Assembling equipment for automatically loading and unloading jig, chip and carrier tape

By integrating automated loading and unloading fixtures, chip and carrier tape assembly equipment, the problem of low positioning and transfer efficiency of chips between carrier tape and fixture is solved. It realizes rapid and accurate positioning of carrier tape in fixture and high-precision placement of chips, meeting the high-precision requirements of the semiconductor industry.

CN224402051UActive Publication Date: 2026-06-23DONGGUAN TENGYUAN MASCH TECH CO LTD
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Patent Information

Application Number
CN202521652082.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-05
Publication Date
2026-06-23
Estimated Expiration
2035-08-05

AI Technical Summary

Technical Problem

In the existing technology, the process of transferring and positioning chips between the carrier tape and the fixture is inefficient and not very accurate. Especially in the case of small-sized chips and high-density packaging, it is difficult to achieve fast and accurate positioning and fixation.

Method used

An automated assembly device for mounting and dismounting fixtures, chips, and carrier tapes was designed. Through the integrated design of modules such as fixture transfer components, carrier tape conveying components, and chip placement components, the device achieves rapid and accurate positioning of the carrier tape in the fixture and high-precision placement of the chip. A high-resolution vision camera is used to correct positional errors in real time.

Benefits of technology

It enables rapid and reliable positioning of carrier tapes in fixtures and high-precision, high-speed placement of chips, improving the level of automation and meeting the semiconductor industry's demand for smaller chips, higher precision, and faster line changeover.

✦ Generated by Eureka AI based on patent content.
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Abstract

The assembling equipment capable of automatically loading and unloading the jig, the chip and the carrier tape comprises a working table, a jig transferring assembly used for transferring the jig, the chip and the carrier tape is arranged on the working table, a jig loading and unloading assembly used for loading the jig is arranged at one end of the working table in a connected mode, and the other end of the working table is connected with the chip loading and unloading assembly. A jig feeding assembly used for feeding and feeding jigs is arranged on the portion, located on the workbench, of one side of the jig feeding and discharging assembly. In the implementation process of the technical scheme, the whole process of carrying in the jig, placing the chips and locking the jig is automatically joined, manual intervention is not needed, a plurality of chips can be synchronously placed at a time, different sizes of chips can be adapted, the core requirements of smaller chips, higher precision and quicker wire replacement of semiconductors are met, and the production efficiency is improved. The carrier tape for bearing the chip can be quickly, accurately and reliably positioned and fixed in the jig, and the chip can be placed in the carrier tape in a high-precision and high-speed manner.
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