FPC gold finger reinforcing device capable of preventing pad falling

Abstract

This utility model provides an FPC gold finger reinforcement device to prevent solder pad detachment, comprising: a substrate and multiple gold finger bodies, further comprising: a support structure, wherein the support structure is installed between each two adjacent solder pad bodies; a protective structure, wherein the protective structure is sleeved on one end of the substrate and the gold finger bodies; and an anti-bending structure, wherein the anti-bending structure is provided between the outermost two gold finger bodies, which are far apart from each other, and the protective structure. The FPC gold finger reinforcement device provided by this utility model increases the bonding area between the solder pad bodies and the substrate through support ribs and connecting rods, thereby increasing the bonding force between the two and preventing loosening or detachment during insertion and removal. The reinforcing plates on both sides distribute the bending force, preventing wrinkles or damage to the solder pad bodies and gold finger bodies after being stretched, which would affect the performance and subsequent use.

Description

Technical Field

[0001] This utility model relates to the field of FPC pads, and in particular to an FPC gold finger reinforcement device to prevent pad detachment. Background Technology

[0002] FPC gold fingers are elongated conductive contacts designed on the edge area of ​​an FPC. They are typically made of copper foil and plated with gold. They are soldered onto the FPC via pads to achieve electrical connection, serving as the interface between the FPC and external connectors, sockets, or other circuit components.

[0003] FPCs often need to be bent during use, which can easily lead to loose or even detached solder pads, causing solder joint breakage, poor contact, or even complete circuit disconnection, thus shortening the lifespan of the FPC.

[0004] Therefore, it is necessary to provide an FPC gold finger reinforcement device to prevent solder pad detachment and solve the above-mentioned technical problems. Utility Model Content

[0005] This invention provides an FPC gold finger reinforcement device to prevent solder pads from falling off, which solves the problem that FPCs often need to be bent during use, which can easily lead to loosening or even falling off of the solder pads.

[0006] To solve the above technical problems, the present invention provides an FPC gold finger reinforcement device for preventing solder pad detachment, comprising: a substrate and a plurality of gold finger bodies, wherein the plurality of gold finger bodies are all welded side by side at equal intervals to the surface of the substrate through solder pad bodies, and further comprising: a support structure, wherein the support structure is installed between two adjacent solder pad bodies, and the support structure is used to fix the solder pad bodies.

[0007] A protective structure is sleeved on one end of the substrate and the gold finger body, and the protective structure is used to limit the position of the gold finger body;

[0008] The anti-bending structure is provided between the outermost two gold finger bodies, which are far apart from each other, and the protective structure.

[0009] Preferably, the support structure includes a support rib and a plurality of connecting rods. The support rib is fixedly installed on the surface of the substrate and is located between two adjacent pad bodies. A plurality of connecting rods are symmetrically installed on both sides of the support rib, and each connecting rod is connected to the pad body.

[0010] Preferably, the protective structure includes a support plate and a protective film. The support plate is sleeved on one end of the substrate and the gold finger body, and the protective film is disposed between the support plate and the gold finger body.

[0011] Preferably, the anti-bending structure includes a reinforcing plate, an adhesive element, and an insulating layer. The reinforcing plate is mounted on the surface of the substrate via the adhesive element, and the insulating layer is provided between the reinforcing plate and the adhesive element and the outermost gold finger body.

[0012] Preferably, the gold finger body has arc-shaped corners on both sides of the insertion end.

[0013] Preferably, the FPC gold finger reinforcement device for preventing solder pad detachment further includes an anti-warping structure, which is disposed on the substrate and is used to prevent the insertion end of the gold finger body from warping.

[0014] Preferably, the anti-warping structure includes a reinforcing plate and a protective layer. The reinforcing plate is installed between the substrate and the supporting plate. The protective layer is provided on one side of the insertion end of the substrate and the gold finger body, and the protective layer covers the gold finger body.

[0015] Compared with related technologies, the FPC gold finger reinforcement device for preventing solder pad detachment provided by this utility model has the following beneficial effects:

[0016] This utility model provides an FPC gold finger reinforcement device to prevent solder pad detachment. By using support ribs and connecting rods, the bonding area between the solder pad body and the substrate is increased, thereby increasing the bonding force between the two and preventing loosening or detachment during insertion and removal. When bending occurs, the bending force is distributed by the reinforcing plates on both sides, preventing the solder pad body and gold finger body from being stretched and wrinkled or damaged, which would affect the performance and subsequent use. Attached Figure Description

[0017] Figure 1 A schematic diagram of a preferred embodiment of the FPC gold finger reinforcement device for preventing solder pad detachment provided by this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the support structure of this utility model;

[0020] Figure 4 This is a front sectional view of the present invention;

[0021] Figure 5 for Figure 4 The enlarged schematic diagram of part A shown below;

[0022] Figure 6 This is a right-side cross-sectional view of the present invention.

