Semiconductor plastic sealing mold with adjustable plastic sealing thickness

Abstract

The utility model discloses a kind of semiconductor plastic package moulds of plastic package thickness adjustable, including upper die and lower die, upper die includes fixed cover plate, frame located at the both ends of fixed cover plate and plastic package part located at the bottom of fixed cover plate, one or more adjusting mechanisms are provided in fixed cover plate, one adjusting mechanism includes pull rod assembly, wedge block assembly and multiple elastic limiting components, plastic package part is below wedge block assembly, elastic limiting component is used to connect wedge block assembly with plastic package part, the length direction of elastic limiting component is perpendicular to the length direction of wedge block assembly;Wedge block assembly includes mutually matched wedge gasket and wedge adjusting plate, one end of wedge adjusting plate is connected with one end of pull rod assembly, pull rod assembly is used to drive wedge adjusting plate to move relative to wedge gasket.The semiconductor plastic package mould of the utility model does not need to be all disassembled to whole plastic package mould, the purpose of adjusting plastic package product thickness can be realized, it is simple and quick to operate, can effectively improve work efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor injection molding technology, specifically relating to a semiconductor molding die with adjustable molding thickness. Background Technology

[0002] If existing board-level semiconductor molding dies (such as BGA, QFN, etc.) need to produce products of the same specifications but different molding thicknesses, the only way to change the molding thickness is to completely disassemble the mold, replace the corresponding pad parts, and reassemble them before production. However, completely disassembling the mold takes a long time and the disassembly operation is cumbersome and complicated.

[0003] Existing technologies also employ other methods to adjust the molding thickness, such as adjusting the molding area thickness via a motor drive within the equipment. However, these methods involve complex internal structures, high costs, and low practical application value. Another method involves replacing the backing plate within the mold, but this is also complex, time-consuming, and requires removing the mold from the machine, impacting production efficiency. Utility Model Content

[0004] In view of this, in order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide an improved semiconductor molding die with adjustable molding thickness, which can quickly and easily adjust the thickness of the molded product on the equipment without disassembling the die, and is simple to operate and highly efficient.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor molding die with adjustable molding thickness includes an upper die and a lower die. The upper die includes a fixed cover plate, frame edges at both ends of the fixed cover plate, and a molding portion at the bottom of the fixed cover plate. One or more adjustment mechanisms are provided in the fixed cover plate. One adjustment mechanism includes a pull rod assembly, a wedge block assembly, and multiple elastic limiting assemblies. The molding portion is located below the wedge block assembly. The elastic limiting assemblies are used to connect the wedge block assembly and the molding portion. The length direction of the elastic limiting assemblies is perpendicular to the length direction of the wedge block assembly. The molding portion includes a first flow channel plate and second flow channel plates symmetrically arranged on both sides of the first flow channel plate. Each second flow channel plate has a through hole in the middle for the molding plate to pass through. A pad is also fixedly provided on the top surface of each molding plate.

[0007] The wedge block assembly includes a wedge pad and a wedge adjusting plate that cooperate with each other. One end of the wedge adjusting plate is connected to one end of the pull rod assembly, and the pull rod assembly is used to drive the wedge adjusting plate to move relative to the wedge pad.

[0008] According to some preferred embodiments of the present invention, the fixed cover plate has a first receiving groove for accommodating the wedge block assembly, the depth of the first receiving groove is less than the thickness of the fixed cover plate, the wedge adjusting plate is located above the wedge pad, the top surface of the wedge adjusting plate is always in contact with the top surface of the first receiving groove, the length of the wedge adjusting plate is less than the length of the wedge pad, the width of the wedge adjusting plate is equal to the width of the wedge pad, and the bottom surface of the wedge adjusting plate is in contact with the top surface of the wedge pad.

