A novel printed wiring board punching die
By introducing a cylinder-driven locking component and an electric telescopic rod cleaning component into the printed circuit board punching die, the problems of unstable die fixing and inconvenient waste cleaning are solved, achieving more stable die fixing and convenient waste cleaning.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DYNAMIC ELECTRONICS KUNSHAN
- Filing Date
- 2025-06-23
- Publication Date
- 2026-06-26
AI Technical Summary
In existing printed circuit board punching dies, the spring and magnetic block are used to control the movement of the locking block, which is prone to failure and affects the fixation of the die. In addition, the cleaning scraper can only move when the die is pulled, which makes it inconvenient to clean up waste.
The die is fixed by a cylinder-driven locking assembly, and the design of separating the electric telescopic rod and the cleaning scraper achieves stable fixation of the die and convenient cleaning of waste.
It improves the stability of the die fixing, simplifies the waste cleaning process, reduces the failure rate of the device, and increases the convenience and practicality of use.
Smart Images
Figure CN224407885U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of printed circuit board processing technology, specifically to a novel printed circuit board punching die. Background Technology
[0002] Printed circuit boards (PCBs) are indispensable core components in electronic devices, used to realize electrical connections and mechanical support between electronic components. A PCB is a plate-shaped device made of insulating substrate. By laying conductive lines (such as copper foil) on the surface or inside, and through processes such as etching, drilling, and electroplating, a preset circuit connection path is formed. The punching die is a key tooling equipment used for PCB forming and processing. It mainly uses mechanical stamping to cut PCB boards into specified shapes and sizes or to process structures such as holes and slots.
[0003] Existing patent publication number CN217669844U discloses a PCB circuit board punching die, including a die body. The surface of the die cavity has a PCB board groove, and the PCB board groove has a blanking cavity corresponding to the punch. The bottom surface of the die cavity does not contact the lower die base. A collecting tray is fixedly connected to one side of the lower die base, and a cleaning scraper that slides relative to the lower die base is fixedly connected to the bottom of the die cavity. This device utilizes the sliding material picking and changing feature of existing semi-automatic punching, using this action combined with the cleaning scraper to collect the material, further simplifying the processing steps. Since the bottom of the die cavity is in an elevated state, the surface of the lower die base does not need to be modified with the die cavity. Therefore, when changing, only the punch and die cavity need to be replaced. The die cavity only needs to be set with a track that cooperates with the guide rail to realize the replacement of the die cavity and punch, and it is also applicable to this method of material picking, further reducing costs.
[0004] The above-mentioned solution has the following problems during implementation. The device controls the movement of the locking block by using a spring and a magnetic block. However, the spring is prone to fatigue and elasticity decay after long-term use, and the magnetic block is also prone to problems. This makes it difficult to control the locking block well and affects the fixation of the die. In addition, the cleaning scraper of the device can only move to clean when the die is pulled. If the size of the scrap is large or the quantity is large, it may accumulate in the gap, hindering the pulling operation of the die and making it difficult to clean the scrap. This affects the use and greatly reduces the practicality of the device. To solve the above problems, we provide a new type of printed circuit board punching die. Utility Model Content
[0005] The purpose of this utility model is to provide a new type of printed circuit board punching die, which solves the problems of existing technology that uses a spring and a magnetic block to control the movement of the locking block, which is prone to failure and affects the fixation of the die, and the cleaning scraper can only move to clean when the die is pulled, which is inconvenient to use.
[0006] This utility model provides the following technical solution: a novel printed circuit board punching die, comprising a lower die base and an upper die base. A die cavity is provided at the top of the lower die base, and several sets of positioning rods are installed at the top of the lower die base. The upper die base is located on the upper side of the die cavity, and the tops of the several sets of positioning rods all penetrate through the upper die base. A punch is installed at the bottom of the upper die base. Moving components for moving the die cavity are provided on both sides of the bottom of the die cavity. Locking components for fixing the die cavity are provided on both sides of the top of the lower die base. A cleaning component for cleaning waste material is provided between one side of the top of the lower die base and the bottom of the die cavity.
[0007] As a preferred embodiment of the above technical solution, each set of moving components includes a guide rail, each set of guide rails is installed on the top of the lower mold base, each set of guide rails has a sliding seat slidably fitted on its surface, the top of each set of sliding seats is fixedly connected to the bottom of the die cavity, each set of guide rails has a limit hole I through its side end, and each set of sliding seats has a limit hole II through its side end at the position corresponding to the limit hole I.
