Heat sink mounting base and scanner

Abstract

The utility model discloses a heat dissipation mounting seat and scanner, heat dissipation mounting seat includes installation support and heat dissipation subassembly, and installation support includes support plate, and a plurality of support holes are seted up on support plate, and a plurality of support holes are set up on support plate at intervals, and heat dissipation subassembly includes heat dissipation board, and one side of heat dissipation board is used for the core board installation of control module, and the other side of heat dissipation board is equipped with a plurality of heat conduction columns, and the number of heat conduction column is consistent with the number of support hole and sets up through support hole one by one correspondence. A plurality of heat conduction columns set up through a plurality of support holes one by one correspondence increase heat conduction path, so that the heat of core board can be conducted to heat dissipation board, heat conduction column and support plate quickly, speed up the heat dissipation speed, guarantee the core board heat dissipation effect, and support plate, heat dissipation board and core board arrange in turn and occupy little space, and assemble conveniently and quickly, save the cost.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board heat dissipation technology, specifically relating to a heat dissipation mounting base and a scanner. Background Technology

[0002] Under high load operation, the scanner's core board is highly susceptible to performance degradation and even component damage due to insufficient heat dissipation. Currently, traditional heat dissipation methods typically involve setting up independent heat dissipation modules such as cooling fans and heat sinks on one side of the core board. This not only occupies a lot of space and involves cumbersome assembly steps, increasing operating costs, but also causes the cooling fans to accumulate dust after prolonged operation, significantly affecting heat dissipation efficiency and requiring disassembly for cleaning, resulting in low ease of use. Utility Model Content

[0003] In view of the above-mentioned defects or deficiencies, this utility model provides a heat dissipation mounting base and scanner, which aims to solve the technical problem of the large space occupied by the existing core board heat dissipation structure.

[0004] To achieve the above objectives, this utility model provides a heat dissipation mounting base, which includes:

[0005] The mounting bracket includes a support plate with multiple support holes spaced apart on the support plate.

[0006] The heat dissipation assembly includes a heat sink, one side of which is used for mounting the core board of the control module, and the other side of the heat sink is provided with multiple heat conduction pillars. The number of heat conduction pillars is consistent with the number of support holes and they are arranged to pass through the support holes one by one.

[0007] In this embodiment of the utility model, the heat dissipation mounting base further includes a fixing component, which includes a fixing bracket and a connecting fastener. The core board includes a substrate and a chip. The chip is disposed on one side of the substrate and located between the substrate and the heat dissipation plate. The fixing bracket is disposed on the side of the substrate facing away from the chip. The connecting fastener passes through the fixing bracket and the substrate and is connected to the heat dissipation plate.

[0008] In this embodiment of the utility model, the fixing bracket is made of an elastic material and protrudes along the direction toward the substrate, and the chip is pressed onto the heat sink through the substrate.

[0009] In this embodiment of the utility model, the fixing bracket includes a clamping section and multiple connecting sections. The clamping section is protruding in the direction toward the substrate. One end of each of the multiple connecting sections is connected to the clamping section, and the multiple connecting sections are spaced apart on the substrate. Each connecting section has a connecting ear at the end away from the clamping section, and the connecting ear has a connecting hole for fasteners to pass through.

[0010] In this embodiment of the utility model, the heat dissipation mounting base further includes a support component, which includes a first support column. The main board of the control module is located on the side of the fixed bracket facing away from the substrate. One end of the first support column passes through the heat dissipation plate and is connected to the heat dissipation plate, and the other end of the first support column is supported on the main board and connected to the main board.

[0011] In this embodiment of the utility model, the support component further includes a second support column, one end of which passes through the substrate and is connected to the substrate, and the other end of which is supported on the motherboard and connected to the motherboard.

[0012] In this embodiment of the utility model, the first support column is provided with an external thread and is threadedly connected to the heat sink. The support assembly also includes a first fastener. The first support column is provided with a first threaded hole at one end facing the motherboard. The first fastener passes through the motherboard and is connected to the first threaded hole.