[0009] According to some preferred embodiments of this utility model, the bottom surface of the wedge-shaped adjusting plate and the top surface of the wedge-shaped pad are both inclined surfaces. Both the bottom surface of the wedge-shaped adjusting plate and the top surface of the wedge-shaped pad are inclined upwards from one end near the tie rod assembly to the other end. The acute angle between the bottom surface of the wedge-shaped adjusting plate and the horizontal plane is equal to the acute angle between the top surface of the wedge-shaped pad and the horizontal plane. The height of the wedge-shaped adjusting plate gradually decreases from one end near the tie rod assembly to the other end, while the height of the wedge-shaped pad gradually increases from one end near the tie rod assembly to the other end. This arrangement ensures a proper match between the wedge-shaped adjusting plate and the wedge-shaped pad.

[0010] According to some preferred embodiments of the present invention, the wedge-shaped adjusting plate is provided with a plurality of waist-shaped holes that penetrate its thickness direction, and the waist-shaped holes are provided in a one-to-one correspondence with the elastic limiting components, and the length direction of the waist-shaped holes is parallel to the length direction of the wedge-shaped adjusting plate.

[0011] According to some preferred embodiments of the present invention, each of the elastic limiting components includes a limiting post, a first bolt, an elastic element, and a washer. The screw of the first bolt passes through the interior of the washer and the limiting post. The bottom of the first bolt is fixedly connected to the top of the plastic seal. The limiting post passes through the thickness direction of the fixed cover plate and the wedge block assembly. The top of the first bolt is located above the top surface of the fixed cover plate. The elastic element is sleeved on the upper end of the outer periphery of the limiting post.

[0012] According to some preferred embodiments of the present invention, each of the limiting posts is located in a corresponding oblong hole. The length of the first bolt is greater than the length of the limiting post. The outer diameter of the gasket is greater than the outer diameter of the limiting post and the outer diameter of the head of the first bolt. The inner diameter of the gasket is smaller than the outer diameter of the head of the first bolt and the inner diameter of the limiting post. The top surface of the gasket is in contact with the bottom surface of the head of the first bolt, and the bottom surface of the gasket is in contact with the top surface of the limiting post. The bottom surface of the limiting post is in contact with the top surface of the plastic seal. In some embodiments of the present invention, there is a gap between the top surface of the limiting post and the bottom surface of the head of the first bolt, and the gasket is clamped in this gap, thereby ensuring that the limiting post is pressed against the bottom surface of the gasket and the top surface of the plastic seal. In addition, the oblong hole opened on the wedge-shaped adjusting plate can ensure that the limiting post and the first bolt will not affect the movement of the wedge-shaped adjusting plate when the pull rod assembly drives it. Furthermore, when the pull rod assembly moves the wedge-shaped adjustment plate back and forth, due to the action of the elastic limiting component, the wedge-shaped block assembly, as well as the pad and the entire encapsulation plate in the encapsulation part, will move up or down in the vertical direction with the expansion and contraction of the elastic element, thereby changing the thickness of the encapsulation area on the bottom surface of the encapsulation part, so as to adjust the thickness of the encapsulated product.

[0013] According to some preferred embodiments of the present invention, the fixed cover plate has a plurality of grooves formed from its top surface downwards. The depth of the grooves is less than the thickness of the fixed cover plate. The grooves are arranged in a one-to-one correspondence with the elastic limiting components. Each groove is used to accommodate at least a part of an elastic element. The diameter of the groove is greater than the outer diameter of the gasket. One end of the elastic element abuts against the bottom surface of the gasket, and the other end of the elastic element abuts against the bottom surface of the groove. The elastic element is in a compressed state.

[0014] According to some preferred embodiments of the present invention, one end of the fixed cover plate is provided with a through groove corresponding to the pull rod assembly, one of the through grooves is connected to a first receiving groove, and one of the through grooves is used for a pull rod assembly to pass through; each pull rod assembly includes a fixed block, an adjusting block, a pull rod and a second bolt, the fixed block is fixedly connected to the adjusting block and the fixed block is located on the side of the adjusting block away from the wedge block assembly.

[0015] According to some preferred embodiments of the present invention, the length direction of the pull rod is parallel to the length direction of the second bolt and the wedge block assembly, the length of the second bolt is greater than the length of the pull rod, the second bolt passes through the interior of the pull rod and one end of the second bolt is threadedly connected to one end of the wedge adjusting plate.

