A direct-in and oblique-in laser triangulation system

Abstract

This utility model relates to the field of optical measurement technology, specifically to a direct-incident and oblique-incident laser triangulation ranging system, including a laser emitting module and a receiving module. The laser emitting module is used to selectively provide a direct-incident optical path for vertically projecting a laser beam onto the measurement area, or to provide an oblique-incident optical path for obliquely projecting a laser beam onto the measurement area. The receiving module includes a receiving mirror group and a photosensitive chip. The receiving module is used to receive the laser beam reflected from the measurement area and to focus it onto the photosensitive chip for imaging. The position of the photosensitive chip is adjustable so that it receives and adapts to the direct-incident optical path at a first position and to the oblique-incident optical path at a second position. When switching measurement modes, this utility model only requires selecting the optical path and adjusting the position of the photosensitive chip internally, without changing the external mounting posture of the entire sensor.

Description

Technical Field

[0001] This utility model relates to the field of optical measurement technology, specifically to a direct-entry and oblique-entry laser triangulation ranging system. Background Technology

[0002] Laser triangulation is a common non-contact measurement method in industry. In practical applications, two different incident methods are typically used depending on the surface material and roughness of the object being measured. The first is direct incidence, where the laser beam is projected perpendicularly or nearly perpendicularly onto the object's surface. This method primarily receives diffuse reflection from the surface, thus providing a stable and clear imaging signal for rough surfaces with strong diffuse reflection, ensuring measurement accuracy. The second is oblique incidence, where the laser beam is projected at a certain angle onto the object's surface. This method is mainly for effectively receiving strongly directional specular reflection from smooth or mirror-like surfaces. For such surfaces, if direct incidence is used, most of the reflected light will return along its original path, resulting in the receiving sensor not effectively receiving the light signal.

[0003] Therefore, currently, direct-incident sensors are installed at stations measuring rough surfaces, while oblique-incident sensors are installed at stations measuring smooth surfaces. While this approach ensures measurement accuracy for each, it lacks flexibility. Alternatively, the entire sensor could be manually replaced depending on the object being measured, or the overall sensor mounting orientation could be adjusted via complex mechanical structures to switch between direct and oblique incidence. Manually replacing sensors is not only time-consuming and labor-intensive, impacting production efficiency, but also requires complex system recalibration after each replacement. Adjusting the sensor orientation using mechanical structures significantly increases equipment complexity, cost, and potential sources of mechanical error; furthermore, changes in orientation may affect the sensor's preset measurement range and optical performance. Utility Model Content

[0004] The technical problem to be solved by this utility model is how to flexibly adapt to the measurement needs of objects with different surface characteristics in a single measurement system with lower cost, lower complexity and higher reliability. The purpose is to provide a direct-entry and oblique-entry laser triangulation ranging system, which realizes that only the sensitive element related to the optical path needs to be moved once, without replacing the entire sensor or readjusting the optical path, which is simple to operate and reduces costs.

[0005] This utility model is achieved through the following technical solution:

[0006] A direct-input and oblique-input laser triangulation ranging system, comprising:

[0007] A laser emitting module, wherein the laser emitting module is configured to selectively provide a direct incident optical path for vertically projecting a laser into a measurement area, or to provide an oblique incident optical path for obliquely projecting a laser into the measurement area;

[0008] A receiving module, comprising a receiving mirror group and a photosensitive chip, wherein the receiving module is used to receive laser light reflected from the measurement area and to focus it onto the photosensitive chip for imaging by the receiving mirror group;

[0009] The position of the photosensitive chip is adjustable so that it can receive and adapt to the direct-incident light path at a first position and receive and adapt to the oblique-incident light path at a second position.

[0010] As an optional embodiment, the laser emitting module includes a laser, a semi-transparent mirror, a fixed mirror, a first emitting lens, and a second emitting lens;

[0011] The direct-incident optical path is formed by the laser emitted by the laser being focused by the first emitting lens and transmitted through the semi-transparent and semi-reflective mirror.

