Multilayer circuit board hot melting device

Abstract

The utility model discloses a kind of multilayer circuit board hot melting devices, belong to PCB hot melting technical field, including base, the upper end middle part of base is equipped with multiple-point adjusting type plastic part fixing mechanism;The upper end of base is fixedly installed with positioning plate;Positioning groove for placing multilayer circuit board body is opened on positioning plate;The upper end rear side of base is installed with floating protection type hot melting mechanism;The floating protection type hot melting mechanism includes hot melting machine and separation component;Hot melting machine is fixedly installed in the upper end rear side of base;Separation component is installed in the upper end of base. By the above-mentioned mode, the device can be fixed to different number of different size plastic parts, reduce the additional workload that needs to be frequently designed plastic part placement mold, further improve the practicability of device.

Description

Technical Field

[0001] This utility model relates to the field of PCB hot-melt technology, specifically to a multilayer circuit board hot-melt device. Background Technology

[0002] Circuit board hot melt equipment is a device used for the processing of printed circuit boards (PCBs), which involves the pre-lamination and pressing of multi-layer materials such as PP sheets and core boards.

[0003] In the existing technology, the hot melt machine works by heating the hot melt column on the chip or plastic part with a hot melt rod, so that the hot melt column melts on the circuit board. At this time, the hot melt rod will directly contact the circuit board, which can easily cause the hot melt insertion hole area on the circuit board to be heated and deformed. Furthermore, since multilayer circuit boards have stronger thermal conductivity, they are more likely to be damaged, which is quite inconvenient.

[0004] Based on this, the present invention designs a multilayer circuit board hot-melting device to solve the above problems. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a multilayer circuit board hot-melting device.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A multilayer circuit board hot-melt device includes a base, a multi-point adjustable plastic part fixing mechanism, a multilayer circuit board body, plastic parts, a positioning plate, and a floating protective hot-melt mechanism; a multi-point adjustable plastic part fixing mechanism for adaptive fixing of different numbers and shapes of plastic parts is installed in the middle of the upper end of the base.

[0008] A positioning plate is fixedly installed on the upper end of the base; the positioning plate has a positioning groove for placing the multi-layer circuit board body.

[0009] A floating protective hot melt mechanism for heating the hot melt column of the plastic part is installed on the upper rear side of the base.

[0010] The floating protective hot-melt mechanism includes a hot-melt machine and a partition assembly; the hot-melt machine is fixedly installed on the upper rear side of the base; the partition assembly is installed on the upper end of the base.

[0011] Furthermore, the multi-point adjustable plastic part fixing mechanism includes a placement plate, a rotating disk, a clamping assembly, and a horizontal push cylinder; multiple placement plates are symmetrically fixedly installed on the front and rear sides of the upper end of the base; multiple rotating disks are symmetrically rotated and installed on the front and rear sides of the upper end of the base; multiple clamping assemblies are distributed in a circumferential array at equal intervals on the rotating disks; and the clamping assemblies are connected to the base; the horizontal push cylinder is fixedly installed on the upper end of the base; and the output end of the horizontal push cylinder is connected to the clamping assemblies near the front and rear ends of the base.

[0012] The clamping assembly connected to the horizontal push cylinder is designated as the driving part; all clamping assemblies not connected to the horizontal push cylinder are designated as driven parts.

[0013] Furthermore, the clamping assembly includes a movable rod, an L-shaped clamping plate, a guide rail, and a sliding block;

[0014] The upper end of the rotating disk has multiple arc-shaped grooves; the arc-shaped grooves are evenly distributed in a circular array at equal intervals on the upper end of the rotating disk;

[0015] The guide rail is fixedly installed on the upper end of the base; the sliding block is slidably connected to the guide rail; the upper end of the sliding block is fixedly connected to the long side end of the guide rail; and a movable rod is fixedly installed on the long side end of the guide rail; the movable rod is slidably connected to the arc-shaped slide groove.

[0016] Furthermore, the horizontal push cylinder is fixedly connected to the L-shaped clamp of the drive unit;

[0017] Furthermore, the placement plate has multiple clearance slots; the clearance slots are arranged in a rectangular array at the upper end of the placement plate.