[0016] According to some preferred embodiments of the present invention, the pull rod includes a rod portion and a limiting end portion connected together. The limiting end portion is located at the end of the rod portion away from the wedge block assembly. The outer diameter of the rod portion is smaller than the outer diameter of the limiting end portion. The rod portion extends through the thickness direction of the adjusting block. The fixed block has a second receiving groove for accommodating the limiting end portion at the end near the adjusting block. The end of the rod portion away from the adjusting block abuts against one end of the wedge adjusting plate. The end of the limiting end portion near the rod portion abuts against the side of the adjusting block near the fixed block. In some embodiments of this utility model, the adjustment amount of the encapsulation thickness of the encapsulated product is related to the thickness of the adjusting block. Specifically, the movement of the wedge adjusting plate relative to the wedge pad is pulled by the tightening force when tightening the second bolt. According to the formula H=L×tanα (H is the thickness change of the encapsulated product; L is the thickness change of the adjusting block, which is also the distance the wedge adjusting plate moves relative to the wedge pad; α is the angle between the bottom surface of the wedge adjusting plate and the horizontal plane), it can be concluded that during the encapsulation process, the thickness change of the encapsulated product can be adjusted by changing the adjusting block of different thicknesses, thereby changing the thickness of the encapsulated product.

[0017] By adopting the above technical solution, compared with the prior art, the semiconductor molding die with adjustable molding thickness of this utility model, through the setting of an adjustment mechanism in the fixed cover plate and its interaction with the molding part, uses the pull rod assembly in the adjustment mechanism to drive the wedge adjustment plate in the wedge block assembly to move horizontally, so as to create a change in the gap between the wedge adjustment plate and the wedge pad. Then, under the action of the elastic limiting assembly, it drives the entire wedge block assembly to move vertically upward or downward, thereby changing the thickness of the molding cavity in the molding part used to form the molding product, thus adjusting the thickness of the molding product. It does not require disassembling the entire molding die, can quickly adjust the thickness of the molding product, is simple to operate, and can effectively improve work efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional structural diagram of the semiconductor encapsulation mold in a preferred embodiment of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of the fixed cover plate from a first perspective in a preferred embodiment of the present invention;

[0021] Figure 3This is a three-dimensional structural diagram of the fixed cover plate from a second perspective in a preferred embodiment of the present invention;

[0022] Figure 4 This is a three-dimensional structural diagram of the upper mold hidden portion in a preferred embodiment of the present invention;

[0023] Figure 5 This is an exploded view of the tie rod assembly in a preferred embodiment of the present invention;

[0024] Figure 6 This is a top view of the upper mold in a preferred embodiment of the present invention;

[0025] Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure along the AA direction;

[0026] Figure 8 for Figure 6 A schematic diagram of the cross-sectional structure along the BB direction;

[0027] Figure 9 for Figure 6 A schematic diagram of the cross-sectional structure along the CC direction;

[0028] Figure 10 In the preferred embodiment of this utility model, Figure 8 A cross-sectional view of the structure after the tie rod assembly (with a thinner adjusting block) moves the wedge block assembly to the left;

[0029] The attached figures are labeled as follows:

[0030] Upper mold-10, lower mold-20, fixed cover plate-1, first receiving groove-11, groove-12, through groove-13, frame-2, sealing part-3, first flow channel plate-31, second flow channel plate-32, sealing plate-33, pad-34, pull rod assembly-4, fixed block-41, second receiving groove-411, adjusting block-42, rod part-431, limiting end-432, second bolt-44, wedge-shaped pad-51, wedge-shaped adjusting plate-52, waist-shaped hole-521, elastic limiting assembly-6, limiting post-61, first bolt-62, elastic element-63, gasket-64. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0032] Reference Figures 1 to 10 This embodiment provides a semiconductor molding die with adjustable molding thickness, including an upper die 10 and a lower die 20. The upper die 10 includes a fixed cover plate 1, frame edges 2 located at both ends of the fixed cover plate 1, a molding part 3 located at the bottom of the fixed cover plate 1, and one or more adjustment mechanisms disposed in the fixed cover plate 1. The two ends of the bottom of the molding part 3 are located between the two frame edges 2. The lower die 20 has a molding groove for holding resin opened from its top surface downwards to cooperate with the molding part 3 of the upper die 10, thereby injection molding to form a molded product.

