A heat dissipation cover mounting and aligning device

Abstract

The utility model provides a heat dissipation cover paste whole array device, include: base, including opposite top surface and bottom surface, press fixture pressure block, including fixed connection's press head and press rod, press rod slidingly penetrates in the base, the press head is located bottom surface of the base, connecting rod, set up the both sides of press fixture pressure block, the one end fixed connection of connecting rod is in the base, the other end of connecting rod projects the base bottom surface and with the base parallel, ring dial block, set up the both sides of press head, and ring dial block is located on the connecting rod with the base parallel, can along the connecting rod sliding, can effectively solve the problem of pasting in pasting.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor devices, specifically to a heat sink mounting and arranging device. Background Technology

[0002] With the development of 2.5D and 3D packaging technologies, large-size carrier substrates (used to support and connect multiple chips) have been widely used in semiconductor packaging. These large-size substrates are usually equipped with heat dissipation devices such as heat sinks and heat rings, which not only protect the chips but also effectively dissipate heat. However, due to the high warpage of large-size substrates, coupled with dimensional errors in the heat sinks, heat rings, and substrates during processing, there is a risk of misalignment of the heat dissipation devices during the mounting process, thus affecting product yield and performance. Utility Model Content

[0003] In view of the problems existing in the heat dissipation device mounting in the prior art, this application provides a heat dissipation cover mounting and aligning device to solve the problems such as errors in the mounting of heat dissipation covers in the prior art.

[0004] To achieve the above and other related objectives, this utility model provides a heat dissipation cover mounting and aligning device, which includes:

[0005] The base includes a top surface and a bottom surface that are positioned opposite each other;

[0006] The pressing fixture includes a pressing head and a pressing rod that are fixedly connected. The pressing rod slides through the base, and the pressing head is located on the bottom surface of the base.

[0007] A connecting rod is provided on both sides of the pressing block of the pressing fixture. One end of the connecting rod is fixedly connected to the base, and the other end of the connecting rod extends out of the bottom surface of the base and is parallel to the base.

[0008] A ring-shaped deflector is disposed on both sides of the pressing head, and the ring-shaped deflector is located on the connecting rod parallel to the base and can slide along the connecting rod.

[0009] Optionally, it further includes: an elastic element located on the connecting rod parallel to the base, and the elastic element being located between the pressing jig block and the ring block.

[0010] Optionally, it also includes:

[0011] A pad is located on the top surface of the base;

[0012] A limiting plate, in contact with the pad block, is positioned above the base;

[0013] A support plate is disposed above the limiting plate;

[0014] Multiple support rods are located between the limiting plate and the support plate;

[0015] The transmission rod is located above the base, and it passes through the support plate and the limiting plate from top to bottom, and is in contact with the pressing block of the pressing fixture.

[0016] Optionally, the side of the pressing rod away from the pressing head further includes a T-shaped connector, the vertical rod of which is fixedly connected to the pressing rod.

[0017] Optionally, when the pressing block of the pressing fixture is pressed down, the horizontal plate of the T-shaped connector is in contact with the top surface of the base.

[0018] Optionally, it also includes:

[0019] Support feet are located around the bottom surface of the base;

[0020] A stop bar is located on the bottom surface of the base and around the pressing block of the pressing fixture. One end of the stop bar is fixedly connected to the base, and the other end of the stop bar is exposed outside the base.

[0021] The support leg and the abutment are flush on the side away from the base.

[0022] Optionally, it also includes:

[0023] A reference weight is located on the transmission rod between the limiting plate and the support plate;

[0024] An adjustable weight is located on the transmission rod above the support plate.

[0025] Optionally, it also includes:

[0026] Multiple handles are arranged opposite each other on both sides of the base;

[0027] A pulley, located on the base, is used to slidably mount the heat sink cover mounting and aligning device onto the heat sink cover mounting equipment.

[0028] Optionally, the transmission rod has a protrusion on the side near the limiting plate.

[0029] Optionally, when the pressing block of the pressing fixture is pressed down, the height of the pad is equal to the height of the pressing head and the bottom surface of the base.

[0030] Optionally, when the pressing block of the pressing fixture is pressed down, the adjustable weight is in close contact with the support plate, and the force of the adjustable weight acts on the support plate.