[0012] The oblique incident light path is as follows: the laser emitted by the laser is focused by the first emitting lens and reflected by the semi-transparent and semi-reflective mirror, then focused by the second emitting lens and reflected by the fixed reflective mirror to form the light.

[0013] Furthermore, the system also includes a light-absorbing partition, which is movably disposed between the direct incident light path and the oblique incident light path and the measurement area, for selectively blocking one of the non-working light paths of the direct incident light path or the oblique incident light path during operation.

[0014] Optionally, the angle formed by the optical axis of the oblique incident optical path and the optical axis of the straight incident optical path is equal to the angle formed by the optical axis of the straight incident optical path and the optical axis of the receiving module.

[0015] As an optional embodiment, the laser emitting module includes a laser, a first emitting lens, a second emitting lens, a fixed reflector, and a movable reflector;

[0016] When the movable reflector moves to a position outside the laser's output optical path, the laser emitted by the laser is focused by the first emitting lens and directly projected to form the direct incident optical path;

[0017] When the movable reflector moves to a position within the laser's output optical path, the laser emitted by the laser is first focused by the first emitting lens and then reflected by the movable reflector, and then focused by the second emitting lens and reflected by the fixed reflector to form the oblique incident optical path.

[0018] Optionally, the movable reflector is rotatably disposed between the laser and the measurement area, and moves into or out of the laser's output optical path by rotating.

[0019] As an optional embodiment, the laser emitting module includes a first laser, a second laser, a first emitting lens, and a second emitting lens;

[0020] The direct-incident light path is formed when the first laser is activated and is focused by the first emitting lens;

[0021] The oblique incident light path is formed when the second laser is activated and is focused by the second emitting lens.

[0022] Optionally, the first laser is mounted such that the optical axis of the straight-incident optical path it forms is perpendicular to the measuring base surface;

[0023] The second laser is installed in such a way that the optical axis of the oblique incident optical path it forms intersects the measuring base surface at an angle.

[0024] Optionally, the photosensitive chip is adjusted to the first position or the second position by rotating about its axis.

[0025] Optionally, the first transmitting lens is an aspherical lens, the second transmitting lens is a spherical lens, and the receiving lens group includes two aspherical lenses.

[0026] Compared with the prior art, this utility model has the following advantages and beneficial effects:

[0027] This invention integrates a straight-incident optical path for vertical projection and an oblique-incident optical path for oblique projection into the same emission module, and uses a selection mechanism to activate one of the optical paths, so that the photosensitive chip moves accordingly to a preset receiving position that precisely matches the currently activated optical path.

[0028] This invention integrates both direct and oblique incident light paths into a single system, enabling the use of a single sensor to handle objects with different surface characteristics, such as roughness or smoothness. This avoids the need for multiple dedicated sensors for different measurement tasks or frequent sensor replacements, reducing the hardware cost and deployment complexity of the measurement system, and improving the system's measurement flexibility and applicability.

[0029] When switching measurement modes, this invention only requires selecting the optical path and adjusting the position of the photosensitive chip within the system, without changing the external mounting posture of the entire sensor. This achieves fast and convenient measurement mode switching, saving time spent on readjustment and calibration. Furthermore, it avoids mechanical installation errors that may be introduced by changing the overall posture of the sensor, ensuring the uniformity and stability of the measurement reference in both modes. Attached Figure Description

[0030] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the principles of the present invention. These drawings are included to provide a further understanding of the present invention, and are included in and constitute a part of this specification, but do not constitute a limitation on the embodiments of the present invention.

[0031] Figure 1 This is a schematic diagram of a direct-entry and oblique-entry laser triangulation ranging system according to the present invention. The figure shows the structure of Embodiment 2.

[0032] Figure 2 This is a schematic diagram of the structure of a direct-entry and oblique-entry laser triangulation ranging system according to the present invention. The figure shows the structure of Embodiment 3.

[0033] Figure 3 This is a schematic diagram of the structure of a direct-entry and oblique-entry laser triangulation ranging system according to the present invention. The figure shows the structure of Embodiment 4.

[0034] Figure 4 This is a simulation diagram of the direct-incident optical path according to this utility model.