[0033] Furthermore, such as Figure 9 As shown, the molding section 3 includes a first flow channel plate 31 and two second flow channel plates 32 symmetrically arranged on both sides of the first flow channel plate 31. Each second flow channel plate 32 has a through hole in the middle for the molding plate 33 to pass through. A pad 34 is also fixedly disposed on the top surface of each molding plate 33. The first flow channel plate 31 and the two second flow channel plates 32 are located between the two frame plates 2 and are fixed between the two frame plates 2. The pad 34 and the molding plate 33 as a whole can move up and down in the vertical direction relative to the second flow channel plate 32.

[0034] Furthermore, the fixed cover plate 1 in this embodiment is provided with two adjustment mechanisms. Each adjustment mechanism includes a pull rod assembly 4, a wedge block assembly and multiple elastic limiting components 6. The plastic sealing part 3 is located below the wedge block assembly. The elastic limiting component 6 is used to connect the wedge block assembly and the plastic sealing part 3, and the length direction of the elastic limiting component 6 is perpendicular to the length direction of the wedge block assembly.

[0035] like Figure 2 and Figure 3 As shown, the fixed cover plate 1 has a first receiving groove 11 for accommodating the wedge block assembly with its bottom surface facing upwards. The depth of the first receiving groove 11 is less than the thickness of the fixed cover plate 1. The fixed cover plate 1 also has a plurality of grooves 12 with its top surface facing downwards. The depth of the grooves 12 is less than the thickness of the fixed cover plate 1. The grooves 12 are arranged one-to-one with the elastic limiting components 6. The fixed cover plate 1 has a through groove 13 corresponding to the pull rod assembly 4 at one end. The through grooves 13 are arranged one-to-one with the pull rod assembly 4, and one through groove 13 is connected to one first receiving groove 11. One through groove 13 is used for one pull rod assembly 4 to pass through.

[0036] Specifically, such as Figure 4 As shown, the wedge block assembly includes a wedge-shaped pad 51 and a wedge-shaped adjusting plate 52 that cooperate with each other. One end of the wedge-shaped adjusting plate 52 is connected to one end of the pull rod assembly 4. The wedge-shaped adjusting plate 52 is located above the wedge-shaped pad 51, and the pad block 34 is fixedly connected to the wedge-shaped pad 51. The top surface of the wedge-shaped adjusting plate 52 is always in contact with the top surface of the first receiving groove 11. The length of the wedge-shaped adjusting plate 52 is less than the length of the wedge-shaped pad 51 to ensure that the wedge-shaped adjusting plate 52 can move back and forth relative to the wedge-shaped pad 51, and the width of the wedge-shaped adjusting plate 52 is equal to the width of the wedge-shaped pad 51.

[0037] The bottom surface of the wedge-shaped adjusting plate 52 is in contact with the top surface of the wedge-shaped pad 51. Both the bottom surface of the wedge-shaped adjusting plate 52 and the top surface of the wedge-shaped pad 51 are inclined surfaces. Both the bottom surface of the wedge-shaped adjusting plate 52 and the top surface of the wedge-shaped pad 51 are inclined upwards from one end near the tie rod assembly 4 to the other end. The acute angle between the bottom surface of the wedge-shaped adjusting plate 52 and the horizontal plane is equal to the acute angle between the top surface of the wedge-shaped pad 51 and the horizontal plane. The height of the wedge-shaped adjusting plate 52 gradually decreases from one end near the tie rod assembly 4 to the other end, while the height of the wedge-shaped pad 51 gradually increases from one end near the tie rod assembly 4 to the other end. This arrangement ensures that the wedge-shaped adjusting plate 52 and the wedge-shaped pad 51 are matched, preventing the entire wedge block assembly from tilting.

