A defective product sorting mechanism for a semiconductor logistics device

Abstract

The utility model relates to a mechanism technology field of selecting, especially relates to a mechanism of selecting substandard products for semiconductor logistics equipment, its technical scheme includes: control mechanism, install first conveying mechanism and second conveying mechanism on the control mechanism, first conveying mechanism is used for conveying semiconductor spare parts, second conveying mechanism is used for conveying defective semiconductor spare parts, the control mechanism includes operation platform, install guiding assembly on the operation platform, guiding assembly is used for guiding the moving path of defective semiconductor spare parts, install the material distributing subassembly on the operation platform, the material distributing subassembly is used for changing the conveying path of defective semiconductor spare parts on first conveying mechanism. The utility model has the advantage that the sorting path is accurate and controllable, solves the problem that the substandard product transfer path deviates due to the insufficient guiding accuracy of the traditional equipment.

Description

Technical Field

[0001] This utility model relates to the field of sorting mechanism technology, specifically a defect sorting mechanism for semiconductor logistics equipment. Background Technology

[0002] In the semiconductor manufacturing industry, the production process involves dozens of high-precision steps such as photolithography, etching, and thin film deposition. Any minute defect can cause device failure. To ensure yield, semiconductor logistics equipment needs to perform real-time defect detection and sorting of wafers or chips on the production line. Traditional inspection systems typically rely on vision components to identify defective products, and then mechanical sorting mechanisms transfer defective products from the main conveyor line to the defective product recycling path.

[0003] However, at present, when semiconductor logistics equipment sorts defective products, defective products are prone to deviating from the preset path during the transfer process, requiring manual intervention to correct the error, increasing the frequency of equipment downtime to clear jammed materials, and ultimately causing a decrease in production efficiency and an increase in maintenance costs.

[0004] To address this issue, a defect sorting mechanism for semiconductor logistics equipment is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a defective product sorting mechanism for semiconductor logistics equipment, which has the advantages of precise and controllable sorting path and solves the problem of defective product transfer path deviation caused by insufficient guiding accuracy in traditional equipment.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a defective product sorting mechanism for semiconductor logistics equipment, including a control mechanism, wherein a first conveying mechanism and a second conveying mechanism are installed on the control mechanism, the first conveying mechanism is used to convey semiconductor components, and the second conveying mechanism is used to convey defective semiconductor components;

[0007] The control mechanism includes an operating table, on which a guide assembly is mounted to guide the movement path of the defective semiconductor components.

[0008] The control panel is equipped with a material distribution component, which is used to change the conveying path of the defective semiconductor components on the first conveying mechanism.

[0009] Preferably, a control component is installed on the operating table, which is used for visual inspection of semiconductor components conveyed by the first conveying mechanism.

[0010] In the design, the control component realizes real-time visual inspection of semiconductor components on the first conveying mechanism. This component has high-precision image recognition capability, which can quickly determine the quality status of the parts and provide an accurate signal source for the sorting action.

[0011] Preferably, the guide assembly is fixedly installed on the operating table on the opposite side of the first conveying mechanism and the second conveying mechanism.

[0012] In the design, the guide component is fixedly installed on the operating table on the opposite side of the first conveying mechanism and the second conveying mechanism. This layout realizes the straight-line guiding function of the defective product transfer path and has the physical limiting function to prevent defective products from slipping or deviating from the recycling track.

[0013] Preferably, the material distribution assembly includes a connecting frame, on which an electric push rod is mounted, and at the output end of the electric push rod is a push plate, which is used to push the defective semiconductor components on the first conveying mechanism.

[0014] In the design, the material sorting component adopts an electric pusher driven by a connecting frame. The pusher achieves directional pushing of defective semiconductor components through linear telescopic motion, with controllable stroke and precise force application characteristics, ensuring that defective products are smoothly transferred from the main path to the defective product recycling path.

[0015] Preferably, the first conveying mechanism includes a first support frame, on which a first conveyor belt is mounted via a first drive motor.

[0016] In the design, the first conveying mechanism carries the first conveyor belt driven by the first drive motor through the first support frame, which realizes the high stability of semiconductor components. The drive motor has a speed adjustment function to adapt to different detection cycles.

[0017] Preferably, the second conveying mechanism includes a second support frame, on which a second conveyor belt is mounted via a second drive motor.

