: case; A screen, which is mounted on the housing; A circuit board support is disposed within the cavity enclosed by the housing; A circuit board, which is mounted on the circuit board support and is electrically connected to the screen; A first heat-conducting component is disposed between the circuit board bracket and the circuit board; A first electrical connection structure is provided, wherein the circuit board has a first connector, and the first connector is connected to the circuit board support through the first electrical connection structure.

2. The electronic device according to claim 1, characterized in that, The first heat-conducting component includes a first surface and a second surface disposed opposite to each other; the first surface faces the circuit board, and the second surface faces the circuit board support; The first electrical connection structure includes a first metal layer disposed on the first surface, a second metal layer disposed on the second surface, and a third metal layer connecting the first metal layer and the second metal layer; The first metal layer is electrically connected to the first connector, and the second metal layer is electrically connected to the circuit board bracket.

3. The electronic device according to claim 2, characterized in that, The first metal layer is in direct contact with the first connector, and the second metal layer is in direct contact with the circuit board bracket.

4. The electronic device according to claim 3, characterized in that, The vertical projection of the first connector onto the first heat-conducting component at least partially overlaps with the vertical projection of the first metal layer onto the first heat-conducting component.

5. The electronic device according to any one of claims 2-4, characterized in that, The first heat-conducting element also includes a side surface connecting the first surface and the second surface, and the third metal layer is at least partially disposed on the side surface.

6. The electronic device according to claim 5, characterized in that, The electronic device further includes a protective film connected to the third metal layer, connected to at least a portion of the first metal layer, and connected to at least a portion of the second metal layer.

7. The electronic device according to any one of claims 2-4, characterized in that, A first groove is provided on the first surface, and the first metal layer is disposed in the first groove.

8. The electronic device according to claim 7, characterized in that, A second groove is provided on the second surface, and the second metal layer is disposed in the second groove.

9. The electronic device according to any one of claims 1-4, characterized in that, The first electrical connection structure is connected to the first thermally conductive component through an adhesive layer.

10. The electronic device according to any one of claims 1-4, characterized in that, The first electrical connection structure includes copper foil.

11. The electronic device according to any one of claims 1-4, characterized in that, The housing includes a middle frame and a back cover, and the screen is mounted on the middle frame; along the thickness direction of the electronic device, the back cover and the screen are located on both sides of the middle frame; The electronic device includes a second electrical connection structure, which is electrically connected to the first connector and to the screen.

12. The electronic device according to claim 11, characterized in that, The electronic device further includes: a second heat-conducting component and a third heat-conducting component, wherein the first heat-conducting component, the second heat-conducting component, and the third heat-conducting component are integrated into one unit; A battery, wherein the battery is disposed within a cavity enclosed by the housing; A wireless charging coil, wherein the third heat-conducting element is disposed between the battery and the wireless charging coil.

13. The electronic device according to any one of claims 1-4, characterized in that, The first heat-conducting component includes at least one of graphite sheet, graphene film, boron carbide heat dissipation film, and heat spreader.

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