[0013] And / or, the second support column includes a positioning section and a support section, the positioning section is located at one end of the support section, and a support step is formed between the positioning section and the support section, the positioning section passes through the substrate and is connected to the substrate, the substrate is supported on the support step, and the end of the support section away from the positioning section is supported on the motherboard and connected to the motherboard.

[0014] In this embodiment of the invention, the heat dissipation assembly further includes a heat-conducting sheet, which is disposed on the support plate and located between the support plate and the heat dissipation plate.

[0015] In this embodiment of the utility model, a relief groove is provided on the side of the support plate facing the heat sink, a support hole is provided on the bottom wall of the relief groove, and a heat-conducting sheet is provided in the relief groove and is attached to the heat sink.

[0016] And / or, the heat dissipation assembly also includes a heat-conducting block disposed on the core plate and located between the core plate and the heat sink.

[0017] To achieve the above objectives, the present invention also provides a scanner, which includes a heat dissipation mounting base as described above.

[0018] Through the above technical solutions, the heat dissipation mounting base and scanner provided in this utility model embodiment have the following beneficial effects:

[0019] In the technical solution of this utility model, the heat sink plate is provided with multiple spaced heat-conducting columns. The support plate of the mounting bracket has support holes corresponding to the positions of each heat-conducting column, so that each heat-conducting column can pass through the corresponding support hole to install the heat sink plate on the support plate. The core plate is connected to the side of the heat sink plate facing away from the support plate, so that the heat generated by the core plate can be directly conducted to the heat sink plate and then to the support plate through the heat-conducting columns on the heat sink plate. The multiple heat-conducting columns passing through the multiple support holes one by one increases the heat conduction path, so that the heat generated by the core plate can be quickly conducted to the heat sink plate, heat-conducting columns and support plate, which accelerates the heat dissipation speed, ensures the heat dissipation effect of the core plate, and the sequential arrangement of the support plate, heat sink plate and core plate occupies little space, is convenient and quick to assemble, and saves costs.

[0020] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0021] The accompanying drawings are provided to further illustrate the embodiments of the present invention and form part of the specification. They are used together with the following detailed description to explain the embodiments of the present invention, but do not constitute a limitation thereof. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without any inventive effort. In the drawings:

[0022] Figure 1 This is a schematic diagram of the assembly structure of a heat dissipation mounting base and a control module according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of the mounting bracket and heat-conducting plate in a heat dissipation mounting base according to an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of a heat dissipation mounting base according to an embodiment of the present invention, omitting the mounting bracket;

[0025] Figure 4 This is an exploded structural diagram of a heat sink, a core plate, and a fixing assembly according to an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the assembly structure of a heat sink, a core plate, and a fixing component according to an embodiment of the present invention;

[0027] Figure 6 This is a cross-sectional view of a heat sink and a control module according to an embodiment of the present invention;

[0028] Figure 7This is a cross-sectional structural schematic diagram of a heat sink, a support assembly, and a control module according to an embodiment of the present invention;

[0029] Figure 8 yes Figure 7 Enlarged view of region A in the middle;

[0030] Figure 9 This is a cross-sectional structural diagram of a support plate, a heat sink, a support assembly, and a control module according to an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures

[0032] Detailed Implementation

[0033] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0034] The heat dissipation mounting base of this utility model is described below with reference to the accompanying drawings.

[0035] like Figures 1 to 5 As shown, this utility model provides a heat dissipation mounting base, which includes a mounting bracket 10 and a heat dissipation assembly. The mounting bracket 10 includes a support plate 11, on which a plurality of support holes 111 are provided, and the plurality of support holes 111 are spaced apart on the support plate 11. The heat dissipation assembly includes a heat dissipation plate 20, one side of which is used for mounting the core board 200 of the control module, and the other side of the heat dissipation plate 20 is provided with a plurality of heat conduction pillars 21, the number of heat conduction pillars 21 being consistent with the number of support holes 111 and correspondingly passing through the support holes 111.

