Antenna structure and electronic equipment

Abstract

This application discloses an antenna structure and electronic device, relating to the field of communication technology. The antenna structure includes: an antenna radiator, an antenna ground plane, and a metal body. The metal body is disposed between the antenna radiator and the antenna ground plane. An insulating medium is filled between the metal body and the antenna radiator, and the metal body is electrically connected to the antenna ground plane.

Description

Technical Field

[0001] This application belongs to the field of communication technology, specifically relating to an antenna structure and electronic device. Background Technology

[0002] In existing technologies, antenna structures designed for mobile phones and other electronic devices typically consist of three metal bodies. For example, metal body A is the antenna radiator, metal body C is the antenna ground plane, and metal body B serves as the antenna grounding connection structure between metal bodies A and C. Metal body B is directly electrically connected to metal body A via elastic connecting components such as antenna springs. This antenna grounding structure requires high grounding stability of the elastic connecting components, often necessitating the design of gold-plated contact elastic electrical connecting components on the antenna radiator, resulting in high costs. Utility Model Content

[0003] The purpose of this application is to provide an antenna structure and electronic device that can solve the problem that existing antenna grounding structures have high requirements for the grounding stability of elastic connection components and are costly.

[0004] In a first aspect, embodiments of this application propose an antenna structure, comprising: an antenna radiator, an antenna ground plane, and a metal body, wherein the metal body is disposed between the antenna radiator and the antenna ground plane, an insulating medium is filled between the metal body and the antenna radiator, and the metal body is electrically connected to the antenna ground plane.

[0005] Secondly, embodiments of this application propose an electronic device including the antenna structure described in the first aspect.

[0006] In the embodiments of this application, the antenna structure includes: an antenna radiator, an antenna ground plane, and a metal body. The metal body is disposed between the antenna radiator and the antenna ground plane, and an insulating medium is filled between the metal body and the antenna radiator. The metal body is electrically connected to the antenna ground plane. Thus, by designing a coupling grounding structure between the antenna radiator and the metal body, this embodiment eliminates the need for an elastic connecting component between them for electrical connection. Compared to existing methods that directly connect the antenna with an elastic connector, this not only ensures better grounding stability but also eliminates the need for a gold-plated surface on the antenna radiator, simplifying the antenna radiator manufacturing process and reducing costs.

[0007] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0008] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0009] Figure 1 This is a top view of the antenna structure according to an embodiment of this application;

[0010] Figure 2 This is a side view of an antenna structure according to an embodiment of this application;

[0011] Figure 3 This is a schematic diagram illustrating the relationship between equivalent capacitive reactance and frequency according to an embodiment of this application. Detailed Implementation

[0012] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0013] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and do not limit the number of objects; for example, a first object can be one or more. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0014] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0015] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0016] Currently, mobile electronic devices such as smartphones are rapidly evolving, leading to an increasing number of antennas operating at higher frequencies and in greater numbers. Consequently, this places greater demands on antenna grounding design, considering factors such as location, size, space, and cost. However, low-cost, high-performance design remains a consistent requirement for electronic device antenna structures. Existing electronic device antenna structures typically employ DC flexible electrical connections, which have the following drawbacks:

[0017] 1) The requirements for the grounding stability of the elastomer are high, which often requires the design of gold-plated contact elastomer components on the antenna carrier, resulting in high cost.

[0018] 2) The design requires a high level of space, such as area or thickness.

[0019] 3) The antenna carrier has many process steps and is complex to manufacture. For example, the metal frame needs to be anodized first, then laser-engraved or CNC machined, and then gold-plated sheet components are welded in the laser-engraved or computer numerical control (CNC) area.

[0020] 4) The antenna reference ground is a large metal body other than the antenna carrier. It generally refers to the attached metal of the screen display module (LCD Module, LCM). The distance between it and the metal carrier is about 0.3mm. In order to effectively reduce the impact of the antenna reference ground on radiation performance, it is usually necessary to design a DC grounding point between the antenna carrier and the antenna reference ground to build a complete antenna reference ground. If there are multiple antennas, multiple DC grounding points are usually required to be set close to the antennas.