[0018] In the design, the second conveying mechanism adopts a combination of a second support frame integrating a second drive motor and a second conveyor belt, which realizes the continuous recycling and transfer of defective products. The surface of the conveyor belt has anti-slip texture to reduce the risk of vibration and displacement during the transfer of defective products.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0020] This invention achieves precise and controllable sorting path by having a guide component and a material sorting component work together on the operating table, effectively solving the problem of defective product transfer path deviation caused by insufficient guiding accuracy in traditional equipment.

[0021] The guide assembly is fixed to the operating table and located in the connection area between the first and second conveying mechanisms, providing a physical guide channel for defective semiconductor components. This assembly directly defines the movement path of the defective products, eliminating the risk of defective products deviating from the preset track in traditional equipment.

[0022] The sorting component is installed on the control panel and actively intervenes to change the conveying direction of defective products on the first conveyor mechanism. When a defective product is identified, the sorting component precisely triggers an action to push it laterally into the path defined by the guide component, ensuring that the defective product enters the second conveyor mechanism in a directional manner.

[0023] The coordinated design of the guiding and distributing components forms a closed-loop control system. The distributing component forces defective products off the main conveyor line, while the guiding component immediately receives and constrains their movement trajectory. Together, they eliminate the free deviation of defective products during the transfer process, significantly improving path control accuracy and reducing the need for jamming and manual intervention. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the control mechanism structure of this utility model;

[0026] Figure 3 This is a schematic diagram of the first conveying mechanism of this utility model;

[0027] Figure 4 This is a schematic diagram of the second conveying mechanism of this utility model.

[0028] In the diagram: 1. Control mechanism; 11. Operating table; 12. Material distribution assembly; 13. Control assembly; 14. Guiding assembly; 2. First conveying mechanism; 21. First support frame; 22. First conveyor belt; 23. First drive motor; 3. Second conveying mechanism; 31. Second support frame; 32. Second conveyor belt; 33. Second drive motor. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Example 1

[0031] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, one embodiment of this utility model is provided: a defective product sorting mechanism for semiconductor logistics equipment, including a control mechanism 1, a first conveying mechanism 2 and a second conveying mechanism 3 installed on the control mechanism 1, the first conveying mechanism 2 being used to convey semiconductor components, and the second conveying mechanism 3 being used to convey defective semiconductor components;

[0032] The control mechanism 1 includes an operating table 11, on which a guide assembly 14 is mounted. The guide assembly 14 is used to guide the movement path of the defective semiconductor components.

[0033] A material distribution assembly 12 is installed on the control panel 11. The material distribution assembly 12 is used to change the conveying path of the defective semiconductor components on the first conveying mechanism 2.

[0034] Specifically, by working together with the guide component 14 and the material distribution component 12 on the operating table 11, the sorting path can be accurately controlled, effectively solving the problem of defective product transfer path deviation caused by insufficient guiding accuracy in traditional equipment.

[0035] The guide assembly 14 is fixed to the operating table 11 and located in the connection area between the first conveying mechanism 2 and the second conveying mechanism 3, providing a physical guide channel for defective semiconductor components. This assembly directly defines the movement path of the defective products, eliminating the risk of defective products deviating from the preset track in traditional equipment.

[0036] The material sorting component 12 is installed on the operating table 11 and actively intervenes to change the conveying direction of defective products on the first conveying mechanism 2. When a defective product is identified, the material sorting component 12 precisely triggers an action to push it laterally into the path defined by the guide component 14, ensuring that the defective product enters the second conveying mechanism 3 in a directional manner.

[0037] The coordinated design of the guide component 14 and the distribution component 12 forms a closed-loop control. The distribution component 12 forces the defective product off the main conveyor line, while the guide component 14 immediately receives it and constrains its movement trajectory. The two work together to eliminate the free deviation of the defective product during the transfer process, significantly improving the path control accuracy and reducing the need for jamming and manual intervention.

[0038] Example 2

[0039] To achieve accurate identification and path control of defective products, such as Figure 2 As shown, in this embodiment, a control component 13 is installed on the operating table 11. The control component 13 is used for visual inspection of semiconductor components transported by the first conveying mechanism 2.

