probe card structure
The problem of exposed probe connection sections was solved by forming a seamless insulating layer on the probe surface, thus achieving the requirements of stable signal transmission and high-density oscillating probes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINGR TECHNOLOGIES (ZHEJIANG) LTD
- Filing Date
- 2025-06-10
- Publication Date
- 2026-06-30
AI Technical Summary
If the length of the sleeve cannot match the probe's connection section, the connection section will be exposed to the external environment, where impurities or dust will adhere, affecting signal transmission and potentially causing leakage or short circuit.
An insulating layer is applied to the probe surface through coating, plating, or sputtering to form a seamless covering. The insulating layer extends to the connection section and the fixing section to ensure that it matches the fixing base and prevents exposure.
The seamless insulation layer covers the connection section to prevent impurities or dust from adhering, avoid signal transmission degradation, prevent leakage or short circuit, and meet the requirements of high-density oscillating needles.
Smart Images
Figure CN224436408U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing technology, specifically to a probe card structure. Background Technology
[0002] The probe card structure includes a mounting base and multiple probes. Each probe has a fixed section, a tip section, and a connecting section. The fixed section passes through the mounting base, and the tip section and the connecting section are located outside the mounting base. To insulate the probes from the external environment, a sleeve is usually fitted onto the connecting section.
[0003] However, the length of the sleeve often cannot match the length of the connecting section, so the connecting section cannot be completely covered by the sleeve, and the part of the connecting section near the mounting base is often exposed to the external environment. After the part of the connecting section near the mounting base is exposed, impurities or dust can adhere to or get stuck in this part, reducing the signal transmission effect of the probe, and even causing problems such as leakage or short circuit. Utility Model Content
[0004] The purpose of this invention is to solve the following technical problem: the length of the sleeve often cannot match the length of the connecting section, causing the part of the connecting section near the fixed seat to be frequently exposed to the external environment, where impurities or dust may adhere to or get stuck, resulting in a reduction in the signal transmission effect of the probe.
[0005] To achieve the above objectives, this utility model provides a probe card structure, which includes a substrate, a mounting base, and a plurality of probes. The mounting base is connected to the bottom of the substrate. Each probe includes an insulating layer and a connecting segment, a fixing segment, and a tip segment connected in sequence. The connecting segment is located outside the mounting base and is electrically connected to the substrate. The fixing segment is fixed in the mounting base to fix the probe to the substrate, and the tip segment is located outside the mounting base and is used to contact the chip under test. The insulating layer extends from the connecting segment to at least a portion of the fixing segment and covers it, so that the mounting base covers at least a portion of the insulating layer. The insulating layer, formed by coating, plating, or sputtering, seamlessly covers the outer surface of the probe.
[0006] In some embodiments, the insulating layer covers the entirety of the fixing segment and the entirety of the connecting segment.
[0007] In some embodiments, the insulating layer extends from the connection segment to a portion of the needle tip segment and covers it.
[0008] In some embodiments, the surface roughness of the outer surface of the insulating layer is less than the surface roughness of the outer surface of the probe.
[0009] In some embodiments, the insulating layer is covered with a grounding layer.
[0010] In some embodiments, the fixed segments of the multiple probes are arranged in a matrix within the mounting base.
[0011] The above-mentioned technical solution of this utility model has the following beneficial effects:
[0012] Because the insulating layer extends seamlessly from the connecting section to at least a portion of the fixed section and provides a seamless cover, all outer peripheral surfaces of the connecting section are seamlessly covered by the insulating layer, and at least the portion of the fixed section connected to the connecting section is also seamlessly covered by the insulating layer. Furthermore, the fixed section is fixed in the mounting base, allowing at least a portion of the insulating layer to extend into and be covered by the mounting base, preventing the portion of the connecting section near the mounting base from being exposed to the external environment. Therefore, the insulating layer can match the length of the connecting section, preventing the portion of the connecting section near the mounting base from being exposed to the external environment. Even if impurities or dust adhere to or become stuck at this location, it will not reduce the signal transmission performance of the probe, nor will it cause problems such as leakage or short circuits. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the probe card structure in one embodiment of the present invention;
[0014] Figure 2 This is a schematic diagram of the probe card structure in another embodiment of the present invention;
[0015] Figure 3 This is a schematic diagram of the probe card structure in another embodiment of the present invention;
[0016] Figure 4 This is a schematic diagram of the probe card structure in another embodiment of the present invention;
[0017] Figure 5 This is a schematic diagram of the arrangement of the fixing segment in the fixing seat in one embodiment of the present invention.
[0018] Explanation of reference numerals in the attached figures
[0019] 1. Substrate;
[0020] 2. Fixture;
[0021] 3. Probe; 31. Insulating layer; 32. Connecting section; 33. Fixing section; 34. Tip section. Detailed Implementation
[0022] The features and exemplary embodiments of various aspects of this utility model will now be described in detail. To make the objectives, technical solutions, and advantages of this utility model clearer, the following description, in conjunction with the accompanying drawings and specific embodiments, will provide a further detailed description. It should be understood that the specific embodiments described herein are intended only to explain this utility model and not to limit it. For those skilled in the art, this utility model can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this utility model by illustrating examples of it.
