Gallium nitride output intrinsically safe power supply

Abstract

The utility model discloses a gallium nitride output essential safety type power supply, including power supply body and bottom mounting plate, the casing bottom of power supply body is fixed with bottom mounting plate, still include guide and scatter mechanism, the guide and scatter mechanism includes top and exposes the groove, heat conduction silicon pad, double -faced wrong groove board, edge and exposes the groove, gantry clamping plate, lead touch piece, edge fin, bottom link and horn, through setting up guide and scatter mechanism and carry out heat dissipation improvement to the essential safety type power supply of gallium nitride semiconductor technology's application, and the top and exposes the groove of guide and scatter mechanism cooperation deep groove reduces the casing thickness of power supply body, and then combines heat conduction silicon pad and double -faced wrong groove board, forms the efficient heat conduction path and conducts heat dissipation outward, and simultaneously, the gantry clamping plate collocates lead touch piece and edge fin, constructs the multi -point three -dimensional heat dissipation surface of top surface and side surface formula, solves the casing heat dissipation blind area problem of power supply body, realizes the heat of power supply body and multi -point dispersion export.

Description

Technical Field

[0001] This utility model relates to the field of safe power supply technology, and in particular to an intrinsically safe power supply with gallium nitride output. Background Technology

[0002] Gallium nitride (GaN) is a wide bandgap semiconductor material that has higher breakdown electric field strength, thermal conductivity, and electron mobility compared to traditional silicon (Si). "GaN intrinsically safe power supplies" are special power supply devices that combine GaN semiconductor technology with intrinsically safe design standards. They are mainly used in hazardous environments such as flammable and explosive environments, and have both high efficiency and safety characteristics.

[0003] Currently, some intrinsically safe power supplies using gallium nitride semiconductor technology on the market typically rely on their own casing for passive heat dissipation due to the heat generated during operation. However, this simple casing provides few outlets for heat dissipation, which can lead to aging of internal components under high-temperature operating conditions, thereby affecting the operational stability and lifespan of the intrinsically safe power supply. To address this, we propose a gallium nitride output intrinsically safe power supply. Utility Model Content

[0004] The main objective of this invention is to provide an intrinsically safe power supply with gallium nitride output. This is achieved by improving heat dissipation through a heat dissipation mechanism in the intrinsically safe power supply using gallium nitride semiconductor technology. The exposed grooves on the top of the heat dissipation mechanism, combined with deep grooves, reduce the thickness of the power supply casing. Combined with thermally conductive silicon pads and double-sided staggered plates, an efficient heat conduction path is formed to conduct heat outwards. Simultaneously, the gantry plate, along with contact plates and side fins, constructs a multi-point, three-dimensional heat dissipation surface on the top and sides, solving the problem of heat dissipation blind spots in the power supply casing and enabling multi-point heat dissipation from the power supply, effectively addressing the problems in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A gallium nitride output intrinsically safe power supply includes a power supply body and a base plate. The base plate is fixed to the bottom end of the power supply body housing. The power supply body also includes a heat dissipation mechanism, which includes a top groove, a thermally conductive silicon pad, a double-sided staggered plate, a side groove, a gantry plate, lead-in contacts, side fins, a bottom connecting strip, and corner plates. The top of the power supply body has a recessed top groove for mounting the thermally conductive silicon pad and the double-sided staggered plate layer by layer. Side grooves for mounting the gantry plate are arranged on the vertical shell surfaces of the power supply body on both sides of the top groove. Lead-in contacts are arranged and fixed to the top of the gantry plate, and baffles are fixed to the top of the lead-in contacts. The feet of the gantry plate are welded and fixed to the top of the bottom connecting strip. Corner plates are symmetrically fixed to the bottom plate surface by bolts at both ends of the bottom connecting strip.

[0007] Furthermore, a deep groove is recessed downward at the bottom wall of the top exposed groove, and a frame-shaped pad with a thermally conductive silicon pad is pressed into the top exposed groove outside the deep groove.

[0008] By adopting the above-mentioned preferred technical solution, after opening a deep groove downward at the top exposed groove, the shell thickness of the power supply body at this location is reduced, allowing heat to dissipate outwards more effectively. Then, the frame-shaped pad of the thermal conductive silicon pad can work with the double-sided staggered plate to conduct heat outwards.

[0009] Furthermore, the upper and lower surfaces of the double-sided slotted plate above the thermally conductive silicon pad are provided with grooves, and the grooves on the upper and lower surfaces of the double-sided slotted plate are in different directions.

[0010] By adopting the above-mentioned preferred technical solution, the double-sided slotted plate has slots with different directions on both sides. While reducing the thickness of the plate, a rib-groove structure is formed for reinforcement, and the plate at the thickened part can better conduct heat and dissipate it outward.

[0011] Furthermore, five sets of guide contact pieces are welded to the top of the gantry plate in an inclined arrangement, and the top of the guide contact pieces is welded and fixed to the baffle.

[0012] By adopting the above-mentioned preferred technical solution, the gantry plate can conduct heat outward with a large number of contact plates, and at the same time, there are baffles connected above the contact plates for reinforcement and protection, so that the contact plates are not easily deformed when subjected to force.