[0018] Furthermore, the partition assembly includes a cover plate, a vertical guide rod, and a vertical push cylinder; the vertical push cylinder is fixedly installed at the lower end of the base; the output end of the vertical push cylinder is fixedly connected to the cover plate; the vertical guide rod is fixedly installed at the lower end of the cover plate; and the vertical guide rod is slidably connected to the upper end of the base.

[0019] Furthermore, the cover plate is provided with multiple trapezoidal hot-melt insertion holes corresponding to the hot-melt pillars;

[0020] Furthermore, the inner diameter of the upper side of the trapezoidal hot melt socket is larger than the outer diameter of the hot melt rod at the movable end of the hot melt machine; the inner diameter of the lower side of the trapezoidal hot melt socket is smaller than the outer diameter of the hot melt rod at the movable end of the hot melt machine.

[0021] Compared with the prior art, the advantages of this utility model are as follows: 1. The separator works in contact with the upper end of the multilayer circuit board body, and at this time the hot melt column of the plastic part is located inside the separator; then the hot melt machine moves downward toward the multilayer circuit board body. During the movement, the hot melt rod on the hot melt machine will be inserted into the separator and perform hot melt operation on the hot melt column inside the separator. The hot melt column after hot melt will flow along the separator to the upper end of the multilayer circuit board body, realizing the fixation of the multilayer circuit board body and the plastic part. Then the hot melt rod of the hot melt machine will be blocked by the bottom of the separator to avoid direct contact with the multilayer circuit board body, reducing the probability of deformation when the multilayer circuit board body is heated, improving the quality of hot melt of the multilayer circuit board body, and improving the practicality of the device;

[0022] 2. Through the cooperation of the placement plate, rotating disk, clamping components and horizontal push cylinder, the device can fix plastic parts of different quantities and sizes, reducing the extra workload of frequently designing plastic part placement molds and further improving the practicality of the device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a perspective view of a multilayer circuit board hot-melt device according to the present invention;

[0025] Figure 2 This is a front view of a multilayer circuit board hot-melt device according to the present invention;

[0026] Figure 3 For along Figure 2 A three-dimensional image with a portion removed along the AA direction;

[0027] Figure 4 for Figure 3 Magnification at point B;

[0028] Figure 5 for Figure 1 Enlarged view of point C in the middle;

[0029] Figure 6 This is a perspective view of a multilayer circuit board hot-melt device of the present invention, with a portion of the front cut away.

[0030] Figure 7 This is a cross-sectional view of the multilayer circuit board body, plastic parts, and cover plate being bonded together.

[0031] The labels in the diagram represent:

[0032] 1. Base; 2. Multi-point adjustable plastic part fixing mechanism; 21. Placement plate; 211. Leaving groove; 22. Rotating disk; 23. Arc-shaped slide groove; 24. Movable rod; 25. L-shaped clamp; 26. Guide rail; 27. Sliding block; 28. Horizontal push cylinder; 3. Multi-layer circuit board body; 31. Hot melt insertion hole; 4. Plastic part; 41. Hot melt column; 5. Positioning plate; 51. Positioning groove; 6. Floating protective hot melt mechanism; 61. Hot melt machine; 63. Cover plate; 64. Trapezoidal hot melt insertion hole; 65. Vertical guide rod; 66. Vertical push cylinder; 7. Rotary downward pressure cylinder. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0034] The terms "left," "right," "front," "back," "up," and "down" used in the following description refer to the orientation from the perspective of the front view.

[0035] In some embodiments, please refer to the accompanying drawings. Figures 1-7 A multilayer circuit board hot-melt device includes a base 1, a multi-point adjustable plastic part fixing mechanism 2, a multilayer circuit board body 3, plastic parts 4, a positioning plate 5, a floating protective hot-melt mechanism 6, and a rotary pressing cylinder 7; the upper middle part of the base 1 is equipped with a multi-point adjustable plastic part fixing mechanism 2 for adaptive fixing of different numbers and shapes of plastic parts 4.