[0035] Figure 5 It is a dot matrix diagram of the direct-incident optical path according to this utility model.

[0036] Figure 6 This is a simulation diagram of the oblique incident optical path according to the present invention.

[0037] Figure 7 It is a dot matrix diagram of the oblique incident light path according to the present invention.

[0038] Reference numerals: 1-Laser, 2-Semi-transparent mirror, 3-Fixed mirror, 4-First emitting lens, 5-Second emitting lens, 6-Light-absorbing partition, 7-Photosensitive chip, 8-Receiving mirror group, 9-Measurement area, 11-First laser, 12-Second laser, 21-Moving mirror. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this utility model.

[0040] It should also be noted that, for ease of description, only the parts relevant to this utility model are shown in the accompanying drawings.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] Where there is no conflict, the embodiments and features of the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0044] Example 1

[0045] This embodiment describes a laser triangulation ranging system that is compatible with two measurement modes. The system integrates two different laser emission paths and uses a position-adjustable photosensitive chip 7 that is linked to the selection of the optical path to ensure that imaging can be obtained in different modes. The system includes a laser emission module and a receiving module.

[0046] The emission module is the light source part of the system, and it can provide two optical path capabilities as needed: direct incident optical path - that is, the laser beam is projected vertically onto the surface of the object being measured; oblique incident optical path - that is, the laser beam is projected onto the surface of the object being measured at an oblique angle.

[0047] That is, the laser emitting module is used to selectively provide a straight incident optical path for vertically projecting the laser into the measurement area 9, or to provide an oblique incident optical path for obliquely projecting the laser into the measurement area 9;

[0048] The receiving module is responsible for capturing the laser reflected from the surface of the object being measured. The receiving module includes a receiving mirror group 8 and a photosensitive chip 7. The receiving module is used to receive the laser reflected from the measurement area 9 and to focus the laser onto the photosensitive chip 7 by the receiving mirror group 8 to form an image.

[0049] The receiving lens group 8 refers to an optical system consisting of one or more lenses, whose function is to converge weak, divergent reflected light into a clear spot. In this embodiment, the lens group consists of two aspherical lenses.

[0050] The photosensitive chip 7 typically refers to a CMOS or CCD image sensor, which converts the light spot signal focused on it into an electrical signal that can be processed and calculated by subsequent circuits. The position of the photosensitive chip 7 is adjustable so that it receives and adapts to a direct-incident light path in a first position and to a second position that receives and adapts to an oblique-incident light path. The photosensitive chip 7 is adjusted to the first or second position by rotating about its axis.

[0051] When the transmitting module switches from direct-incident mode to oblique-incident mode, the photosensitive chip 7 will simultaneously rotate from the first position to the second position. That is, by adjusting the angle between the photosensitive chip 7 and the principal optical axis of the received light according to Scheimpflug Principle, the switching between direct-incident and oblique-incident sensors can be realized.

[0052] By integrating selectable direct-incident and oblique-incident optical paths within a single system, and supplementing them with a rotatable photosensitive chip 7 for coordinated adjustment, high-precision measurement of objects with different surface characteristics can be achieved.

[0053] Depending on the surface characteristics of the object under test (e.g., rough or smooth), the system selects to enable either the direct-incident or oblique-incident optical path in the laser emission module. Simultaneously with selecting the emission path, the system drives the photosensitive chip 7 to rotate around its axis to a preset corresponding position (first position or second position) to ensure that the receiving module can clearly receive and image the reflected light spot, thus completing a precise distance measurement.

[0054] Example 2

[0055] like Figure 1 As shown, this embodiment describes a specific implementation of a laser emission module. Two optical paths, direct incidence and oblique incidence, are separated from a single laser source and switched between them. This is achieved using a semi-transparent mirror 2 and a fixed reflector 3, along with a light-absorbing partition 6.

[0056] The laser emitting module includes a laser 1, a semi-transparent mirror 2, a fixed reflector 3, a first emitting lens 4, and a second emitting lens 5.