[0031] As described above, the heat sink mounting and aligning device, its manufacturing method, and the display device provided by this utility model have at least the following beneficial technical effects:

[0032] In this utility model's heat sink mounting and aligning device, the coordinated action of ring-shaped levers (first lever 41 and second lever 42) achieves alignment between the heat sink and the chip, solving the problem of misalignment during mounting. The use of a reference weight 61 and an adjustable weight 62 provides adjustable pressure, and the transmission rod abutment structure prevents overpressure damage to the chip. An automatic reset mechanism driven by an elastic element 31 further improves manual operation efficiency. A protrusion 64 on the transmission rod contacts the limiting plate 51 to prevent overpressure damage to the chip. Attached Figure Description

[0033] Figure 1 The image shows the front view of the heat sink mounting assembly.

[0034] Figure 2 The diagram shows the pressing block of the pressing fixture.

[0035] Figure 3 The diagram shows the heat sink mounting and aligning device applied to the carrier substrate.

[0036] Figure 4 Displayed as Figure 3 An enlarged view of region A shown.

[0037] Figure Labels

[0038] 1. Base; 10. Top surface; 11. Bottom surface; 2. Pressing fixture block; 21. Pressing head; 211. Contact head; 212. Metal head; 22. Pressing rod; 23. T-shaped connecting block; 3. Connecting rod; 31. Elastic element; 4. Ring block; 5. Pad block; 51. Limiting plate; 52. Support rod; 53. Support plate; 6. Transmission rod; 61. Reference weight; 62. Adjustable weight; 63. Groove; 64. Protrusion; 7. Carrier substrate; 71. Chip; 72. Heat sink cover; 8. Support rod; 9. Handle; 91. Pulley; 92. Support foot. Detailed Implementation

[0039] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0040] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0041] like Figure 1 The image shows a front view of the heat sink cover mounting and aligning device provided in this embodiment. The heat sink cover mounting and aligning device includes a base 1, comprising a top surface 10 and a bottom surface 11 disposed opposite to each other; a pressing fixture block 2, comprising a pressing head 21 and a pressing rod 22 fixedly connected, the pressing rod 22 slidingly penetrating within the base 1, and the pressing head 21 located on the bottom surface 11 of the base 1; a connecting rod 3, disposed on both sides of the pressing fixture block 2, one end of the connecting rod 3 fixedly connected to the base 1, and the other end extending out of the bottom surface 11 of the base and parallel to the base 1; and a ring-shaped paddle 4, disposed on both sides of the pressing head 21, and the ring-shaped paddle 4 located on the connecting rod 3 parallel to the base 1, and slidable along the connecting rod 3.

[0042] like Figure 2 The diagram shown is a schematic of the pressing block of the pressing fixture provided in this embodiment; combined with Figure 1 The pressing fixture 2 provided in this embodiment includes a pressing head 21, a pressing rod 22, and a T-shaped connecting block 23. The pressing head 21 consists of two parts: a contact head 211 that contacts the carrier substrate 7, and a metal head 212. The contact head 211 is detachably connected to the metal head 212. In this embodiment, the contact head 211 is fixed to the metal head 212 by bolts. Specifically, the contact head 211 directly contacts the heat dissipation device such as the heat sink 72 and heat dissipation ring on the carrier substrate 7; therefore, the material of the contact head 211 includes Teflon, etc. The pressing head 21, pressing rod 22, and T-shaped connecting block 23 are made of metal materials such as stainless steel and aluminum alloy. The pressing head 21, pressing rod 22, and T-shaped connecting block 23 can be an assembled and fixed connecting body or an integrally formed metal structure.

[0043] Please continue reading. Figure 1 The heat dissipation cover 72 mounting and aligning device provided in this embodiment also includes a pad 5 located on the top surface 10 of the base; a limiting plate 51 in contact with the pad 5 and disposed above the base 1; a support plate 53 disposed above the limiting plate 51; a plurality of support rods 52 located between the limiting plate 51 and the support plate 53; and a transmission rod 6 located above the base 1, the transmission rod 6 passing through the support plate 53 and the limiting plate 51 from top to bottom and in contact with the pressing fixture block 2.

