Nickel embedded sheet battery protection plate

Abstract

The utility model provides a kind of nickel piece battery protection plate, its structure includes inner layer board, nickel piece, glass fiber epoxy resin layer, copper material layer etc., inner layer board opens adaptive embedding groove, nickel piece is embedded and thickness is matched;Glass fiber epoxy resin layer is exposed nickel piece by laser cutting;Through hole is passed through and is plated copper to realize conduction;Bare nickel piece of uncovering area direct welding is supplied to power core. Preparation mode contains inner layer board processing (graphic transfer, bell slot etc.), nickel piece preparation, PP layer and cover film processing, assembly combination compression and post-processing (through hole, green oil, uncovering). The technical scheme can realize nickel piece built-in and efficient connection, improve PCB integration and stability, and is implemented by detailed process protection, suitable for the PCB production scene of nickel piece built-in.

Description

Technical Field

[0001] This utility model mainly relates to the technical field of battery protection boards, specifically a nickel-embedded battery protection board. Background Technology

[0002] With the rapid development of mobile phone technology, the requirements for battery protection boards are constantly changing. Protection boards need to be compatible with new battery materials, battery structures, and mobile phone charging technologies. This places higher demands on the design and development of protection boards, requiring corresponding technological innovations and improvements. For example, optimizing the mounting components of the battery protection board and saving space by maximizing component placement and trace routing on a limited board surface. Currently, in the battery protection board production process, nickel sheets are mounted onto the PCB using SMT (Surface Mount Technology), and then the battery cell tabs are connected or extended using laser soldering to the nickel sheet pads. This method occupies surface space and increases the complexity of the battery manufacturing process.

[0003] Therefore, there is a need to develop a battery protection board technology that can optimize the mounting process, save space, and simplify the process. Utility Model Content

[0004] This utility model mainly provides a nickel-embedded battery protection board to solve the technical problems mentioned in the background art.

[0005] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0006] A nickel-embedded battery protection board includes an inner layer plate, a glass fiber epoxy resin layer, and a copper material layer stacked in sequence, and also includes nickel sheets, through holes, and an opening processing area.

[0007] The inner layer plate has an embedding groove adapted to the shape of the nickel sheet, the nickel sheet is embedded in the embedding groove, and the thickness of the inner layer plate is the same as the thickness of the nickel sheet.

[0008] The glass fiber epoxy resin layer corresponds to the area of ​​the nickel sheet to be exposed, and is laser-cut to form a hollow part so as to expose the surface of the nickel sheet;

[0009] The through hole penetrates the nickel sheet, the inner layer plate, and the copper layer. The hole wall is copper-plated to achieve conductivity between the nickel sheet and the copper layer.

[0010] The opening processing area is located in the area of ​​the copper layer and the glass fiber epoxy resin layer corresponding to the nickel sheet, and is used to expose the nickel sheet power supply core tab for direct soldering.

[0011] A green oil layer is provided on the side of the copper material layer away from the glass fiber epoxy resin layer;

[0012] The through hole is provided with an internal green oil filling area for filling and injecting green oil.

[0013] The glass fiber epoxy resin layer has a covering film on the side facing the inner layer plate.

[0014] Furthermore, the gap between the nickel sheet and the inner layer plate embedding groove is 0.05-0.1 mm, and the gap is filled with an adhesive for fixing the nickel sheet.

[0015] Furthermore, the covering film is a polyimide covering film, which is bonded to the glass fiber epoxy resin layer by hot pressing.

[0016] Furthermore, the diameter of the via is 0.2-0.3 mm, and the thickness of the copper plating layer is ≥18 μm.

[0017] Furthermore, the distance between the edge of the opening processing area and the edge of the nickel sheet has been isolated by a covering film to avoid damage to the nickel sheet due to processing deviations.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] 1. Space optimization: Built-in nickel strips save more than 60% of the mounting space on the PCB surface, facilitating the layout of high-density components;

[0020] 2. Simplified process: Eliminating SMT placement and laser welding processes increases production efficiency by 30% and shortens the process flow by 2-3 steps;

[0021] 3. Enhanced compatibility: Compatible with new battery materials and fast charging technologies, meeting the needs of scenarios such as ultra-thin batteries and high-power charging;

[0022] 4. Improved reliability: The nickel sheet is integrally pressed with the PCB board, which improves the connection strength and reduces the risk of failure caused by poor soldering.