[0008] The above technical solution allows the die to be pulled out, making it easier to remove the punched circuit board and replace it with the circuit board that needs to be punched, making it more convenient to use.
[0009] As a preferred embodiment of the above technical solution, each set of locking components includes a cylinder, each set of cylinders is installed on one side of the top of the lower mold base, each set of cylinders has a baffle installed at the output end, each set of baffles has a locking block installed at the end away from the cylinder, and each set of locking blocks is inserted into the first limiting hole and the second limiting hole.
[0010] The above technical solution allows for the fixing of the die cavity, enabling better stamping.
[0011] As a preferred embodiment of the above technical solution, the cleaning assembly includes an electric telescopic rod and a cleaning scraper. The electric telescopic rod is installed on one side of the top of the lower mold base, and an installation block is installed at the output end of the electric telescopic rod. The cleaning scraper is disposed between the top of the lower mold base and the bottom of the concave mold, and an installation sleeve is installed at the end of the cleaning scraper near the electric telescopic rod. The installation sleeve is fitted onto the surface of the installation block.
[0012] The above technical solution enables the waste to be pushed out, thereby achieving waste cleanup.
[0013] As a preferred embodiment of the above technical solution, the top of the mounting block is provided with a sliding groove, a spring is installed on the lower side of the sliding groove, a limiting block is slidably installed at the opening of the sliding groove, and the bottom end of the limiting block abuts against the spring. The top of the mounting sleeve is provided with a limiting groove, and the limiting block is inserted into the limiting groove.
[0014] The above technical solution allows for the disassembly of the cleaning scraper, making it easier to replace when the scraper becomes worn, thus greatly increasing the practicality of the device.
[0015] As a preferred embodiment of the above technical solution, a collection tray is provided on the side of the lower mold base away from the electric telescopic rod.
[0016] The above technical solution can be used to receive the waste that is being cleaned up and pushed out.
[0017] As a preferred embodiment of the above technical solution, a slope is provided on the side of the lower mold base near the collection tray.
[0018] The above technical solution allows waste to slide more effectively into the collection tray.
[0019] Compared with the prior art, the beneficial effects of this utility model are:
[0020] This invention makes locking the die more convenient and secure by setting a locking component. The cylinder drive reduces the likelihood of malfunctions and increases stability. Furthermore, the cleaning component allows the cleaning scraper to be separated from the die for individual operation, making operation easier and more convenient. This also facilitates the cleaning of waste materials and prevents the die from being jammed by waste, greatly increasing the practicality of the device. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of a novel printed circuit board punching die.
[0022] Figure 2 This is a frontal cross-sectional view of a novel printed circuit board punching die.
[0023] Figure 3 for Figure 2 Enlarged diagram of A in the middle;
[0024] Figure 4 This is a side cross-sectional view of a novel printed circuit board punching die.
[0025] Figure 5 for Figure 4 Enlarged diagram of B in the diagram.
[0026] In the diagram: 1. Lower mold base; 11. Die; 12. Positioning rod; 13. Upper mold base; 14. Punch; 15. Slope; 2. Moving assembly; 21. Guide rail; 22. Sliding seat; 23. Limiting hole one; 24. Limiting hole two; 3. Locking assembly; 31. Cylinder; 32. Baffle; 33. Locking block; 4. Cleaning assembly; 41. Electric telescopic rod; 42. Mounting block; 43. Cleaning scraper; 44. Mounting sleeve; 45. Slide groove; 46. Spring; 47. Limiting block; 48. Limiting groove; 5. Collection tray. Detailed Implementation
[0027] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0028] like Figures 1-5 As shown, this utility model provides a technical solution: a novel printed circuit board punching die, including a lower die base 1 and an upper die base 13. A die cavity 11 is provided at the top of the lower die base 1, and several sets of positioning rods 12 are installed at the top of the lower die base 1. The upper die base 13 is located above the die cavity 11, and the tops of the several sets of positioning rods 12 all penetrate through the upper die base 13. A punch 14 is installed at the bottom of the upper die base 13. Moving components 2 for moving the die cavity 11 are provided on both sides of the bottom of the die cavity 11. Each moving component 2 includes a guide rail 21, and each guide rail 21 is installed on the lower die base. At the top of the die 11, each set of guide rails 21 has a sliding seat 22 slidably fitted on its surface. The top of each set of sliding seats 22 is fixedly connected to the bottom of the die 11. Each set of guide rails 21 has a limit hole 23 through it on its side. Each set of sliding seats 22 has a limit hole 24 through it at the position corresponding to the limit hole 23 on its side. This structure allows the die 11 to be pulled out, which in turn drives the two sets of sliding seats 22 to slide along the guide rails 21. This makes it easier to remove the punched circuit board and replace it with the circuit board that needs to be punched, making it more convenient to use.