[0044] The pad 5 is used to support the limiting plate 51, forming a gap between the limiting plate 51 and the base 1 to facilitate control of the pressing depth of the transmission rod 6. Generally, the shape and position of the pad 5 can be adjusted according to the size of the heat sink cover 72 mounting assembly. The pad 5 includes small pads, located at the four corners of the top surface 10 of the base; in this embodiment, the pad 5 is a cuboid pad, the length of which is equal to the width of the base 1, such as... Figure 1 As shown, the pad 5 is located at both ends of the top surface 10 of the base. Support rods 52 support the support plate 53, forming a gap between the limiting plate 51 and the support plate 53. A reference weight 61 is installed on the transmission rod 6 between the limiting plate 51 and the support plate 53. The number of support rods 52 is greater than or equal to three; in this embodiment, four support rods 52 are provided. The support plate 53 is located at the four corners of the top surface of the limiting plate 51. The transmission rod 6 is as follows... Figure 1 As shown, the support plate 53 and the limiting plate 51 pass through from top to bottom, and the lower end of the transmission rod 6 is a hemispherical end, which abuts against the pressing block 2 of the pressing fixture.

[0045] The heat sink cover 72 mounting and aligning device also includes a reference weight 61 located on the transmission rod 6 between the limiting plate 51 and the support plate 53; and an adjustable weight 62 located on the transmission rod 6 above the support plate 53. The reference weight 61 provides a basic pre-pressure to ensure minimum stable pressure when the pressing head 21 initially contacts the heat sink cover 72; the adjustable weight 62 is assembled via a threaded connection, dynamically adjusting the total pressing pressure to adapt to heat sink covers 72 or sealing rings of different sizes / materials. By adjusting the position / number of the weights, the required pressing force for the product can be precisely matched. Generally, the mass of the reference weight 61 includes 1kg, 2kg, and 3kg; the mass of the adjustable weight 62 includes 0.5kg, 1kg, 5kg, 10kg, and 20kg, which can be freely combined according to the size of the actual heat sink device. Generally, for a small sealing ring requiring 50-60N of pressure, approximately a 2kg reference weight plus a 5kg adjustable weight is needed; for a large heat sink cover 72 requiring 250N of pressure, approximately a 2kg reference weight plus two 20kg adjustable weights is needed. This example is for illustrative purposes only; specific data will depend on conditions such as the distance between the reference weight 61 and the adjustable weight 62 and the pressing head 21 in the actual heat sink cover 72 mounting assembly device.

[0046] Specifically, Figure 1 As shown, the transmission rod 6 has a groove 63 located on the upper side of the support plate 53, and an adjustable weight 62 is disposed within the groove 63. From the overall structure, the transmission rod 6 gradually thickens from top to bottom. A protrusion 64 is also provided on the transmission rod 6, located on the side of the transmission rod 6 closest to the limiting plate 51. Figure 1In the state shown, the gravity of the adjustable weight 62 acts on the support plate 53 and does not exert pressure on the pressing block 2 of the pressing fixture. Figure 1 This can be considered as the heat sink cover 72 mounting and aligning device being in an unused, static state: The pressing fixture block 2 is under pressure from the reference weight 61. At this time, the adjustable weight 62 is tightly against the support plate 53, therefore it does not exert pressure on the pressing fixture block 2. Furthermore, when the pressing fixture block 2 is under pressure, the height of the pad 5 is equal to the height of the pressing head 21 and the bottom surface 11 of the base; the protrusion 21 is tightly against the limiting plate 51, and the transmission rod 6, blocked by the protrusion 64, bears the weight of the weight on the limiting plate 51, preventing the entire force of the weight from being applied to the pressing fixture block 2; the horizontal plate of the T-shaped connecting block is in close contact with the top surface 10 of the base; this provides triple protection, preventing excessive pressure from the transmission rod, which could lead to excessive pressure on the pressing fixture block 2 and damage to the heat sink cover 72 mounting and aligning device.