[0036] It should be noted that the heat dissipation mounting base of this utility model can be applied to electronic devices. The electronic device includes a control module, which includes a core board 200 and a motherboard 300. The core board 200 is mounted on the motherboard 300 and communicates with the motherboard 300 for data processing and signal transmission. The heat dissipation mounting base is used to mount the core board 200 and dissipate heat from the core board 200. The electronic device can be a scanner. This utility model does not limit the type of electronic device to which the heat dissipation mounting base is applied. This utility model embodiment only illustrates the application of the heat dissipation mounting base to a scanner as an example.

[0037] Specifically, the heat sink 20 is provided with a plurality of spaced heat-conducting columns 21. The support plate 11 of the mounting bracket 10 has support holes 111 corresponding to the positions of each heat-conducting column 21, allowing each heat-conducting column 21 to pass through the corresponding support hole 111 to mount the heat sink 20 onto the support plate 11. The core plate 200 is connected to the side of the heat sink 20 facing away from the support plate 11, allowing the heat generated by the core plate 200 to be directly conducted to the heat sink 20 and then to the support plate 11 through the heat-conducting columns 21 on the heat sink 20. The arrangement of multiple heat-conducting columns 21 passing through multiple support holes 111 in a corresponding manner increases the heat transfer efficiency. The heat conduction path allows the heat generated by the core board 200 to be quickly conducted to the heat sink 20, the heat conduction pillar 21, and the support plate 11, accelerating the heat dissipation speed and ensuring the heat dissipation effect of the core board 200. Furthermore, the sequential arrangement of the support plate 11, heat sink 20, and core board 200 occupies little space, making assembly convenient and quick, saving costs. The heat generated by the core board 200 diffuses onto the heat sink 20 and is conducted along the heat conduction pillar 21, ensuring stable and reliable heat conduction without the need for frequent disassembly and cleaning, thus improving ease of use. In addition, the heat conduction pillar 21 passing through the support hole 111 increases the structural strength of the support plate 11, improving structural stability.

[0038] In this embodiment of the utility model, the heat dissipation mounting base further includes a fixing component 30, which includes a fixing bracket 31 and a connecting fastener 32. The core board 200 includes a substrate 201 and a chip 202. The chip 202 is disposed on one side of the substrate 201 and located between the substrate 201 and the heat dissipation plate 20. The fixing bracket 31 is disposed on the side of the substrate 201 facing away from the chip 202. The connecting fastener 32 passes through the fixing bracket 31 and the substrate 201 and is connected to the heat dissipation plate 20.

[0039] like Figure 4 and Figure 5 As shown, the fixing bracket 31 is connected to the heat sink 20 via the connecting fastener 32. The core board 200 is located between the fixing bracket 31 and the heat sink 20. The fixing bracket 31 serves to fix the core board 200 on the heat sink 20 so that the heat generated by the core board 200 can be quickly diffused to the heat sink 20 and conducted along the heat conduction pillar 21, thereby improving the heat conduction efficiency. Furthermore, the core board 200 includes a substrate 201 and a chip 202 disposed on the substrate 201. The chip 202 is the main heat-generating component in the core board 200. The chip 202 is disposed on the side of the substrate 201 facing the heat sink 20 and is attached to the heat sink 20, which further accelerates the heat conduction speed and optimizes the heat dissipation effect.

[0040] In this embodiment of the utility model, the fixing bracket 31 is made of an elastic material, and the fixing bracket 31 protrudes in the direction toward the substrate 201, and presses the chip 202 onto the heat sink 20 through the substrate 201. Figure 4 and Figure 5 As shown, the fixing bracket 31 is disposed on the side of the substrate 201 facing away from the chip 202 and protrudes towards the substrate 201. The fixing bracket 31, made of elastic material, is connected to the heat sink 20 by connecting fasteners 32, so that the fixing bracket 31 can press the substrate 201 and the chip 202 towards the heat sink 20, thereby making the chip 202 fit tightly against the heat sink 20, increasing the contact area between the chip 202 and the heat sink 20, and further accelerating the heat conduction rate.