[0057] A semi-transparent mirror 2 is an optical element that can simultaneously split an incident light beam into two beams: one part of the light will pass through it and continue to propagate in the original direction (transmitted light), while the other part of the light will be reflected by its surface and emitted at a specific angle (reflected light). Based on the characteristics of the semi-transparent mirror 2, a straight incident light path and an oblique incident light path are formed.

[0058] The direct-incident light path (the light path indicated by the black line) is formed by the laser emitted by the laser 1, which is focused by the first emitting lens 4 and transmitted through the semi-transparent and semi-reflective mirror 2.

[0059] The oblique incident light path (the light path indicated by the yellow line) is as follows: the laser emitted by the laser 1 is focused by the first emitting lens 4 and reflected by the semi-transparent and semi-reflective mirror 2, then focused by the second emitting lens 5 and reflected by the fixed reflecting mirror 3 to form the light path.

[0060] The initial focusing by the first emitting lens 4 ensures the quality of the initial beam. The focusing by the second emitting lens 5 further adjusts the beam focus, bringing it to the measurement area 9. The first emitting lens 4 is an aspherical lens, and the second emitting lens 5 is a spherical lens.

[0061] This embodiment employs a light-absorbing baffle 6 to achieve selective use of the two optical paths. The light-absorbing baffle 6 is a physical baffle whose surface is usually treated to be dark black or has a light-absorbing coating to absorb light to the maximum extent and prevent unnecessary reflection.

[0062] The light-absorbing baffle 6 is movably disposed between the direct incident light path and the oblique incident light path and the measurement area 9, and is used to selectively block one of the non-working light paths in the direct incident light path or the oblique incident light path during operation.

[0063] In practical applications, when a straight-incident light path is required, the partition moves to block the path of the oblique-incident light path; conversely, when an oblique-incident light path is required, it moves to block the path of the straight-incident light path. This ensures that only one "working light path" reaches the object being measured at any given time, avoiding interference from non-working light paths.

[0064] The angle between the optical axis of the oblique incident light path and the optical axis of the straight incident light path is equal to the angle between the optical axis of the straight incident light path and the optical axis of the receiving module.

[0065] The operation process can be summarized as follows:

[0066] Select direct incidence mode: Control the movement of the light-absorbing partition 6 to block the oblique incidence light path. At this time, the light emitted by the laser 1 passes through the first emitting lens 4 and the semi-transparent mirror 2, and illuminates the object under test perpendicularly.

[0067] Select oblique incidence mode: Control the movement of the light-absorbing partition 6 to block the direct-incident light path. At this time, the light emitted by the laser 1 passes through the first emitting lens 4, is reflected successively by the semi-transparent and semi-reflective mirror 2 and the fixed reflector 3, and passes through the second emitting lens 5 before finally obliquely illuminating the object under test.

[0068] Example 3

[0069] like Figure 2 As shown, this embodiment describes a hardware scheme different from Embodiment 2. Instead of using the semi-transparent mirror 2 to separate the beam, a movable mirror 21 is used. By changing the physical position of the movable mirror 21, it is determined whether the laser beam is emitted directly or guided to a more complex path.

[0070] The laser emitting module includes a laser 1, a first emitting lens 4, a second emitting lens 5, a fixed reflector 3, and a movable reflector 21; the first emitting lens 4 is an aspherical lens, and the second emitting lens 5 is a spherical lens.

[0071] When the movable reflector 21 moves to a position outside the output light path of the laser 1, the laser emitted by the laser 1 is focused by the first emitting lens 4 and directly projected to form a straight incident light path.

[0072] When the movable reflector 21 moves to a position in the output optical path of the laser 1, the laser emitted by the laser 1 is first focused by the first emitting lens 4 and then reflected by the movable reflector 21. Then it is focused by the second emitting lens 5 and reflected by the fixed reflector 3 to form an oblique incident optical path.

[0073] The movable reflector 21 is rotatably disposed between the laser 1 and the measurement area 9, and moves into or out of the output light path of the laser 1 by rotating.