[0047] like Figure 3 The diagram shows the effect of the heat sink cover mounting and aligning device on the carrier substrate. When the heat sink cover 72 mounting and aligning device is applied to the carrier substrate 7, both the reference weight 61 and the adjustable weight 62 exert pressure on the transmission rod 6. Under the action of the weights, the transmission rod 6 applies pressure to the pressing fixture block 2. Under the action of the pressure, the pressing fixture block 2 adheres the heat sink cover 72 or heat sink ring to the carrier substrate 7, while the carrier substrate 7 lifts the pressing fixture block 2 upward. Ideally, the pressing head 21 should be in contact with the bottom surface 11 of the base when the pressing fixture block 2 is in the lifted state. However, under normal circumstances, the upward supporting force provided by the carrier substrate 7 is insufficient to bring the pressing head 21 into contact with the bottom surface 11 of the base.

[0048] like Figure 4 As shown, it is displayed as Figure 3 The enlarged view of area A shows that a connecting rod 3 is provided at each end of the pressing jig block 2. One end of the connecting rod 3 is fixedly connected to the base 1, and the other end extends out of the base 1 and is parallel to the bottom surface 11 of the base. Generally, fixing one end of the connecting rod 3 to the base 1 includes directly fixing the connecting rod 3 inside the base 1, or bending the end of the connecting rod 3 inside the base 1 to increase the contact between the connecting rod 3 and the base 1. The height of the portion of the connecting rod 3 located on the bottom surface 11 of the base is less than the height of the support leg 91.

[0049] like Figure 4As shown, a ring-shaped lever 4 is disposed on a connecting rod 3 parallel to the base 1, and a ring-shaped lever 4 is disposed at each end of a pressing fixture block 2. The ring-shaped lever 4 slides along the connecting rod 3. The ring-shaped lever 4 includes a first lever 41 and a second lever 42, which are fixedly connected. The first lever 41 is located above the second lever 42. On the side near the pressing fixture block 2, the first lever 41 and the second lever 42 form a trapezoidal guide surface. Compared to the second lever 42, the first lever 41 is farther away from the pressing fixture block 2. Specifically, it also includes an elastic element 31, located on the connecting rod 3 parallel to the base 1, and the elastic element 31 is located between the pressing fixture block 2 and the ring-shaped lever 4. The elastic element 31 includes a return spring, etc.

[0050] like Figure 1 As shown, the heat sink cover 72 mounting and aligning device also includes support feet 92 located around the bottom surface 11 of the base. The support feet 92 are used to support the entire heat sink cover 72 mounting and aligning device. Abutment rods 8 are located on the bottom surface 11 of the base and around the pressing fixture block 2. The number of abutment rods 8 is not limited; in this embodiment, two abutment rods are provided. One end of the abutment rod 8 is fixedly connected to the base 1, and the other end of the abutment rod 8 is exposed outside the base. The abutment rods 8 further prevent excessive pressure from the transmission rod 6, which could cause the pressing fixture block 2 to damage the chip 71. Specifically, the support feet 92 and the abutment rods 8 are flush on the side away from the base 1.

[0051] It also includes: multiple handles 9, arranged opposite each other on both sides of the base 1; and pulleys 91, located on the base 1, for slidably mounting the heat sink 72 mounting assembly to the heat sink 72 mounting equipment. Specifically, in this embodiment, three handles 9 are provided, respectively located on the three sides of the base 1, wherein two handles 9 are as follows: Figure 1 As shown, the pulley 91 is arranged in the vertical direction relative to the base 1 and parallel to the transmission rod 6, which facilitates the vertical movement of the heat sink cover 72 mounting and aligning device; and the pulley 91 is located directly below the handle 9; optionally, there is another handle 9 perpendicular to the transmission rod 6 and located on one of the other two opposite sides of the base, for mounting the heat sink cover 72 mounting and aligning device onto the heat sink cover 72 mounting equipment and sliding it in the horizontal direction.