[0023] Numbering on the map:

[0024] 1. Substrate; 11. Pad body; 12. Gold finger body; 121. Curved corner;

[0025] 2. Support structure; 21. Support ribs; 22. Connecting rods;

[0026] 3. Protective structure; 31. Reinforcing plate; 32. Protective film;

[0027] 4. Anti-bending structure; 41. Reinforcing plate; 42. Adhesive components; 43. Insulation layer;

[0028] 5. Anti-warping structure; 51. Reinforcing plate; 52. Protective layer. Detailed Implementation

[0029] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0030] First Embodiment

[0031] Please refer to the following: Figure 1 and Figure 2 An FPC gold finger reinforcement device for preventing solder pad detachment includes: a substrate 1 and a plurality of gold finger bodies 12, wherein the plurality of gold finger bodies 12 are all welded side by side at equal intervals to the surface of the substrate 1 through solder pad bodies 11; and further includes: a support structure 2, wherein the support structure 2 is installed between two adjacent solder pad bodies 11, and the support structure 2 is used to fix the solder pad bodies 11.

[0032] A protective structure 3 is sleeved on one end of the substrate 1 and the gold finger body 12, and the protective structure 3 is used to limit the gold finger body 12.

[0033] The anti-bending structure 4 is provided between the outermost two gold finger bodies 12 and the protective structure 3 on the side that is far apart from each other.

[0034] A shielding layer is filled between multiple gold finger bodies 12 and inside the protective structure 3 to prevent interference between the gold finger bodies 12. When the FPC is inserted into the connector for insertion and removal, the support structure 2 connects two adjacent pad bodies 11, increasing the bonding area and bonding force between the pad body 11 and the substrate 1, preventing the pad body 11 from falling off during insertion and removal. At the same time, the protective structure 3 clamps and protects the exposed ends of the gold finger bodies 12 and the pad bodies 11. When bending occurs, the bending force is distributed by two anti-bending structures 4 to prevent the gold finger bodies 12 and the pad bodies 11 from cracking or falling off due to bending and pulling, which would affect subsequent use.

[0035] Please refer to the following: Figure 2 and Figure 3 The support structure 2 includes a support rib 21 and a plurality of connecting rods 22. The support rib 21 is fixedly installed on the surface of the substrate 1 and is located between two adjacent pad bodies 11. A plurality of connecting rods 22 are symmetrically installed on both sides of the support rib 21 and each connecting rod 22 is connected to the pad body 11.

[0036] In use, the pad body 11 is connected to the support rib 21 by multiple connecting rods 22. The support rib 21 and connecting rods 22 increase the bonding area between the pad body 11 and the substrate 1, thereby increasing the bonding force between the two and preventing loosening or detachment during insertion and removal.

[0037] Please refer to the following: Figure 2 , Figure 4 and Figure 6 The protective structure 3 includes a support plate 31 and a protective film 32. The support plate 31 is sleeved on one end of the substrate 1 and the gold finger body 12, and the protective film 32 is provided between the support plate 31 and the gold finger body 12.

[0038] The support plate 31 clamps and protects the exposed pad body 11 and gold finger body 12 from the substrate 1, so that the two are tightly attached to each other, preventing the exposed parts from being separated or falling off due to external force. At the same time, a protective film 32 is set between the gold finger body 12 and the support plate 31 to prevent the support plate 31 from damaging the gold finger body 12.

[0039] Please refer to the following: Figure 3 and Figure 4 The anti-bending structure 4 includes a reinforcing plate 41, an adhesive 42, and an insulating layer 43. The reinforcing plate 41 is mounted on the surface of the substrate 1 through the adhesive 42. The insulating layer 43 is provided between the reinforcing plate 41 and the adhesive 42 and the outermost gold finger body 12.

[0040] When the gold finger body 12 needs to be bent, the bending force is distributed by the reinforcing plates 41 on both sides to prevent the pad body 11 and the gold finger body 12 from being stretched and wrinkled or damaged, which would affect the performance. At the same time, the reinforcing plate 41 is separated from the gold finger body 12 by the insulating layer 43 to avoid interference with the gold finger body 12.

[0041] Please refer to the following: Figure 2 The gold finger body 12 has arc-shaped corners 121 on both sides of the insertion end;

[0042] By setting the gold finger body 12 and the pad body 11 into arc angles 121 on both sides of the insertion direction, the friction and collision with the interface of the connecting device are reduced, and the insertion ends of the pad body 11 and the gold finger body 12 are prevented from becoming loose or falling off.