[0040] This design employs a control component 13 to achieve real-time visual inspection of semiconductor components on the first conveying mechanism 2. This control component 13 possesses high-precision image recognition capabilities, specifically utilizing a CCD camera with a resolution of at least 5 megapixels and integrating an LED ring light source to eliminate blind spots. The camera is connected to an image processing unit, which executes edge detection and grayscale comparison algorithms to quickly determine the quality status of parts, providing an accurate signal source for subsequent sorting operations. To improve reliability, the control component 13 also includes a position sensor, mounted on the operating table 11 and aligned with the conveying path of the first conveying mechanism 2. This sensor monitors the position of components in real time and feeds back coordinate data to the image processing unit, ensuring overall inspection accuracy is controlled within ±0.1mm.

[0041] Furthermore, the guide assembly 14 is fixedly installed on the operating table 11 on the opposite side of the first conveying mechanism 2 and the second conveying mechanism 3.

[0042] In this design, the guide assembly 14 is fixedly mounted on the surface of the operating table 11 on the opposite side of the first conveying mechanism 2 and the second conveying mechanism 3. This layout provides a straight-line guiding function for the transfer path of defective products. To improve smoothness, the guide rail surface is coated with polytetrafluoroethylene to reduce the coefficient of friction.

[0043] Furthermore, the material distribution assembly 12 includes a connecting frame on which an electric push rod is mounted. A push plate is mounted on the output end of the electric push rod, which is used to push the defective semiconductor components on the first conveying mechanism 2.

[0044] The sorting assembly 12 adopts an electric pusher plate structure supported by a connecting frame. The main body of the connecting frame is made of aluminum alloy and is securely mounted on the operating table 11 with bolts. The electric pusher is a servo electric pusher with a stroke of 500 to 1000 mm and a thrust of 50 to 100 N, with a response time of less than 0.1 seconds. The pusher plate is a rectangular polyurethane sheet with an anti-stick textured surface to effectively prevent scratching the surface of the parts during pushing. The pusher plate achieves directional pushing of defective semiconductor parts through the linear telescopic movement of the electric pusher, with controllable stroke and precise force application characteristics. To further improve accuracy, the sorting assembly 12 also integrates a position feedback module. This module is precisely aligned with the guide rail inlet of the guide assembly 14 and receives signal triggering action from the control assembly 13: when the control assembly 13 detects and identifies a defective product, it immediately outputs an electrical signal to the electric pusher, driving the pusher plate to complete the lateral pushing action within 0.2 seconds, accurately guiding the defective product into the guide assembly 14, ensuring that the defective product is smoothly transferred from the main conveying path to the defective product recycling path.

[0045] Example 3

[0046] To achieve efficient diversion and conveying of good and defective products, such as Figure 3 and Figure 4As shown, in this embodiment, the first conveying mechanism 2 includes a first support frame 21, and a first conveyor belt 22 is mounted on the first support frame 21 via a first drive motor 23.

[0047] This design uses a first support frame 21 to support a first conveyor belt 22 driven by a first drive motor 23, forming a first conveying mechanism 2. The main body of the first support frame 21 is a welded carbon steel frame. The first drive motor 23 is a brushless DC motor with a power range of 100 to 200 watts, and is equipped with a frequency converter to achieve stepless adjustment of the conveying speed within the range of 0.1 to 1.0 m / s to adapt to different testing cycle requirements. The first conveyor belt 22 is made of PVC, with a width of 200 mm and a surface smoothness Ra≤1.6 micrometers. It is connected to the first drive motor 23 through a synchronous belt drive mechanism to achieve high-stability conveying of semiconductor components. To ensure smooth pushing of defective products, the first conveyor belt 22 and the inlet end of the guide assembly 14 maintain a horizontal height difference of less than 1 mm.

[0048] Furthermore, the second conveying mechanism 3 includes a second support frame 31, on which a second conveyor belt 32 is mounted via a second drive motor 33.

