High-efficiency heat dissipation PCB circuit board structure

Abstract

The utility model discloses a kind of high-efficiency heat dissipation PCB circuit board structure, including PCB circuit board ontology and heat dissipation cover, the top of the PCB circuit board ontology is fixedly connected with the symmetrically arranged pair of support rod, the both sides bottom of the heat dissipation cover is fixedly connected with assembly plate, the assembly plate is equipped with the through hole corresponding with support rod, the top of the heat dissipation is fixedly connected with the symmetrically arranged two installation barrels, two the installation barrel in are equipped with suction fan, the heat dissipation cover is equipped with the symmetrically arranged two traction plate, the side of the traction plate close to heat dissipation cover is fixedly connected with the plug-in rod corresponding with support rod position, the plug-in rod is slidably inserted on heat dissipation cover;The utility model can quickly absorb the heat on PCB circuit board PCB circuit board ontology, greatly improve the heat dissipation effect of PCB circuit board, and heat dissipation assembly dismounting is convenient, and installation cleaning operation is simple.

Description

Technical Field

[0001] This utility model relates to the field of circuit board related products, specifically a high-efficiency heat dissipation PCB circuit board structure. Background Technology

[0002] PCB circuit boards are the supporting structures for the electrical connections of electronic components. They are also called printed circuit boards. PCB circuit boards have evolved from single-layer boards to double-sided boards, multi-layer boards and flexible boards, and are constantly developing towards higher precision, higher density and higher reliability. They are constantly shrinking in size, reducing costs and improving performance, so that PCB circuit boards will continue to maintain strong vitality in the development of future electronic products. During the operation of equipment, PCB circuit boards will generate a certain amount of heat, so heat dissipation components are needed to dissipate the heat.

[0003] However, most existing heat dissipation installations currently use screws for fixing, which is inconvenient to assemble and disassemble on-site due to the limited internal space of the equipment, and has its defects. Utility Model Content

[0004] The purpose of this invention is to provide a high-efficiency heat dissipation PCB circuit board structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat dissipation PCB circuit board structure, comprising a PCB circuit board body and a heat sink, wherein a pair of symmetrically arranged support rods are fixedly connected to the top of the PCB circuit board body, and mounting plates are fixedly connected to the bottom of both sides of the heat sink, wherein the mounting plates are provided with through holes corresponding to the support rods, and two symmetrically arranged mounting cylinders are fixedly connected to the top of the heat sink, wherein each mounting cylinder is equipped with a suction fan, and two symmetrically arranged traction plates are provided inside the heat sink, wherein the side of the traction plate closest to the heat sink is fixedly connected to a support rod. A corresponding insertion rod is provided, which is slidably inserted into the heat sink. A slot corresponding to the insertion rod is provided on the side wall of the support rod. Multiple first springs are fixedly connected between the traction plate and the heat sink. A push plate is fixedly connected to one side of the top of the traction plate. One end of the push plate is slidably inserted into the heat sink. Grooves are provided on both sides of the heat sink. A sliding rod is fixedly connected in the groove. An L-shaped connecting plate is slidably sleeved on the sliding rod. A wedge plate is fixedly connected to the bottom end of the L-shaped connecting plate. A second spring is sleeved on the sliding rod. The two ends of the second spring are fixedly connected to the L-shaped connecting plate and the inner wall of the groove, respectively.

[0006] Preferably, a protective steel mesh is fixedly installed at the top of the mounting cylinder.

[0007] Preferably, a stop sleeve is fixedly sleeved on the support rod.

[0008] Preferably, one end of the push plate is configured with an arc-shaped structure.

[0009] Preferably, the front and rear ends of the heat sink are connected.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] This high-efficiency heat dissipation PCB circuit board structure utilizes an L-shaped connecting plate that slides down a sliding rod, causing a wedge plate to move downwards. The wedge plate then presses against a push plate, which in turn moves a traction plate. This traction plate pulls the insertion rod and the first spring, allowing the mounting plate on the heat sink to be fitted onto the support rod. Releasing the L-shaped connecting plate causes the first spring, now under tension, to return the traction plate to its original position, pushing the insertion rod back into the slot on the support rod to secure the heat sink. A suction fan on the heat sink draws away the high temperatures generated during PCB circuit board operation. This invention rapidly absorbs heat from the PCB circuit board, significantly improving its overall heat dissipation. Furthermore, the heat dissipation components are easy to assemble and disassemble, and the installation and cleaning processes are simple. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a high-efficiency heat dissipation PCB circuit board structure according to the present invention;

[0013] Figure 2 This is an enlarged view of point A of a high-efficiency heat dissipation PCB circuit board structure according to this utility model.