[0023] like Figures 1 to 4 As shown, this utility model provides a probe card structure, which includes a substrate 1, a mounting base 2, and a plurality of probes 3. The mounting base 2 is connected to the bottom of the substrate 1. Each probe 3 includes an insulating layer 31 and sequentially connected connecting segments 32, 33, and tip segments 34. The connecting segment 32 is located outside the mounting base 2 and is electrically connected to the substrate 1. The 33 is fixed in the mounting base 2 to fix the probe 3 to the substrate. The tip segment 34 is located outside the mounting base 2 and is used to contact the chip under test. The insulating layer 31 extends from the connecting segment 32 to at least a portion of the 33 and covers it, so that the mounting base 2 covers at least a portion of the insulating layer 31. The insulating layer 31, formed by coating, plating, or sputtering, seamlessly covers the outer surface of the probe 3.
[0024] Specifically, probe 3 includes a connecting segment 32, a fixing segment 33, and a tip segment 34, which are connected sequentially. The connecting segment 32 is electrically connected to the substrate 1, and the tip segment 34 can contact the chip under test. Electrical signals can be transmitted through the connecting segment 32, the fixing segment 33, and the tip segment 34. Since the insulating layer 31 extends from the connecting segment 32 to at least a portion of the fixing segment 33 and is seamlessly covered, all outer peripheral surfaces of the connecting segment 32 are seamlessly covered by the insulating layer 31, and at least a portion of the fixing segment 33 connected to the connecting segment 32 is also seamlessly covered by the insulating layer 31. Furthermore, the fixing segment 33 is fixed in the mounting base 2, allowing at least a portion of the insulating layer 31 to extend into and be covered by the mounting base 2, preventing the portion of the connecting segment 32 near the mounting base 2 from being exposed to the external environment. Therefore, the insulation layer 31 can match the length of the connecting section 32, preventing the part of the connecting section 32 near the fixing seat 2 from being exposed to the external environment. Even if impurities or dust adhere to or get stuck in this part, it will not reduce the signal transmission effect of the probe 3, nor will it cause problems such as leakage or short circuit.
[0025] Furthermore, to meet testing requirements, probe card structures typically incorporate a large number of probes 3. Therefore, the mounting base 2 requires a significant number of fixed segments 33, and adjacent fixed segments 33 must maintain a predetermined spacing to ensure mutual insulation. However, existing sleeves have a certain thickness. If sleeves are wrapped around the fixed segments 33 of the probes 3, the sleeves will occupy space in the mounting base 2. Simultaneously, a certain spacing must be maintained between adjacent sleeves, increasing the distance between adjacent fixed segments 33. This leads to a decrease in the distribution density of fixed segments 33 in the mounting base 2, reducing the number of probes 3 that can be arranged, ultimately failing to meet the requirements for high-density probes. Moreover, due to manufacturing tolerances and other factors, gaps can easily form between the sleeves and the fixed segments 33. This increases the distance between the outer surface of the sleeve and the outer surface of the fixed segment 33, further occupying space in the mounting base 2, and potentially further reducing the distribution density of fixed segments 33 in the mounting base 2. Furthermore, wrapping the fixed segments 33 with sleeves makes it difficult to control the spacing between adjacent probes 3 when placing them. However, in this utility model, the insulating layer 31 is formed by coating, plating or sputtering, so that the insulating layer 31 can seamlessly cover the outer surface of the probe 3, so that the insulating layer 31 can have a thinner thickness than the sleeve, and the insulating layer 31 occupies less space than the sleeve, which makes it easier to effectively control and shorten the distance between adjacent probes 3, especially to meet the needs of high-density oscillating probes, thereby meeting the testing requirements.
[0026] In some embodiments, the connecting segment 32, the fixing segment 33, and the tip segment 34 are integrally formed. One end of the connecting segment 32 is electrically connected to the substrate 1, the other end of the connecting segment 32 is connected to one end of the fixing segment 33, the other end of the fixing segment 33 is connected to one end of the tip segment 34, and the other end of the tip segment 34 is used to contact the chip under test.
[0027] like Figure 2 As shown, in some embodiments of this utility model, the insulating layer 31 covers the entirety of the fixing section 33 and the entirety of the connecting section 32.
[0028] Specifically, the first end of the connecting segment 32 is fixedly connected to the substrate 1, the first end of the fixing segment 33 is fixedly connected to the end of the connecting segment 32, and the end of the fixing segment 33 is fixedly connected to the first end of the tip segment 34. The insulating layer 31 extends from the first end of the connecting segment 32 to the end of the fixing segment 33, and the entire outer peripheral surface of the connecting segment 32 and the entire outer peripheral surface of the fixing segment 33 are seamlessly covered by the insulating layer 31. Because the entire outer peripheral surface of the fixing segment 33 is seamlessly covered by the insulating layer 31, insulation can be formed between the fixing segments 33 of adjacent probes 3, ensuring the signal transmission effect.