[0013] Furthermore, the corner plates press against the surfaces of the bottom mounting plates on both sides of the power supply body, and mounting holes for screwing bolts are provided on the surfaces of the corner plates and the bottom mounting plates.

[0014] By adopting the above-mentioned preferred technical solution, there are mounting holes between the corner plate and the base plate, which can be screwed on with bolts for locking.

[0015] Furthermore, a strip protrudes from the lower inclined body of the side fin, and the strip is fixed to the outside of the vertical plate of the gantry plate;

[0016] By adopting the above-mentioned preferred technical solution, the side fins can be welded to the outside of the gantry plate for fixed connection.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] This invention improves heat dissipation by setting a heat dissipation mechanism in an intrinsically safe power supply using gallium nitride semiconductor technology. The top exposed groove of the heat dissipation mechanism, combined with the deep groove, reduces the thickness of the power supply body shell. Combined with the thermally conductive silicon pad and the double-sided staggered plate, an efficient heat conduction path is formed to conduct heat outward. At the same time, the gantry plate, combined with the contact plate and the side fins, constructs a multi-point three-dimensional heat dissipation surface on the top and sides, solving the problem of heat dissipation blind spots in the power supply body shell and realizing the multi-point dispersion and dissipation of heat from the power supply body.

[0019] Furthermore, the double-sided slotted plate uses a groove structure to reduce weight while forming ribs to improve bending stiffness. At the same time, the lead-in plates above the gantry plate, together with the baffle, form an interconnecting frame, making the lead-in plates less susceptible to damage from external forces during heat dissipation, thus ensuring effective heat dissipation of the power supply body. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a gallium nitride output intrinsically safe power supply according to the present invention.

[0021] Figure 2 This is a schematic diagram showing the disassembly of the corner plate and the base plate of a gallium nitride output intrinsically safe power supply according to this utility model.

[0022] Figure 3 This is an exploded view of the conduction mechanism of a gallium nitride output intrinsically safe power supply according to this utility model.

[0023] In the diagram: 1. Power supply body; 2. Bottom mounting plate; 3. Dissipation mechanism; 4. Top exposed groove; 5. Deep groove; 6. Thermal conductive silicone pad; 7. Double-sided staggered groove plate; 8. Side exposed groove; 9. Machining plate; 10. Contact plate; 11. Baffle; 12. Side fins; 13. Bottom connecting strip; 14. Corner plate. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0025] like Figure 1-3As shown, a gallium nitride output intrinsically safe power supply includes a power supply body 1 and a base plate 2. The base plate 2 is fixed to the bottom end of the housing of the power supply body 1. It also includes a heat dissipation mechanism 3, which includes a top exposed groove 4, a thermally conductive silicon pad 6, a double-sided staggered plate 7, a side exposed groove 8, a gantry plate 9, a contact plate 10, a side fin 12, a bottom connecting strip 13, and a corner plate 14. The top of the power supply body 1 is recessed to provide a layer-by-layer mounting of the thermally conductive silicon pad 6. The top exposed groove 4 of the double-sided staggered plate 7, and the side exposed grooves 8 for mounting the gantry plate 9 are arranged on the vertical shell surface of the power supply body 1 on both sides of the top exposed groove 4. The top of the gantry plate 9 is fixed with a guide plate 10, and the top of the guide plate 10 is fixed with a baffle 11. The plate foot of the gantry plate 9 is welded and fixed to the top of the bottom connecting strip 13, and the two ends of the bottom connecting strip 13 are symmetrically fixed with corner plates 14 that are bolted to the surface of the bottom mounting plate 2.

[0026] Among them, the bottom wall of the top exposed groove 4 is recessed and a deep groove 5 is provided, and a frame-shaped pad of thermally conductive silicon pad 6 is pressed on the top exposed groove 4 outside the deep groove 5.

[0027] By adopting the above-mentioned preferred technical solution, after opening a deep groove 5 downward at the top exposed groove 4, the shell thickness of the power supply body 1 at this location is reduced, so that heat can be better dissipated outward. Then, the frame-shaped pad of the thermal conductive silicon pad 6 can work with the double-sided staggered plate 7 to conduct heat outward.

[0028] Among them, the upper and lower surfaces of the double-sided slotted plate 7 above the thermally conductive silicon pad 6 are provided with grooves, and the grooves on the upper and lower surfaces of the double-sided slotted plate 7 are in different directions.

[0029] By adopting the above-mentioned preferred technical solution, the double-sided slotted plate 7 has slots with different directions on both sides. While reducing the thickness of the plate, a rib-groove structure is formed for reinforcement, and the plate at the thickened part can better conduct heat to dissipate outward.

[0030] Among them, five sets of guide plates 10 at the top of the gantry plate 9 are arranged and welded in an inclined manner, and the top plate of the guide plate 10 is welded and fixed to the baffle 11.