[0041] Furthermore, the fixing bracket 31 includes a clamping section 311 and a plurality of connecting sections 312. The clamping section 311 is protruding in the direction toward the substrate 201. One end of the plurality of connecting sections 312 is connected to the clamping section 311 respectively, and the plurality of connecting sections 312 are spaced apart on the substrate 201. Each connecting section 312 has a connecting ear 3121 at the end away from the clamping section 311. The connecting ear 3121 has a connecting hole 3122 for the connecting fastener 32 to pass through.

[0042] like Figure 4 and Figure 5 As shown, the pressing section 311 is arc-shaped and protrudes towards the substrate 201, so that the chip 202 is pressed against the heat sink 20 by the substrate 201, increasing the contact area between the chip 202 and the heat sink 20 and accelerating the heat transfer efficiency. One end of the pressing section 311 is connected to two connecting sections 312, and the other end of the pressing section 311 is also connected to two connecting sections 312. The four connecting sections 312 extend from the pressing section 311 away from the pressing section 311 and form connecting ears 3121 with connecting holes 3122. The connecting fasteners 32 pass through the corresponding connecting holes 3122 and the substrate 201 in sequence to connect to the heat sink 20, so as to fix the substrate 201 on the heat sink 20. The connection is stable and reliable, and the multiple connecting sections 312 can all play the role of limiting the substrate 201, further improving the structural stability.

[0043] In this embodiment of the utility model, the heat dissipation mounting base further includes a support component 40, which includes a first support column 41. The main board 300 of the control module is disposed on the side of the fixed bracket 31 facing away from the substrate 201. One end of the first support column 41 passes through the heat dissipation plate 20 and is connected to the heat dissipation plate 20, and the other end of the first support column 41 is supported on the main board 300 and connected to the main board 300.

[0044] like Figure 3 , Figure 4 and Figure 7As shown, the control module also includes a motherboard 300, which has a socket 301 and a base plate 201 with pins 203. The pins 203 on the base plate 201 are used to be inserted into the socket 301 for signal transmission. The two ends of the first support column 41 are connected to the heat sink 20 and the motherboard 300 respectively to support the heat sink 20, reduce the force on the base plate 201, effectively prevent the pins 203 from breaking under force, and improve the structural stability.

[0045] Furthermore, the support assembly 40 also includes a second support post 42, one end of which passes through the substrate 201 and is connected to the substrate 201, and the other end of which is supported on the motherboard 300 and connected to the motherboard 300. Figure 4 , Figure 7 and Figure 8 As shown, the two ends of the second support column 42 are connected to the substrate 201 and the motherboard 300 respectively to support the substrate 201. The first support column 41 and the second support column 42 are spaced apart on the motherboard 300 and are used to support the heat sink 20 and the substrate 201 respectively, so as to disperse the pressure on the pin 203, effectively prevent the pin 203 from breaking due to long-term stress, greatly improve the structural stability, and extend the service life of the core board 200.

[0046] In this embodiment of the utility model, the first support column 41 is provided with an external thread and is threadedly connected to the heat sink 20. The support assembly 40 also includes a first fastener 43. The first support column 41 is provided with a first threaded hole 411 at one end facing the motherboard 300. The first fastener 43 passes through the motherboard 300 and is set and connected in the first threaded hole 411.

[0047] like Figure 7 and Figure 9 As shown, the first support post 41 passes through the heat sink 20 and is threaded to the heat sink 20 via an external thread. The end of the first support post 41 away from the heat sink 20 is supported on the motherboard 300 to reduce the force on the pin 203 and improve structural stability. Furthermore, the first fastener 43 passes through the motherboard 300 on the side of the motherboard 300 facing away from the substrate 201 and extends into the first threaded hole 411 of the first support post 41. The threaded connection of the first fastener 43 into the first threaded hole 411 and the threaded connection between the first support post 41 and the heat sink 20 prevent the first support post 41 from loosening and falling off, ensuring a stable and reliable connection.