[0029] like Figures 3 to 4As shown, in some embodiments of the present invention, the insulating layer 31 extends from the connecting section 32 to a portion of the needle tip section 34 and covers it.
[0030] Specifically, the first end of the connecting segment 32 is fixedly connected to the substrate 1, the first end of the fixing segment 33 is fixedly connected to the end of the connecting segment 32, and the end of the fixing segment 33 is fixedly connected to the first end of the tip segment 34. The insulating layer 31 extends from the first end of the connecting segment 32 to a portion of the tip segment 34, and the entire outer peripheral surface of the connecting segment 32 and the entire outer peripheral surface of the fixing segment 33 are seamlessly covered by the insulating layer 31. The portion of the tip segment 34 connected to the fixing segment 33 is also seamlessly covered by the insulating layer 31. Because a portion of the outer peripheral surface of the tip segment 34 is seamlessly covered by the insulating layer 31, insulation can be formed between the tip segments 34 of adjacent probes 3, ensuring signal transmission performance.
[0031] In some embodiments of this utility model, the thickness of the insulating layer 31 ranges from 0.005mm to 1mm, for example, the thickness of the insulating layer 31 can be 0.005mm.
[0032] Specifically, by setting the thickness of the insulating layer 31 within the aforementioned range, the mounting base 2 can accommodate a larger number of mounting segments 33, thereby enabling the installation of more probes 3 to meet testing requirements.
[0033] In some embodiments of this invention, the surface roughness of the outer surface of the insulating layer 31 is less than that of the outer surface of the probe 3. Therefore, the outer surface of the insulating layer 31 is smoother, and impurities or dust are less likely to adhere to the outer surface of the insulating layer 31, preventing impurities or dust from affecting signal transmission.
[0034] In some other embodiments of this invention, the surface roughness of the outer surface of the insulating layer 31 may also be greater than or equal to the surface roughness of the outer surface of the probe 3.
[0035] In some embodiments of this invention, the insulating layer 31 is covered with a grounding layer. The grounding layer can protect the probe 3 and prevent the probe 3 from being interfered with by external signals.
[0036] like Figure 5 As shown, in some embodiments of this utility model, the fixing segments 33 of multiple probes 3 are arranged in a matrix in the fixing seat 2.
[0037] Specifically, by arranging the segments as described above, the spacing between adjacent fixed segments 33 can be reduced, thereby increasing the number of fixed segments 33 that can be installed, which in turn increases the number of probes 3 to meet testing requirements.
[0038] In some embodiments of this utility model, such as Figures 1 to 3As shown, connecting segment 32 extends in a straight line. In some other embodiments of this utility model, such as Figure 4 As shown, the connecting segment 32 extends along a curve that is recessed away from the substrate 1.
[0039] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above examples are only for the purpose of helping to understand the method and core ideas of this utility model. The above are only preferred embodiments of this utility model. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this utility model, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of this utility model to other occasions without modification, should all be considered within the protection scope of this utility model.
Claims
1. A probe card structure, characterized in that, The device includes a substrate (1), a mounting base (2), and a plurality of probes (3). The mounting base (2) is connected to the bottom of the substrate (1). The probes (3) include an insulating layer (31) and a connecting segment (32), a fixing segment (33), and a tip segment (34) connected in sequence. The connecting segment (32) is located outside the mounting base (2) and is electrically connected to the substrate (1). The fixing segment (33) is fixed in the mounting base (2) to fix the probes (3) to the substrate. The tip segment (34) is located outside the mounting base (2) and is used to contact the chip under test. The insulating layer (31) extends from the connecting segment (32) to at least a portion of the fixing segment (33) and covers it so that the mounting base (2) covers at least a portion of the insulating layer (31). The insulating layer (31), formed by coating, plating, or sputtering, seamlessly covers the outer surface of the probes (3).
2. The probe card structure according to claim 1, characterized in that, The insulating layer (31) covers the entirety of the fixed section (33) and the entirety of the connecting section (32).
3. The probe card structure according to claim 2, characterized in that, The insulating layer (31) extends from the connecting segment (32) to a portion of the needle tip segment (34) and covers it.
4. The probe card structure according to claim 1, characterized in that, The surface roughness of the outer surface of the insulating layer (31) is less than the surface roughness of the outer surface of the probe (3).
5. The probe card structure according to claim 1, characterized in that, The insulating layer (31) is covered with a grounding layer.
6. The probe card structure according to claim 1, characterized in that, The fixed segments (33) of the plurality of probes (3) are arranged in a matrix in the fixed seat (2).