[0049] The second conveying mechanism 3 adopts a combined structure of a second support frame 31 integrating a second drive motor 33 and a second conveyor belt 32. The structural design of the second support frame 31 is the same as that of the first support frame 21, and the two are arranged in parallel. The basic parameters of the second drive motor 33 are the same as those of the first drive motor 23, but its output speed is reduced by 20% to 30% to adapt to the lower operating speed required for the defective product recycling process. The second conveyor belt 32 has a rubber base material, a width of 200 mm, and an anti-slip texture pressed onto its surface in a diamond grid pattern. To ensure smooth transfer, the input end of the second conveyor belt 32 is seamlessly connected to the output end of the guide assembly 14, with a gap of less than 0.5 mm. At the same time, the second drive motor 33 is synchronously controlled with the first drive motor 23 through a programmable logic controller (PLC): when the material distribution assembly 12 triggers the pushing action, the PLC controller instantly adjusts the operating speed of the second conveyor belt 32 to precisely match the speed of the first conveyor belt 22, ensuring that defective products do not experience impact or accumulation during the entire transfer process.

[0050] When this utility model is in use, the operating console 11 starts the control program and initializes the electric push rod stroke and thrust parameters of the material distribution component 12; the control component 13 loads the preset visual detection algorithm, calibrates the CCD camera and the ring light source, and ensures that the detection accuracy meets the standard; the first conveying mechanism 2 and the second conveying mechanism 3 synchronize their speeds through the programmable logic controller (PLC), wherein the speed of the first conveyor belt 22 can be adapted to different detection cycles, and the speed of the second conveyor belt 32 is set to the matching value of the first conveyor belt 22.

[0051] The first drive motor 23 drives the first conveyor belt 22 to transport semiconductor components at a constant speed. The components are arranged at equal intervals and enter the inspection area. The position sensor of the control component 13 tracks the coordinates of the components in real time, the CCD camera continuously captures images of the surface of the components, and the image processing unit executes the defect comparison algorithm and outputs a good / bad judgment signal.

[0052] When the control component 13 identifies a defective product, it immediately generates an electrical signal and marks the position coordinates; the position feedback module of the material distribution component 12 receives the signal and drives the servo electric push rod into the ready-to-trigger state; when the defective product moves with the first conveyor belt 22 to the front of the push plate, the position sensor triggers a synchronization command.

[0053] An electric push rod drives a push plate to move laterally, pushing defective products out of the main path of the first conveyor belt 22; the push plate stroke dynamically adapts to the size of the parts to ensure that the surface is not damaged when the defective products are removed; the pushed defective products slide into the defective product recycling path along the guide assembly 14; its surface has a low-friction coating to reduce sliding resistance, and its inlet is seamlessly connected to the first conveyor belt 22 and its outlet is seamlessly connected to the second conveyor belt 32 to prevent deviation or jamming.

[0054] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A defective product sorting mechanism for semiconductor logistics equipment, comprising a control mechanism (1), wherein a first conveying mechanism (2) and a second conveying mechanism (3) are mounted on the control mechanism (1), the first conveying mechanism (2) being used to convey semiconductor components, and the second conveying mechanism (3) being used to convey defective semiconductor components, characterized in that: The control mechanism (1) includes an operating table (11) on which a guide assembly (14) is mounted, the guide assembly (14) being used to guide the movement path of the defective semiconductor components; The operating table (11) is equipped with a material distribution component (12), which is used to change the conveying path of the defective semiconductor components on the first conveying mechanism (2).

2. The defective product sorting mechanism for semiconductor logistics equipment according to claim 1, characterized in that, The control unit (13) is installed on the control console (11). The control unit (13) is used for visual inspection of semiconductor components transported by the first conveying mechanism (2).

3. The defective product sorting mechanism for semiconductor logistics equipment according to claim 1, characterized in that, The guide assembly (14) is fixedly installed on the operating table (11) on the opposite side of the first conveying mechanism (2) and the second conveying mechanism (3).

4. The defective product sorting mechanism for semiconductor logistics equipment according to claim 1, characterized in that, The material distribution assembly (12) includes a connecting frame, on which an electric push rod is mounted. A push plate is mounted on the output end of the electric push rod, and the push plate is used to push the defective semiconductor components on the first conveying mechanism (2).

5. A defective product sorting mechanism for semiconductor logistics equipment according to claim 1, characterized in that, The first conveying mechanism (2) includes a first support frame (21), on which a first conveyor belt (22) is mounted via a first drive motor (23).

6. The defective product sorting mechanism for semiconductor logistics equipment according to claim 1, characterized in that, The second conveying mechanism (3) includes a second support frame (31), on which a second conveyor belt (32) is mounted via a second drive motor (33).

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