[0048] In this embodiment of the present invention, the second support column 42 includes a positioning segment 421 and a support segment 422. The positioning segment 421 is disposed at one end of the support segment 422, and a support step 4221 is formed between the positioning segment 421 and the support segment 422. The positioning segment 421 passes through the substrate 201 and is connected to the substrate 201. The substrate 201 is supported on the support step 4221. The end of the support segment 422 away from the positioning segment 421 is supported on the main board 300 and connected to the main board 300. Figures 7 to 9 As shown, the two ends of the support segment 422 are connected to the positioning segment 421 and the main board 300, respectively. The positioning segment 421 passes through the substrate 201 so that the substrate 201 is supported on the support step 4221, which improves the support stability of the substrate 201 and further reduces the force at the pin 203.

[0049] Furthermore, the second support column 42 has a second threaded hole 423 that penetrates the positioning section 421 and the support section 422. The support assembly 40 also includes a second fastener 44 and a third fastener 45. The second fastener 44 passes through the main board 300 and is connected to the second threaded hole 423, and the third fastener 45 passes through the substrate 201 and is connected to the second threaded hole 423. Figures 7 to 9 As shown, the second fastener 44 is threaded to the support section 422, and the third fastener 45 is threaded to the positioning section 421, making disassembly and assembly convenient and quick. The support section 422 is supported on the main board 300 and stabilizes the support substrate 201 through the support step 4221, improving the support stability. The positioning section 421 serves to limit the substrate 201, further improving the structural stability.

[0050] In the embodiments of this utility model, such as Figure 9 As shown, the support assembly 40 also includes a mounting fastener 46. The mounting fastener 46 passes through the motherboard 300 and is connected to the support plate 11. The connection between the motherboard 300 and the support plate 11 through the mounting fastener 46 not only improves the structural stability and effectively prevents the motherboard 300 from loosening, but also further reduces the force on the pin 203. Moreover, the support plate 11 and the motherboard 300 work together to limit the core board 200, further improving the structural stability.

[0051] In the embodiments of this utility model, such as Figure 3 and Figure 4As shown, the heat sink 20 is provided with mounting ears 211, which are used for the first support column 41 to pass through and be threadedly connected to the first support column 41. The mounting ears 211 serve to avoid the heat conduction column 21, so that the first support column 41 can be connected to the mounting ears 211, which improves the ease of assembly. In addition, the heat sink 20 is provided with a clearance opening 212, and the main board 300 and the base plate 201 are detachably connected by a snap fastener. The clearance opening 212 is set with a corresponding snap fastener to facilitate the removal of the base plate 201 from the main board 300, which improves the ease of disassembly.

[0052] In this embodiment of the invention, the heat dissipation assembly further includes a heat-conducting plate 50, which is disposed on the support plate 11 and located between the support plate 11 and the heat dissipation plate 20. Figure 2 and Figure 9 As shown, a heat-conducting sheet 50 is sandwiched between the heat sink 20 and the support plate 11. The heat-conducting sheet 50 is used to quickly conduct heat from the heat sink 20 to the support plate 11, which further accelerates the heat dissipation rate and improves the heat dissipation effect.

[0053] Furthermore, a clearance groove 112 is provided on the side of the support plate 11 facing the heat sink 20, and a support hole 111 is provided on the bottom wall of the clearance groove 112. The heat-conducting sheet 50 is disposed in the clearance groove 112 and is fitted to the heat sink 20. Figure 2 As shown, the heat-conducting plate 50 is disposed in the relief groove 112 to reduce the thickness of the support plate 11, further reducing the space occupied and improving the space utilization rate.