[0021] Therefore, this application provides an antenna scheme with micro-coupling grounding between the antenna carrier and the metal electrical connection component, without making a DC connection, which can reduce or eliminate the DC connection structure of the antenna elastomer and achieve low-cost, high-performance antenna coupling grounding.

[0022] The antenna structure provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0023] Please see Figure 1 and 2 , Figure 1 and2 This is a schematic diagram of the antenna structure provided in an embodiment of this application. Figure 1 As shown, the antenna structure includes:

[0024] The antenna radiator 101, the antenna ground 102, and the metal body 103 are provided. The metal body 103 is disposed between the antenna radiator 101 and the antenna ground 102. The space between the metal body 103 and the antenna radiator 101 is filled with an insulating medium 104, and the metal body 103 is electrically connected to the antenna ground 102.

[0025] The metal body 103 and the antenna radiator 101 are equivalent to a parallel plate capacitor, and the equivalent capacitance between the metal body 103 and the antenna radiator 101 matches the operating frequency band of the antenna structure.

[0026] This application provides an antenna structure employing an antenna coupling grounding scheme, specifically as follows: Figure 1 and Figure 2 As shown, the antenna structure includes an antenna radiator 101, an antenna ground plane 102, and a metal body 103. The antenna radiator 101 serves as the antenna carrier, and in electronic devices, it generally refers to the metal frame structure supporting the screen, i.e., the metal middle frame. The antenna ground plane 102 serves as the antenna reference ground and is usually also a metal body structure, generally referring to the copper foil of a flexible screen or the stainless steel protective structure of a rigid screen. The metal body 103 is disposed between the antenna radiator 101 and the antenna ground plane 102 and is used as an antenna coupling ground structure. In some implementations, conductive foam can be used.

[0027] In this embodiment, the metal body 103 is in contact with the surface of the antenna ground 102 and has good DC conduction characteristics, while there is no direct DC conduction path between the antenna radiator 101 and the metal body 103, thus forming an antenna coupling grounding scheme. In other words, the antenna radiator 101 and the metal body 103 are not in direct contact, but there is a certain gap. Specifically, an insulating medium 104 is filled between the antenna radiator 101 and the metal body 103. In order to ensure the stability of the antenna structure, in some embodiments, the insulating medium 104 can be an insulating double-sided adhesive or a similar insulating adhesive material, which is used to fix the metal body 103 on the antenna radiator 101 to achieve the pre-fixation of the metal body 103.

[0028] In this way, the metal body 103 and the antenna radiator 101 constitute a parallel-plate capacitor, and there is a certain equivalent coupling capacitance between them, which enables the coupling capacitance of the antenna radiator 101 to be grounded. Considering the frequency characteristics, the grounding between the metal body 103 and the antenna radiator 101 is actually a capacitive grounding method, and its frequency characteristic is a capacitive reactance 1 / (ωC). As the frequency ω increases or the capacitance C increases, the capacitive reactance 1 / (ωC) gradually decreases, indicating that high-frequency energy can pass easily. When the frequency ω is low, the capacitance C can also be increased to ensure that the capacitive reactance 1 / (ωC) is small, thus ensuring that low-frequency energy can pass.

[0029] Specifically, according to the formula for calculating the capacitance of parallel plates, C = εs / d, the specific equivalent capacitance between the metal body 103 and the antenna radiator 101 is determined by the distance d between the metal body 103 and the antenna radiator 101, the facing area S between the metal body 103 and the antenna radiator 101, and the dielectric constant ε of the insulating medium 104 filling the space between the metal body 103 and the antenna radiator 101.

