A charging device
By combining a thermally conductive layer, a phase change thermal storage layer, and a thermal insulation layer, the heat dissipation problem of the charging device is solved, achieving efficient thermal management, improving charging efficiency and system reliability, and extending the life of components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HELLO TECH ENERGY CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-06-26
AI Technical Summary
Traditional charging devices suffer from high surface temperatures and poor heat dissipation of the metal casing under natural heat dissipation conditions. Insufficient heat dissipation of the charging circuit board and MOSFET leads to localized hot spots, affecting charging efficiency and system reliability.
A thermal management composite structure is adopted, consisting of a heat-conducting layer, a phase change heat storage layer, a heat insulation layer, and a temperature equalization layer. The heat-conducting layer rapidly conducts heat, the phase change heat storage layer absorbs and stores heat, the heat insulation layer blocks heat diffusion, and the temperature equalization layer eliminates local hot spots, thus achieving a modular design.
Effective heat management of the charging circuit board under natural heat dissipation conditions improves charging efficiency, reduces casing temperature, eliminates local hot spots, extends component life, enhances system safety, and facilitates assembly and maintenance.
Smart Images
Figure CN224408990U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of new energy vehicle charging technology, specifically to a charging device. Background Technology
[0002] With the increasing popularity of new energy vehicles, the demand for charging devices is growing rapidly. Traditional charging devices use metal casings to ensure structural strength, but under natural heat dissipation conditions, the following problems exist: high surface temperature of the metal casing and poor heat dissipation capacity; difficulty in effectively conducting and dissipating heat generated by the charging circuit board; insufficient heat dissipation of heat-generating components such as MOSFETs, affecting charging efficiency; and the existence of localized hot spots, reducing system reliability and lifespan. To solve these problems, existing technologies mostly employ simple metal heat sinks or forced cooling solutions using fans, but the former has limited heat dissipation effect, while the latter increases system complexity and failure rate.
[0003] Therefore, there is an urgent need to provide a charging device to solve the above problems. Utility Model Content
[0004] The purpose of this invention is to provide a charging device that can effectively manage the heat of the charging device under natural heat dissipation conditions, reduce the temperature of the outer casing, eliminate local hot spots, and improve charging efficiency and system reliability.
[0005] This utility model is achieved through the following technical solution:
[0006] A charging device, comprising:
[0007] shell;
[0008] A charging circuit board is disposed within the housing;
[0009] A thermal management composite structure is disposed within the outer casing. The thermal management composite structure includes a thermally conductive layer, a phase change thermal storage layer, a thermal insulation layer, and a temperature equalization layer stacked sequentially. The thermally conductive layer is thermally coupled to the charging circuit board, and the temperature equalization layer is thermally coupled to the outer casing.
[0010] As an alternative, the temperature equalization layer is made of a material with a thermal conductivity greater than 1000 W / (m·K).
[0011] As an alternative, the temperature homogenizing layer is a graphite sheet.
[0012] As an optional solution, the thickness of the graphite sheet is 0.1 mm to 0.3 mm.
[0013] As an alternative, the thermal management composite structure further includes an adhesive layer bonded between the outer shell and the insulation layer.
[0014] As an alternative, the adhesive layer includes PET double-sided adhesive and a thermally conductive interface material, wherein the thermally conductive interface material is bonded to the side of the PET double-sided adhesive near the heat insulation layer, and the side of the PET double-sided adhesive away from the heat insulation layer is bonded to the inside of the outer shell.
[0015] As an optional solution, the thermal interface material is thermally conductive silicone grease or thermally conductive phase change material.
[0016] As an alternative, the charging circuit board includes a circuit board and a plurality of MOSFETs disposed on the circuit board, wherein the plurality of MOSFETs are disposed on the side of the circuit board near the heat-conducting layer and in contact with the heat-conducting layer.
[0017] As an optional solution, the phase change temperature of the phase change energy storage layer is 60℃~80℃.
[0018] As an optional solution, the insulation layer can be made of aerogel insulation film or insulation foam.