[0054] In this embodiment of the invention, the heat dissipation assembly further includes a heat-conducting block 60, which is disposed on the core plate 200 and located between the core plate 200 and the heat sink 20. Figure 4 As shown, the heat-conducting block 60 is sandwiched between the chip 202 and the heat sink 20, so that the heat generated by the chip 202 can be quickly conducted to the heat sink 20 through the heat-conducting block 60. The heat dissipation speed is fast, which effectively prevents the chip 202 from accumulating heat and causing performance failure. In addition, both the heat-conducting sheet 50 and the heat-conducting block 60 can be made of thermal grease in the prior art, which optimizes the thermal conductivity of the heat-conducting sheet 50 and the heat-conducting block 60 and improves the heat dissipation efficiency.

[0055] In the embodiments of this utility model, such as Figure 3 and Figure 4 As shown, multiple heat-conducting pillars 21 are integrally formed on the heat sink 20, and the heat-conducting pillars 21, the heat sink 20 and the mounting bracket 10 can all be made of magnesium alloy or aluminum alloy. The structure is thin and light and has excellent thermal conductivity, which further improves the heat dissipation effect.

[0056] In the embodiments of this utility model, such as Figure 1 and Figure 2As shown, the mounting bracket 10 also includes a panel 12. A support plate 11 is connected to one side of the panel 12 and is perpendicular to the panel 12. The support plate 11, heat sink 20, core plate 200, fixing bracket 31, and main board 300 are stacked in sequence. The panel 12 serves to shield the support plate 11, heat sink 20, core plate 200, fixing bracket 31, and main board 300, improving the aesthetic appearance of the scanner. Furthermore, the panel 12 is provided with a reinforcing rib 13, which is located on the side of the support plate 11 facing away from the heat sink 20. The reinforcing rib 13 is connected to both the panel 12 and the support plate 11, increasing the connection stability between the panel 12 and the support plate 11 and further improving the structural stability.

[0057] In the embodiments of this utility model, such as Figure 6 As shown, when assembling the heat sink mounting bracket and control module, the core board 200 is first connected to the heat sink 20 via the fixing bracket 31, and the pins 203 are inserted into the insertion holes of the motherboard 300. After the pins 203 and the socket 301 are assembled, the second fastener 44 is used to connect the second support post 42 to fix the substrate 201 onto the motherboard 300; furthermore, as Figure 7 As shown, after the core board 200 and the motherboard 300 are assembled, the first support post 41 is connected between the heat sink 20 and the motherboard 300, so that the first support post 41 and the second support post 42 respectively support the heat sink 20 and the substrate 201, preventing the pins 203 from breaking under force and improving structural stability; Figure 9 As shown, after the heat sink 20 and the motherboard 300 are assembled, the heat conduction pillar 21 is passed through the corresponding support hole 111 to connect the heat sink 20 to the support plate 11. This allows the heat generated by the chip 202 to be conducted to the support plate 11 in sequence through the heat conduction block 60, the heat sink 20, the heat conduction pillar 21, and the heat conduction sheet 50. The heat transfer speed is fast, ensuring the heat dissipation effect of the core board 200. It also occupies little space, is easy and quick to assemble, and saves costs. Furthermore, the use of mounting fasteners 46 to connect the motherboard 300 and the support plate 11 further improves the connection stability.

[0058] Furthermore, this utility model also provides a scanner, which includes the heat dissipation mounting base as described above. For example... Figure 1 As shown, the heat dissipation mounting base is used to install the scanner's core board 200 and motherboard 300, and to quickly dissipate heat from the core board 200. The panel 12 serves to decorate the scanner, improving its appearance. Furthermore, the specific structure of the heat dissipation mounting base is as described in the above embodiments. Since the scanner adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0059] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0060] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0062] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heat dissipation mounting base, characterized in that, The heat dissipation mounting base includes: Mounting bracket (10), the mounting bracket (10) includes a support plate (11), the support plate (11) is provided with a plurality of support holes (111), the plurality of support holes (111) are spaced apart on the support plate (11); The heat dissipation assembly includes a heat sink (20), one side of which is used for mounting the core board (200) of the control module, and the other side of which is provided with a plurality of heat conduction pillars (21). The number of heat conduction pillars (21) is consistent with the number of support holes (111) and they are arranged to pass through the support holes (111) one by one.