[0030] Therefore, in order to ensure that the antenna radiator 101 can be grounded through the metal body 103, the spacing d and the facing area S between the metal body 103 and the antenna radiator 101 can be designed during the antenna design stage according to the required antenna operating frequency band and the dielectric constant of the filling insulating medium 104. This ensures that the equivalent capacitance between the metal body 103 and the antenna radiator 101 meets the requirements of the antenna structure's operating frequency band. In other words, the equivalent capacitance between the metal body 103 and the antenna radiator 101 matches the operating frequency band of the antenna structure, ensuring that the impedance generated by the coupling grounding between the antenna radiator 101 and the metal body 103 is low, such as within 4Ω, thereby ensuring that energy in the operating frequency band can pass through, and that the antenna structure can receive signals within the operating frequency band.

[0031] Optionally, only the first region of the antenna radiator 101 and the metal body 103 are filled with an insulating medium 104, the first region being the projection region of the metal body 103 on the antenna radiator 101.

[0032] The metal body 103 serves as a grounding connection structure, and its size is smaller than that of the antenna radiator 101. In some embodiments, the insulating medium 104 can be provided only in the area of ​​the antenna radiator 101 directly opposite the metal body 103; that is, the area of ​​the insulating medium 104 is the same as the surface area of ​​the metal body 103. This reduces the process complexity and material cost of providing an insulating medium between the wire radiator 101 and the metal body 103.

[0033] Optionally, the side of the antenna radiator 101 facing the metal body 103 is provided with a micron-sized insulating layer.

[0034] In some embodiments, a micron-level insulating layer can be provided on the side of the antenna radiator 101 facing the metal body 103, that is, the thickness of the insulating layer is on the micron level, to ensure that the antenna radiator 101 and the metal body 103 are insulated and non-conductive, and there is no direct current, thus ensuring the coupling grounding characteristics between the antenna radiator 101 and the metal body 103.

[0035] Optionally, the side of the antenna radiator 101 facing the metal body 103 is provided with an anodized layer.

[0036] In some embodiments, an anodizing process can be performed on the surface of the antenna radiator 101 to form an anodized layer, i.e. an insulating layer. This process is simple to implement and can form a micron-level insulating layer, ensuring the insulation effect between the antenna radiator 101 and the metal body 103.

[0037] It should be noted that in some embodiments, a micron-level insulating layer may be provided only in the first region of the antenna radiator 101, or an anodizing process may be performed only on the first region to form an anodized layer in the first region, thereby saving manufacturing processes.

[0038] Optionally, the side of the antenna radiator 101 facing the metal body 103 is provided with a conductive layer, the insulating medium 104 covers the conductive layer, and the distance between the metal body 103 and the antenna radiator 101 is less than 10 μm.

[0039] In other embodiments, laser engraving can be performed on the side of the antenna radiator 101 facing the metal body 103 to form a conductive layer on the surface of the antenna radiator 101. However, the insulating medium 104 filling the space between the antenna radiator 101 and the metal body 103 must completely cover the laser-engraved area on the antenna radiator 101, i.e., cover the conductive layer. This ensures that the antenna radiator 101 and the metal body 103 are insulated and non-conductive, and there is no direct current, thus ensuring the antenna coupling grounding effect. Furthermore, there is no need to perform an anodizing process on the surface of the antenna radiator 101 after laser engraving, which eliminates the need for anodizing on the surface of the antenna radiator 101.

[0040] It should be noted that, in this embodiment, an anodizing process can also be performed on the side of the metal body 103 facing the antenna radiator 101 to form an insulating layer, further ensuring that the antenna radiator 101 and the metal body 103 are insulated and non-conductive.

[0041] In this embodiment, since the anodized layer on the surface of the antenna radiator 101 is removed, the coupling distance between the antenna radiator 101 and the metal body 103 can be further reduced, thereby enhancing the grounding effect of the coupling capacitance. In other words, when only the surface of the antenna radiator 101 is laser-etched, the distance between the metal body 103 and the antenna radiator 101 is smaller than when the surface of the antenna radiator 101 is anodized.

