Hall current sensor and hall current detection system
By first installing the Hall chip into an insulating housing in the Hall current sensor, fixing the insulating housing to the PCB board, and then inserting it into the through hole of the busbar, the problem of Hall chip being easily damaged during assembly is solved, improving detection accuracy and application adaptability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU INOSA UNITED POWER SYST CO LTD
- Filing Date
- 2025-07-02
- Publication Date
- 2026-06-26
AI Technical Summary
In the manufacturing process of coreless Hall current sensors, Hall chips are susceptible to mechanical damage from external forces such as impacts, compression, and vibrations, which leads to a reduction in detection accuracy.
The Hall chip is first installed in an insulating housing, and the insulating housing is fixed to the PCB board. Then, the insulating housing and the Hall chip are inserted into the through holes of the busbar to avoid the Hall chip being exposed for a long time during the assembly process. The bent leads are used to connect to the PCB board surface to reduce the spot soldering process and enhance protection.
This improves the detection accuracy of Hall current sensors, avoids damage to Hall chips during assembly, reduces manufacturing difficulty and cost, and enhances application adaptability in high-voltage output scenarios.
Smart Images
Figure CN224416943U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of current sensor technology, and in particular to a Hall current sensor and a Hall current detection system. Background Technology
[0002] A Hall effect current sensor is a non-contact current detection device based on the Hall effect principle, widely used in industrial automation control, power electronics, new energy vehicles, smart grids, and other fields. This sensor can accurately measure DC, AC, and various waveforms of current, and features high precision, fast response, electrical isolation, and strong anti-interference capabilities, making it a key component in the field of current detection.
[0003] Coreless Hall current sensors, due to their small size, light weight, and low cost, are gradually becoming an important development direction in the field of current detection. Unlike traditional Hall current sensors, coreless Hall current sensors eliminate the magnetic core structure, directly mounting the Hall chip near the current busbar. Current measurement is achieved by detecting the magnetic field generated by the current, resulting in a simpler structure.
[0004] In the existing manufacturing process of coreless Hall current sensors, the common procedure is to first fix the insulating shell to the busbar, and then fix the Hall chip inside the insulating shell. However, during this manufacturing process, the Hall chip needs to undergo multiple handling, positioning, and installation operations. In these operations, the Hall chip is highly susceptible to external forces, such as impact, compression, and vibration, which can cause mechanical damage and reduce the detection accuracy of the Hall current sensor. Utility Model Content
[0005] The main purpose of this invention is to propose a Hall current sensor and a Hall current detection system, which aims to improve the protection of Hall chips and improve the detection accuracy of Hall current sensors.
[0006] To achieve the above objectives, the Hall current sensor proposed in this utility model includes:
[0007] Busbar, wherein the busbar is provided with through holes; and
[0008] A Hall module extends into the through hole. The Hall module includes an insulating shell and a Hall chip. The insulating shell has a mounting hole, the Hall chip is mounted in the mounting hole, and the Hall pins of the Hall chip protrude from the mounting hole for electrical connection with the PCB board. The insulating shell is used for fixed connection with the PCB board.
[0009] In one embodiment, the Hall pin includes a vertical segment extending in a first direction and a bent segment extending in a second direction, the vertical segment and the bent segment being connected, the vertical segment being located within the mounting hole, and the bent segment being exposed within the mounting hole for surface mounting to a PCB board.
[0010] In one embodiment, the insulating housing includes a housing body and a receiving groove disposed at one end of the housing body, the housing body extending along a first direction and the receiving groove extending along a second direction to accommodate at least a portion of the bent section.
[0011] In one embodiment, the insulating housing further includes a fixing shoulder connected to the housing body, the fixing shoulder having a fixing pin at one end near the opening of the mounting hole, the fixing pin being used for surface mounting to a PCB board.
[0012] In one embodiment, the fixing shoulder has a clearance section at one end away from the fixing pin, and in the third direction, the outer diameter of the through hole is smaller than the outer diameter of the insulating shell at one end of the fixing shoulder.