[0023] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0024] Figure 1 This is a cross-sectional structural diagram of the present invention;

[0025] The reference numerals in the figure are as follows: 100, nickel sheet; 200, inner layer plate; 300, fiberglass epoxy resin layer; 400, copper material layer; 500, green oil layer; 600, through hole; 700, green oil filling area inside the hole; 800, cover film; 900, opening treatment area. Detailed Implementation

[0026] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, which show several embodiments of the utility model. However, the utility model can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the disclosure of the utility model more thorough and comprehensive.

[0027] like Figure 1 As shown, this technical solution includes an inner layer plate 200, a nickel sheet 100, a glass fiber epoxy resin layer 300, a copper material layer 400, a through hole 600, and an opening treatment area 900. It also involves auxiliary structures such as a green oil layer 500, a green oil filling area inside the hole 700, and a cover film 800. Each part achieves the function of "nickel sheet built-in and direct welding of battery cell tabs" through precise processing and assembly.

[0028] Specifically, it is a nickel-embedded battery protection board, which includes an inner layer 200, a glass fiber epoxy resin layer 300, and a copper material layer 400 stacked in sequence, and also includes a nickel sheet 100, a through hole 600, and an opening processing area 900.

[0029] The inner layer plate 200 has an insert groove that matches the shape of the nickel sheet 100. The nickel sheet 100 is embedded in the insert groove, and the thickness of the inner layer plate 200 is the same as the thickness of the nickel sheet 100.

[0030] The glass fiber epoxy resin layer 300 corresponds to the area of ​​the nickel sheet 100 to be exposed. A hollow part is formed by laser cutting to expose the surface of the nickel sheet 100.

[0031] The through hole 600 penetrates the nickel sheet 100, the inner layer plate 200 and the copper layer 400. The hole wall is copper plated to achieve the connection between the nickel sheet 100 and the copper layer 400.

[0032] The open-cover processing area 900 is set in the area of ​​the copper layer 400 and the glass fiber epoxy resin layer 300 corresponding to the nickel sheet 100, and is used to expose the power supply core tab of the nickel sheet 100 for direct soldering.

[0033] A green oil layer 500 is provided on the side of the copper layer 400 away from the glass fiber epoxy resin layer 300;

[0034] The through hole 600 is provided with an internal green oil filling area 700 for filling and injecting green oil.

[0035] A cover film 800 is provided on the side of the fiberglass epoxy resin layer 300 facing the inner layer plate 200.

[0036] The gap between the nickel sheet 100 and the inner plate 200 is 0.05-0.1mm, and the gap is filled with adhesive for fixing the nickel sheet 100.

[0037] The cover film 800 is a polyimide cover film, which is bonded to the glass fiber epoxy resin layer 300 by hot pressing.

[0038] The diameter of the 600 via is 0.2-0.3 mm, and the copper plating thickness is ≥18 μm.

[0039] The distance between the edge of the open processing area 900 and the edge of the nickel sheet 100 has been isolated by a covering film to avoid damage to the nickel sheet 100 due to processing deviations.

[0040] The specific implementation details of this technical solution include:

[0041] (a) Inner layer board 200 machining

[0042] Substrate selection: Select an FR4 substrate with the same thickness as the nickel sheet 100 (thickness matching is the basis for ensuring the flatness between layers and avoiding structural deformation after lamination).

[0043] Graphic transfer and tool hole creation:

[0044] Using conventional PCB pattern transfer processes (such as dry film LDI imaging etching), a "tool hole target" is made on the surface of the FR4 substrate (for precise positioning in subsequent target punching).

[0045] The target punching machine punches out the required tool holes (including positioning holes, process holes, etc., to provide a reference for subsequent processing) according to the target shape.

[0046] Nickel sheet embedding groove processing:

[0047] According to the shape of the nickel sheet 100 (the shape of the nickel sheet needs to be designed in advance according to the battery cell tab connection requirements), use a router to router out the "embedded groove" at the corresponding position on the FR4 substrate.

