Wafer pick-and-place device

Abstract

The utility model belongs to wafer technical field discloses a kind of wafer taking and placing device, for taking and placing wafer body, wafer taking and placing device includes bottom plate, multiple suction pieces and protection component, and the side of bottom plate is connected with mechanical arm;Multiple suction pieces are circumferentially spaced apart and set on the side of bottom plate deviating from mechanical arm, for suction wafer body;Protection component includes driving element, connecting piece and hook claw, driving element is set to bottom plate, connecting piece is connected with the output end of driving element, hook claw is connected with connecting piece, wafer taking and placing device has power-on state and power-off state, when wafer taking and placing device is in power-on state, hook claw is optionally opened and set, when wafer taking and placing device is in power-off state, hook claw is closed and set, to make hook claw optionally and wafer body jointing. Hook claw can be closed and jointed with wafer body without the power of driving element, avoid wafer body to drop, driving element can drive hook claw to close or open after power recovery, improve the reliability of wafer taking and placing device.

Images