A heat dissipating photovoltaic module

Abstract

The utility model discloses a heat dissipation photovoltaic module, including photovoltaic module and heat dissipation pipeline, the backboard of photovoltaic module is bonded with heat dissipation pipeline, the passage width of heat dissipation pipeline is 0.5~3mm, the density of heat dissipation pipeline in the backboard both sides is higher than the density of heat dissipation pipeline in the middle area of backboard, the area of heat dissipation pipeline occupies does not exceed 20% of backboard. The utility model discloses microchannel heat dissipation pipeline, and carries out the density design of subarea, effectively carries out heat dissipation to different parts, and improves the efficiency of photovoltaic module solar energy conversion into electric energy.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic technology, specifically a heat dissipation photovoltaic module. Background Technology

[0002] In the photovoltaic field, photovoltaic modules generate heat during operation. Especially in areas with high outdoor temperatures, the heat generated by the modules is difficult to dissipate through natural convection. This reduces the module's power generation efficiency, accelerates cell degradation and material aging, and ultimately reduces the module's power output and shortens its lifespan.

[0003] Currently, photovoltaic modules mostly use natural heat dissipation methods, such as radiation and natural convection. However, this heat dissipation method is inefficient and uneven, which can easily lead to localized overheating of the modules.

[0004] When photovoltaic modules are operating, approximately 80% of the solar energy is not converted into electrical energy but is instead accumulated as heat, causing the module temperature to rise. Traditional heat dissipation methods (such as natural air cooling) are inefficient and cannot effectively control the temperature rise, making it difficult to meet the requirements of high-efficiency photovoltaic systems.

[0005] Chinese patent CN119382611A discloses a liquid-cooled temperature control method, system, and controller for a photovoltaic (PV) curtain wall. The system includes a PV glass module; a heat spreader plate with a first and second end face arranged opposite each other, the back of the PV glass module being bonded to the first end face of the heat spreader plate; a liquid cooling pipe containing coolant, welded to the second end face of the heat spreader plate; a temperature sensor mounted on the PV glass module; a cooling circulation assembly connected to the liquid cooling pipe, through which heat from the PV glass module is transferred to the cooling circulation assembly via the heat spreader plate and the liquid cooling pipe; and a controller for acquiring the module temperature measured by the temperature sensor and controlling the cooling circulation assembly to open / close based on the temperature. This solution bonds the heat spreader plate to the back of the PV glass module and then uses the liquid cooling pipe bonded to the heat spreader plate for cooling. However, the efficiency of the PV module in converting solar energy into electrical energy needs improvement. Summary of the Invention

[0006] The present invention aims to provide a heat-dissipating photovoltaic module that can cool the photovoltaic module while improving the efficiency of converting solar energy into electrical energy.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0008] A heat-dissipating photovoltaic module includes a photovoltaic module and heat dissipation pipes. The heat dissipation pipes are bonded to the back panel of the photovoltaic module. The channel width of the heat dissipation pipes is 0.5~3mm. The density of the heat dissipation pipes on both sides of the back panel is higher than the density of the heat dissipation pipes in the middle area of ​​the back panel. The area occupied by the heat dissipation pipes does not exceed 20% of the back panel.

[0009] This invention provides a microchannel heat dissipation photovoltaic module through the design of microchannel technology. Because the heat generation in the edge area of ​​the photovoltaic module is greater than that in the center area, in order to balance heat dissipation and ensure the photovoltaic efficiency of the backsheet (sunlight reflected from the ground or an object to the backsheet), the heat dissipation pipes are designed with regional density, with the microchannel density in the edge area of ​​the module being higher than that in the center area.

[0010] Based on the embodiments of this utility model, further optimizations can be made to this utility model. The optimized technical solutions are as follows:

[0011] In one preferred embodiment, the heat dissipation piping is arranged in a serpentine pattern.

[0012] In one preferred embodiment, the backplate includes a central region, a left region and a right region located on both sides of the central region and in the X direction. The length of the left region in the X direction is 1 / 4 to 1 / 3 of the length of the backplate in the X direction, and the length of the right region in the X direction is 1 / 4 to 1 / 3 of the length of the backplate in the X direction. The density of the heat dissipation pipes in the left and right regions is 8 to 10 pipes / cm, and the density of the heat dissipation pipes in the central region is 4 to 6 pipes / cm.

