A photovoltaic module

Abstract

The embodiment of the present application provides a photovoltaic module, which comprises a cell piece and a solder strip, and the solder strip is connected with the grid line of the cell piece. The solder strip is provided with a first embossed area, and the solder strip is connected with the grid line through the first embossed area. In the width direction of the grid line, the width of the first embossed area is greater than the width of the grid line. By arranging the first embossed area, the contact area of the solder strip and the grid line can be increased, so that the connection stability of the solder strip and the grid line can be improved, and the actual use demand can be met.

Description

Technical Field

[0001] This application relates to the field of photovoltaics, and in particular to a photovoltaic module. Background Technology

[0002] Photovoltaic modules typically consist of solar cells, solder ribbons, and busbars. The busbars are connected to the grid lines via solder ribbons to conduct current. However, the connection strength between the solder ribbons and the busbars / grid lines is often weak, which can easily affect the stability of the photovoltaic module during use. Utility Model Content

[0003] This application provides a photovoltaic module for improving the stability of grid wire and solder strip connections.

[0004] This application provides a photovoltaic module, the photovoltaic module comprising:

[0005] The solar cell has grid lines;

[0006] The solder strip is connected to the grid line;

[0007] The solder strip is provided with a first embossed area, which is connected to the grid line. Along the width direction of the grid line, the width of the first embossed area is greater than the width of the grid line.

[0008] In one possible implementation, the width of the first embossed area is 0.05 mm to 2 mm.

[0009] In one possible implementation, the first embossed area is provided with at least one first recess, the depth of which is 10 micrometers to 200 micrometers.

[0010] In one possible implementation, a weldment is provided between the solder strip and the grid line, and a portion of the weldment is located in the first recess.

[0011] In one possible implementation, the thickness of the welded part is not less than the depth of the first recess.

[0012] In one possible implementation, the thickness of the welded part is 30 micrometers to 200 micrometers.

[0013] In one possible implementation, the battery cell further includes at least one solder joint disposed on the grid line, the solder strip being connected to the solder joint, and the first embossed area being located at the connection position between the solder strip and the solder joint.

[0014] In one possible implementation, the photovoltaic module further includes a busbar connected to the solder strip;

[0015] At least one of the solder strip and the busbar is provided with a second embossed area, and the solder strip and the busbar are connected through the second embossed area.

[0016] In one possible implementation, the second embossed area is disposed on the busbar;

[0017] Along the width direction of the solder strip, the width of the second embossed area is not less than the width of the solder strip.

[0018] In one possible implementation, the width of the second embossed area is 0.1 mm to 4 mm.

[0019] In one possible implementation, the battery cell is a back-contact battery cell, and the cross-section of the solder strip is rectangular.

[0020] This application provides a photovoltaic module, which includes solar cells and a solder ribbon connected to the grid lines of the solar cells. The solder ribbon has a first embossed area, through which it connects to the grid lines. Along the width direction of the grid lines, the width of the first embossed area is greater than the width of the grid lines. By providing the first embossed area, the contact area between the solder ribbon and the grid lines can be increased, thereby improving the connection stability between the solder ribbon and the grid lines and better meeting practical application requirements. Attached Figure Description

[0021] Figure 1 A schematic diagram of a photovoltaic module provided in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the connection between the solder strip and the gate line provided in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the solder strip and welded part provided in the embodiments of this application;

[0024] Figure 4 This is a schematic diagram of the solder strip and busbar provided in the embodiments of this application.

[0025] Figure Labels

[0026] 1-Battery cell;

[0027] 11-grid line;

[0028] 2-Welding strip;

[0029] 21-First stamping area;

[0030] 211 - First recessed portion;

[0031] 3-Welded parts;

[0032] 4-Busbar;

[0033] 41 - Second stamping area. Detailed Implementation

[0034] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0035] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0036] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0037] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0038] like Figure 1 As shown, this application embodiment provides a photovoltaic module, which includes solar cells 1 and solder ribbons 2, with adjacent solar cells 1 electrically connected via solder ribbons 2. The solar cells 1 have grid lines 11 for collecting the current generated by the solar cells 1, such as... Figure 2 As shown, the solder strip 2 is connected to the grid line 11. The solder strip 2 and the grid line 11 are not only fixedly connected but also electrically connected, allowing the solder strip 2 to draw the current from the grid line 11. The solder strip 2 has a first embossed area 21 with an embossed pattern, creating an uneven structure on the surface of the solder strip 2. The first embossed area 21 is connected to the grid line 11, and along the width direction of the grid line 11, the width of the first embossed area 21 is greater than the width of the grid line 11.