[0048] Key Verification: After the milling groove, the tolerance clearance between the embedded nickel sheet 100 and the FR4 empty space (embedded groove) needs to be verified to ensure that the clearance is within the range of 0.05-0.1mm (too small a clearance may prevent the nickel sheet from being embedded, while too large a clearance will result in the nickel sheet not being securely fixed; this clearance can be achieved by adjusting the milling machine tool compensation and machining parameters). If the clearance does not meet the requirements, the milling program or tool needs to be readjusted until a match is achieved.

[0049] Browning and baking sheet:

[0050] The processed inner layer board 200 is subjected to browning treatment (to increase the surface roughness of FR4 and improve the bonding force with the PP layer).

[0051] After browning, bake the baking board (e.g., at 110℃ for 60 minutes) to remove moisture and stabilize its dimensions, ready for subsequent assembly.

[0052] (II) Preparation of nickel sheet 100

[0053] Purchase nickel sheets with single-sided partial epoxy adhesive (epoxy adhesive ensures adhesion between the nickel sheet and the inner layer board and PP layer), and "tie" them according to the PCB production process (to facilitate automatic feeding by subsequent mounting equipment). The nickel sheet material selection must meet the requirements of "conductivity and solderability" (e.g., commonly used pure nickel sheets with the same thickness as the inner layer board FR4).

[0054] (III) Processing of the glass fiber epoxy resin layer 300 and the cover film 800

[0055] PP cutting: Cut the initial sheet of glass fiber epoxy resin layer (PP layer) according to the PCB stack-up design dimensions.

[0056] Fake cover film 800:

[0057] Apply a cover film (polyimide cover film is recommended, as it has the characteristics of high temperature resistance and good insulation) to the PP layer surface. The cover film and PP layer are then bonded together by hot pressing (e.g., bonding at 100℃ and 0.3-0.5MPa pressure for 2-4 minutes) to temporarily fix the position of the cover film.

[0058] Laser cutting and film removal:

[0059] Using a laser cutting machine, a hollow pattern is cut out on the PP layer and cover film according to the shape of the area where 100% of the nickel sheet needs to be exposed (laser cutting has high precision and can ensure that the exposed area and the nickel sheet are accurately matched).

[0060] After cutting, remove the "excess cover film 800" from the PP layer, leaving only the cover film for the non-exposed areas of the PP layer (the cover film is used to protect the PP layer and prevent it from sticking to other layers during pressing).

[0061] (iv) Component assembly and pressing

[0062] Pre-assembled with fake stickers:

[0063] The pre-processed inner layer plate (200, with embedding groove and tool hole, browned and baked plate) is combined with the "PP layer of reverse cover film 800" for temporary bonding (the cover film faces the inner layer plate, and the adhesive of the cover film is used to temporarily fix the position between the layers). At this time, the cut-out area of ​​the PP layer needs to be precisely aligned with the embedding groove position of the inner layer plate (positioned by tool hole to ensure the subsequent embedding accuracy of the nickel sheet).

[0064] Nickel sheet mounting:

[0065] Using a reinforcing chip mounter, the tape-and-reel nickel sheet 100 is automatically mounted into the "embedded slot of the inner layer plate 200" (the chip mounter accurately places the nickel sheet by identifying tool holes or targets; if the gap between the embedded slot and the nickel sheet is 0.05-0.1mm, an adhesive, such as epoxy, can be filled into the gap to further fix the nickel sheet and prevent displacement during pressing).

[0066] Lamination riveting and pressing:

[0067] According to the PCB stack-up design (inner layer board + PP layer + copper layer, etc.), the remaining PP layer and copper layer (400, which needs to be cut and surface treated in advance) are stacked with the semi-finished products that have been falsely attached and mounted with nickel sheets, and the positions of each layer are fixed by riveting or riveting equipment.

[0068] The material is fed into a laminator for lamination (lamination parameters: temperature 190-200℃, pressure 200PSI, time 60-90 minutes, which need to be adjusted according to the PP layer material and the thickness of the laminate), so that the layers are tightly bonded to form an integrated PCB blank.

[0069] (v) Post-processing procedures

[0070] Machining and copper plating of 600mm vias:

[0071] According to the design requirements, a CNC drilling machine is used to drill through holes 600 in the "nickel sheet 100 embedded area and the copper layer 400 area that needs to be conductive" on the PCB blank (the hole diameter is designed to be 0.2-0.3mm, and the drilling accuracy must be ensured to avoid damaging the nickel sheet).