[0013] To ensure heat dissipation efficiency, the heat dissipation pipes are made of metal materials with good thermal conductivity, including aluminum and copper.

[0014] In one preferred embodiment, the heat dissipation pipes are bonded to the backplate using thermally conductive adhesive.

[0015] In one preferred embodiment, the thermal conductivity of the thermally conductive adhesive is not less than 1 W / m•K, and the temperature resistance range is -40℃ to 90℃.

[0016] In one preferred embodiment, in order to increase the contact area between the fluid and the air and enhance the heat exchange effect, the lower end of the heat dissipation pipe is fixedly connected to fins arranged perpendicularly to the back plate, and the height of the fins is greater than or equal to 5mm.

[0017] In one preferred embodiment, the inlet of the heat dissipation pipe is connected to the outlet of the buried pipe, and the outlet of the heat dissipation pipe is connected to the inlet of the buried pipe.

[0018] In one preferred embodiment, the buried pipe is buried in the soil together with the photovoltaic support, and the lowest point of the buried pipe is 1-2m deeper than the photovoltaic support.

[0019] When photovoltaic power stations are built on the ground, a combination of microchannel heat dissipation pipes and buried pipes is used. The microchannel heat dissipation pipes exchange heat with the back of the modules, reducing the module temperature; the buried pipes exchange heat with the air and soil, reducing the temperature of the heat transfer medium inside the pipes. This fully utilizes the low temperature and heat capacity of the air and soil to effectively cool the heat transfer medium passing through the modules. The buried pipes are inserted into the soil along with the photovoltaic support structure, to a depth of 1-2 meters deeper than the support structure. They can be installed simultaneously with the support structure construction, effectively saving on engineering work.

[0020] In one preferred embodiment, the buried pipe is buried in the soil together with the photovoltaic support, and heat exchange fins are arranged around the buried pipe.

[0021] This arrangement differs from the single-sided arrangement of microchannel heat exchange tubes. The heat exchange fins of the buried tubes surround the pipes, and the fin height should not be less than 5mm, which can effectively enhance the heat exchange effect.

[0022] In one preferred embodiment, the outlet of the buried pipe is first connected to the inlet of the water collection tank, and the outlet of the water collection tank is then connected to the inlet of the heat dissipation pipe.

[0023] In one preferred embodiment, a water collection tank is installed at the outlet of the buried pipe. After exchanging heat with the soil, the heat transfer medium enters the water collection tank and is then uniformly distributed to each component by the water collection tank.

[0024] This utility model also includes a computer control module. The heat dissipation pipe is equipped with a temperature sensor and a flow sensor. A temperature sensor is provided on the back plate. The computer control module collects sensor data in real time and controls the start, stop and operation power of the coolant pump.

[0025] Furthermore, temperature sensors and flow sensors are installed at the inlet and outlet ports of the heat dissipation pipes to monitor the ambient temperature, and a temperature sensor is installed on the back panel.

[0026] Furthermore, the computer control module collects the inlet and outlet temperatures, flow rates, and backplane temperatures of the microchannel heat dissipation pipes in real time. When the backplane temperature exceeds 30°C, the pump is activated. The computer control module can effectively adjust the pump flow rate to ensure that the temperature difference between the heat dissipation pipe ends is less than 10°C.

[0027] Existing liquid cooling systems typically employ a fixed flow rate design, failing to adjust the coolant flow rate in real time according to component temperature changes. This results in energy waste under low-irradiation conditions and insufficient heat dissipation under high-irradiation conditions. This invention addresses this by using a computer control module to collect sensor data in real time and control the start / stop and operating power of the coolant pump.

[0028] Furthermore, the coolant can be sourced locally. For example, water can be used as the coolant in water-based photovoltaic systems, while water or a mixture of water and ethylene glycol can be used as the coolant in non-water-based photovoltaic systems.

[0029] Furthermore, when a photovoltaic power station is built on water, the microchannel heat dissipation pipes are directly connected to the water body, making full use of the low temperature and heat capacity of the water body to effectively cool down the heat transfer medium passing through the module.