[0019] The beneficial effects of this utility model are as follows:
[0020] This invention provides a charging device, wherein the thermal management composite structure comprises a heat-conducting layer, a phase-change heat storage layer, a heat insulation layer, and a temperature-equalizing layer stacked sequentially. The heat-conducting layer can quickly conduct heat generated by the charging circuit board, preventing heat accumulation; the phase-change heat storage layer can quickly absorb and store the heat conducted by the heat-conducting layer, effectively suppressing temperature rise; the heat insulation layer can effectively block heat diffusion, reducing heat transfer to the outer casing; and the temperature-equalizing layer has a temperature-equalizing function, conducting residual heat to the outer casing while eliminating local hot spots on the outer casing. Therefore, this thermal management composite structure possesses the functions of heat conduction, heat storage, heat insulation, and temperature equalization. It can effectively manage the heat of the charging circuit board under natural heat dissipation conditions, improve charging efficiency, significantly reduce the surface temperature of the outer casing, improve safety, eliminate local hot spots, extend the service life of components, and the thermal management composite structure adopts a modular design, facilitating assembly and maintenance. Attached Figure Description
[0021] To more clearly and understandably illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0022] Figure 1 This is a structural schematic diagram of the charging device provided in an embodiment of the present utility model;
[0023] Figure 2This is an exploded view of the charging device provided in an embodiment of this utility model;
[0024] Figure 3 This is an exploded view of the thermal management composite structure provided in this embodiment of the utility model;
[0025] Figure 4 This is a schematic diagram of the structure of the charging circuit board provided in an embodiment of the present invention.
[0026] In the picture:
[0027] 1. Outer shell; 11. Top cover; 12. Bottom shell;
[0028] 2. Charging circuit board; 21. Circuit board; 22. MOSFET;
[0029] 3. Thermal management composite structure; 31. Thermally conductive layer; 32. Phase change thermal storage layer; 33. Thermal insulation layer; 34. Temperature equalization layer; 35. Adhesive layer. Detailed Implementation
[0030] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0031] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0033] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0034] like Figure 1 and Figure 2 As shown, this embodiment provides a charging device, including a housing 1 and a charging circuit board 2. The charging circuit board 2 is disposed inside the housing 1. To ensure structural strength, the housing 1 is made of metal. (Reference) Figure 4 The charging circuit board 2 includes a circuit board 21 and multiple MOS transistors 22 (metal-oxide-semiconductor field-effect transistors, which are important semiconductor devices) disposed on the circuit board 21. The multiple MOS transistors 22 are arranged in a dispersed manner. The MOS transistors 22 are the main heat-generating components of the charging device. As for the specific structure and working principle of the charging circuit board 2, they are all existing technologies and will not be described in detail here.
[0035] The above structure has the following problems under natural heat dissipation conditions: the surface temperature of the metal casing 1 is high, resulting in poor heat dissipation; the heat generated by the charging circuit board 2 is difficult to conduct and dissipate effectively; insufficient heat dissipation of heat-generating components such as the MOSFET 22 affects charging efficiency; and the dispersed arrangement of multiple MOSFETs 22 leads to very high temperatures at the corresponding locations on the casing 1, resulting in localized hot spots and reducing system reliability and lifespan. To solve these problems, existing technologies often employ simple metal heat sinks or forced cooling solutions using fans, but the former has limited heat dissipation effect, while the latter increases system complexity and failure rate.
[0036] To solve the above problems, such as Figure 2 and Figure 3 As shown, the charging device provided in this embodiment also includes a thermal management composite structure 3. The thermal management composite structure 3 is disposed inside the outer shell 1 and includes a thermally conductive layer 31, a phase change heat storage layer 32, a heat insulation layer 33, and a temperature equalization layer 34 stacked sequentially. The thermally conductive layer 31 is thermally coupled to the charging circuit board 2, and the temperature equalization layer 34 is thermally coupled to the outer shell 1. Here, thermal coupling refers to the heat transfer phenomenon between two structural components, which can be direct contact between the two structural components or heat conduction between the two structural components through an intermediate thermally conductive element.
