A cleaning chamber structure of a semiconductor cleaning machine

Abstract

The utility model relates to technical field of semiconductor cleaning machine, and disclose a kind of cleaning chamber structure of semiconductor cleaning machine, including semiconductor cleaning device, the top fixed mounting of semiconductor cleaning device has water pump unit, the front of semiconductor cleaning device is equipped with feed inlet, and the inside of semiconductor cleaning device is equipped with transmission mechanism.The cleaning chamber structure of the semiconductor cleaning machine, by transmission mechanism, to control the drive of semiconductor product, without artificial operation, can realize automatic processing, transmission mechanism, under the action of belt by driving structure, drive semiconductor to move, because belt has high friction, so it can drive surface semiconductor to move;Semiconductor is cleaned by cleaning mechanism, cleaning mechanism uses all-around coverage, can be more comprehensive and improve cleaning range, and the setting of booster equipment, can improve cleaning strength, can strongly remove semiconductor surface, to realize high-definition cleaning effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning machine technology, specifically to a cleaning chamber structure for a semiconductor cleaning machine. Background Technology

[0002] Semiconductors are materials whose electrical conductivity at room temperature falls between that of conductors and insulators. Most electronic products, such as computers, mobile phones, and digital recorders, rely heavily on semiconductors as their core components. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential in their applications.

[0003] During the manufacturing process of semiconductor products, effective cleaning is required. Generally, cleaning machines are used to clean the products. However, existing cleaning machines are not comprehensive enough, often only capable of performing single cleaning processes, and the cleaning process is relatively simple, failing to achieve comprehensive cleaning. Therefore, this utility model provides a cleaning chamber structure for a semiconductor cleaning machine, thereby improving the cleaning effect on semiconductors. Utility Model Content

[0004] In view of the shortcomings of the existing cleaning chamber structure of semiconductor cleaning machines, this utility model provides a cleaning chamber structure for semiconductor cleaning machines, which solves the problems mentioned in the background art.

[0005] This utility model provides the following technical solution: a cleaning chamber structure for a semiconductor cleaning machine, including a semiconductor cleaning device. A water pump unit is fixedly installed on the top of the semiconductor cleaning device. A feed inlet is opened on the front of the semiconductor cleaning device. A transmission mechanism is installed inside the semiconductor cleaning device. A cleaning platform is provided inside the inner cavity of the semiconductor cleaning device. The transmission mechanism is installed on both sides of the cleaning platform. A water source recovery port is formed on the side of the cleaning platform near the transmission mechanism. The water source recovery port is connected to the bottom of the semiconductor cleaning device. A cleaning top plate is installed above the cleaning platform. A cleaning mechanism is installed below the cleaning top plate. The outer side of the transmission mechanism is composed of a transmission belt, and a drive gear is installed inside the transmission belt. Driven gears are driven and connected to the upper and lower sides of the drive gear. A drive rack is provided on the inner side of the transmission belt. The driven gear meshes with the drive rack. The surface of the transmission belt is composed of a hollow belt structure and has multiple sets of hollow openings that are connected to the internal space. A drive motor is installed inside the semiconductor cleaning device. The output end of the drive motor is connected to the shaft end of the drive gear.

[0006] Preferably, the water inlet pipe of the water pump unit extends to the bottom of the inner cavity of the semiconductor cleaning device through the semiconductor cleaning device, and the water outlet pipe of the water pump unit is connected to the cleaning mechanism below the cleaning top plate.

[0007] Preferably, the water source recovery port is composed of several crossbars arranged in an alternating pattern, and the gap between the crossbars is smaller than the size of the semiconductor product.

[0008] Preferably, the two ends of the driven gear are connected to the inside of the semiconductor cleaning device via shafts.

[0009] Preferably, a pressurizing device is installed at the bottom of the cleaning mechanism, and the water spray nozzle of the cleaning mechanism is adjustable.

[0010] Compared with the existing semiconductor cleaning machine's cleaning chamber structure, this invention has the following advantages:

[0011] 1. The cleaning chamber structure of this semiconductor cleaning machine controls the driving of semiconductor products through a transmission mechanism, eliminating the need for manual operation and enabling automated processing. The transmission mechanism, through the drive structure, drives the semiconductor to move under the action of the belt. Because the belt has high friction, it can drive the semiconductor on the surface to move. Furthermore, based on the control of the drive mechanism, the reciprocating motion of the transmission mechanism can be realized.

[0012] 2. The cleaning chamber structure of this semiconductor cleaning machine uses a cleaning mechanism to clean the semiconductor. The cleaning mechanism adopts all-round coverage, which can be more comprehensive and improve the cleaning range. In addition, the setting of the pressure equipment can increase the cleaning force and powerfully remove the semiconductor surface, thereby achieving a high cleaning effect. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the cleaning machine of this utility model;

[0014] Figure 2 This is a partial structural diagram of the cleaning machine of this utility model;

[0015] Figure 3 This is a schematic diagram of the transmission mechanism structure of this utility model;

[0016] Figure 4 This is a schematic diagram of the cleaning mechanism of this utility model;

[0017] Figure 5 This is a top view of the cleaning table structure of this utility model.

