Rotor refrigerating device for a vacuum centrifuge

Abstract

The utility model relates to a rotor refrigerating plant of vacuum centrifuge, including mounting seat, semiconductor refrigeration subassembly and fluid passage, semiconductor refrigeration subassembly is used to form refrigeration end and heat -generating end, the heat -generating end is pasted with mounting seat, the refrigeration end is used to radiate refrigeration to rotor, the mounting seat is used to bear semiconductor refrigeration subassembly and conduction heat, fluid passage sets up in mounting seat, fluid passage is used to flow circulation refrigerant and take away the heat of mounting seat, the utility model discloses a clever combination of the refrigeration of semiconductor refrigeration subassembly and fluid passage circulation refrigerant heat dissipation, forms stable temperature difference in vacuum environment, utilizes heat radiation and exchanges heat to give rotor cooling, has solved the rotor refrigeration heat dissipation problem of vacuum centrifuge.

Description

Technical Field

[0001] This utility model belongs to the field of centrifuge heat dissipation technology, specifically relating to a rotor cooling device for a vacuum centrifuge. Background Technology

[0002] A centrifuge is a device that uses centrifugal force to separate liquid suspensions of different densities and particle sizes. The sample is placed inside the centrifuge rotor. The rotor is mounted on top of the motor shaft.

[0003] High-speed centrifuges (maximum speed ≥ 10,000 rpm and ≤ 30,000 rpm) or ultracentrifuges (maximum speed ≥ 30,001 rpm) are widely used in basic medicine, biochemistry, chemical engineering, pharmaceuticals, food, and sample testing. Especially in basic medicine and biopharmaceuticals, ultracentrifuges are essential instruments. During high-speed or ultracentrifugation, the rotor of an ultracentrifuge operates in a vacuum environment; otherwise, due to air friction resistance, it would be difficult for the rotor to achieve ultracentrifugation. Since ultracentrifuged samples are generally temperature-sensitive—for example, during the ultracentrifugation extraction of animal cell exosomes, the internal temperature of the rotor must not exceed 10°C—it is difficult to cool a rotor operating at high speed in a vacuum environment through heat conduction or convection. This is because there is no conductive or convective medium in a vacuum, and traditional compressor refrigeration systems are extremely inefficient at cooling the rotor. In practical applications, it is difficult to reduce the internal temperature of the rotor to below 10°C.

[0004] In summary, there is an urgent need to provide a rotor cooling device for vacuum centrifuges that can effectively solve the technical problem of the difficulty in cooling the rotor of a centrifuge in a vacuum environment. Utility Model Content

[0005] The purpose of this invention is to provide a rotor cooling device for a vacuum centrifuge that can effectively solve the technical problem of difficulty in cooling the rotor of a centrifuge in a vacuum environment.

[0006] The above objective is achieved through the following technical solution: a rotor refrigeration device for a vacuum centrifuge, comprising a mounting base, a semiconductor refrigeration component, and a fluid channel. The semiconductor refrigeration component forms a cooling end and a heating end. The heating end is attached to the mounting base, and the cooling end radiates cooling to the rotor. The mounting base supports the semiconductor refrigeration component and conducts heat. The fluid channel is disposed within the mounting base and is used to circulate refrigerant to remove heat from the mounting base.

[0007] This invention is used to cool and dissipate heat from the rotor of a vacuum centrifuge. In practical applications, the semiconductor cooling component can be a TEC1-25506 semiconductor cooling chip. The heating end is tightly attached to the upper surface of the mounting base. When the rotor assembly is centrifuged in a vacuum environment, after a direct current is applied to the circuit of the semiconductor cooling component, energy transfer occurs. When a direct current is applied to the TEC1-25506 semiconductor cooling chip, the heat generated by its heating surface is rapidly conducted to the aluminum mounting base. The heat of the mounting base is then quickly carried away by the refrigerant flowing at high speed in the fluid channel tightly attached to its inner surface, forming a continuous and stable extremely low temperature from the cooling end of the semiconductor cooling component. The rotor assembly, located directly above the cooling end, exchanges heat with the rotor through thermal radiation, thereby cooling the rotor. In a specific embodiment, the distance between the bottom surface of the 8x50ml angle rotor assembly of an ultra-high speed refrigerated centrifuge and the cooling surface of the TEC1-25506 semiconductor cooling chip is 20mm. After centrifugation at 30,000rpm for 3 hours in a vacuum environment, the centrifuge is stopped. Immediately after complete stopping, the temperature of the sample inside the rotor (pure water in this embodiment) is measured to be 6℃. The experimental results fully meet industry requirements.