[0013] In one embodiment, the through hole penetrates the busbar in the first direction; the Hall chip has two Hall elements arranged at intervals along the first direction, and the center of the connecting line of the two Hall elements overlaps with the geometric center of the through hole.
[0014] In one embodiment, in the second direction, the through hole is located in the middle of the busbar; and / or
[0015] In the second direction, the busbar has a concave narrowing notch on each side of the through hole.
[0016] In one embodiment, the insulating shell is made of plastic, and the CTI of the plastic is greater than 400; and / or,
[0017] The busbar is configured as a copper busbar.
[0018] This utility model also proposes a Hall current detection system, including a PCB board and the Hall current sensor, wherein the Hall pin is electrically connected to the PCB board, and the insulating shell is fixedly connected to the PCB board.
[0019] In one embodiment, two or three Hall current sensors are provided, and an isolation magnetic core is provided between two adjacent Hall current sensors.
[0020] This invention provides a Hall current sensor incorporating a busbar and a Hall module. The busbar has a through-hole into which the Hall module extends. The Hall module includes an insulating shell and a Hall chip. The insulating shell has mounting holes into which the Hall chip is mounted, with its Hall pins protruding for electrical connection to the PCB board. The insulating shell is used for fixed connection to the PCB board. Compared to existing technologies where the insulating shell is fixed to the busbar and the Hall chip is then installed inside, this invention first installs the Hall chip inside the insulating shell, fixes the insulating shell to the PCB board, and then inserts both the insulating shell and the Hall chip into the through-hole of the busbar. This ensures the Hall chip is installed inside the insulating shell immediately upon assembly, preventing prolonged exposure during assembly and thus avoiding damage caused by stress during exposure. This, in turn, guarantees the detection accuracy of the Hall current sensor. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0022] Figure 1 A schematic diagram of the structure of an embodiment of the Hall current sensor provided by this utility model;
[0023] Figure 2 An exploded structural diagram of an embodiment of a Hall current sensor;
[0024] Figure 3 A front view of an embodiment of the Hall current detection system provided by this utility model;
[0025] Figure 4 This is a side view of an embodiment of a Hall current detection system;
[0026] Figure 5 This is a partial structural schematic diagram of an embodiment of a Hall current detection system;
[0027] Figure 6 for Figure 5 A schematic diagram illustrating the principle.
[0028] Explanation of icon numbers:
[0029] 10. Hall current sensor; 20. PCB board; 30. Isolation magnetic core;
[0030] 100, busbar; 110, through hole; 120, narrowed notch;
[0031] 200. Hall effect module;
[0032] 300. Insulating housing; 310. Mounting hole; 320. Housing body; 330. Receiving groove; 340. Fixing shoulder; 341. Fixing pin; 342. Clearance section;
[0033] 400. Hall effect chip; 410. Hall effect pin; 411. Vertical section; 412. Bending section; 420. Hall effect element.
[0034] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0036] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0038] In the existing manufacturing process of coreless Hall current sensors, the common procedure is to first fix the insulating shell to the busbar, and then fix the Hall chip inside the insulating shell. However, during this manufacturing process, the Hall chip needs to undergo multiple handling, positioning, and installation operations. In these operations, the Hall chip is highly susceptible to external forces, such as impact, compression, and vibration, which can cause mechanical damage and reduce the detection accuracy of the Hall current sensor.
[0039] This utility model proposes a Hall current sensor 10.
[0040] Please see Figure 1 and Figure 2 In one embodiment of this utility model, the Hall current sensor 10 includes a busbar 100 and a Hall module 200. The busbar 100 has a through hole 110, into which the Hall module 200 extends. The Hall module 200 includes an insulating shell 300 and a Hall chip 400. The insulating shell 300 has a mounting hole 310, into which the Hall chip 400 is mounted, and the Hall pins 410 of the Hall chip 400 protrude from the mounting hole 310 for connection with the PCB board 20 (e.g., ...). Figure 3 and Figure 4 (As shown) Electrical connection, the insulating housing 300 is used for fixed connection with the PCB board 20.