[0037] The thermally conductive layer 31 can quickly conduct heat generated by the charging circuit board 2, preventing heat accumulation; the phase change heat storage layer 32 can quickly absorb and store the heat conducted by the thermally conductive layer 31, effectively suppressing temperature rise; the heat insulation layer 33 can effectively block heat diffusion, reducing heat transfer to the outer casing 1; and the temperature equalization layer 34 has a temperature equalization function, conducting residual heat to the outer casing 1 and eliminating local hot spots on the outer casing 1. Therefore, this thermal management composite structure 3 has the functions of heat conduction, heat storage, heat insulation, and temperature equalization. It can effectively manage the heat of the charging circuit board 2 under natural heat dissipation conditions, improve charging efficiency, significantly reduce the surface temperature of the outer casing 1, improve safety, eliminate local hot spots, extend the service life of components, and the thermal management composite structure 3 adopts a modular design, facilitating assembly and maintenance.
[0038] Specifically, such as Figure 1 and Figure 2 As shown, the outer casing 1 includes a top cover 11 and a bottom casing 12. The bottom casing 12 has a cavity, and the charging circuit board 2 and the thermal management composite structure 3 are placed inside the bottom casing 12. The top cover 11 is detachably fastened to the upper side of the bottom casing 12 to encapsulate the charging circuit board 2 and the thermal management composite structure 3. In this embodiment, as... Figure 2 As shown, the charging circuit board 2 is located on the upper side of the thermal management composite structure 3. In other alternative embodiments, the charging circuit board 2 may also be located on the lower side of the thermal management composite structure 3.
[0039] In one optional embodiment, a plurality of MOSFETs 22 are disposed on the side of the circuit board 21 near the heat-conducting layer 31 and in contact with the heat-conducting layer 31. Since the MOSFETs 22 are the main heat-generating components, this arrangement allows the MOSFETs 22 to directly contact the heat-conducting layer 31, thereby improving heat dissipation efficiency.
[0040] Optionally, the thermal conductive layer 31 is made of a material with high thermal conductivity. For example, the thermal conductive layer 31 can be made of any one or a combination of copper foil, aluminum foil, graphene, and graphite.
[0041] Optionally, the phase change thermal storage layer 32 can be a phase change thermal insulation sheet, which mainly stores heat by utilizing the property of phase change materials to change shape when heated. Phase change thermal insulation sheets are existing technology and will not be described in detail here.
[0042] Optionally, the phase change temperature of the phase change heat storage layer 32 is 60℃~80℃. This matches the operating temperature of the charging circuit board 2, thereby achieving better heat dissipation.
[0043] Optionally, the insulation layer 33 may be made of a material with a thermal conductivity of less than 0.02 W / (m·K) to block heat transfer and reduce heat transfer to the bottom shell 12. For example, in this embodiment, the insulation layer 33 is an aerogel insulation film. The extremely low thermal conductivity of the aerogel insulation film can effectively block heat transfer to the bottom shell 12 and prevent the bottom shell 12 from becoming too hot. In other optional embodiments, the insulation layer 33 may also be made of insulation foam.
[0044] Optionally, the temperature distribution layer 34 is made of a material with a thermal conductivity greater than 1000 W / (m·K), which enables heat conduction and achieves a uniform temperature effect. For example, in this embodiment, the temperature distribution layer 34 can be a graphite sheet. Utilizing the temperature distribution characteristics of graphite sheets, lateral temperature uniformity can be achieved, eliminating the problem of localized overheating of the bottom case 12 caused by the MOSFET 22. In other optional embodiments, the temperature distribution layer 34 can also be a VC plate, or other materials with a thermal conductivity greater than 1000 W / (m·K) and a certain strength.
[0045] Optionally, the thickness of the graphite sheet is 0.1 mm to 0.3 mm. For example, the thickness of the graphite sheet can be selected as 0.1 mm, 0.2 mm, or 0.3 mm. By setting the thickness of the graphite sheet within the above range, heat conduction can be achieved and a uniform temperature effect can be ensured, while preventing excessive thickness from affecting the uniform temperature effect.