[0074] The optical path switching of the system depends on the mechanical position of the moving reflector 21:

[0075] Direct incident light path (when the movable reflector 21 is moved out): The movable reflector 21 will rotate to a "give way" position, completely not blocking the light beam emitted from the laser 1. At this time, the light beam only needs to be focused by the first emitting lens 4 to be directly and vertically projected onto the measurement area 9.

[0076] Oblique incident light path (when the movable reflector 21 intervenes): The movable reflector 21 rotates to the "working" position in the middle of the light path to intercept the laser beam. At this time, the laser beam first passes through the first emitting lens 4 and is then reflected by the movable reflector 21; then, the reflected light passes through the second emitting lens 5 and is finally reflected a second time by a fixed reflector 3, guiding the beam to the measurement area 9 at an oblique angle.

[0077] Example 4

[0078] like Figure 3 As shown, this embodiment describes a laser emission module scheme that is structurally different from the aforementioned embodiments. It completely abandons the design of a single light source plus an optical path switching element (such as a semi-transparent mirror 2 or a movable mirror 21), and instead adopts two completely independent, fixed-position emission units. The system uses electronic control to select which unit to activate, thereby achieving the switching of measurement modes.

[0079] The laser emitting module includes a first laser 11, a second laser 12, a first emitting lens 4, and a second emitting lens 5;

[0080] The direct-incident light path is formed when the first laser 11 is activated and focused by the first emitting lens 4;

[0081] The oblique incident light path is formed when the second laser 12 is activated and focused by the second emitting lens 5.

[0082] When the system needs to perform direct incidence measurement, the control circuit activates (i.e., powers on) the first laser 11. When switching to oblique incidence measurement, the first laser 11 is turned off, and the second laser 12 is activated simultaneously. This electronic switching method avoids any mechanical movement, thus offering advantages such as fast response speed, no mechanical wear, and no vibration.

[0083] The first laser 11 is installed in such a way that the optical axis of the straight incident optical path it forms is perpendicular to the measurement base surface;

[0084] The second laser 12 is installed in such a way that the optical axis of the oblique incident light path it forms intersects with the measurement base surface at an angle.

[0085] Example 5

[0086] This embodiment verifies the feasibility and advancement of the entire technical solution through a complete computer optical simulation case.

[0087] The simulation set up a specific measurement scenario: the measurement range was 40±5mm, that is, with the measurement center 40mm away from the sensor, the measurable depth range was 10mm.

[0088] The simulation used a specific optical configuration:

[0089] The emission optical path is designed as a conjugate optical path. The lens in direct-incidence mode is an aspherical lens, while the lens in oblique-incidence mode consists of one aspherical lens and one spherical lens.

[0090] Receiving optical path: The receiving lens group 8 consists of two aspherical lenses.

[0091] Geometric layout: The angle between the central axes of the two emitting optical paths is set to 25°, which is equal to the angle between the axis of the direct-incident optical path and the axis of the receiving optical path. Correspondingly, the rotation angle between the positions of the photosensitive chip 7 in the two modes is 25.03°.

[0092] Sensor specifications: The photosensitive chip 7 used in the simulation has a photosensitive surface size of 14mm.

[0093] The simulation results are presented in the form of a dot plot.

[0094] Figure 4 This is a simulation diagram of a direct-incident light path. From left to right, the diagram shows the transmitting light path and the receiving light path. Figure 5 This is a dot matrix diagram of the direct-incident light path.

[0095] Figure 6 This is a simulation diagram of the oblique incident light path. From left to right, the diagram shows the transmitting light path and the receiving light path. Figure 7 This is a dot matrix diagram of the obliquely incident light path.

[0096] By analyzing the RMS radius (root mean square radius) of the dot plot, the size and concentration of the imaging spot can be quantitatively assessed. The smaller the RMS radius, the more concentrated the spot and the higher the image quality.

[0097] The results of this embodiment show that, regardless of whether the point plot is directly incident or obliquely incident, its RMS radius demonstrates that the system has good imaging performance and meets the expected design requirements.

[0098] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0099] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0100] Those skilled in the art should understand that the above embodiments are merely for clearly illustrating the present invention and are not intended to limit the scope of the present invention. For those skilled in the art, other changes or modifications can be made based on the above-described invention, and these changes or modifications still fall within the scope of the present invention.