[0042] It should be noted that, in this embodiment of the application, the coupling distance d between the antenna radiator 101 and the metal body 103 can be designed to be no more than 10 μm.

[0043] Optionally, the antenna structure operates in a first frequency band, the equivalent capacitance between the metal body 103 and the antenna radiator 101 is a first capacitance value, the equivalent impedance between the metal body 103 and the antenna radiator 101 is less than a first resistance value, and the first frequency band is a medium high band (MHB).

[0044] Alternatively, the antenna structure operates in the second frequency band, the equivalent capacitance between the metal body 103 and the antenna radiator 101 is the second capacitance value, the equivalent impedance between the metal body 103 and the antenna radiator 101 is less than the second resistance value, the second frequency band is the low band (LB), and the second capacitance value is greater than the first capacitance value.

[0045] That is, the antenna structure in this application embodiment can be applied to both medium and high frequency antennas and low frequency antennas. In specific implementation, the parameters between the metal body 103 and the antenna radiator 101, such as the distance d and the facing area S, can be designed according to the operating frequency band so that the equivalent impedance (also called equivalent capacitive reactance) between the metal body 103 and the antenna radiator 101 is less than the predetermined target value, such as within 4Ω, so as to achieve good grounding of the antenna radiator 101.

[0046] Specifically, in some embodiments, when the antenna structure is designed to operate in the first frequency band f1, such as when the operating frequency is higher than 1.7 GHz, a reasonable spacing d and facing area S between the metal body 103 and the antenna radiator 101 can be designed so that the equivalent capacitance between the metal body 103 and the antenna radiator 101 is a first capacitance value C1. This capacitance value C1 and the operating frequency band f1 make the equivalent impedance between the metal body 103 and the antenna radiator 101 ZC1, ZC1 = 1 / (f1C1), and ZC1 satisfies that it is less than a given target value such as a first resistance value, which can be 4Ω. In this way, it can be ensured that high-frequency energy can easily pass through when the antenna structure is used as a mid-to-high frequency antenna, and a good coupling grounding effect can be guaranteed.

[0047] In other embodiments, when the antenna structure is designed to operate in the second frequency band f2, such as when the operating frequency is higher than 700MHz, a reasonable spacing d and facing area S between the metal body 103 and the antenna radiator 101 can be designed so that the equivalent capacitance between the metal body 103 and the antenna radiator 101 is a second capacitance value C2. This capacitance value C2 and the operating frequency band f2 make the equivalent impedance between the metal body 103 and the antenna radiator 101 ZC2, ZC2 = 1 / (f2C2), and ZC2 satisfies that it is less than a given target value such as a second resistance value. The second resistance value can also be 4Ω or other relatively small resistance values. In this way, it can be ensured that low-frequency energy can easily pass through when the antenna structure is used as a low-frequency antenna, ensuring a good coupling grounding effect.

[0048] Optionally, the first resistance value is equal to the second resistance value, and the ratio of the second capacitance value to the first capacitance value is equal to the ratio of the first frequency band to the second frequency band.

[0049] In some embodiments, to ensure good coupling and grounding, the equivalent impedance between the metal body 103 and the antenna radiator 101 must be less than the target value, such as less than 4Ω, for both mid-to-high frequency and low-frequency antennas. Since the antenna frequency band and equivalent impedance are negatively correlated (the higher the antenna operating frequency, the smaller the capacitive reactance), when the antenna structure is designed for use as a low-frequency antenna, to achieve the same equivalent impedance, the ratio of the coupling area to the coupling distance between the metal body 103 and the antenna radiator 101 can be increased proportionally based on the ratio between the high-frequency and low-frequency operating frequencies. That is, when used as a low-frequency antenna, the ratio of the equivalent capacitance between the metal body 103 and the antenna radiator 101 to that when used as a mid-to-high frequency antenna is equal to the ratio of the operating frequency of the mid-to-high frequency antenna to the operating frequency of the low-frequency antenna.