[0046] In an optional embodiment, such as Figure 3 As shown, the thermal management composite structure 3 also includes an adhesive layer 35, which is bonded between the bottom shell 12 and the temperature equalization layer 34 of the outer shell 1. Through the adhesive layer 35, the entire thermal management composite structure 3 can be bonded to the bottom shell 12, achieving close contact between the thermal management composite structure 3 and the bottom shell 12.
[0047] Optionally, the adhesive layer 35 includes PET double-sided adhesive and a thermally conductive interface material. The thermally conductive interface material is bonded to the side of the PET double-sided adhesive near the temperature uniform layer 34, and the side of the PET double-sided adhesive away from the heat insulation layer 33 is bonded to the inside of the outer shell 1. The PET double-sided adhesive can bond the entire thermal management composite structure 3 to the bottom shell 12, achieving close contact between the thermal management composite structure 3 and the bottom shell 12. It is understood that the phase change heat storage layer 32 can only absorb and store most of the heat generated by the charging circuit board 2, and the heat insulation layer 33 cannot achieve complete heat blocking. Therefore, the thermally conductive interface material can facilitate the further conduction of the remaining heat to the outer shell 1 for heat dissipation, reducing internal heat residue and ensuring sufficient heat dissipation of the charging circuit board 2. Since the remaining heat is relatively small, the temperature of the bottom shell 12 will not be very high after heat conduction.
[0048] Optionally, the thermal interface material can be made of a material with a thermal conductivity greater than 3 W / (m·K), which is sufficient to conduct the remaining small portion of heat. For example, the thermal interface material can be thermally conductive silicone grease or a thermally conductive phase change material.
[0049] It is worth noting that the layers in the thermal management composite structure 3 are roughly rectangular, matching the approximate shape of the charging circuit board 2. The layers in the thermal management composite structure 3 can be directly composited during processing, or they can be bonded together with double-sided adhesive.
[0050] For example, in an optional embodiment, the thermally conductive layer 31 is made of copper foil with a thickness of 0.1 mm, the phase change heat storage layer 32 is made of phase change heat insulation sheet with a thickness of 2 mm, the heat insulation layer 33 is made of aerogel heat insulation film with a thickness of 1 mm, the temperature equalization layer 34 is made of graphite sheet with a thickness of 0.2 mm, and the adhesive layer 35 includes PET double-sided adhesive and thermally conductive silicone.
[0051] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A charging device, characterized by, include: shell; A charging circuit board is disposed within the housing; A thermal management composite structure is disposed within the outer casing. The thermal management composite structure includes a thermally conductive layer, a phase change thermal storage layer, a thermal insulation layer, and a temperature equalization layer stacked sequentially. The thermally conductive layer is thermally coupled to the charging circuit board, and the temperature equalization layer is thermally coupled to the outer casing.
2. The charging device of claim 1, wherein, The temperature equalization layer is made of a material with a thermal conductivity greater than 1000 W / (m·K).
3. The charging device of claim 2, wherein, The temperature equalization layer is a graphite sheet.
4. The charging device of claim 3, wherein, The thickness of the graphite sheet is 0.1 mm to 0.3 mm.
5. The charging device of claim 1, wherein, The thermal management composite structure also includes an adhesive layer, which is bonded between the outer shell and the temperature equalization layer.
6. The charging device of claim 5, wherein, The adhesive layer includes PET double-sided adhesive and a thermally conductive interface material. The thermally conductive interface material is bonded to the side of the PET double-sided adhesive near the temperature-equalizing layer, and the side of the PET double-sided adhesive away from the temperature-equalizing layer is bonded to the inside of the outer shell.
7. The charging device of claim 6, wherein, The thermal interface material is either thermally conductive silicone grease or a thermally conductive phase change material.
8. The charging device according to any one of claims 1 to 7, characterized in that The charging circuit board includes a circuit board and a plurality of MOSFETs disposed on the circuit board. The plurality of MOSFETs are disposed on the side of the circuit board near the heat-conducting layer and are in contact with the heat-conducting layer.
9. The charging device according to any one of claims 1 to 7, characterized in that The phase change temperature of the phase change thermal storage layer is 60℃~80℃.
10. The charging device according to any one of claims 1 to 7, characterized in that The insulation layer is made of aerogel insulation film or insulation foam.