[0036] like Figure 1 As shown, the multi-point adjustable plastic part fixing mechanism 2 includes a placement plate 21, a rotating disk 22, clamping components, and a horizontal push cylinder 28; multiple placement plates 21 are symmetrically fixedly installed on the front and rear sides of the upper end of the base 1; multiple rotating disks 22 are symmetrically rotated and installed on the front and rear sides of the upper end of the base 1; multiple clamping components are distributed in a circumferential array at equal intervals on the rotating disks 22; and the clamping components are connected to the base 1; the horizontal push cylinder 28 is fixedly installed on the upper end of the base 1; and the output end of the horizontal push cylinder 28 is connected to the clamping components near the front and rear ends of the base 1.

[0037] The clamping assembly connected to the horizontal push cylinder 28 is configured as a driving part; all clamping assemblies not connected to the horizontal push cylinder 28 are configured as driven parts.

[0038] A positioning plate 5 is fixedly installed on the upper end of the base 1; the positioning plate 5 has a positioning groove 51 for placing the multilayer circuit board body 3.

[0039] A floating protective hot melt mechanism 6 for heating the hot melt column 41 of the plastic part 4 is installed on the upper rear side of the base 1.

[0040] The floating protective hot melt mechanism 6 includes a hot melt machine 61 and a partition assembly; the hot melt machine 61 is fixedly installed on the upper rear side of the base 1; the partition assembly is installed on the upper end of the base 1.

[0041] The upper left and right sides of the base 1 are symmetrically fixed with rotary pressing cylinders 7 for fixing the multilayer circuit board body 3 and the positioning plate 5.

[0042] In this utility model, the operator places the plastic parts 4 on the upper end of the corresponding placement plate 21 according to the quantity and position of the plastic parts 4 to be installed on the multilayer circuit board body 3 in the current batch.

[0043] Then, the horizontal push cylinder 28 at the corresponding position is activated. The horizontal push cylinder 28 then drives the clamping component of the drive unit to move. The clamping component will then drive the rotating disk 22 to rotate. The rotation of the rotating disk 22 will then drive the clamping components of the other multiple driven parts to move synchronously until the multiple clamping components are pressed against the side end of the plastic part 4, thereby fixing the plastic part 4.

[0044] Then, the multilayer circuit board body 3 is placed into the positioning groove 51, and at this time, the hot melt insertion hole 31 of the multilayer circuit board body 3 is aligned and inserted with the hot melt column 41 of the plastic part 4; then, the rotating pressing cylinder 7 works to fix the multilayer circuit board body 3 and the positioning plate 5.

[0045] Subsequently, the separating component contacts the upper end of the multilayer circuit board body 3, and at this time, the hot melt column 41 of the plastic part 4 is located inside the separating component; then the hot melt machine 61 moves downward toward the multilayer circuit board body 3. During the movement, the hot melt rod on the hot melt machine 61 will be inserted into the separating component and perform hot melt operation on the hot melt column 41 inside the separating component. The hot melt column 41 after hot melt will flow along the separating component to the upper end of the multilayer circuit board body 3, thereby fixing the multilayer circuit board body 3 and the plastic part 4. Then the hot melt rod of the hot melt machine 61 will be blocked by the lower part of the separating component to avoid direct contact with the multilayer circuit board body 3, reduce the probability of deformation of the multilayer circuit board body 3 when heated, improve the quality of hot melt of the multilayer circuit board body 3, and improve the practicality of the device.

[0046] By cooperating with the placement plate 21, rotating disk 22, clamping assembly and horizontal push cylinder 28, the device can fix different numbers and sizes of plastic parts 4, reducing the extra workload of frequently designing molds for placing plastic parts 4, and further improving the practicality of the device.

[0047] like Figure 4 As shown, the clamping assembly includes a movable rod 24, an L-shaped clamping plate 25, a guide rail 26, and a sliding block 27;

[0048] The upper end of the rotating disk 22 is provided with multiple arc-shaped grooves 23; the arc-shaped grooves 23 are evenly distributed in a circular array at equal intervals on the upper end of the rotating disk 22.