[0041] Understandably, the Hall current sensor 10 includes a busbar 100 and a Hall module 200. The Hall module 200 includes an insulating housing 300 and a Hall chip 400. The busbar 100 carries the current to be measured and generates a magnetic field. The Hall chip 400 detects the current. The insulating housing 300 provides insulation between the busbar 100 and the Hall chip 400, and also serves to fix it to the PCB board 20. Specifically, one end of the insulating housing 300 has a mounting hole 310, in which the Hall chip 400 is mounted, with its Hall pins 410 protruding from the mounting hole 310. The busbar 100 has a through hole 110, into which the insulating housing 300, carrying the Hall chip 400, extends.
[0042] Thus, when assembling the Hall current sensor 10, the Hall chip 400 is first installed into the mounting hole 310 of the insulating housing 300. Then, the Hall pins 410 of the Hall chip 400 are electrically connected to the PCB board 20, and the insulating housing 300 is fixedly connected to the PCB board 20, thereby fixing the Hall module 200 onto the PCB board 20. Finally, the Hall module 200, fixed to the PCB board 20, is inserted into the through hole 110 of the busbar 100. In this way, the Hall chip 400 is installed in the insulating housing 300 at the beginning of assembly, thus avoiding prolonged exposure of the Hall chip 400 during the assembly process. This prevents damage to the Hall chip 400 due to stress during exposure, thereby ensuring the detection accuracy of the Hall current sensor 10 and preventing its failure.
[0043] The technical solution of this utility model involves setting a busbar 100 and a Hall module 200 in a Hall current sensor 10. The busbar 100 has a through hole 110, into which the Hall module 200 extends. The Hall module 200 includes an insulating shell 300 and a Hall chip 400. The insulating shell 300 has a mounting hole 310, into which the Hall chip 400 is mounted, with its Hall pins 410 protruding for electrical connection to the PCB board 20. The insulating shell 300 is used for fixed connection to the PCB board 20. Compared to the prior art, which fixes the insulating shell 300 to the busbar 100 and then installs the Hall chip 400 into it, this utility model first installs the Hall chip 400 into the insulating shell 300, fixes the insulating shell 300 to the PCB board 20, and then extends both the insulating shell 300 and the Hall chip 400 into the through hole 110 of the busbar 100. In this way, the Hall chip 400 is installed in the insulating shell 300 at the beginning of assembly, thereby avoiding the Hall chip 400 being exposed for a long time during the assembly process, thus avoiding damage to the Hall chip 400 due to force during exposure, and thus ensuring the detection accuracy of the Hall current sensor 10.
[0044] Please see Figure 1 and Figure 2 In an embodiment of this utility model, the Hall pin 410 includes a vertical segment 411 extending in a first direction and a bent segment 412 extending in a second direction. The vertical segment 411 and the bent segment 412 are connected. The vertical segment 411 is located inside the mounting hole 310, and the bent segment 412 is exposed outside the mounting hole 310 for surface mounting to the PCB board 20.
[0045] Understandably, in this invention, the Hall pin 410 is bent. Specifically, the Hall pin 410 includes a vertical segment 411 and a bent segment 412 connected together, wherein the vertical segment 411 extends along a first direction, and the bent segment 412 extends along a second direction, the first and second directions being perpendicular to each other. In this invention, the first direction is also the thickness direction of the busbar 100, and the second direction is also the width direction of the busbar 100. After the Hall chip 400 is installed in the insulating housing 300, the vertical segment 411 of the Hall pin 410 is located within the mounting hole 310, and the bent segment 412 can protrude from the mounting hole 310 to extend along the second direction. The bent segment 412 is used for surface mounting with the PCB board 20 (e.g., Figure 3 and Figure 4 (As shown). It is understandable that surface mount technology refers to directly soldering miniaturized electronic components onto the surface of a printed circuit board. Thus, by bending the Hall pin 410 to surface mount it onto the PCB board 20, spot soldering or selective soldering processes are avoided, reducing manufacturing difficulty and cost.
[0046] Please see Figure 1 and Figure 2 In an embodiment of this utility model, the insulating shell 300 includes a shell body 320 and a receiving groove 330 disposed at one end of the shell body 320. The shell body 320 extends along a first direction, and the receiving groove 330 extends along a second direction to accommodate at least a portion of the bent section 412.