Claims

1. A direct and oblique laser triangulation system, characterized in that, include: A laser emitting module is configured to optionally provide a direct incident optical path for vertically projecting a laser onto the measurement area (9), or to provide an oblique incident optical path for obliquely projecting a laser onto the measurement area (9); The receiving module includes a receiving mirror group (8) and a photosensitive chip (7). The receiving module is used to receive the laser reflected by the measurement area (9) and to focus the laser onto the photosensitive chip (7) by the receiving mirror group (8) to form an image. The position of the photosensitive chip (7) is adjustable so that it can receive and adapt to the direct incident light path at its first position and receive and adapt to the oblique incident light path at its second position.

2. The direct-in and oblique-in laser triangulation ranging system according to claim 1, characterized in that, The laser emitting module includes a laser (1), a semi-transparent mirror (2), a fixed reflector (3), a first emitting lens (4), and a second emitting lens (5); The direct-incident optical path is formed by the laser emitted by the laser (1), which is focused by the first emitting lens (4) and transmitted through the semi-transparent and semi-reflective mirror (2); The oblique incident light path is as follows: the laser emitted by the laser (1) is focused by the first emitting lens (4) and reflected by the semi-transparent and semi-reflective mirror (2), and then focused by the second emitting lens (5) and reflected by the fixed reflector (3) to form the light path.

3. The direct-in and oblique-in laser triangulation ranging system according to claim 2, characterized in that, It also includes a light-absorbing partition (6), which is movably disposed between the direct incident light path and the oblique incident light path and the measurement area (9) for selectively blocking one of the non-working light paths in the direct incident light path or the oblique incident light path during operation.

4. The direct-in and oblique-in laser triangulation ranging system according to claim 2, characterized in that, The angle formed by the optical axis of the oblique incident optical path and the optical axis of the straight incident optical path is equal to the angle formed by the optical axis of the straight incident optical path and the optical axis of the receiving module.

5. The direct-in and oblique-in laser triangulation ranging system according to claim 1, characterized in that, The laser emitting module includes a laser (1), a first emitting lens (4), a second emitting lens (5), a fixed reflector (3), and a movable reflector (21). When the movable reflector (21) moves to a position outside the output light path of the laser (1), the laser emitted by the laser (1) is focused by the first emitting lens (4) and directly projected to form the direct incident light path; When the movable reflector (21) moves to a position in the output optical path of the laser (1), the laser emitted by the laser (1) is first focused by the first emitting lens (4) and then reflected by the movable reflector (21), and then focused by the second emitting lens (5) and reflected by the fixed reflector (3) to form the oblique incident optical path.

6. The direct-in and oblique-in laser triangulation ranging system according to claim 5, characterized in that, The movable reflector (21) is rotatably disposed between the laser (1) and the measurement area (9), and moves into or out of the output light path of the laser (1) by rotating.

7. The direct-in and oblique-in laser triangulation ranging system according to claim 1, characterized in that, The laser emitting module includes a first laser (11), a second laser (12), a first emitting lens (4), and a second emitting lens (5); The direct-incident light path is formed when the first laser (11) is activated and is focused by the first emitting lens (4); The oblique incident light path is formed when the second laser (12) is activated and focused by the second emitting lens (5).

8. The direct-input and oblique-input laser triangulation ranging system according to claim 7, characterized in that, The first laser (11) is installed in such a position that the optical axis of the straight incident optical path formed therefrom is perpendicular to the measuring base surface; The second laser (12) is installed in such a way that the optical axis of the oblique incident optical path formed therein intersects the measuring base surface at an angle.

9. The direct-in and oblique-in laser triangulation ranging system according to claim 1, characterized in that, The photosensitive chip (7) is adjusted to the first position or the second position by rotating about its axis.

10. The direct-entry and oblique-entry laser triangulation ranging system according to claim 2 or 5, characterized in that, The first transmitting lens (4) is an aspherical lens, the second transmitting lens (5) is a spherical lens, and the receiving lens group (8) includes two aspherical lenses.

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