[0039] By setting a first embossed area 21 on the solder ribbon 2, the surface area at the connection point between the solder ribbon 2 and the grid line 11 can be increased, thereby increasing the contact area between the solder ribbon 2 and the grid line 11. This improves the connection stability between the solder ribbon 2 and the grid line 11, reduces the possibility of the solder ribbon 2 detaching from the grid line 11 of the solar cell 1, and thus improves the reliability of the photovoltaic module, extends its service life, and increases its efficiency. The width of the first embossed area 21 is greater than the width of the grid line 11. This design reduces the requirement for relative positional accuracy between the first embossed area 21 and the grid line 11, thereby reducing processing difficulty and better meeting actual production needs.

[0040] In one possible implementation, the width of the first embossed area 21 is from 0.05 mm to 2 mm. The width of the first embossed area 21 can be 0.05 mm, 0.15 mm, 0.25 mm, 0.35 mm, 0.45 mm, 0.55 mm, 0.65 mm, 0.75 mm, 0.85 mm, 0.95 mm, 1.05 mm, 1.15 mm, 1.25 mm, 1.35 mm, 1.45 mm, 1.55 mm, 1.65 mm, 1.75 mm, 1.85 mm, 1.95 mm, or 2.00 mm.

[0041] If the width of the first embossed area 21 is too small, it may not completely cover the connection position between the solder ribbon 2 and the grid line 11, resulting in a small increase in the contact area between the solder ribbon 2 and the grid line 11, and thus little improvement in the connection stability. If the width of the first embossed area 21 is too large, its excessive area may negatively impact the quality and performance of the solder ribbon 2, consequently affecting the overall performance of the photovoltaic module. Therefore, the width of the first embossed area 21 is between 0.05 mm and 2 mm. This increases the contact area between the solder ribbon 2 and the grid line 11 while reducing its impact on the solder ribbon 2, better meeting practical application requirements.

[0042] In one possible implementation, the first embossed area 21 is provided with at least one first recess 211, the depth of which is 10 micrometers to 200 micrometers. The depth of the first recess 211 can be 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 110 micrometers, 120 micrometers, 130 micrometers, 140 micrometers, 150 micrometers, 160 micrometers, 170 micrometers, 180 micrometers, 190 micrometers, or 200 micrometers.

[0043] By setting the first recess 211, the surface area of ​​the first embossed area 21 can be increased, which is beneficial to increasing the contact area between the solder ribbon 2 and the gate line 11. When the depth of the first recess 211 is less than 10 micrometers, the increase in the surface area of ​​the first embossed area 21 is small, and the effect on improving the connection stability of the solder ribbon 2 and the gate line 11 is small. When the depth of the first recess 211 is greater than 200 micrometers, the depth of the first recess 211 is too large, which will affect the thickness of the solder ribbon 2, resulting in the local thickness of the solder ribbon 2 being too thin, affecting the structural integrity of the solder ribbon 2. When the depth of the first recess 211 is too large, it will also lead to the local cross-sectional area of ​​the solder ribbon 2 being too small. According to the resistance law formula: R=ρ(L / A), where R is the resistance, ρ is the resistivity of the material, L is the conductor length, and A is the cross-sectional area of ​​the conductor material, according to the resistance law formula, when the material and length are constant, the resistance is inversely proportional to the cross-sectional area, that is, the smaller the cross-sectional area, the greater the resistance. When the depth of the first recess 211 is too large, it will cause the resistance at the corresponding location in that area to increase, resulting in increased current loss during transmission and affecting the overall efficiency of the photovoltaic module.

[0044] like Figure 3 As shown, in one possible embodiment, a solder joint 3 is provided between the solder strip 2 and the gate line 11. The solder joint 3 can be solder paste. A portion of the solder joint 3 is located in the first recess 211.

[0045] Setting up welding component 3 can help improve the welding stability between the welding strip 2 and the grid line 11.