[0030] Compared with the prior art, the beneficial effects of this utility model are:

[0031] (1) This utility model is designed with regional density to effectively dissipate heat in different parts and improve the efficiency of photovoltaic modules in converting solar energy into electrical energy.

[0032] (2) By setting serpentine microchannels on the back plate and setting fins on the microchannels, the heat exchange area of ​​the back plate can be effectively increased.

[0033] (3) For ground power plants, the combination of microchannel heat dissipation pipes and buried pipes can effectively reduce the temperature of the heat transfer medium and improve the heat exchange effect without using external energy to cool the heat transfer medium.

[0034] (4) For surface power stations, the microchannel heat dissipation pipeline is directly connected to the water body, effectively utilizing the low temperature and large heat capacity characteristics of the water body.

[0035] (5) The coolant in the microchannel is a common liquid such as water, which is suitable for a variety of environments.

[0036] (6) Connect the temperature and flow sensors on the microchannel and backplane to the computer control module. The module can effectively adjust the pump flow to meet the heat dissipation requirements of the photovoltaic module. Attached Figure Description

[0037] Figure 1 This is a flowchart illustrating one embodiment of the present invention.

[0038] Figure 2 This is a layout diagram of one embodiment of the present utility model.

[0039] Figure 3 This is a schematic diagram of a microchannel cross-section according to an embodiment of the present invention.

[0040] Figure 4 This is a schematic diagram of a buried heat dissipation pipe according to an embodiment of the present invention.

[0041] Figure 5 This is a schematic diagram of the cross-section of a buried heat dissipation pipe according to an embodiment of the present invention.

[0042] Among them: 1-backplate, 2-heat dissipation pipe, 3-flow sensor, 4-temperature sensor, 5-microchannel heat dissipation fins, 6-photovoltaic module bracket, 7-buried pipe, 8-heat dissipation fins, 41-left side area, 42-middle area, 43-right side area. Detailed Implementation

[0043] The present invention will be described in detail below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in the embodiments of the present invention can be combined with each other. For ease of description, the terms "upper," "lower," "left," and "right" appearing below only indicate that they correspond to the upper, lower, left, and right directions in the accompanying drawings and do not limit the structure.

[0044] Example 1

[0045] like Figure 1 As shown in the figure, this embodiment proposes an operation process for a flow-adaptive microchannel heat dissipation photovoltaic module. The computer control module collects the temperature and flow rate of the fluid in the microchannel and the temperature of the backplane in real time, and effectively regulates the liquid flow rate in the microchannel by adjusting the pump speed.

[0046] Specifically, when the backplate temperature is greater than 30°C, start the pump; when the temperature difference between the ends of the heat dissipation pipes is greater than 10°C, increase the pump speed and increase the flow rate in the pipes, and keep the temperature difference between the ends of the pipes less than 10°C.

[0047] Example 2

[0048] like Figure 2 and Figure 3 As shown, this embodiment proposes a flow-adaptive microchannel heat dissipation photovoltaic module, with heat dissipation pipes 2 arranged on the backplate 1.

[0049] The heat dissipation pipe 2 is made of a metal material with good thermal conductivity and is arranged in a serpentine pattern with a channel width of 0.5~3mm. The heat dissipation pipe 2 is adhered to the backplate 1 using thermally conductive adhesive. The adhesive should preferably be a material with a thermal conductivity of not less than 1W / m·K and a temperature resistance range between -40℃ and 90℃. The coolant in the heat dissipation pipe 2 can be sourced locally, such as water or a mixture of water and ethylene glycol. Temperature sensors 4 and flow sensors 3 are installed at the inlet and outlet ports of the heat dissipation pipe 2, and temperature sensor 4 is also installed on the backplate 1.

[0050] More specifically, the heat dissipation pipes 2 are designed with zoned density, with the microchannel density at the component edge being higher than that in the center. For example, the edge density is 8-10 channels / cm, and the center density is 4-6 channels / cm. The coverage area of ​​the microchannels on the backplate should not exceed 20%. Figure 3 As shown, the heat dissipation fins 5 are arranged on the outside of the heat dissipation pipes 2, and the fin height should not be less than 5mm.