[0008] Those skilled in the art should know that, in addition to the TEC1-25506 semiconductor refrigeration chip, other forms of semiconductor refrigeration chips may be used in the semiconductor refrigeration assembly; the refrigerant includes coolant, gas or other fluid with heat exchange capacity, and the fluid is driven to flow in the fluid channel by a circulating pump.

[0009] The technical solution of this utility model has high reliability, no refrigerant pollution, and is environmentally friendly and energy-saving. The semiconductor refrigeration component is a current-transducer type chip. By controlling the input current, high-precision temperature control can be achieved. With the addition of temperature detection and control methods, it is easy to realize remote control, program control, and computer control, and is convenient to form an automatic control system.

[0010] This invention solves the problem of rotor cooling and heat dissipation in vacuum centrifuges by ingeniously combining the cooling of semiconductor refrigeration components with the heat dissipation of refrigerant through fluid channels to form a stable temperature difference in a vacuum environment and using thermal radiation for heat exchange to cool the rotor.

[0011] A further technical solution is that the contact surfaces of the semiconductor cooling component, the fluid channel, and the mounting base are all provided with a high thermal conductivity material. The high thermal conductivity material has high thermal conductivity, enabling rapid heat conduction from the heating end of the semiconductor cooling component to the mounting base and then to the fluid channel; in application, thermally conductive silicone grease can be selected as the high thermal conductivity material.

[0012] A further technical solution is that the mounting base is made of aluminum alloy. In this way, the mounting base, being made of aluminum alloy, has excellent thermal conductivity, allowing for rapid heat transfer from the heating end of the semiconductor cooling component.

[0013] A further technical solution is that the fluid channel is a tubular structure, which is spirally or serpentinely coiled within the mounting base. In application, the tubular structure is a metal tube, including copper, aluminum, or other high thermal conductivity metal tubes. The fluid channel is coiled within the mounting base to increase the contact area with the refrigerant and improve heat dissipation efficiency.

[0014] A further technical solution is that the semiconductor cooling assembly includes multiple semiconductor cooling chips, which are evenly distributed in an array on the mounting base. This arrangement ensures reliable and uniform heat dissipation, guarantees the heat dissipation effect, and enhances the cooling effect on the rotor by providing a uniform temperature distribution at the cooling end.

[0015] A further technical solution is that the semiconductor cooling component is fixed to the mounting base by a first pressure ring. During application, the first pressure ring is fixedly connected to the mounting base by screws, and the semiconductor cooling component is pressed between the two for fixation.

[0016] A further technical solution is that the fluid channel component is fixed to the mounting base by an inner pressure ring and an outer pressure ring. During application, the inner pressure ring and the outer pressure ring are respectively fixed to the mounting base by screws, and the fluid channel component is pressed and fixed to the mounting base by the inner pressure ring and the outer pressure ring.

[0017] A further technical solution is that the mounting base is provided with grooves that match the distribution of the fluid channels, and the fluid channels are embedded in the grooves. This arrangement increases the contact area between the mounting base and the fluid channels, thereby improving heat dissipation.

[0018] A further technical solution is that the mounting base is provided with a positioning structure, which is used to cooperate with the corresponding structure of the rotor of the vacuum centrifuge to ensure that the rotor and the cooling end of the semiconductor refrigeration component maintain a set distance.

[0019] A further technical solution is that the fluid channel is provided with an inlet and an outlet for receiving and discharging refrigerant.