[0046] Typically, insulating adhesive is applied to certain areas of the solar cell 1 to isolate some of the grid lines 11. For example, the grid lines 11 of the positive and negative terminals that are in back contact with the battery are located on the same side of the solar cell 1. Therefore, by applying insulating adhesive, the positive and negative grid lines 11 can be isolated, thereby reducing the possibility of short circuits between grid lines 11 of different polarities. The areas with insulating adhesive protrude relative to the surface of the solar cell 1, while the areas without insulating adhesive are recessed relative to the surface of the insulating adhesive. When the connection point between the solder ribbon 2 and the grid line 11 is located where no insulating adhesive is applied, a height difference will exist between the connection point and the surface of the insulating adhesive. When the solder ribbon 2 is applied, a certain gap will exist between the solder ribbon 2 and the solar cell 1, increasing the difficulty of soldering and affecting the stability of the soldering. By using solder paste or other soldering components 3, the height difference between the connection point and the surface of the insulating adhesive can be filled, thereby improving the stability between the solar cell 1 and the grid lines 11 and better meeting practical application requirements.

[0047] Solder paste can be printed on the battery cell 1 before soldering.

[0048] In one possible implementation, the cell 1 includes silver paste pads on which solder paste is pre-printed. This can increase the height of the grid lines 11 at the locations where they are connected to the solder strips 2, thereby improving the stability of the connection between the solder strips 2 and the cell 1.

[0049] like Figure 3 As shown, in one possible implementation, the thickness of the welded part 3 is not less than the depth of the first recess 211.

[0050] When the thickness of the weldment 3 is less than the depth of the first recess 211, when the welding strip 2 contacts the battery cell 1, the weldment 3 extends into the first recess 211. However, because the thickness of the weldment 3 is less than the depth of the first recess 211, the weldment 3 cannot fully contact the surface of the first recess 211, resulting in a gap between the weldment 3 and the first recess 211. This leads to a decrease in the connection stability between the welding strip 2 and the battery cell 1. By ensuring that the thickness of the weldment 3 is not less than the depth of the first recess 211, the weldment 3 can better contact the surface of the first recess 211, reducing the possibility of a gap between the weldment 3 and the first recess 211, thereby improving the stability of the weld.

[0051] In one possible implementation, the thickness of the weldment 3 is from 30 micrometers to 200 micrometers. The thickness of the weldment 3 can be 30 micrometers, 50 micrometers, 70 micrometers, 90 micrometers, 110 micrometers, 130 micrometers, 150 micrometers, 170 micrometers, 190 micrometers, 200 micrometers, etc.

[0052] When the thickness of the weldment 3 is too small, gaps are easily generated between the weldment 3 and the welding strip 2, which affects the stability of the welding. When the thickness of the weldment 3 is too large, it will lead to increased costs. Therefore, the thickness of the weldment 3 is 30 micrometers to 200 micrometers, which can reduce costs while improving welding stability.

[0053] In one possible implementation, the battery cell 1 includes solder joints, which may be solder pads, etc., and solder strips 2 are connected to the solder joints. The solder joints are located on the grid lines 11. A first embossed area 21 is located at the connection position between the solder strip 2 and the solder joint, so that the solder strip 2 can be welded to the grid lines 11 through the solder joints.

[0054] Setting solder joints facilitates the positioning of the connection between the solder strip 2 and the grid line 11 during welding, thereby improving welding stability and thus enhancing welding quality.

[0055] like Figure 1 As shown, in one possible implementation, the photovoltaic module further includes a busbar 4 connected to the solder strip 2 for drawing current from the solder strip 2. Figure 4As shown, at least one of the solder strip 2 and the busbar 4 is provided with a second embossed area 41, and the solder strip 2 and the busbar 4 are connected through the second embossed area 41. The second embossed area 41 can be provided in the solder strip 2, or in the busbar 4, or both the solder strip 2 and the busbar 4 can be provided with the second embossed area 41.

[0056] By setting an embossed area at the connection point between the solder strip 2 and the busbar 4, the contact area between the solder strip 2 and the busbar 4 can be increased, thereby improving the connection stability between the solder strip 2 and the busbar 4 and better meeting actual usage requirements.

[0057] In one possible implementation, the second embossed area 41 is disposed on the busbar 4, along the width direction of the solder strip 2, and the width of the second embossed area 41 is not less than the width of the solder strip 2.