[0038] Furthermore, the pull rod assembly 4 is used to drive the wedge-shaped adjusting plate 52 to move relative to the wedge-shaped pad 51, such as... Figure 4 and Figure 5 As shown, each pull rod assembly 4 includes a fixing block 41, an adjusting block 42, a pull rod, and a second bolt 44. The fixing block 41 is fixedly connected to the adjusting block 42, and the fixing block 41 is located on the side of the adjusting block 42 away from the wedge block assembly. The length direction of the pull rod is parallel to the length direction of the second bolt 44 and the wedge block assembly. The length of the second bolt 44 is greater than the length of the pull rod. The second bolt 44 passes through the interior of the pull rod, and one end of the second bolt 44 is threadedly connected to one end of the wedge adjusting plate 52. By rotating the second bolt 44, the wedge adjusting plate 52 can be moved back and forth relative to the wedge pad 51. At the same time, the second bolt 44 can also pass through the fixing block 41 to ensure that the second bolt 44 can be loosened or tightened at the through groove 13 at one end of the fixing cover plate 1, and the entire pull rod assembly 4 can be disassembled.

[0039] Specifically, such as Figure 5As shown, the pull rod includes a connected rod portion 431 and a limiting end 432. The limiting end 432 is located at the end of the rod portion 431 away from the wedge block assembly. The outer diameter of the rod portion 431 is smaller than the outer diameter of the limiting end 432. A second receiving groove 411 for accommodating the limiting end 432 is provided at the end of the fixing block 41 near the adjusting block 42. The end of the limiting end 432 near the rod portion 431 abuts against the side of the adjusting block 42 near the fixing block 41. The rod portion 431 extends through the thickness direction of the adjusting block 42, and the end of the rod portion 431 away from the adjusting block 42 abuts against the end of the wedge-shaped adjusting plate 52, ensuring that the second bolt 44 inside the pull rod is tightened in place, thereby ensuring that the wedge-shaped adjusting plate 52 moves into position. During the encapsulation process, the thickness variation of the encapsulated product can be adjusted by replacing the adjusting block 42 of different thicknesses, thereby changing the thickness of the encapsulated product.

[0040] Furthermore, the wedge-shaped adjusting plate 52 has multiple oblong holes 521 extending through its thickness direction. Each oblong hole 521 corresponds to one of the elastic limiting components 6, and the length direction of the oblong holes 521 is parallel to the length direction of the wedge-shaped adjusting plate 52. For example... Figures 6 to 10 As shown, each elastic limiting component 6 includes a limiting post 61, a first bolt 62, an elastic element 63, and a washer 64. The screw of the first bolt 62 passes through the interior of the washer 64 and the limiting post 61. Each limiting post 61 is located in a corresponding oblong hole 521, ensuring that the limiting post 61 and the first bolt 62 will not affect the movement of the wedge-shaped adjusting plate 52 when the pull rod assembly 4 moves it. The bottom of the first bolt 62 is fixedly connected to the pad 34 and the sealing plate 33 of the sealing part 3. The limiting post 61 penetrates the thickness direction of the fixed cover plate 1 and the wedge block assembly, and the top of the first bolt 62 is located above the top surface of the fixed cover plate 1.

[0041] The length of the first bolt 62 is greater than the length of the limiting post 61. There is a gap between the top surface of the limiting post 61 and the bottom surface of the head of the first bolt 62. The outer diameter of the washer 64 is greater than the outer diameter of both the limiting post 61 and the head of the first bolt 62. The inner diameter of the washer 64 is smaller than the outer diameter of both the head of the first bolt 62 and the inner diameter of the limiting post 61. The top surface of the washer 64 is in contact with the bottom surface of the head of the first bolt 62, and the bottom surface of the washer 64 is in contact with the top surface of the limiting post 61. That is, the washer 64 is clamped in the gap between the top surface of the limiting post 61 and the bottom surface of the head of the first bolt 62. In addition, the bottom surface of the limiting post 61 is in contact with the top surface of the plastic seal 3 to ensure that the limiting post 61 is pressed against the bottom surface of the washer 64 and the top surface of the plastic seal 3.