[0047] Specifically, the insulating housing 300 includes a housing body 320 and a receiving groove 330 disposed at one end of the housing body 320. A mounting hole 310 is disposed at one end of the housing body 320 and extends along a first direction; the receiving groove 330 and the opening end of the mounting hole 310 are located at the same end. The housing body 320 extends along the first direction, and the receiving groove 330 extends along a second direction. It can be understood that a Hall element 420 has two Hall pins 410, and the bent sections 412 of the two Hall pins 410 protrude from the mounting hole 310 and extend in the second direction, respectively, towards a side opposite to the other. In the embodiment shown in the figures of this utility model, the receiving grooves 330 are disposed on opposite sides of the mounting hole 310 to respectively accommodate the bent sections 412 of the two Hall pins 410, thereby improving the protection of the Hall pins 410.
[0048] Understandably, the position and shape of the receiving groove 330 can be adjusted according to the position and shape of the Hall pin 410, and there are no restrictions here.
[0049] Understandably, the creepage distance between busbar 100 and Hall chip 400 refers to the distance along busbar 100 to insulating shell 300 and then to bending section 412. The arrangement of the receiving groove 330 extending in the second direction extends the creepage distance, thereby ensuring the safety creepage distance between busbar 100 and Hall chip 400. This allows the Hall current sensor 10 to be applied to high-voltage output scenarios, improving the versatility of the Hall current sensor 10.
[0050] Please see Figure 1 and Figure 2 In an embodiment of this utility model, the insulating shell 300 further includes a fixing shoulder 340 connected to the shell body 320. The fixing shoulder 340 has a fixing pin 341 at one end near the opening of the mounting hole 310. The fixing pin 341 is used for surface mounting to the PCB board 20.
[0051] Understandably, in one embodiment, the insulating shell 300 is fixedly connected to the PCB board 20 via a fixing pin 341. Specifically, the insulating shell 300 also includes a fixing shoulder 340, which is connected to the shell body 320. The fixing shoulder 340 has a fixing pin 341 at one end facing the PCB board 20, and it is understood that the fixing pin 341 is made of metal. In the solution shown in the figures of this utility model, the fixing pin 341 extends along a second direction, thereby facilitating the surface mounting of the fixing pin 341 onto the PCB board 20. In this way, compared with other fixing methods such as spot welding, surface mounting reduces manufacturing difficulty and cost. At the same time, the extension of the fixing pin 341 along the second direction also avoids interference between the fixing pin 341 and the bending section 412.
[0052] In one embodiment, the fixed pin 341 and the insulating shell 300 are integrally molded using a plastic coating process, which facilitates the processing of the fixed pin 341 and the insulating shell 300. It is understood that, to improve the connection stability between the insulating shell 300 and the PCB board 20, the insulating shell 300 has a fixing shoulder 340 on each opposite side of the shell body 320. That is, the two fixing shoulders 340 are arranged opposite each other along a third direction, which is the length direction of the busbar 100, and is perpendicular to the first and second directions. Each fixing shoulder 340 has a fixing pin 341, thus improving the fixing stability and reliability of the insulating shell 300 and the PCB board 20.
[0053] Please see Figure 1 and Figure 2 In an embodiment of this utility model, the fixed shoulder 340 is provided with a clearance section 342 at one end away from the fixed pin 341, and in the third direction, the outer diameter of the through hole 110 is smaller than the outer diameter of the insulating shell 300 at one end of the fixed shoulder 340.
[0054] Specifically, in the first direction, the fixing shoulder 340 has a clearance section 342 formed at the end opposite to the fixing pin 341. That is, in the first direction, one end of the fixing shoulder 340 is flush with the end of the housing body 320 where the mounting hole 310 is provided, and the other end of the fixing shoulder 340 is lower than the other end of the housing body 320. That is, in the first direction, the thickness of the fixing shoulder 340 is less than the thickness of the housing body 320. When the insulating housing 300 and the Hall chip 400 are inserted into the through hole 110, it is not necessary to insert the fixing shoulder 340 into the through hole 110. Thus, in the third direction, the outer diameter of the end of the insulating housing 300 near the PCB board 20 is larger than the outer diameter of the through hole 110. Thus, the setting of the clearance section 342 helps to reduce the aperture of the through hole 110, thereby helping to improve the detection accuracy of the Hall current sensor 10.
