A production tool for FPC circuit board lamination processing

By designing a process of simultaneous hot pressing and cooling, the problem of hot pressing and cooling delay in FPC circuit board production has been solved, achieving efficient molding and uniform cooling, and improving the quality and production efficiency of the circuit boards.

CN224419027UActive Publication Date: 2026-06-26FOSHAN JINGGUO ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
FOSHAN JINGGUO ELECTRONICS CO LTD
Filing Date
2025-08-07
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing FPC circuit board lamination manufacturing tools have a delay between hot pressing and cooling, resulting in extended production cycles and poor product quality. Thermal stress may cause circuit board deformation or reduced interlayer bonding strength.

Method used

The synchronous hot-pressing and cooling method is adopted. Through the coordinated operation of tooling components and cooling components, hot pressing and cooling are carried out simultaneously. The serpentine heat exchange tube and liquid storage component are structurally designed to ensure timely supply and uniform distribution of coolant.

Benefits of technology

It significantly improves molding efficiency and structural stability, avoids board deformation caused by sudden temperature changes, improves the uniformity of lamination and the dimensional accuracy of circuit boards, and enhances production yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a production frock for FPC circuit board compression processing relates to production frock technical field, including frock assembly, including fixed mesa, the bottom fixed heat exchange spare of fixed mesa, the top fixed limiting piece of fixed mesa, cooling assembly, set up in frock assembly one side, including fixed in fixed mesa bottom's liquid storage spare, the top of liquid storage spare is provided with transmission part, the bottom fixed communication spare of liquid storage spare, the utility model discloses beneficial effect is through the cooling mode of synchronous hot -pressing and the stress balance's cooperation, has improved forming efficiency and structure stability, has solved the problem of heat stress accumulation and cooling lag effectively, has guaranteed the evenness of laminated combination again, avoided the plate deformation caused by temperature sudden change, realized the process synchronization of hot -pressing and cooling simultaneously, has improved the size accuracy and production yield of FPC circuit board greatly.
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