[0049] The guide rail 26 is fixedly installed on the upper end of the base 1; the sliding block 27 is limited and slidably connected to the guide rail 26; the upper end of the sliding block 27 is fixedly connected to the long side end of the guide rail 26; and a movable rod 24 is fixedly installed on the long side end of the guide rail 26; the movable rod 24 is limited and slidably connected to the arc-shaped slide groove 23.

[0050] The placement plate 21 has multiple clearance slots 211; the clearance slots 211 are arranged in a rectangular array at the upper end of the placement plate 21.

[0051] The horizontal push cylinder 28 is fixedly connected to the L-shaped clamping plate 25 of the drive unit;

[0052] In this utility model, the operator places the plastic parts 4 on the upper end of the corresponding placement plate 21 according to the quantity and position of the plastic parts 4 to be installed on the multilayer circuit board body 3 in the current batch.

[0053] Then, the horizontal push cylinder 28 at the corresponding position is activated. The operation of the horizontal push cylinder 28 drives the L-shaped clamp 25 of the drive unit to move along the guide rail 26 following the sliding block 27. The movement of the L-shaped clamp 25 drives the movable rod 24 to move. The movement of the movable rod 24 of the drive unit will drive the rotating disk 22 to rotate through the arc-shaped slide groove 23. The rotation of the rotating disk 22 will drive the multiple movable rods 24 of the driven unit to slide along the corresponding arc-shaped slide groove 23, so that the L-shaped clamp 25 of the driven unit moves along the guide rail 26 following the sliding block 27 until the four sides of the plastic part 4 are pressed against the short side end of the L-shaped clamp 25; thus completing the fixation of the plastic part 4.

[0054] Then the multilayer circuit board body 3 is placed into the positioning groove 51, and at this time the hot melt insertion hole 31 of the multilayer circuit board body 3 is aligned and inserted with the hot melt pillar 41 of the plastic part 4.

[0055] like Figure 5 , Figure 6 and Figure 7As shown, the partition assembly includes a cover plate 63, a vertical guide rod 65, and a vertical push cylinder 66; the vertical push cylinder 66 is fixedly installed at the lower end of the base 1; the output end of the vertical push cylinder 66 is fixedly connected to the cover plate 63; the vertical guide rod 65 is fixedly installed at the lower end of the cover plate 63; and the vertical guide rod 65 is slidably connected to the upper end of the base 1.

[0056] The cover plate 63 has multiple trapezoidal hot-melt insertion holes 64 corresponding to the hot-melt column 41;

[0057] The inner diameter of the trapezoidal hot melt socket 64 on the upper side is larger than the outer diameter of the hot melt rod at the movable end of the hot melt machine 61; the inner diameter of the trapezoidal hot melt socket 64 on the lower side is smaller than the outer diameter of the hot melt rod at the movable end of the hot melt machine 61.

[0058] The cover plate 63 has symmetrical slots on its left and right sides to avoid the rotating downward cylinder 7.

[0059] In this utility model, after the hot melt insertion hole 31 of the multilayer circuit board body 3 and the hot melt column 41 of the plastic part 4 are inserted, the vertical push cylinder 66 works to pull the cover plate 63 to move downward with the vertical guide rod 65 until the lower end of the cover plate 63 contacts the upper end of the multilayer circuit board body 3, and the hot melt column 41 that extends beyond the upper end of the hot melt insertion hole 31 will extend into the trapezoidal hot melt insertion hole 64.

[0060] Subsequently, the hot melt machine 61 moves downward toward the multilayer circuit board body 3. During the movement, the hot melt rod on the hot melt machine 61 is inserted into the trapezoidal hot melt socket 64 and performs hot melt operation on the hot melt column 41 in the trapezoidal hot melt socket 64. The hot melted hot melt column 41 then flows downward along the trapezoidal hot melt socket 64 to the upper end of the multilayer circuit board body 3, thereby fixing the multilayer circuit board body 3 to the plastic part 4. Then, the hot melt rod of the hot melt machine 61 is blocked by the lower side of the trapezoidal hot melt socket 64, avoiding direct contact with the multilayer circuit board body 3 and reducing the probability of deformation of the multilayer circuit board body 3 when heated.