[0042] The elastic element 63 is sleeved on the upper end of the outer periphery of the limiting post 61. In this embodiment, the elastic element 63 is always in a compressed state, and the elastic element 63 is preferably a spring. Each groove 12 on the fixed cover plate 1 is used to accommodate at least a part of the elastic element 63, and the diameter of the groove 12 is larger than the outer diameter of the gasket 64. One end of the elastic element 63 abuts against the bottom surface of the gasket 64, and the other end of the elastic element 63 abuts against the bottom surface of the groove 12. When the pull rod assembly 4 drives the wedge-shaped adjusting plate 52 to move back and forth, due to the action of the elastic limiting assembly 6, the wedge-shaped block assembly, the gasket 34 in the sealing part 3, and the sealing plate 33 as a whole will move up or down in the vertical direction with the expansion and contraction of the elastic element 63, thereby changing the thickness of the sealing area on the bottom surface of the sealing part 3, so as to achieve the effect of adjusting the thickness of the sealing product.

[0043] Specifically, the working process of the semiconductor molding die of this utility model is as follows:

[0044] When adjusting the thickness of the encapsulated product, first remove the bolts between the fixing block 41 and the adjusting block 42 to remove the fixing block 41. Then, unscrew the second bolt 44 inside the pull rod and remove the pull rod. Next, replace the adjusting block 42 with a thicker or thinner one according to the actual required thickness of the encapsulated product. Then, pass the pull rod through the adjusted block 42 after the thickness has been changed, and insert the second bolt 44 into the pull rod. Tighten the second bolt 44 onto the wedge-shaped adjusting plate 52. The force exerted during the tightening of the second bolt 44 will pull the wedge-shaped adjusting plate 52 forward or backward. When the end of the pull rod 432 near the rod portion 431 abuts against the side of the adjusting block 42 near the fixing block 41, and the end of the pull rod 431 away from the adjusting block 42 abuts against the end of the wedge-shaped adjusting plate 52, it indicates that the second bolt 44 is tightened in place, and the wedge-shaped adjusting plate 52 has moved the target distance. In this embodiment, as shown... Figure 8 and Figure 10 As shown, by Figures 8 to 10 The state shown indicates that the adjusting block 42 has been replaced with a thinner one, so that... Figure 10 The wedge-shaped adjusting plate 52 in Figure 8 Based on this, it moves forward (towards the direction away from the adjusting block 42) a certain distance, thereby correspondingly reducing the thickness of the encapsulation area below the encapsulation plate 33, making the thickness of the encapsulated product thinner.

[0045] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the protection scope of this utility model.

Claims

1. A semiconductor plastic sealing mold with adjustable plastic sealing thickness, comprising an upper mold and a lower mold, the upper mold comprising a fixed cover plate, a frame at both ends of the fixed cover plate, and a plastic sealing part at the bottom of the fixed cover plate, characterized in that, The fixed cover plate is provided with one or more adjustment mechanisms. One of the adjustment mechanisms includes a pull rod assembly, a wedge block assembly and multiple elastic limiting assemblies. The plastic sealing part is located below the wedge block assembly. The elastic limiting assembly is used to connect the wedge block assembly and the plastic sealing part. The length direction of the elastic limiting assembly is perpendicular to the length direction of the wedge block assembly. The wedge block assembly includes a wedge pad and a wedge adjusting plate that cooperate with each other. One end of the wedge adjusting plate is connected to one end of the pull rod assembly, and the pull rod assembly is used to drive the wedge adjusting plate to move relative to the wedge pad.

2. The semiconductor molding die according to claim 1, characterized in that, The fixed cover plate has a first receiving groove on its bottom surface for accommodating the wedge block assembly. The depth of the first receiving groove is less than the thickness of the fixed cover plate. The wedge adjusting plate is located above the wedge pad. The top surface of the wedge adjusting plate is always in contact with the top surface of the first receiving groove. The length of the wedge adjusting plate is less than the length of the wedge pad. The width of the wedge adjusting plate is equal to the width of the wedge pad. The bottom surface of the wedge adjusting plate is in contact with the top surface of the wedge pad.