[0020] Compared to existing technologies, the implementation of this utility model's technical solution, by combining semiconductor refrigeration components with fluid channel heat dissipation, effectively solves the problem of centrifuge rotors being difficult to cool using traditional methods in a vacuum environment. It can reduce the internal temperature of the rotor to a level that meets practical application requirements. Simultaneously, by utilizing the characteristics of the semiconductor refrigeration components, high-precision temperature control is achieved. By adjusting the input current, the temperature of the cooling surface can be precisely controlled according to different application scenarios and sample requirements. This utility model has no moving parts, resulting in higher reliability compared to traditional refrigeration systems and reducing equipment maintenance and repair costs caused by component wear and failure. Furthermore, it does not use refrigerants, avoiding environmental pollution caused by refrigerants, meeting environmental protection and energy-saving requirements, and possessing significant social and economic benefits. Attached Figure Description

[0021] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of this utility model. The illustrative embodiments of this utility model and their descriptions are used to explain this utility model and do not constitute an improper limitation of this utility model.

[0022] Figure 1 and Figure 2 These are schematic diagrams of the rotor refrigeration device of a vacuum centrifuge according to one embodiment of this utility model from different perspectives.

[0023] Figure 3 This is a top view of the rotor refrigeration device of a vacuum centrifuge according to one embodiment of the present invention;

[0024] Figure 4 This is a bottom view of the rotor refrigeration device of a vacuum centrifuge according to one embodiment of the present invention.

[0025] In the picture:

[0026] 1. Mounting base 2. Fluid channel 3. External pressure ring 4. Internal pressure ring

[0027] 5 First pressure ring 6 Semiconductor cooling chip 7 Inlet 8 Outlet Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings. This description is merely illustrative and explanatory, and should not be construed as limiting the scope of protection of the present invention. Furthermore, those skilled in the art can combine the features in the embodiments described herein and in different embodiments according to the description in this document.

[0029] The embodiments of this utility model are as follows, please refer to... Figures 1-4A rotor refrigeration device for a vacuum centrifuge includes a mounting base 1, a semiconductor refrigeration component, and a fluid channel 2. The semiconductor refrigeration component forms a cooling end and a heating end. The heating end is attached to the mounting base 1, and the cooling end is used to radiate cooling to the rotor. The mounting base 1 supports the semiconductor refrigeration component and conducts heat. The fluid channel 2 is disposed within the mounting base 1 and is used to circulate refrigerant to remove heat from the mounting base 1.

[0030] This invention is used to cool and dissipate heat from the rotor of a vacuum centrifuge. In practical applications, the semiconductor cooling component can be a 6TEC1-25506 semiconductor cooling chip. The heating end is tightly attached to the upper surface of the mounting base 1. When the rotor assembly is centrifuged in a vacuum environment, after a direct current is applied to the circuit of the semiconductor cooling component, energy transfer occurs. When a direct current is applied to the 6TEC1-25506 semiconductor cooling chip, the heat generated by its heating surface is rapidly conducted to the aluminum mounting base 1. The heat of the mounting base 1 is then quickly carried away by the high-speed flowing refrigerant in the fluid channel 2 tightly attached to its inner surface, forming a continuous and stable extremely low temperature from the cooling end of the semiconductor cooling component. The rotor assembly, located directly above the cooling end, exchanges heat with the rotor through thermal radiation, thereby cooling the rotor.

[0031] Those skilled in the art should know that, in addition to the 6TEC1-25506 semiconductor refrigeration chip, other forms of semiconductor refrigeration chips 6 may be used in the semiconductor refrigeration assembly; the refrigerant includes coolant, gas or other fluid with heat exchange capacity, and the fluid is driven to flow in the fluid channel 2 by a circulating pump.

[0032] The technical solution of this utility model has high reliability, no refrigerant pollution, and is environmentally friendly and energy-saving. The semiconductor refrigeration component is a current-transducer type chip. By controlling the input current, high-precision temperature control can be achieved. With the addition of temperature detection and control methods, it is easy to realize remote control, program control, and computer control, and is convenient to form an automatic control system.