[0058] This design reduces the relative positional accuracy requirements of busbar 4 and solder strip 2, thereby reducing the processing difficulty of battery cell 1 and improving the stability of the connection between solder strip 2 and busbar 4.

[0059] In one possible implementation, the width of the second embossed area 41 is from 0.1 mm to 4 mm. The width of the second embossed area 41 can be 0.1 mm, 0.4 mm, 0.8 mm, 1.2 mm, 1.6 mm, 2.0 mm, 2.4 mm, 2.8 mm, 3.2 mm, 3.6 mm, 4.0 mm, etc.

[0060] When the width of the second embossing area 41 is too small, its impact on the contact area between the busbar 4 and the solder strip 2 is relatively small, resulting in a relatively small improvement in welding stability. When the width of the second embossing area 41 is too large, it increases the number of processing steps for the busbar 4 and the solder strip 2, affecting production efficiency. When the width of the second embossing area 41 is between 0.1 mm and 4 mm, the processing efficiency is high, and the effect on enhancing the connection stability of the solder strip 2 and the busbar 4 is more significant.

[0061] In one possible implementation, the battery cell 1 is a back-contact battery cell, and the cross-section of the solder strip 2 is rectangular.

[0062] Typically, the side of the solar cell 1 that faces the light is the front, and the side that faces away from the light is the back. The grid lines 11 that contact the solar cell are located on the back of the solar cell 1. This design reduces the shading of the grid lines 11 on the surface of the solar cell 1, thereby increasing the light-receiving area of ​​the solar cell 1. Simultaneously, placing the grid lines 11 on the back of the solar cell 1 reduces the possibility of corrosion, thus extending the lifespan of the solar cell 1 and reducing the impact of the external environment. This allows the solar cell 1 to be used in harsh environments such as high humidity, broadening its application range. The cross-section of the solder ribbon 2 is rectangular, allowing for a larger cross-sectional area for the same perimeter. This helps reduce the resistance of the solder ribbon 2 and decreases current loss during transmission. Furthermore, the rectangular cross-section of the solder ribbon 2 increases the contact area between the solder ribbon 2 and the busbar 4, the grid lines 11, and the solder joint, further improving welding stability and better meeting practical application requirements.

[0063] In one possible implementation, the embossing shape of the first embossing area 21 and the second embossing area 41 is at least one of triangle, rectangle, and circle.

[0064] During processing, different embossing shapes can be set in the first embossing area 21 and the second embossing area 41 according to requirements. The embossing shape can be the same shape or a mixture of multiple shapes. By designing the shape of the embossing, the area of ​​the embossing area can be increased, thereby increasing the contact area between the welding strip 2 and the grid line 11 and the busbar 4, thus improving the stability of the welding.

[0065] Photovoltaic modules may also include structures such as a first cover plate, a second cover plate, a first encapsulating film, and a second encapsulating film. Solar cells 1 are interconnected via solder strips 2 to form a cell string. The first and second cover plates are located on opposite sides of the cell string. The first encapsulating film is located between the first cover plate and the cell string, and the second encapsulating film is located between the second cover plate and the cell string. The first and second encapsulating films provide cushioning and shock absorption, preventing damage to the solar cells 1. Simultaneously, they also act as sealants, reducing the possibility of external air, water vapor, dust, etc., entering the photovoltaic module and contacting the solar cells 1. This reduces the likelihood of oxidation, short circuits, and leakage in the photovoltaic module, improving safety and extending its lifespan.

[0066] The first and second cover plates are located on opposite sides of the photovoltaic module, providing support and protection. They also act as impact protectors, and offer waterproofing, dustproofing, and corrosion resistance, reducing the likelihood of damage during use and thus improving the module's lifespan and reliability.