[0043] Second Embodiment

[0044] Please refer to the following: Figure 1 and Figure 6 The FPC gold finger reinforcement device for preventing solder pad detachment also includes an anti-warping structure 5, which is disposed on the substrate 1 and is used to prevent the insertion end of the gold finger body 12 from warping.

[0045] In this embodiment, the strength of the substrate 1 is improved by the anti-warping structure 5, and the insertion ends of the pad body 11 and the gold finger body 12 are protected to prevent the pad body 11 and the gold finger body 12 from falling off.

[0046] Please refer to the reference again. Figure 1 and Figure 6 The anti-warping structure 5 includes a reinforcing plate 51 and a protective layer 52. The reinforcing plate 51 is installed between the substrate 1 and the supporting plate 31. The protective layer 52 is provided on one side of the insertion end of the substrate 1 and the gold finger body 12, and the protective layer 52 covers the gold finger body 12.

[0047] The reinforcing plate 51 is made of PI or stainless steel. The strength of the substrate 1 is improved by the reinforcing plate 51, which further enhances the bending resistance. At the same time, the protective layer 52 protects the insertion end of the pad body 11 and the gold finger body 12, preventing the insertion end from being damaged or falling off due to repeated insertion and removal.

[0048] The working principle of the FPC gold finger reinforcement device for preventing solder pad detachment provided by this utility model is as follows:

[0049] When the FPC is inserted into the connector for insertion and removal, multiple connecting rods 22 connect the pad body 11 to the support rib 21. The support rib 21 and connecting rods 22 increase the bonding area between the pad body 11 and the substrate 1, increasing the bonding force between them and preventing loosening or detachment during insertion and removal. At the same time, the retaining plate 31 clamps and protects the exposed pad body 11 and gold finger body 12 from the substrate 1, ensuring a tight fit between them and preventing the exposed parts from being separated or detached by external force. When bending occurs, the reinforcing plates 41 on both sides distribute the bending force, preventing the pad body 11 and gold finger body 12 from being pulled and wrinkled or damaged, which would affect the performance and subsequent use. The protective layer 52 is provided to enhance the strength of the substrate 1 through the reinforcing plate 51, thereby further improving its resistance to bending. At the same time, the protective layer 52 protects the insertion ends of the pad body 11 and the gold finger body 12, preventing damage or detachment of the insertion ends due to repeated insertion and removal.

[0050] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A reinforcement device for FPC gold fingers to prevent solder pad detachment, comprising: The substrate and multiple gold finger bodies, wherein the multiple gold finger bodies are all welded side by side at equal intervals to the surface of the substrate through solder pad bodies, characterized in that it further includes: a support structure, wherein the support structure is installed between each two adjacent solder pad bodies, and the support structure is used to fix the solder pad bodies; A protective structure is sleeved on one end of the substrate and the gold finger body, and the protective structure is used to limit the position of the gold finger body; The anti-bending structure is provided between the outermost two gold finger bodies, which are far apart from each other, and the protective structure.

2. The FPC gold finger reinforcement device for preventing solder pad detachment according to claim 1, characterized in that, The support structure includes a support rib and a plurality of connecting rods. The support rib is fixedly installed on the surface of the substrate and is located between two adjacent pad bodies. A plurality of connecting rods are symmetrically installed on both sides of the support rib and are all connected to the pad bodies.

3. The FPC gold finger reinforcement device for preventing solder pad detachment according to claim 1, characterized in that, The protective structure includes a support plate and a protective film. The support plate is sleeved on one end of the substrate and the gold finger body, and the protective film is disposed between the support plate and the gold finger body.

4. The FPC gold finger reinforcement device for preventing solder pad detachment according to claim 3, characterized in that, The anti-bending structure includes a reinforcing plate, an adhesive component, and an insulating layer. The reinforcing plate is mounted on the surface of the substrate via the adhesive component, and the insulating layer is provided between the reinforcing plate and the adhesive component and the outermost gold finger body.

5. The FPC gold finger reinforcement device for preventing solder pad detachment according to claim 1, characterized in that, The gold finger body has arc-shaped corners on both sides of the insertion end.

6. The FPC gold finger reinforcement device for preventing solder pad detachment according to claim 3, characterized in that, The FPC gold finger reinforcement device for preventing solder pad detachment also includes an anti-warping structure, which is disposed on the substrate and is used to prevent the insertion end of the gold finger body from warping.

7. The FPC gold finger reinforcement device for preventing solder pad detachment according to claim 6, characterized in that, The anti-warping structure includes a reinforcing plate and a protective layer. The reinforcing plate is installed between the substrate and the supporting plate. The protective layer is provided on one side of the insertion end of the substrate and the gold finger body, and the protective layer covers the gold finger body.

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