Wafer gripping mechanism

Abstract

The utility model relates to wafer automation technical field especially is a kind of wafer clamping mechanism, for with the clamping mechanical arm connection of wafer loading equipment, including the jaw for clamping wafer, the drive assembly for making the jaw clamping or release wafer and the waterproof seal box for preventing water infiltration drive assembly, the waterproof seal box is located between clamping mechanical arm and jaw;The waterproof seal box includes the loading box of top end opening and the sealing upper cover plate of buckling installation in loading box top end, the loading box is driven connection with the clamping mechanical arm, the drive assembly is installed in loading box.The utility model is applicable to humid working condition transmission operation, structure is accurate, adopts double waterproof groove design protection clamping mechanism, and waterproof sealing effect is better.

Description

Technical Field

[0001] This utility model relates to the field of wafer automation technology, and in particular to a wafer clamping mechanism. Background Technology

[0002] With the continuous development of industrial automation and intelligence, the demand for wafers is increasing both domestically and internationally. Some wafer production processes require environments with liquids, such as cleaning or performing other processes on wafers in the presence of water or corrosive liquids. This necessitates Humid robotic arms that are designed for handling humid conditions. Currently, the domestic market for Humid robotic arms is dominated by foreign companies, and domestically produced equipment is extremely scarce. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a wafer clamping mechanism that is suitable for transmission operations in humid conditions. It has a precise structure and adopts a double waterproof groove design to protect the clamping mechanism, resulting in better waterproof sealing.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A wafer gripping mechanism for connection to a gripping robotic arm of a wafer loading device includes grippers for gripping wafers, a drive assembly for gripping or releasing wafers by the grippers, and a waterproof sealed enclosure for preventing water from penetrating the drive assembly. The waterproof sealed enclosure is located between the gripping robotic arm and the grippers. The waterproof sealed enclosure includes a loading box with an open top and a sealing top cover plate snapped onto the top of the loading box. The loading box is drivenly connected to the gripping robotic arm, and the drive assembly is installed inside the loading box.

[0006] Furthermore, the gripper includes a tray connected to the loading box for carrying the wafer, a clamping assembly, and a connecting plate connected to the clamping assembly. The driving assembly is driven to the connecting plate, and the connecting plate passes through the loading box. The driving assembly drives the connecting plate to move closer to or away from the tray, so that the tray and the clamping assembly can clamp or release the wafer.

[0007] Furthermore, a first waterproof groove is connected to one side of the loading box, a second waterproof groove is provided inside the loading box, the drive assembly is located between the first and second waterproof grooves, and one end of the connecting plate extends into the first waterproof groove.

[0008] Furthermore, the loading box has a through groove on its wall that communicates with the first waterproof groove, and the connecting plate passes through the through groove. The inner side of the first waterproof groove has a notch, and the connecting plate passes through the first notch. When the driving assembly drives the connecting plate away from the pallet to the desired position, one end of the connecting plate abuts against the inner wall of the first waterproof groove.

[0009] Furthermore, the connecting plate includes an upper connecting part, an abutting part, and a lower connecting part that are driven to be connected to the driving assembly. The two ends of the abutting part are respectively connected to the upper connecting part and the lower connecting part. The lower connecting part is slidably connected to the first waterproof groove. The upper connecting part passes through the notch. The abutting part corresponds to the through groove. When clamping the wafer, the abutting part passes through the through groove. When releasing the wafer, one side of the abutting part abuts against the inner sidewall of the first waterproof groove.

[0010] Furthermore, the tray includes a support plate and at least two first ladders disposed on the support plate for carrying wafers, and the clamping assembly includes a clamping plate connected to the connecting plate and at least two second ladders mounted on the clamping plate for carrying wafers; when clamping the wafer, the inner sidewalls of the first and second ladders clamp the outer side of the wafer.

[0011] Furthermore, the driving assembly includes a driving unit, a photoelectric sensor, and a detection baffle connected to the gripper driving assembly. The detection baffle is connected to the output shaft of the driving unit and has a notch. When the gripper picks up the wafer, the photoelectric sensor corresponds to the notch.

[0012] The beneficial effects of this utility model are:

[0013] In practical applications, the wafer to be processed is placed on the grippers, and the drive assembly drives the grippers to clamp the wafer. The robotic arm then drives the entire gripping mechanism to transfer the wafer. Throughout the process, the waterproof sealing box effectively provides a waterproof seal. The first waterproof groove facilitates waterproof sealing of the displacement space at the connection between the drive assembly and the grippers, while the second waterproof groove provides secondary waterproof reinforcement, protecting the internal drive assembly and other electrical connection components. This invention is suitable for transmission operations in humid conditions. It features a precise structure and a double waterproof groove design to protect the gripping mechanism, resulting in a superior waterproof seal. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0016] Figure 3 For the present utility model Figure 2 Enlarged structural diagram at point A;

[0017] Figure 4 This is a schematic diagram of the first waterproof groove structure of this utility model;