[0050] For example, in the frequency range of 0.5 to 5.5 GHz, the impedance characteristics of the coupling capacitor grounding method based on the embodiments of this application are as follows: Figure 3 As shown, ZC is the frequency capacitive reactance in the capacitor-grounded form.

[0051] As shown in the figure, when the antenna operating frequency is higher than 1.7 GHz, the coupling distance d between the metal body 103 and the antenna radiator 101 is 0.01 mm, and the coupling area S is 10 mm². 2 The dielectric constant ξ of the insulating medium 104 filling the coupling region is 3.2. At this time, the equivalent impedance of the coupling ground can reach within 4Ω, which can achieve good grounding.

[0052] According to the principle of parallel plate capacitors, for a low-frequency antenna operating at 700MHz, with the same dielectric constant ξ = 3.2 in the coupling region, in order to achieve a coupling grounding impedance of less than 4Ω, since capacitive reactance is inversely proportional to frequency, the ratio of coupling area to coupling distance needs to be increased to 1.7GHz / 700MHz, or 17 / 7.

[0053] Based on the design and data analysis above, it can be seen that by setting an appropriate coupling capacitor for the operating frequency and converting it into the corresponding coupling area and coupling spacing, the coupling capacitor grounding of the antenna in the metal frame of the screen can be achieved.

[0054] Optionally, the first frequency band is 1.7 GHz, and the first capacitance is 30 pF.

[0055] In some embodiments, the antenna structure can be designed as a high-frequency antenna with an operating frequency band of 1.7 GHz. In this case, the target value of the coupling capacitance can be designed to be 30 pF. That is, by designing the coupling distance d and coupling area S between the metal body 103 and the antenna radiator 101, the equivalent capacitance value can reach 30 pF to ensure that the equivalent capacitive reactance is small, such as within 4 Ω, thereby achieving good grounding of the antenna radiator 101.

[0056] Optionally, the distance between the metal body 103 and the antenna radiator 101 is 0.01 mm, and the area of ​​the first region is 10 mm². 2 The dielectric constant of insulating medium 104 is 3.2.

[0057] Furthermore, in some embodiments, to achieve a coupling equivalent capacitance of 30pF between the metal body 103 and the antenna radiator 101, the specific coupling parameters between the metal body 103 and the antenna radiator 101 can be designed as follows: coupling distance d = 0.01mm, and direct coupling area S = 10mm². 2 The dielectric constant ξ of the insulating medium 104 in the coupling region is 3.2.

[0058] It should be noted that the metal body 103 is typically conductive foam. After being placed between the antenna radiator 101 and the antenna ground 102, it will be compressed and deformed, increasing its projected area on the antenna radiator 101. Specifically, the projected area, i.e., the coupling area S, on the antenna radiator 101 can be designed to be 10 mm² in its natural state. 2 .

[0059] As can be seen from the above embodiments of this application, the embodiments of this application can achieve the following technical effects:

[0060] 1) Reduced process cost: After the LCM auxiliary metal body is coupled and grounded, there is no need to weld the gold-plated surface component required for DC grounding on the antenna radiator 101 (usually, laser engraving is required to weld the gold-plated sheet to avoid passive intermodulation), which simplifies the antenna carrier processing technology and reduces the process cost of the antenna carrier.

[0061] 2) Enhance the effectiveness of high-frequency grounding: Capacitive grounding has lower capacitive reactance at high frequencies and only requires setting an appropriate coupling capacitor. However, existing DC grounding methods are limited by the process or size of the metal body 103, making it difficult to achieve a breakthrough in high-frequency inductive reactance.

[0062] 3) In some embodiments, the anodic oxide layer on the surface of the antenna radiator 101 can be removed, thereby further reducing the coupling spacing and enhancing the grounding effect of the coupling capacitor.