3. The semiconductor molding die according to claim 2, characterized in that, The bottom surface of the wedge-shaped adjusting plate and the top surface of the wedge-shaped pad are both inclined surfaces. The bottom surface of the wedge-shaped adjusting plate and the top surface of the wedge-shaped pad are both inclined upward from one end near the tie rod assembly to the other end. The acute angle between the bottom surface of the wedge-shaped adjusting plate and the horizontal plane is equal to the acute angle between the top surface of the wedge-shaped pad and the horizontal plane. The height of the wedge-shaped adjusting plate gradually decreases from one end near the tie rod assembly to the other end, and the height of the wedge-shaped pad gradually increases from one end near the tie rod assembly to the other end.

4. The semiconductor molding die according to claim 3, characterized in that, The wedge-shaped adjusting plate has multiple waist-shaped holes that extend through its thickness direction. Each waist-shaped hole corresponds to an elastic limiting component, and the length direction of the waist-shaped hole is parallel to the length direction of the wedge-shaped adjusting plate.

5. The semiconductor molding die according to claim 4, characterized in that, Each of the elastic limiting components includes a limiting post, a first bolt, an elastic element, and a washer. The screw of the first bolt passes through the interior of the washer and the limiting post. The bottom of the first bolt is fixedly connected to the top of the plastic seal. The limiting post passes through the thickness direction of the fixed cover plate and the wedge block assembly. The top of the first bolt is located above the top surface of the fixed cover plate. The elastic element is sleeved on the upper end of the outer periphery of the limiting post.

6. The semiconductor molding die according to claim 5, characterized in that, Each of the limiting posts is located in a corresponding oblong hole. The length of the first bolt is greater than the length of the limiting post. The outer diameter of the gasket is greater than the outer diameter of the limiting post and the outer diameter of the head of the first bolt. The inner diameter of the gasket is smaller than the outer diameter of the head of the first bolt and the inner diameter of the limiting post. The top surface of the gasket is in contact with the bottom surface of the head of the first bolt, and the bottom surface of the gasket is in contact with the top surface of the limiting post. The bottom surface of the limiting post is in contact with the top surface of the plastic seal.

7. The semiconductor molding die according to claim 6, characterized in that, The fixed cover plate has multiple grooves formed from its top surface downwards. The depth of the grooves is less than the thickness of the fixed cover plate. Each groove corresponds to an elastic limiting component. Each groove is used to accommodate at least a part of an elastic element. The diameter of the groove is greater than the outer diameter of the gasket. One end of the elastic element abuts against the bottom surface of the gasket, and the other end of the elastic element abuts against the bottom surface of the groove. The elastic element is in a compressed state.

8. The semiconductor molding die according to claim 5, characterized in that, One end of the fixed cover plate is provided with a through groove corresponding to the pull rod assembly. One of the through grooves is connected to a first receiving groove, and one of the through grooves is used for a pull rod assembly to pass through. Each pull rod assembly includes a fixed block, an adjusting block, a pull rod, and a second bolt. The fixed block is fixedly connected to the adjusting block, and the fixed block is located on the side of the adjusting block away from the wedge block assembly.

9. The semiconductor molding die according to claim 8, characterized in that, The length direction of the pull rod is parallel to the length direction of the second bolt and the wedge block assembly. The length of the second bolt is greater than the length of the pull rod. The second bolt passes through the interior of the pull rod and one end of the second bolt is threadedly connected to one end of the wedge adjusting plate.

10. The semiconductor molding die according to claim 9, characterized in that, The pull rod includes a connected rod portion and a limiting end. The limiting end is located at the end of the rod portion away from the wedge block assembly. The outer diameter of the rod portion is smaller than the outer diameter of the limiting end. The rod portion extends through the thickness direction of the adjusting block. The fixed block has a second receiving groove at the end near the adjusting block for accommodating the limiting end. The end of the rod portion away from the adjusting block abuts against one end of the wedge adjusting plate. The end of the limiting end near the rod portion abuts against the side of the adjusting block near the fixed block.

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