[0014] In the diagram: 1. PCB circuit board body; 2. Heat sink; 3. Support rod; 4. Assembly plate; 5. Mounting cylinder; 6. Suction fan; 7. Traction plate; 8. Insert rod; 9. First spring; 10. Push plate; 11. Slide rod; 12. L-shaped connecting plate; 13. Wedge plate; 14. Second spring; 15. Protective steel mesh; 16. Stop sleeve. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0018] Please see Figure 1-2This utility model provides an embodiment of a high-efficiency heat dissipation PCB circuit board structure, including a PCB circuit board body 1 and a heat sink 2. A pair of symmetrically arranged support rods 3 are fixedly connected to the top of the PCB circuit board body 1. Mounting plates 4 are fixedly connected to the bottom of both sides of the heat sink 2. Mounting plates 4 have through holes corresponding to the support rods 3. Two symmetrically arranged mounting cylinders 5 are fixedly connected to the top of the heat sink 2. Each mounting cylinder 5 contains a suction fan 6. Two symmetrically arranged traction plates 7 are provided inside the heat sink 2. A plug 8 corresponding to the position of the support rod 3 is fixedly connected to the side of the traction plate 7 near the heat sink 2. The plug 8 is slidably inserted into the heat sink 2. Slots corresponding to the plug 8 are provided on the sidewalls of the support rods 3. Multiple first springs 9 are fixedly connected between the traction plate 7 and the heat sink 2. A push plate 10 is fixedly connected to one side of the top of the traction plate 7. One end of the push plate 10 is slidably inserted into the heat sink 2. Both sides of the heat sink 2... A groove is provided, and a slide rod 11 is fixedly connected in the groove. An L-shaped connecting plate 12 is slidably sleeved on the slide rod 11. A wedge plate 13 is fixedly connected to the bottom end of the L-shaped connecting plate 12. A second spring 14 is sleeved on the slide rod 11. The two ends of the second spring 14 are fixedly connected to the L-shaped connecting plate 12 and the inner wall of the groove, respectively. Specifically, pushing down the L-shaped connecting plate 12 causes it to slide on the slide rod 11, thereby causing the wedge plate 13 to move down. At this time, the wedge plate 13 will press against the push plate 10. The push plate 10 will cause the traction plate 7 to move under the push of the wedge plate 13. The traction plate 7 will then pull the insertion rod 8 and the first spring 9, and then the mounting plate 4 on the heat sink 2 will be sleeved on the support rod 3. The L-shaped connecting plate 12 will be released. At this time, the first spring 9, which is in a stretched state, will cause the traction plate 7 to return and push the insertion rod 8 back into the slot on the support rod 3 to realize the installation and fixation of the heat sink 2. The suction fan 6 on the heat sink 2 will work to suck out the high temperature of the PCB circuit board body 1 during operation.

[0019] In this embodiment, a protective steel mesh 15 is fixedly installed at the top of the mounting cylinder 5 to protect the suction fan 6; a stop sleeve 16 is fixedly sleeved on the support rod 3 to support the assembly plate 4; one end of the push plate 10 is set with an arc-shaped structure to reduce the frictional resistance when the wedge plate 13 presses against it; the front and rear ends of the heat dissipation cover 2 are connected.

[0020] The working principle of this high-efficiency heat dissipation PCB circuit board structure is described in detail below: First, the L-shaped connecting plate 12 is pushed down and slides on the slide rod 11, thereby causing the wedge plate 13 to move down. At this time, the wedge plate 13 will press against the push plate 10. Under the push of the wedge plate 13, the push plate 10 causes the traction plate 7 to move. At this time, the traction plate 7 will pull the insertion rod 8 and the first spring 9. Then, the mounting plate 4 on the heat sink 2 is sleeved on the support rod 3. The L-shaped connecting plate 12 is released. At this time, the first spring 9, which is in a stretched state, causes the traction plate 7 to return and push the insertion rod 8 back into the slot on the support rod 3 to realize the installation and fixation of the heat sink 2. The suction fan 6 on the heat sink 2 works to suck out the high temperature of the PCB circuit board body 1 during operation.

[0021] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-efficiency heat dissipation PCB circuit board structure, comprising a PCB circuit board body (1) and a heat sink (2), characterized in that: The top of the PCB circuit board body (1) is fixedly connected to a pair of symmetrically arranged support rods (3), and the heat sink (2) Both sides of the bottom are fixedly connected to an assembly plate (4), and the assembly plate (4) is provided with a through hole corresponding to the support rod (3). The top of the heat sink is fixedly connected to two symmetrically arranged mounting cylinders (5), and each of the two mounting cylinders (5) is equipped with... The suction fan (6) has two symmetrically arranged traction plates (7) inside the heat dissipation shroud (2), and the traction plates (7) are close to the fan. A plug (8) corresponding to the position of the support rod (3) is fixedly connected to one side of the heat sink (2), and the plug (8) slides into the heat sink (2). The support rod (3) is mounted on the heat sink (2), and a slot corresponding to the insertion rod (8) is provided on the side wall of the support rod (3). The traction plate (7) Multiple first springs (9) are fixedly connected between the heat sink (2) and the top of the traction plate (7) are fixed. A push plate (10) is connected, one end of which is slidably inserted into the heat sink (2). The heat sink (2) has... Both sides are provided with grooves, and a slide rod (11) is fixedly connected in the groove. An L-shaped connecting rod is slidably sleeved on the slide rod (11). Connecting plate (12), the bottom end of the L-shaped connecting plate (12) is fixedly connected to a wedge plate (13), and the sliding rod (11) is sleeved with a wedge plate (13). A second spring (14) is provided, and the two ends of the second spring (14) are respectively fixed to the L-shaped connecting plate (12) and the inner wall of the groove. connect.

2. The high-efficiency heat dissipation PCB circuit board structure according to claim 1, characterized in that: A protective steel mesh (15) is fixedly installed at the top of the mounting cylinder (5).

3. The high-efficiency heat dissipation PCB circuit board structure according to claim 1, characterized in that: A stop sleeve (16) is fixedly sleeved on the support rod (3).

4. The high-efficiency heat dissipation PCB circuit board structure according to claim 1, characterized in that: One end of the push plate (10) is arranged in an arc shape.

5. The high-efficiency heat dissipation PCB circuit board structure according to claim 1, characterized in that: The front and rear ends of the heat sink (2) are connected.

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