[0055] Please see Figure 3 and Figure 4 In an embodiment of this utility model, in the first direction, the through hole 110 penetrates the busbar 100; the Hall chip 400 is provided with two Hall elements 420 arranged at intervals along the first direction, and the center of the connecting line of the two Hall elements 420 overlaps with the geometric center of the through hole 110.
[0056] Understandably, the through-hole 110 extends through the busbar 100 along the first direction. In one embodiment, the Hall chip 400 encapsulates two Hall elements 420 spaced apart along the first direction. Understandably, the through-hole 110 has a geometric center in the first, second, and third directions. This geometric center is the center point of the through-hole 110 in the thickness direction of the busbar 100, its center point in the length direction of the busbar 100, and its center point in the width direction of the busbar 100. The center of the connecting line between the two Hall elements 420 in the first direction coincides with the geometric center of the through-hole 110. This improves the detection accuracy of the Hall current sensor 10. Simultaneously, the arrangement of the two Hall elements 420 allows for the detection and differential differentiation of the magnetic field magnitude parallel to the surface of the busbar 100, improving detection accuracy and noise immunity.
[0057] Please see Figure 1 and Figure 2 In an embodiment of the present invention, in the second direction, the through hole 110 is provided in the middle of the busbar 100; and / or, in the second direction, the busbar 100 is provided with a concave narrowing notch 120 on each of the opposite sides of the through hole 110.
[0058] Specifically, in one embodiment, the through hole 110 is located in the middle of the busbar 100 in the second direction. That is, the through hole 110 is located in the middle of the width direction of the busbar 100, which is beneficial to improving the detection accuracy of the Hall current sensor 10.
[0059] In one embodiment, in the second direction, the busbar 100 has an inwardly recessed narrowing notch 120 on each side of the through hole 110. That is, at the location of the through hole 110, the width of the busbar 100 is narrowed, which is beneficial to increasing the magnetic field strength and improving the detection accuracy of the Hall current sensor 10. Furthermore, the two narrowing notches 120 are the same size to further improve the detection accuracy of the Hall current sensor 10.
[0060] In embodiments of this utility model, the insulating shell 300 is made of plastic, and the CTI of the plastic is greater than 400; and / or, the busbar 100 is made of copper.
[0061] Understandably, the insulating shell 300 is configured as plastic. However, in other embodiments, the insulating shell 300 can also be made of insulating materials such as ceramics or composite materials. Furthermore, the plastic has a CTI greater than 400, such as PA6T (polyhexamethylene terephthalamide) or PA10T (polydecyl terephthalamide). CTI refers to the Comparative Tracking Index, a key parameter for evaluating the resistance to tracking on the surface of insulating materials. Thus, the use of materials with high CTI values helps improve the safety creepage distance of the Hall current sensor 10, enabling its application in high-voltage output scenarios and expanding its application scenarios.
[0062] In one embodiment, the busbar 100 is configured as a copper busbar, which has low thermal conductivity, good thermal stability, and mechanical strength, ensuring the detection accuracy and service life of the Hall current sensor 10. Of course, in other embodiments, the busbar 100 can also be an aluminum busbar, etc.
[0063] Please see Figures 3 to 6 This utility model also proposes a Hall current detection system, which includes a PCB board 20 and a Hall current sensor 10. The specific structure of the Hall current sensor 10 is as described in the above embodiments. Since this Hall current detection system adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The Hall pin 410 is electrically connected to the PCB board 20, and the insulating shell 300 is fixedly connected to the PCB board 20.
[0064] Please see Figure 3 and Figure 4Specifically, the main PCB board 20 is used to mount the Hall chip 400 and the insulating housing 300, provides peripheral circuitry for the Hall chip 400, and transmits the analog voltage signal sampled by the Hall chip 400 to the main control chip to realize system data processing. In one embodiment, the main PCB board 20 is made of FR-4 material.