2. The heat dissipation mounting base according to claim 1, characterized in that, The heat dissipation mounting base also includes a fixing component (30), which includes a fixing bracket (31) and a connecting fastener (32). The core board (200) includes a substrate (201) and a chip (202). The chip (202) is disposed on one side of the substrate (201) and located between the substrate (201) and the heat dissipation plate (20). The fixing bracket (31) is disposed on the side of the substrate (201) facing away from the chip (202). The connecting fastener (32) passes through the fixing bracket (31) and the substrate (201) and is connected to the heat dissipation plate (20).

3. The heat dissipation mounting base according to claim 2, characterized in that, The fixing bracket (31) is made of elastic material. The fixing bracket (31) protrudes in the direction toward the substrate (201) and presses the chip (202) onto the heat sink (20) through the substrate (201).

4. The heat dissipation mounting base according to claim 3, characterized in that, The fixed bracket (31) includes a clamping section (311) and a plurality of connecting sections (312). The clamping section (311) is protruding in the direction toward the substrate (201). One end of each of the plurality of connecting sections (312) is connected to the clamping section (311), and the plurality of connecting sections (312) are spaced apart on the substrate (201). Each connecting section (312) has a connecting ear (3121) at the end away from the clamping section (311). The connecting ear (3121) has a connecting hole (3122) for the connecting fastener (32) to pass through.

5. The heat dissipation mounting base according to claim 2, characterized in that, The heat dissipation mounting base also includes a support assembly (40), the support assembly (40) includes a first support column (41), the main board (300) of the control module is disposed on the side of the fixed bracket (31) facing away from the substrate (201), one end of the first support column (41) passes through the heat sink (20) and is connected to the heat sink (20), and the other end of the first support column (41) is supported on the main board (300) and connected to the main board (300).

6. The heat dissipation mounting base according to claim 5, characterized in that, The support assembly (40) further includes a second support column (42), one end of which passes through the substrate (201) and is connected to the substrate (201), and the other end of which is supported on the motherboard (300) and connected to the motherboard (300).

7. The heat dissipation mounting base according to claim 6, characterized in that, The first support column (41) has an external thread and is threadedly connected to the heat sink (20). The support assembly (40) also includes a first fastener (43). The first support column (41) has a first threaded hole (411) at one end facing the motherboard (300). The first fastener (43) passes through the motherboard (300) and is connected to the first threaded hole (411). And / or, the second support column (42) includes a positioning section (421) and a support section (422), the positioning section (421) is disposed at one end of the support section (422), and a support step (4221) is formed between the positioning section (421) and the support section (422). The positioning section (421) passes through the substrate (201) and is connected to the substrate (201). The substrate (201) is supported on the support step (4221). The end of the support section (422) away from the positioning section (421) is supported on the main board (300) and connected to the main board (300).

8. The heat dissipation mounting base according to any one of claims 1 to 7, characterized in that, The heat dissipation assembly also includes a heat-conducting plate (50), which is disposed on the support plate (11) and located between the support plate (11) and the heat dissipation plate (20).

9. The heat dissipation mounting base according to claim 8, characterized in that, The support plate (11) has a relief groove (112) on one side facing the heat sink (20), the support hole (111) is opened on the bottom wall of the relief groove (112), and the heat-conducting sheet (50) is disposed in the relief groove (112) and is attached to the heat sink (20). And / or, the heat dissipation assembly further includes a heat-conducting block (60), which is disposed on the core plate (200) and located between the core plate (200) and the heat dissipation plate (20).

10. A scanner, characterized in that, The scanner includes a heat dissipation mounting base according to any one of claims 1 to 9.

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