[0061] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A multilayer circuit board hot-melt device, comprising a base (1), characterized in that: It also includes a multi-point adjustable plastic part fixing mechanism (2), a multi-layer circuit board body (3), plastic parts (4), a positioning plate (5) and a floating protective hot melt mechanism (6); the upper middle part of the base (1) is equipped with a multi-point adjustable plastic part fixing mechanism (2) for adaptive fixing of different numbers and shapes of plastic parts (4). A positioning plate (5) is fixedly installed on the upper end of the base (1); a positioning groove (51) for placing the multilayer circuit board body (3) is provided on the positioning plate (5). A floating protective hot melt mechanism (6) for heating the hot melt column (41) of the plastic part (4) is installed on the upper rear side of the base (1). The floating protective hot melt mechanism (6) includes a hot melt machine (61) and a separation component; the hot melt machine (61) is fixedly installed on the upper rear side of the base (1); the separation component is installed on the upper end of the base (1).

2. The multilayer circuit board hot-melt device according to claim 1, characterized in that, The multi-point adjustable plastic part fixing mechanism (2) includes a placement plate (21), a rotating disk (22), a clamping assembly, and a horizontal push cylinder (28); multiple placement plates (21) are symmetrically fixedly installed on the front and rear sides of the upper end of the base (1); multiple rotating disks (22) are symmetrically rotated and installed on the front and rear sides of the upper end of the base (1); multiple clamping assemblies are distributed in a circular array at equal intervals on the rotating disks (22); and the clamping assemblies are connected to the base (1); the horizontal push cylinder (28) is fixedly installed on the upper end of the base (1); and the output end of the horizontal push cylinder (28) is connected to the clamping assemblies near the front and rear ends of the base (1); The clamping assembly connected to the horizontal push cylinder (28) is set as the driving part; the clamping assemblies not connected to the horizontal push cylinder (28) are all set as driven parts.

3. The multilayer circuit board hot-melt device according to claim 2, characterized in that, The clamping assembly includes a movable rod (24), an L-shaped clamping plate (25), a guide rail (26), and a sliding block (27); Multiple arc-shaped grooves (23) are provided at the upper end of the rotating disk (22); the arc-shaped grooves (23) are evenly distributed in a circular array at equal intervals at the upper end of the rotating disk (22); The guide rail (26) is fixedly installed on the upper end of the base (1); the sliding block (27) is limited and slidably connected to the guide rail (26); the upper end of the sliding block (27) is fixedly connected to the long side end of the guide rail (26); and a movable rod (24) is fixedly installed on the long side end of the guide rail (26); the movable rod (24) is limited and slidably connected to the arc-shaped slide groove (23).

4. The multilayer circuit board hot-melt device according to claim 3, characterized in that, The horizontal push cylinder (28) is fixedly connected to the L-shaped clamp (25) of the drive unit.

5. The multilayer circuit board hot-melt device according to claim 3, characterized in that, Multiple clearance slots (211) are provided on the placement plate (21); the clearance slots (211) are arranged in a rectangular array at the upper end of the placement plate (21).

6. The multilayer circuit board hot-melt device according to claim 3, characterized in that, The separation assembly includes a cover plate (63), a vertical guide rod (65), and a vertical push cylinder (66); the vertical push cylinder (66) is fixedly installed at the lower end of the base (1); the output end of the vertical push cylinder (66) is fixedly connected to the cover plate (63); the vertical guide rod (65) is fixedly installed at the lower end of the cover plate (63); and the vertical guide rod (65) is slidably connected to the upper end of the base (1).

7. The multilayer circuit board hot-melt device according to claim 6, characterized in that, The cover plate (63) has multiple trapezoidal hot-melt insertion holes (64) corresponding to the hot-melt column (41).

8. The multilayer circuit board hot-melt device according to claim 7, characterized in that, The inner diameter of the upper side of the trapezoidal hot melt socket (64) is larger than the outer diameter of the hot melt rod at the movable end of the hot melt machine (61); the inner diameter of the lower side of the trapezoidal hot melt socket (64) is smaller than the outer diameter of the hot melt rod at the movable end of the hot melt machine (61).

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