[0018] Figure 5 This is a structural schematic diagram of the connecting plate and clamping assembly of the gripper of this utility model;

[0019] Figure 6 This is a schematic diagram of the support plate of the gripper of this utility model. Detailed Implementation

[0020] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0021] like Figure 1 and Figure 2 As shown, this utility model provides a wafer gripping mechanism for connection to a gripping robotic arm 1 of a wafer loading device. It includes grippers 2 for gripping wafers, a drive assembly 3 for gripping or releasing wafers by the grippers 2, and a waterproof sealing box 4 for preventing water from seeping into the drive assembly 3. The waterproof sealing box 4 is located between the gripping robotic arm 1 and the grippers 2. The waterproof sealing box 4 includes a loading box 41 with an open top and a sealing top cover 42 fastened to the top of the loading box 41. The loading box 41 is drivenly connected to the gripping robotic arm 1, and the drive assembly 3 is installed inside the loading box 41.

[0022] In practical applications, this wafer gripping mechanism is connected to the gripping robotic arm 1 of the wafer loading equipment. The wafer to be processed is placed on the gripper 2, and the drive component 3 drives the gripper to clamp the wafer. The gripping robotic arm 1 drives the entire gripping mechanism to complete the wafer transfer operation. Throughout the entire operation, the waterproof sealing box 4 effectively provides a waterproof seal, protecting the internal drive component 3 and other electrical connection components. This gripping mechanism is suitable for transfer operations in humid conditions. It has a precise structure and adopts a double waterproof groove design to protect the gripping mechanism, resulting in better waterproof sealing.

[0023] like Figure 1 and Figure 2 As shown, the gripper 2 includes a tray 21 connected to the loading box 41 for carrying wafers, a clamping assembly 22, and a connecting plate 23 connected to the clamping assembly 22. The driving assembly 3 is driven to connect to the connecting plate 23, and the connecting plate 23 passes through the loading box 41. The driving assembly 3 drives the connecting plate 23 to move closer to or away from the tray 21, so that the tray 21 and the clamping assembly 22 can clamp or release the wafer. In this embodiment, when clamping the wafer, the wafer is placed on the tray 21, and the driving assembly 3 drives the clamping assembly 22 through the connecting plate 23 to clamp the wafer between the clamping assembly 22 and the tray 21, completing a stable clamping operation. The tray 21 is detachable, which is convenient for changing wafers of different specifications, making it more applicable.

[0024] like Figure 2As shown, a first waterproof groove 411 is connected to the inside of one side of the loading box 41, and a second waterproof groove 412 is provided inside the loading box 41. The drive assembly 3 is located between the first waterproof groove 411 and the second waterproof groove 412, and one end of the connecting plate 23 extends into the first waterproof groove 411. In this embodiment, the first waterproof groove 411 facilitates the waterproof sealing of the displacement space at the connection between the drive assembly 3 and the gripper 2, and the second waterproof groove 412 plays a secondary role in strengthening the waterproofing, protecting the internal drive assembly 3 and other electrical connection components.

[0025] like Figure 2 and Figure 4 As shown, the loading box 41 has a through groove 413 on its wall that communicates with the first waterproof groove 411. The connecting plate 23 passes through the through groove 413. The inner side of the first waterproof groove 411 has a notch 4111, and the connecting plate 23 passes through the notch 4111. When the driving assembly 3 drives the connecting plate 23 away from the pallet 21 to the desired position, one end of the connecting plate 23 abuts against the inner wall of the first waterproof groove 411. In this embodiment, the four-sided groove wall structure of the first waterproof groove 411 is designed in conjunction with the connecting plate 23 to ensure that the driving assembly 3 and the gripper 2 can complete the driving operation while playing an effective waterproof limiting role.

[0026] like Figure 5 and Figure 6 As shown, the connecting plate 23 includes an upper connecting part 231, an abutting part 232, and a lower connecting part 233 that are driven and connected to the driving component 3. The two ends of the abutting part 232 are respectively connected to the upper connecting part 231 and the lower connecting part 233. The lower connecting part 233 is slidably connected to the first waterproof groove 411. The upper connecting part 231 passes through the notch 4111. The abutting part 232 corresponds to the through groove 413. When clamping the wafer, the abutting part 232 passes through the through groove 413. When releasing the wafer, one side of the abutting part 232 abuts against the inner sidewall of the first waterproof groove 411. In this embodiment, during the driving process, the notch 4111 restricts the range of movement of the abutting part 232.