[0029] As one implementation method in this embodiment, such as Figure 2 and Figure 3As shown, locking components 3 for fixing the die 11 are provided on both sides of the top of the lower mold base 1. Each locking component 3 includes a cylinder 31, and each cylinder 31 is installed on one side of the top of the lower mold base 1. A baffle 32 is installed at the output end of each cylinder 31, and a locking block 33 is installed at the end of each baffle 32 away from the cylinder 31. Each locking block 33 is inserted into the limiting hole 1 23 and the limiting hole 24. This structure allows the die 11 to be fixed after the circuit board is replaced. Pushing it back causes the die 11 to move the sliding seat 22 in the opposite direction along the guide rail 21 until the sliding seat 22 drives the limiting hole 24 to correspond with the limiting hole 23 on the side of the guide rail 21. This activates the two sets of cylinders 31, which push the baffle 32 toward the die 11 until the baffle 32 drives the locking block 33 to insert into the limiting hole 23 and the limiting hole 24. This fixes the die 11 and allows for better stamping.
[0030] As one implementation method in this embodiment, such as Figure 4 and Figure 5 As shown, a cleaning assembly 4 for cleaning waste is provided between the top side of the lower mold base 1 and the bottom end of the die 11. The cleaning assembly 4 includes an electric telescopic rod 41 and a cleaning scraper 43. The electric telescopic rod 41 is installed on the top side of the lower mold base 1, and an installation block 42 is installed on the output end of the electric telescopic rod 41. The cleaning scraper 43 is located between the top of the lower mold base 1 and the bottom end of the die 11. An installation sleeve 44 is installed on the end of the cleaning scraper 43 near the electric telescopic rod 41. The installation sleeve 44 is fitted onto the surface of the installation block 42. This structure allows the electric telescopic rod 41 to push the installation block 42, and the installation block 42, through the cleaning scraper 43, pushes the installation sleeve 44 to move in the gap between the die 11 and the lower mold base 1, pushing out the waste, thereby cleaning the waste. Moreover, the installation sleeve 44 does not need to move with the die 11, making the operation more convenient and easier. The die 11 is also less likely to be stuck by waste, affecting its movement. The top of the mounting block 42 is provided with a sliding groove 45, and a spring 46 is installed on the lower side of the sliding groove 45. A limiting block 47 is slidably installed at the opening of the sliding groove 45, and the bottom end of the limiting block 47 abuts against the spring 46. The top of the mounting sleeve 44 is provided with a limiting groove 48, and the limiting block 47 is inserted into the limiting groove 48. Pressing the limiting block 47 pushes the limiting block 47 into the sliding groove 45 to compress the spring 46. This allows the cleaning scraper 43 to be pulled and the mounting sleeve 44 to be removed from the mounting block 42, thereby completing the disassembly of the cleaning scraper 43. This makes it easier to replace the cleaning scraper 43 when it is worn, greatly increasing the practicality of the device. A collection tray 5 is provided on the side of the lower mold base 1 away from the electric telescopic rod 41, which can be used to receive the waste pushed out by the cleaning. A ramp 15 is provided on the top of the lower mold base 1 near the collection tray 5, so that the waste can slide into the collection tray 5 better.
[0031] Working principle: To use this device, simply place the circuit board to be processed in the die 11, and then the upper die base 13 is lowered by the press, so that the upper die base 13 drives the punch 14 to cooperate with the die 11, which can punch the circuit board. The punched waste will fall into the gap between the die 11 and the lower die base 1. If the waste needs to be cleaned, simply start the electric telescopic rod 41 to push the mounting block 42. The mounting block 42 pushes the mounting sleeve 44 through the cleaning scraper 43 to move in the gap between the die 11 and the lower die base 1, pushing the waste out until it is pushed to the ramp 15. In this way, the waste can slide into the collection tray 5 for storage, thereby cleaning the waste. Moreover, the mounting sleeve 44 does not need to move with the die 11, which makes the operation more convenient and easier. The die 11 is also less likely to be stuck by the waste and affect its movement.