[0072] The vias are copper-plated (the conventional PCB copper plating process is: adhesive removal → chemical copper plating → electroplating copper) to cover the via walls with a copper layer of ≥18μm thickness, thereby achieving "conduction between nickel sheet 100 and copper layer 400" and constructing a current transmission path.

[0073] Fabrication of 700 green oil filler and 500 green oil layer inside the hole:

[0074] As needed, some of the vias 600 are filled with green oil (the green oil is filled into the vias by screen printing or dispensing and then cured) to protect the copper layer inside the vias or to achieve specific insulation requirements.

[0075] On the side of the copper layer 400 away from the PP layer, green ink is screen-printed and cured to form green ink layer 500, which provides insulation protection for the copper layer and can also be used to mark circuits, provide solder resist, and perform other functions.

[0076] Processing in the opening and handling area 900:

[0077] Before the PCB board blank is "routed into a SET panel", a router or laser cutter is used to remove the area of ​​"copper layer 400 and glass fiber epoxy resin layer 300 corresponding to nickel sheet 100", forming an open-cover processing area 900, exposing the surface of nickel sheet 100 for subsequent "direct soldering of battery tabs". It is necessary to control the "distance between the edge of the open-cover processing area 900 and the edge of nickel sheet 100, which is isolated by a cover film" (this distance can avoid processing deviations that damage the nickel sheet and ensure the integrity of the soldering area).

[0078] III. Functional Verification and Application

[0079] After completing the above processing, the PCB structure can achieve:

[0080] The nickel sheet 100 is built in and connected to the copper layer 400 through the through hole 600, which is plated with copper to form a stable current path.

[0081] The open-cover processing area exposes 900mm nickel sheets, allowing for direct welding of the battery cell tabs and simplifying the assembly process.

[0082] The green oil layer (500) and the green oil filling area inside the hole (700) ensure insulation and protection, while the cover film (800) assists in the processing of the PP layer and provides interlayer protection.

[0083] The present invention has been described above by way of example in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvement made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, shall be within the protection scope of the present invention.

Claims

1. A nickel-embedded battery protection board, characterized in that, It includes an inner layer plate (200), a glass fiber epoxy resin layer (300), and a copper material layer (400) stacked in sequence, and also includes a nickel sheet (100), a through hole (600), and an opening treatment area (900). The inner layer plate (200) has an embedding groove adapted to the shape of the nickel sheet (100), the nickel sheet (100) is embedded in the embedding groove, and the thickness of the inner layer plate (200) is the same as the thickness of the nickel sheet (100). The glass fiber epoxy resin layer (300) corresponds to the area of ​​the nickel sheet (100) to be exposed, and is laser-cut to form a hollow part so as to expose the surface of the nickel sheet (100); The through hole (600) penetrates the nickel sheet (100), the inner layer plate (200) and the copper layer (400). The hole wall is copper plated to achieve the connection between the nickel sheet (100) and the copper layer (400). The opening treatment area (900) is set in the area of ​​the copper material layer (400) and the glass fiber epoxy resin layer (300) corresponding to the nickel sheet (100), and is used to expose the nickel sheet (100) power supply core tab for direct welding; A green oil layer (500) is provided on the side of the copper material layer (400) away from the glass fiber epoxy resin layer (300). The through hole (600) is provided with an in-hole green oil filling area (700) for filling and injecting green oil; The glass fiber epoxy resin layer (300) has a cover film (800) on the side facing the inner layer plate (200).

2. The embedded nickel sheet battery protection board according to claim 1, characterized in that, The gap between the nickel sheet (100) and the inner plate (200) is 0.05-0.1 mm, and the gap is filled with an adhesive for fixing the nickel sheet (100).

3. The embedded nickel sheet battery protection board according to claim 1, characterized in that, The covering film (800) is a polyimide covering film, which is bonded to the glass fiber epoxy resin layer (300) by hot pressing.

4. A nickel-embedded battery protection board according to claim 1, characterized in that, The diameter of the via (600) is 0.2-0.3 mm, and the thickness of the copper plating layer is ≥18 μm.

5. A nickel-embedded battery protection board according to claim 1, characterized in that, The distance between the edge of the opening treatment area (900) and the edge of the nickel sheet (100) has been isolated by a covering film.

Images