[0065] In embodiments of this utility model, two or three Hall current sensors 10 are provided, and an isolation magnetic core 30 is provided between two adjacent Hall current sensors 10.
[0066] Please see Figure 5 and Figure 6 It is understandable that the Hall current sensor 10 in this utility model, since it eliminates the use of a magnetic core, will have serious interphase interference when applied to multiphase output current detection scenarios, that is, it cannot completely differentially eliminate the influence of the magnetic field generated by adjacent copper busbars.
[0067] When the Hall current sensor 10 is used in a multi-phase output current detection scenario, two or three Hall current sensors 10 are provided, and an isolation magnetic core 30 is provided between two adjacent Hall current sensors 10 to reduce inter-phase interference and improve detection accuracy.
[0068] Specifically, the addition of the isolation magnetic core 30 provides a low magnetic reluctance loop for the spatial magnetic field generated by the busbar 100 and stray magnetic fields in the environment, preventing these magnetic fields from affecting the detection accuracy of adjacent Hall chips 400 and providing magnetic shielding. In one embodiment, the isolation magnetic core 30 is made of silicon steel sheet, and the thickness and size of the silicon steel sheet can be adjusted according to the actual detection current frequency to better achieve the shielding effect against interphase interference. Of course, in other embodiments, the isolation magnetic core 30 can also be made of other alloy materials or other materials with magnetic permeability. In one embodiment, in order not to increase the volume of the Hall current detection system, the size of the isolation magnetic core 30 is less than or equal to the size of the insulating shell 300.
[0069] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.
Claims
1. A Hall current sensor, characterized in that, include: Busbar, wherein the busbar is provided with through holes; and A Hall module extends into the through hole. The Hall module includes an insulating shell and a Hall chip. The insulating shell has a mounting hole, the Hall chip is mounted in the mounting hole, and the Hall pins of the Hall chip protrude from the mounting hole for electrical connection with the PCB board. The insulating shell is used for fixed connection with the PCB board.
2. The Hall current sensor as described in claim 1, characterized in that, The Hall pin includes a vertical segment extending in a first direction and a bent segment extending in a second direction, the vertical segment and the bent segment being connected, the vertical segment being located within the mounting hole, and the bent segment being exposed within the mounting hole for surface mounting to a PCB board.
3. The Hall current sensor as described in claim 2, characterized in that, The insulating housing includes a housing body and a receiving groove at one end of the housing body, the housing body extending along the first direction and the receiving groove extending along the second direction to accommodate at least a portion of the bent section.
4. The Hall current sensor as described in claim 3, characterized in that, The insulating housing also includes a fixing shoulder connected to the housing body. The fixing shoulder has a fixing pin at one end near the opening of the mounting hole. The fixing pin is used for surface mounting to the PCB board.
5. The Hall current sensor as described in claim 4, characterized in that, The fixed shoulder has a clearance section at one end away from the fixed pin, and in the third direction, the outer diameter of the through hole is smaller than the outer diameter of the insulating shell at one end of the fixed shoulder.
6. The Hall current sensor as described in claim 2, characterized in that, In the first direction, the through hole penetrates the busbar; the Hall chip is provided with two Hall elements arranged at intervals along the first direction, and the center of the connecting line of the two Hall elements overlaps with the geometric center of the through hole.
7. The Hall current sensor as described in claim 2, characterized in that, In the second direction, the through hole is located in the middle of the busbar; and / or In the second direction, the busbar has a concave narrowing notch on each side of the through hole.
8. The Hall current sensor as described in claim 1, characterized in that, The insulating shell is made of plastic, and the CTI of the plastic is greater than 400; and / or, The busbar is configured as a copper busbar.
9. A Hall current detection system, characterized in that, It includes a PCB board and a Hall current sensor as described in any one of claims 1 to 8, wherein the Hall pin is electrically connected to the PCB board and the insulating housing is fixedly connected to the PCB board.
10. The Hall current detection system as described in claim 9, characterized in that, The Hall current sensor is provided in two or three, and an isolation magnetic core is provided between two adjacent Hall current sensors.