[0051] Example 3

[0052] like Figure 4 and Figure 5 As shown, this embodiment proposes a microchannel heat dissipation photovoltaic module with adaptive flow rate. The buried heat dissipation circular pipe 7 is connected to the heat dissipation pipeline 2 and is buried in the ground.

[0053] When a photovoltaic power station is built on water, the inlet and outlet of heat dissipation pipe 2 are directly fed into the water. A water pump draws low-temperature water directly from the water body and enters the inlet of heat dissipation pipe 2, where the low-temperature water exchanges heat with the photovoltaic modules. After heat exchange, the water, now at a higher temperature, enters the water body through the outlet of heat dissipation pipe 2. This solution directly utilizes the heat capacity of the water body, providing a convenient and effective way to dissipate heat from the modules.

[0054] When the photovoltaic power station is built on the ground, the outlet of the heat dissipation pipe 2 is connected to the buried pipe 7. The buried pipe 7 is close to the photovoltaic support 6 and penetrates into the soil to a depth of about 1 to 2 meters deeper than the photovoltaic support 6.

[0055] The above embodiments should be understood as being used only to illustrate the present invention more clearly, and not to limit the scope of the present invention. After reading the present invention, any modifications of the embodiments by those skilled in the art in various equivalent forms fall within the scope defined by the appended claims.

Claims

1. A heat-dissipating photovoltaic module, comprising a photovoltaic module and a heat dissipation pipe (2), characterized in that, The photovoltaic module has heat dissipation pipes (2) bonded to its back sheet (1). The channel width of the heat dissipation pipes (2) is 0.5~3mm. The density of the heat dissipation pipes (2) on both sides of the back sheet (1) is higher than the density of the heat dissipation pipes (2) in the middle area of ​​the back sheet (1). The area occupied by the heat dissipation pipes (2) does not exceed 20% of the back sheet (1).

2. The heat dissipation photovoltaic module according to claim 1, characterized in that, The heat dissipation pipe (2) is arranged in a serpentine pattern.

3. The heat dissipation photovoltaic module according to claim 2, characterized in that, The backplate includes a middle region (42), a left region (41) and a right region (43) located on both sides of the middle region and in the X direction. The length of the left region (41) in the X direction is 1 / 4 to 1 / 3 of the length of the backplate in the X direction. The length of the right region (43) in the X direction is 1 / 4 to 1 / 3 of the length of the backplate in the X direction. The density of the heat dissipation pipes (2) in the left region (41) and the right region (43) is 8 to 10 pipes / cm. The density of the heat dissipation pipes (2) in the middle region (42) is 4 to 6 pipes / cm.

4. The heat dissipation photovoltaic module according to claim 1, characterized in that, The heat dissipation pipe (2) is bonded to the back plate (1) with thermally conductive adhesive.

5. The heat-dissipating photovoltaic module according to any one of claims 1-4, characterized in that, The lower end of the heat dissipation pipe (2) is fixedly connected to a fin (5) that is perpendicular to the back plate (1), and the height of the fin (5) is greater than or equal to 5mm.

6. The heat-dissipating photovoltaic module according to any one of claims 1-4, characterized in that, The inlet of the heat dissipation pipe (2) is connected to the outlet of the buried pipe (7), and the outlet of the heat dissipation pipe (2) is connected to the inlet of the buried pipe (7).

7. The heat-dissipating photovoltaic module according to claim 6, characterized in that, The buried pipe (7) is buried in the soil together with the photovoltaic support, and the lowest position of the buried pipe (7) is 1-2m deeper than the photovoltaic support.

8. The heat-dissipating photovoltaic module according to claim 6, characterized in that, The buried pipe (7) is buried in the soil together with the photovoltaic support, and heat exchange fins (8) are arranged around the buried pipe (7).

9. The heat-dissipating photovoltaic module according to claim 6, characterized in that, The outlet of the buried pipe (7) is first connected to the inlet of the water collection tank, and the outlet of the water collection tank is then connected to the inlet of the heat dissipation pipe (2).

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