[0052] The specific working process of the heat sink 72 mounting and aligning device: There are many chips 71 on the carrier substrate 7. The height of the chips 71 is generally higher than that of the carrier substrate 7. When using the heat sink 72 mounting and aligning device to mount a heat sink device (including heat sink 72 or heat sink ring) on ​​a chip 71: First, the operator holds the handle 9 and places the heat sink 72 mounting and aligning device on the heat sink 72 mounting equipment. The pulley 91 is placed on the track of the heat sink 72 mounting equipment, and the heat sink 72 mounting and aligning device is slid to the designated position. The heat sink device is then placed on the chip 71. There may be a deviation between the heat sink device and the chip 71. Then, the operator manually pushes the ring lever 4 towards the center, and the second lever 42 contacts the chip 71 and the edge of the heat sink, applying a horizontal force to precisely align the heat sink above the chip 71. Then, the adjustable weight 62 is adjusted; the weight's gravity causes a downward displacement through the transmission rod 6, precisely attaching the heat sink to the chip 71. The carrier substrate 7 lifts the pressing head 21, pushing it upwards, causing the protrusion on the transmission rod 6 to disengage from the limiting plate 51, and the adjustable weight 62 to disengage from the support plate 53, exerting pressure on the transmission rod 6. The elastic element 31 provides an automatic restoring force, pushing the ring lever 42 back to its original position, forming a... Figure 3 The diagram shown is shown in the image.

[0053] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A heat sink cover mounting and aligning device, characterized in that, include: The base includes a top surface and a bottom surface that are positioned opposite each other; The pressing fixture includes a pressing head and a pressing rod that are fixedly connected. The pressing rod slides through the base, and the pressing head is located on the bottom surface of the base. A connecting rod is provided on both sides of the pressing block of the pressing fixture. One end of the connecting rod is fixedly connected to the base, and the other end of the connecting rod extends out of the bottom surface of the base and is parallel to the base. A ring-shaped deflector is disposed on both sides of the pressing head, and the ring-shaped deflector is located on the connecting rod parallel to the base and can slide along the connecting rod.

2. The heat dissipation cover mounting and aligning device according to claim 1, characterized in that, Also includes: An elastic element is located on the connecting rod parallel to the base, and the elastic element is located between the pressing block of the pressing fixture and the ring block.

3. The heat dissipation cover mounting and aligning device according to claim 1, characterized in that, Also includes: A pad is located on the top surface of the base; A limiting plate, in contact with the pad block, is positioned above the base; A support plate is disposed above the limiting plate; Multiple support rods are located between the limiting plate and the support plate; The transmission rod is located above the base, and it passes through the support plate and the limiting plate from top to bottom, and is in contact with the pressing block of the pressing fixture.

4. The heat dissipation cover mounting and aligning device according to claim 1, characterized in that, The side of the pressing rod away from the pressing head also includes a T-shaped connector, and the vertical rod of the T-shaped connector is fixedly connected to the pressing rod.

5. The heat dissipation cover mounting and aligning device according to claim 4, characterized in that, When the pressing block of the pressing fixture is pressed down, the horizontal plate of the T-shaped connector is in contact with the top surface of the base.

6. The heat dissipation cover mounting and aligning device according to claim 1, characterized in that, Also includes: Support feet are located around the bottom surface of the base; A stop bar is located on the bottom surface of the base and around the pressing block of the pressing fixture. One end of the stop bar is fixedly connected to the base, and the other end of the stop bar is exposed outside the base. The support leg and the abutment are flush on the side away from the base.

7. The heat dissipation cover mounting and aligning device according to claim 3, characterized in that, Also includes: A reference weight is located on the transmission rod between the limiting plate and the support plate; An adjustable weight is located on the transmission rod above the support plate.

8. The heat dissipation cover mounting and aligning device according to claim 1, characterized in that, Also includes: Multiple handles are arranged opposite each other on both sides of the base; A pulley, located on the base, is used to slidably mount the heat sink cover mounting and aligning device onto the heat sink cover mounting equipment.

9. The heat dissipation cover mounting and aligning device according to claim 3, characterized in that, The transmission rod has a protrusion on the side near the limiting plate.

10. The heat dissipation cover mounting and aligning device according to claim 3, characterized in that, When the pressing block of the pressing fixture is pressed down, the height of the pad is equal to the height of the pressing head and the bottom surface of the base.

11. The heat dissipation cover mounting and aligning device according to claim 7, characterized in that, When the pressing block of the pressing fixture is pressed down, the adjustable weight is in close contact with the support plate, and the force of the adjustable weight acts on the support plate.

Images