[0033] This invention solves the problem of rotor cooling and heat dissipation in vacuum centrifuges by cleverly combining the cooling of semiconductor refrigeration components with the heat dissipation of refrigerant through fluid channel 2, thereby creating a stable temperature difference in a vacuum environment and using thermal radiation for heat exchange to cool the rotor.

[0034] Based on the above embodiments, in another embodiment of this utility model, the contact surfaces of the semiconductor cooling component, the fluid channel 2, and the mounting base 1 are all provided with a high thermal conductivity material. The high thermal conductivity material has high thermal conductivity, enabling rapid heat conduction from the heating end of the semiconductor cooling component to the mounting base 1, and then to the fluid channel 2; in application, thermally conductive silicone grease can be selected as the high thermal conductivity material.

[0035] Based on the above embodiments, in another embodiment of this utility model, the mounting base 1 is made of aluminum alloy. Thus, the mounting base 1, being made of aluminum alloy, has excellent thermal conductivity and can quickly conduct heat generated at the heating end of the semiconductor cooling component.

[0036] Based on the above embodiments, in another embodiment of the present invention, such as Figure 2 The fluid channel 2 is a tubular structure, which is spiral, serpentine, or otherwise designed to increase the heat dissipation area and is coiled within the mounting base 1. During application, the tubular structure is a metal tube, including copper, aluminum, or other high thermal conductivity metal tubes. The fluid channel 2 is coiled within the mounting base 1 to increase the contact area with the refrigerant and improve heat dissipation efficiency.

[0037] Based on the above embodiments, in another embodiment of the present invention, such as Figure 1 The semiconductor cooling assembly includes multiple semiconductor cooling chips 6, which are evenly distributed in an array on the mounting base 1. This arrangement ensures reliable and uniform heat dissipation, guarantees the heat dissipation effect, and enhances the cooling effect on the rotor by providing a uniform temperature distribution at the cooling end.

[0038] Based on the above embodiments, in another embodiment of the present invention, such as Figure 1 The semiconductor cooling component is fixed to the mounting base 1 by a first pressure ring 5. During application, the first pressure ring 5 is fixedly connected to the mounting base 1 by screws, and the semiconductor cooling component is pressed between the two for fixation.

[0039] Based on the above embodiments, in another embodiment of the present invention, such as Figure 2 The two fluid channels are fixed to the mounting base 1 by an inner pressure ring 4 and an outer pressure ring 3. During application, the inner pressure ring 4 and the outer pressure ring 3 are fixedly connected to the mounting base 1 by screws, and the two fluid channels are pressed and fixed to the mounting base 1 by the inner pressure ring 4 and the outer pressure ring 3.

[0040] Based on the above embodiments, in another embodiment of this utility model, the mounting base 1 is provided with grooves that match the distribution of the fluid channels 2, and the fluid channels 2 are embedded in the grooves. This arrangement increases the contact area between the mounting base 1 and the fluid channels 2, thereby improving the heat dissipation effect.

[0041] Based on the above embodiments, in another embodiment of the present invention, such as Figure 1 The mounting base 1 is provided with a positioning structure, which is used to cooperate with the corresponding structure of the rotor of the vacuum centrifuge to ensure that the rotor and the cooling end of the semiconductor refrigeration component maintain a set distance.

[0042] Based on the above embodiments, in another embodiment of the present invention, such as Figure 4 The fluid channel 2 is provided with an inlet 7 and an outlet 8 for receiving and discharging refrigerant. Specific implementation examples:

[0044] like Figures 1-4 The cooling assembly includes five thermoelectric coolers 6, evenly distributed on an aluminum alloy mounting base 1. The selected thermoelectric coolers are TEC1-25506:K10, with individual dimensions of 40x80x3.2mm and a temperature difference of 60℃ between the hot and cold surfaces. The mounting base 1 and the cooling ring 5 are made of 5052 aluminum alloy, which is easy to bend and weld, and provides rapid heat dissipation. The heating end of the thermoelectric cooler faces downwards and is tightly fitted to the upper surface of the mounting base 1 with screws, the contact surface being coated with high thermal conductivity thermal grease. The cooling end of the thermoelectric cooler faces upwards and is tightly fitted to the first pressure ring 5 with screws, the contact surface also being coated with high thermal conductivity thermal grease. The rotor assembly is located directly above the thermoelectric cooler section and the first pressure ring 5. The example is an 8x50ml angle rotor assembly of an ultra-high speed refrigerated centrifuge with a 20mm gap between the bottom surface of the rotor assembly and the cooling surface of the 6TEC1-25506 semiconductor cooling chip. After centrifugation at 30,000 rpm for 3 hours in a vacuum environment, the centrifuge was stopped. Immediately after stopping, the temperature of the sample inside the rotor (pure water in the specific example) was measured to be 6℃. The experimental results fully meet the industry requirements.

[0045] Compared to existing technologies, the implementation of this utility model's technical solution, by combining a semiconductor cooling component with heat dissipation through the fluid channel 2, effectively solves the problem of centrifuge rotors being difficult to cool using traditional methods in a vacuum environment. It can reduce the internal temperature of the rotor to a level that meets practical application requirements. Simultaneously, by utilizing the characteristics of the semiconductor cooling component, high-precision temperature control is achieved. By adjusting the input current, the temperature of the cooling surface can be precisely controlled according to different application scenarios and sample requirements. This utility model has no moving parts, resulting in higher reliability compared to traditional refrigeration systems and reducing equipment maintenance and repair costs caused by component wear and failure. Furthermore, it does not use refrigerant, avoiding environmental pollution caused by refrigerants, meeting environmental protection and energy-saving requirements, and possessing significant social and economic benefits.

[0046] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A rotor refrigeration device for a vacuum centrifuge, characterized in that, The device includes a mounting base, a semiconductor refrigeration component, and a fluid channel. The semiconductor refrigeration component forms a cooling end and a heating end. The heating end is attached to the mounting base, and the cooling end radiates cooling to the rotor. The mounting base supports the semiconductor refrigeration component and conducts heat. The fluid channel is disposed within the mounting base and is used to circulate refrigerant to remove heat from the mounting base.

2. The rotor refrigeration device of the vacuum centrifuge according to claim 1, characterized in that, The contact surfaces of the semiconductor cooling component, the fluid channel, and the mounting base are all made of a material with high thermal conductivity.

3. The rotor refrigeration device of the vacuum centrifuge according to claim 2, characterized in that, The mounting base is made of aluminum alloy.

4. The rotor cooling device of the vacuum centrifuge according to claim 2, characterized in that, The fluid channel is a tubular structure, which is spiral or serpentine and coiled inside the mounting base.

5. The rotor cooling device of the vacuum centrifuge according to claim 2, characterized in that, The semiconductor cooling assembly includes multiple semiconductor cooling chips, which are evenly distributed in an array on the mounting base.

6. The rotor cooling device of the vacuum centrifuge according to claim 5, characterized in that, The semiconductor cooling component is fixed to the mounting base by a first pressure ring.

7. The rotor cooling device of the vacuum centrifuge according to claim 4, characterized in that, The fluid channel component is fixed to the mounting base by an inner pressure ring and an outer pressure ring.

8. The rotor cooling device of the vacuum centrifuge according to claim 4, characterized in that, The mounting base is provided with grooves that match the distribution of the fluid channels, and the fluid channels are embedded in the grooves.

9. The rotor cooling device of the vacuum centrifuge according to claim 1, characterized in that, The mounting base is provided with a positioning structure, which is used to cooperate with the corresponding structure of the rotor of the vacuum centrifuge to ensure that the rotor and the cooling end of the semiconductor refrigeration component maintain a set distance.

10. The rotor refrigeration device of the vacuum centrifuge according to claim 1, characterized in that, The fluid channel is provided with an inlet and an outlet for receiving and discharging refrigerant.

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