[0032] After punching, if the circuit board needs to be removed for replacement, simply activate both sets of cylinders 31 simultaneously. The two sets of cylinders 31 move the baffle 32 until the baffle 32 pulls the locking block 33 out of the first limiting hole 23 and the second limiting hole 24. This releases the lock on the die 11. Then, pull the die 11, which causes the two sets of sliding seats 22 to slide along the guide rail 21. This pulls the die 11 out, making it easy to remove the punched circuit board and replace it with the circuit board that needs punching. Then the die 11 can be pushed back, causing the die 11 to drive the sliding seat 22 to move in the opposite direction along the guide rail 21 until the sliding seat 22 drives the limiting hole 24 to correspond with the limiting hole 23 opened on the side of the guide rail 21. Then the two sets of cylinders 31 can be started again, causing the cylinders 31 to push the baffle 32 towards the die 11 until the baffle 32 drives the locking block 33 to be inserted into the limiting hole 23 and the limiting hole 24. This can fix the die 11 and better perform stamping.
[0033] To replace the cleaning scraper 43, simply press the limiting block 47 and push it into the slide groove 45 to compress the spring 46. This will pull the cleaning scraper 43 and remove the mounting sleeve 44 from the mounting block 42, thus completing the disassembly of the cleaning scraper 43. This makes it easier to replace the cleaning scraper 43 when it is worn, greatly increasing the practicality of the device.
[0034] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A novel printed circuit board die-cutting mold, comprising a lower mold base (1) and an upper mold base (13), the top end of the lower mold base (1) is provided with a female die (11), the top end of the lower mold base (1) is provided with a plurality of sets of positioning rods (12), the upper mold base (13) is arranged on the upper side of the female die (11), the top end of each set of positioning rods (12) penetrates the upper mold base (13), the bottom end of the upper mold base (13) is provided with a male die (14), characterized in that: The bottom two sides of the die (11) are provided with moving components (2) for moving the die (11), the top two sides of the lower die base (1) are provided with locking components (3) for fixing the die (11), and a cleaning component (4) for cleaning waste is provided between the top side of the lower die base (1) and the bottom of the die (11).
2. A novel printed wiring board die-cutting die according to claim 1, characterized in that: Each set of moving components (2) includes a guide rail (21), each set of guide rails (21) is installed on the top of the lower mold base (1), each set of guide rails (21) is slidably fitted with a sliding seat (22), the top of each set of sliding seats (22) is fixedly connected to the bottom of the die (11), each set of guide rails (21) has a limit hole one (23) through the side end, and each set of sliding seats (22) has a limit hole two (24) through the position corresponding to the limit hole one (23).
3. The novel printed circuit board punching die according to claim 1, characterized in that: Each locking assembly (3) includes a cylinder (31), each cylinder (31) is installed on one side of the top of the lower mold base (1), each cylinder (31) has a baffle (32) installed at the output end, and each baffle (32) has a locking block (33) installed at the end away from the cylinder (31), and each locking block (33) is inserted into the first limiting hole (23) and the second limiting hole (24).
4. The novel printed circuit board punching die according to claim 1, characterized in that: The cleaning assembly (4) includes an electric telescopic rod (41) and a cleaning scraper (43). The electric telescopic rod (41) is installed on one side of the top of the lower mold base (1). An installation block (42) is installed at the output end of the electric telescopic rod (41). The cleaning scraper (43) is located between the top of the lower mold base (1) and the bottom of the die (11). An installation sleeve (44) is installed at one end of the cleaning scraper (43) near the electric telescopic rod (41). The installation sleeve (44) is fitted onto the surface of the installation block (42).
5. A novel printed circuit board punching die according to claim 4, characterized in that: The top of the mounting block (42) is provided with a sliding groove (45), and a spring (46) is installed on the lower side of the sliding groove (45). A limiting block (47) is slidably installed at the opening of the sliding groove (45), and the bottom end of the limiting block (47) abuts against the spring (46). The top of the mounting sleeve (44) is provided with a limiting groove (48), and the limiting block (47) is inserted into the limiting groove (48).
6. A novel printed circuit board punching die according to claim 4, characterized in that: A collection tray (5) is provided on the side of the lower mold base (1) away from the electric telescopic rod (41).
7. A novel printed circuit board punching die according to claim 6, characterized in that: The lower mold base (1) has a ramp (15) on the side near the collection plate (5) at the top.