[0063] The coupling grounding scheme provided in this application embodiment can be applied to various antenna designs, significantly reducing the need for DC power connections within the mobile terminal antenna system. For example, this coupling grounding is applied to mid-to-high frequency antenna designs, Global Positioning System (GPS) L1 / GPS L2 antenna designs, Wireless Fidelity (WIFI) antenna designs, sub-band Sub 6G antenna grounding designs, and other antenna designs. The frequency bands for each antenna are illustrated below: Mid-to-high frequency: 1.71GHz to 2.69GHz; Intermediate frequency: 1.71GHz to 2.17GHz; High frequency: 2.3GHz to 2.69GHz; GPS L5: 1176MHz ± 1MHz; GPS L1: 1575MHz ± 1MHz.

[0064] An antenna structure according to an embodiment of this application includes: an antenna radiator, an antenna ground plane, and a metal body. The metal body is disposed between the antenna radiator and the antenna ground plane, and an insulating material is filled between the metal body and the antenna radiator. The metal body is electrically connected to the antenna ground plane. Thus, this embodiment of the application, by designing a coupling grounding structure between the antenna radiator and the metal body, eliminates the need for an elastic connecting component between them to achieve electrical connection. Compared to existing methods that directly ground the antenna using elastic connecting components, this not only ensures better grounding stability but also eliminates the need for a gold-plated surface on the antenna radiator, simplifying the antenna radiator manufacturing process and reducing manufacturing costs.

[0065] This application also provides an electronic device, which includes the antenna structure described in the foregoing embodiments. The electronic device achieves the same technical effects as the foregoing embodiments, and therefore will not be repeated here to avoid repetition.

[0066] Other components of the electronic device according to embodiments of this application, such as processors and controllers, as well as its operation, are known to those skilled in the art and will not be described in detail here.

[0067] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0068] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An antenna structure, characterized in that, It includes an antenna radiator, an antenna ground plane, and a metal body. The metal body is disposed between the antenna radiator and the antenna ground plane. An insulating medium is filled between the metal body and the antenna radiator, and the metal body is electrically connected to the antenna ground plane.

2. The antenna structure according to claim 1, characterized in that, The insulating medium is filled only between the first region of the antenna radiator and the metal body, where the first region is the projection area of ​​the metal body onto the antenna radiator.

3. The antenna structure according to claim 1, characterized in that, The side of the antenna radiator facing the metal body is provided with a micron-level insulating layer.

4. The antenna structure according to claim 1, characterized in that, The side of the antenna radiator facing the metal body has an anodized layer.

5. The antenna structure according to claim 1, characterized in that, The side of the antenna radiator facing the metal body has a conductive layer, the insulating medium covers the conductive layer, and the distance between the metal body and the antenna radiator is less than 10 μm.

6. The antenna structure according to any one of claims 1 to 5, characterized in that, The antenna structure operates in a first frequency band, the equivalent capacitance between the metal body and the antenna radiator is a first capacitance value, the equivalent impedance between the metal body and the antenna radiator is less than a first resistance value, and the first frequency band is the mid-to-high frequency (MHB) band. Alternatively, the antenna structure operates in a second frequency band, the equivalent capacitance between the metal body and the antenna radiator is a second capacitance value, the equivalent impedance between the metal body and the antenna radiator is less than the second resistance value, the second frequency band is a low-frequency (LB) band, and the second capacitance value is greater than the first capacitance value.

7. The antenna structure according to claim 6, characterized in that, The ratio of the second capacitance value to the first capacitance value is equal to the ratio of the first frequency band to the second frequency band.

8. The antenna structure according to claim 6, characterized in that, The first frequency band is 1.7 GHz, and the first capacitance is 30 pF.

9. The antenna structure according to claim 8, characterized in that, The distance between the metal body and the antenna radiator is 0.01 mm, and the area of ​​the projected region of the metal body on the antenna radiator is 10 mm². 2 The dielectric constant of the insulating medium is 3.

2.

10. An electronic device, characterized in that, The antenna structure includes any one of claims 1 to 9.

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