[0031] By adopting the above-mentioned preferred technical solution, the gantry plate 9 can conduct heat outward with a large number of contact plates 10. At the same time, a baffle 11 is connected above the contact plates 10 for reinforcement and protection, so that the contact plates 10 are not easily deformed when subjected to force.

[0032] The corner plate 14 presses against the surface of the bottom mounting plate 2 on both sides of the power supply body 1, and the corner plate 14 and the surface of the bottom mounting plate 2 are provided with mounting holes for screwing bolts.

[0033] By adopting the above-mentioned preferred technical solution, there are mounting holes between the corner plate 14 and the bottom mounting plate 2, which can be screwed on with bolts for locking.

[0034] Among them, the lower inclined plate of the side fin 12 has a strip protruding, and the strip is fixed on the outside of the vertical plate of the gantry plate 9;

[0035] By adopting the above-mentioned preferred technical solution, the side fins 12 can be welded to the outside of the gantry plate 9 for fixed connection.

[0036] It should be noted that this utility model is an intrinsically safe power supply with gallium nitride output. The heat dissipation is improved by setting a heat dissipation mechanism 3 in the intrinsically safe power supply using gallium nitride semiconductor technology. After the top groove 4 and the side groove 8 of the heat dissipation mechanism 3 are set on the outside of the housing of the power supply body 1, the double-sided slotted plate 7 of the heat dissipation mechanism 3 can press the thermally conductive silicon pad 6 into the top groove 4. Then the gantry plate 9 can be inserted downward along the side groove 8 and inserted into the outside of the housing of the power supply body 1. At this time, the bottom connecting strip 13 below the gantry plate 9 has corner plates 14 at both ends that can press against the surface of the bottom mounting plate 2 on both sides of the power supply body 1. The bolts are screwed into the mounting holes of the bottom mounting plate 2 and the corner plates 14 for locking.

[0037] When the power supply body 1 generates heat during operation, the heat from its casing is conducted outward at the top exposed slot 4. The heat from this location is transferred along the thermally conductive silicone pad 6 to the double-sided slotted plate 7 for outward conduction. The rear gantry plate 9 guides the heat from the casing of the power supply body 1 outward at the side exposed slot 8. The surface of the gantry plate 9 has contact plates 10 and side fins 12 to increase its own heat dissipation points, assisting in the efficient conduction and dissipation of heat from the casing of the power supply body 1. When the power supply body 1 is installed in an explosion-proof power box equipped with an explosion-proof fan, it can effectively conduct and dissipate heat, preventing the power supply body 1 from suffering thermal damage and reducing its service life.

[0038] It should be noted that this utility model is an intrinsically safe power supply with gallium nitride output. All components in this utility model are known to those skilled in the art, and their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0039] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A gallium nitride output intrinsically safe power supply, comprising a power supply body (1) and a base plate (2), wherein the base plate (2) is fixed to the bottom end of the housing of the power supply body (1), characterized in that: It also includes a heat dissipation mechanism (3), which includes a top exposure groove (4), a thermally conductive silicon pad (6), a double-sided staggered plate (7), a side exposure groove (8), a gantry plate (9), a contact plate (10), a side fin (12), a bottom connecting strip (13), and a corner plate (14). The top of the power supply body (1) is recessed and has a top exposure groove (4) for sequentially mounting the thermally conductive silicon pad (6) and the double-sided staggered plate (7), and the top exposure groove (4) has electrical contacts on both sides. The vertical shell surface of the source body (1) is provided with side grooves (8) for mounting the gantry plate (9). The top of the plate of the gantry plate (9) is fixed with contact plates (10), and the top of the contact plates (10) is fixed with baffles (11). The feet of the gantry plate (9) are welded and fixed to the top of the bottom connecting strip (13), and the two ends of the bottom connecting strip (13) are symmetrically fixed with corner plates (14) that are bolted to the surface of the bottom mounting plate (2).

2. The intrinsically safe gallium nitride output power supply according to claim 1, characterized in that: The bottom wall of the top exposed groove (4) is recessed downward to form a deep groove (5), and a frame-shaped pad of a thermally conductive silicon pad (6) is pressed into the top exposed groove (4) outside the deep groove (5).

3. The intrinsically safe gallium nitride output power supply according to claim 1, characterized in that: The upper and lower surfaces of the double-sided slotted plate (7) above the thermally conductive silicon pad (6) are provided with grooves, and the grooves on the upper and lower surfaces of the double-sided slotted plate (7) are in different directions.

4. A gallium nitride output intrinsically safe power supply according to claim 1, characterized in that: The top of the gantry plate (9) has five sets of inclined contact pieces (10) welded together, and the top of the contact pieces (10) is welded and fixed to the baffle (11).

5. A gallium nitride output intrinsically safe power supply according to claim 1, characterized in that: The corner plate (14) presses against the surface of the bottom plate (2) on both sides of the power supply body (1), and the corner plate (14) and the surface of the bottom plate (2) are provided with mounting holes for screwing bolts.

6. A gallium nitride output intrinsically safe power supply according to claim 1, characterized in that: The lower inclined plate of the side fin (12) has a strip protruding, and the strip is fixed on the outside of the vertical plate of the gantry plate (9).

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