[0018] In the diagram: 1. Semiconductor cleaning device; 2. Water pump unit; 3. Feed inlet; 4. Transmission mechanism; 5. Cleaning table; 6. Water source recovery port; 7. Cleaning top plate; 8. Cleaning mechanism; 9. Drive gear; 10. Driven gear; 11. Drive rack. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-5 A cleaning chamber structure for a semiconductor cleaning machine includes a semiconductor cleaning device 1. A water pump unit 2 is fixedly installed on the top of the semiconductor cleaning device 1. A feed inlet 3 is opened on the front of the semiconductor cleaning device 1. A transmission mechanism 4 is installed inside the semiconductor cleaning device 1. A cleaning platform 5 is provided inside the inner cavity of the semiconductor cleaning device 1. The transmission mechanism 4 is installed on both sides of the cleaning platform 5. The semiconductor cleaning device 1 adopts a two-end transmission method to facilitate synchronous cleaning. A water source recovery port 6 is formed on the side of the cleaning platform 5 near the transmission mechanism 4. The water source recovery port 6 is connected to the bottom of the semiconductor cleaning device 1. The water source recovery port 6 is composed of several intersecting crossbars, with the gaps between the crossbars smaller than the dimensions of the semiconductor product. A cleaning top plate 7 is installed above the cleaning table 5, and a cleaning mechanism 8 is installed below the cleaning top plate 7. The inlet pipe of the water pump unit 2 extends through the semiconductor cleaning device 1 to the bottom of the inner cavity of the semiconductor cleaning device 1. The outlet pipe of the water pump unit 2 is connected to the cleaning mechanism 8 below the cleaning top plate 7. A pressurization device is installed at the bottom of the cleaning mechanism 8, and the spray nozzle of the cleaning mechanism 8 is adjustable. The semiconductor is cleaned through the cleaning mechanism 8, which provides all-around coverage. This design provides a more comprehensive and wider cleaning range. The addition of a pressure booster enhances cleaning power, effectively removing impurities from semiconductor surfaces for a superior cleaning effect. The outer side of the transmission mechanism 4 is composed of a transmission belt, inside which is installed a drive gear 9. Driven gears 10 are connected to the upper and lower sides of the drive gear 9. A drive rack 11 is located on the inner side of the transmission belt, meshing with the driven gears 10. The transmission belt surface features a perforated structure with multiple perforated openings connecting to the internal space. This perforated design facilitates cleaning of semiconductor surfaces. When the semiconductor chip is inside the cleaning chamber, its bottom can be cleaned during the transmission process, improving cleaning efficiency. The two ends of the driven gear 10 are connected to the inside of the semiconductor cleaning device 1 through the shaft. The semiconductor cleaning device 1 is equipped with a drive motor. The output end of the drive motor is connected to the shaft end of the drive gear 9. The drive of the semiconductor product is controlled by the transmission mechanism 4. No manual operation is required, and automated processing can be achieved. The transmission mechanism 4 drives the semiconductor to move under the action of the belt through the drive structure. Because the belt has high friction, it can drive the semiconductor on the surface to move.

[0021] Working principle: When using this semiconductor cleaning machine, semiconductors are put into the inlet. Under the action of the transmission mechanism 4, the semiconductors enter the cleaning machine for cleaning. The cleaning mechanism 8 at the top effectively cleans the semiconductors. The cleaning mechanism 8 is a pressurized type, which increases the water pressure at the outlet and the water outlet range. Under the action of multiple cleaning mechanisms, the water outlet range achieves full coverage, thus effectively cleaning the surface of the semiconductors. The cleaned water flows into the water storage chamber inside the cleaning machine through the water source recovery port, and the impurities will also settle inside. After cleaning, the semiconductors leave the cleaning machine through the inlet, completing the cleaning process.

[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cleaning chamber structure of a semiconductor cleaning machine, comprising a semiconductor cleaning device (1), characterized in that: A water pump unit (2) is fixedly installed on the top of the semiconductor cleaning device (1). Feed inlets (3) are opened on the front sides of both sides of the semiconductor cleaning device (1). A transmission mechanism (4) is installed inside the semiconductor cleaning device (1). A cleaning platform (5) is provided inside the inner cavity of the semiconductor cleaning device (1). The transmission mechanism (4) is installed on both sides of the cleaning platform (5). A water source recovery port (6) is formed on the side of the cleaning platform (5) near the transmission mechanism (4). The water source recovery port (6) is connected to the bottom of the semiconductor cleaning device (1). A cleaning top plate (7) is installed above the cleaning platform (5). (7) is equipped with a cleaning mechanism (8). The outer side of the transmission mechanism (4) is composed of a transmission belt, and the inside of the transmission belt is equipped with an active drive gear (9). The upper and lower sides of the active drive gear (9) are connected to driven gears (10). The inner side of the transmission belt is provided with a drive rack (11). The driven gear (10) meshes with the drive rack (11). The surface of the transmission belt is composed of a hollow belt structure and is provided with multiple hollow openings that are connected to the internal space. The semiconductor cleaning device (1) is equipped with a drive motor. The output end of the drive motor is connected to the shaft end of the active drive gear (9).

2. The cleaning chamber structure of a semiconductor cleaning machine according to claim 1, wherein: The water inlet pipe of the water pump unit (2) extends through the semiconductor cleaning device (1) to the bottom of the inner cavity of the semiconductor cleaning device (1), and the water outlet pipe of the water pump unit (2) is connected to the cleaning mechanism (8) below the cleaning top plate (7).

3. The cleaning chamber structure of a semiconductor cleaning machine according to claim 1, wherein: The water source recovery port (6) is composed of several crossbars arranged in an interlaced manner, with the gap between the crossbars being smaller than the size of the semiconductor product.

4. The cleaning chamber structure of a semiconductor cleaning machine according to claim 1, wherein: The two ends of the driven gear (10) are connected to the inside of the semiconductor cleaning device (1) via shafts.

5. The cleaning chamber structure of a semiconductor cleaning machine according to claim 1, wherein: The bottom of the cleaning mechanism (8) is equipped with a pressurizing device, and the water spray nozzle of the cleaning mechanism (8) is adjustable.

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