[0027] like Figure 6As shown, the pallet 21 includes a support plate 211 and at least two first steps 212 disposed on the support plate 211 for carrying wafers, and the clamping assembly 22 includes a clamping plate 221 connected to the connecting plate 23 and at least two second steps 222 mounted on the clamping plate 221 for carrying wafers. When clamping the wafer, the inner walls of the first ladder 212 and the second ladder 222 clamp the outer side of the wafer. In this embodiment, the ladder surfaces of the first ladder 212 and the second ladder 222 are both inclined to facilitate contact with the wafer. At least two sets of the first ladder 212 and the second ladder 222 are provided respectively. When clamping the wafer, the first ladder 212 and the second ladder 222 are located at different positions on the side wall of the wafer to press and fix the wafer for positioning. This structure is simple and the positioning is accurate. If the support plate 211 is hollowed out, the weight of the tray can be reduced. The ladder surfaces are all inclined to facilitate contact with the wafer. When clamping the wafer, after the wafer is placed on the tray 21, it may not be able to be accurately clamped into the set position. At this time, the drive component 3 drives the support plate 221, and the second ladder 222 pushes against the wafer wall until the wafer is pushed to the set position and fixed and clamped.

[0028] like Figure 3 As shown, the driving assembly 3 includes a driving unit 31, a photoelectric sensor 32, and a detection baffle 33, which are driven and connected to the gripper 2. The detection baffle 33 is connected to the output shaft of the driving unit 31, and a notch 331 is provided on the detection baffle 33. When the gripper 2 grips the wafer, the photoelectric sensor 32 corresponds to the notch 331. In this embodiment, when gripping the wafer, the driving unit 31 drives the gripper 2 to complete the wafer gripping action. At this time, the detection baffle 33 moves with the output shaft of the driving unit 31. When the position of the notch 331 of the detection baffle 33 moves to the position directly opposite the detection probe of the photoelectric sensor 32, it indicates that the wafer has been gripped and the next step of the operation can be carried out.

[0029] All technical features in this embodiment can be modified in appearance according to actual needs.

[0030] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A wafer clamping mechanism, characterized in that: For connection with a gripping robotic arm (1) of a wafer loading device, it includes a gripper (2) for gripping a wafer, a drive assembly (3) for gripping or releasing the wafer by the gripper (2), and a waterproof sealing box (4) for preventing water from penetrating the drive assembly (3), the waterproof sealing box (4) being located between the gripping robotic arm (1) and the gripper (2). The waterproof sealed box (4) includes a loading box (41) with an opening at the top and a sealing top cover plate (42) that is fastened to the top of the loading box (41). The loading box (41) is driven to connect with the gripping robotic arm (1), and the drive assembly (3) is installed inside the loading box (41).

2. The wafer clamping mechanism according to claim 1, characterized in that: The gripper (2) includes a tray (21) connected to the loading box (41) and used to carry the wafer, a clamping assembly (22) and a connecting plate (23) connected to the clamping assembly (22). The driving assembly (3) is driven to connect to the connecting plate (23), and the connecting plate (23) passes through the loading box (41). The drive assembly (3) drives the connecting plate (23) to move closer to or away from the tray (21) so that the tray (21) and the clamping assembly (22) can clamp or release the wafer.

3. A wafer clamping mechanism according to claim 2, characterized in that: The loading box (41) has a first waterproof groove (411) inside one side, and a second waterproof groove (412) inside the loading box (41). The drive assembly (3) is located between the first waterproof groove (411) and the second waterproof groove (412). One end of the connecting plate (23) extends into the first waterproof groove (411).

4. A wafer clamping mechanism according to claim 3, characterized in that: The loading box (41) has a through groove (413) on its wall that communicates with the first waterproof groove (411). The connecting plate (23) passes through the through groove (413). The inner side of the first waterproof groove (411) has a notch (4111). The connecting plate (23) passes through the first notch (4111). When the drive assembly (3) moves the connecting plate (23) away from the support plate (21) to the desired position, one end of the connecting plate (23) abuts against the inner wall of the first waterproof groove (411).

5. A wafer clamping mechanism according to claim 4, characterized in that: The connecting plate (23) includes an upper connecting part (231), an abutting part (232), and a lower connecting part (233) that are driven to be connected to the driving assembly (3). The two ends of the abutting part (232) are respectively connected to the upper connecting part (231) and the lower connecting part (233). The lower connecting part (233) is slidably connected to the first waterproof groove (411). The upper connecting part (231) passes through the notch (4111). The abutting part (232) corresponds to the through groove (413). When clamping the wafer, the abutment part (232) passes through the through groove (413). When the wafer is released, one side of the abutment part (232) abuts against the inner wall of the first waterproof groove (411).

6. A wafer clamping mechanism according to claim 2, characterized in that: The pallet (21) includes a support plate (211) and at least two first tiers (212) disposed on the support plate (211) for carrying wafers. The clamping assembly (22) includes a clamping plate (221) connected to the connecting plate (23) and at least two second tiers (222) mounted on the clamping plate (221) for carrying wafers. When clamping the wafer, the inner walls of the first step (212) and the second step (222) clamp the outer side of the wafer.

7. A wafer clamping mechanism according to claim 1, characterized in that: The drive assembly (3) includes a drive unit (31) driven by the gripper (2), a photoelectric sensor (32) and a detection baffle (33). The detection baffle (33) is connected to the output shaft of the drive unit (31) and has a notch (331) on it. When the gripper (2) grips the wafer, the photoelectric sensor (32) corresponds to the notch (331).

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