[0067] The solution provided in this application embodiment increases the contact area between the solder ribbon 2 and the grid line 11 by setting an embossed area at the welding position. Embossing creates a recess, allowing solder paste or other soldering components 3 to enter the recessed area, thereby increasing the contact area between the solder paste and the solder ribbon 2 and improving the connection strength between the solder ribbon 2 and the battery cell 1. The solder paste can extend into the recess of the embossed area, further increasing the contact area between the solder paste and the solder ribbon 2. The thickness of the solder paste is not less than the depth of the recess formed by the embossing to prevent the solder paste from failing to fill the recess and affecting the contact area between the solder paste and the solder ribbon 2. The width of the first embossed area 21 is greater than the width of the grid line 11, which reduces the relative positional accuracy requirements of the solder ribbon 2 and the grid line 11, reducing the welding difficulty. The width direction of the first embossed area 21 is perpendicular to the extension direction of the grid line 11. The busbar 4 and / or the solder ribbon 2 are provided with a second embossed area 41 to increase the contact area between the solder ribbon 2 and the busbar 4, thereby improving the connection stability between the busbar 4 and the solder ribbon 2.

[0068] During production, the entire roll of solder strip 2 can be cut to a suitable length first, then embossed on the surface of the solder strip 2 that will contact the solder joint, followed by embossing in the connection area between the solder strip 2 and the grid line 11 and / or busbar 4, and then welding is performed. In one possible embodiment, the entire surface of the solder strip 2 can also be embossed. The battery cell 1 can be a back contact battery, a TOPCon battery, etc.

[0069] When setting the first embossing area 21 and the second embossing area 41, the settings can be configured according to requirements. Embossing can be performed on the solder strip 2, and the embossing position can be located in the area where the solder strip 2 is welded to the battery cell 1, the area where the solder strip 2 is welded to the busbar 4, or the entire surface of the solder strip 2 can be embossed. Embossing can also be performed on the busbar 4, and the embossing position can be at the connection point between the busbar 4 and the solder strip 2, or the entire surface of the busbar 4 can be embossed.

[0070] This application provides a photovoltaic module, which includes a solar cell 1 and a solder ribbon 2. The solder ribbon 2 is connected to the grid lines 11 of the solar cell 1. The solder ribbon 2 is provided with a first embossed area 21, through which the solder ribbon 2 is connected to the grid lines 11. Along the width direction of the grid lines 11, the width of the first embossed area 21 is greater than the width of the grid lines 11. By providing the first embossed area 21, the contact area between the solder ribbon 2 and the grid lines 11 can be increased, thereby improving the connection stability between the solder ribbon 2 and the grid lines 11 and better meeting practical application requirements.

[0071] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A photovoltaic module, characterized in that, The photovoltaic module includes: A battery cell (1) having grid lines (11). The solder strip (2) is connected to the grid line (11); The solder strip (2) is provided with a first embossed area (21), which is connected to the grid line (11). Along the width direction of the grid line (11), the width of the first embossed area (21) is greater than the width of the grid line (11).

2. The photovoltaic module according to claim 1, characterized in that, The width of the first embossed area (21) is 0.05 mm to 2 mm.

3. The photovoltaic module according to claim 1, characterized in that, The first embossed area (21) is provided with at least one first recess (211), the depth of which is 10 micrometers to 200 micrometers.

4. The photovoltaic module according to claim 3, characterized in that, A welding element (3) is provided between the welding strip (2) and the grid line (11), and a portion of the welding element (3) is located in the first recess (211).

5. The photovoltaic module according to claim 4, characterized in that, The thickness of the welded part (3) is not less than the depth of the first recess (211).

6. The photovoltaic module according to claim 5, characterized in that, The thickness of the welded part (3) is 30 micrometers to 200 micrometers.

7. The photovoltaic module according to claim 1, characterized in that, The battery cell (1) also includes at least one solder joint, which is disposed on the grid line (11), the solder strip (2) is connected to the solder joint, and the first embossed area (21) is located at the connection position between the solder strip (2) and the solder joint.

8. The photovoltaic module according to claim 1, characterized in that, The photovoltaic module also includes a busbar (4), which is connected to the solder strip (2); At least one of the welding strip (2) and the busbar (4) is provided with a second embossed area (41), and the welding strip (2) and the busbar (4) are connected through the second embossed area (41).

9. The photovoltaic module according to claim 8, characterized in that, The second embossed area (41) is provided on the busbar (4); Along the width direction of the solder strip (2), the width of the second embossed area (41) is not less than the width of the solder strip (2).

10. The photovoltaic module according to claim 9, characterized in that, The width of the second embossed area (41) is 0.1 mm to 4 mm.

11. The photovoltaic module according to any one of claims 1 to 10, characterized in that, The battery cell (1) is a back-contact battery cell, and the cross-section of the solder strip (2) is rectangular.

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