A heat dissipation auxiliary device adapted to a surface-emitting laser projection device

By using a combination of liquid cooling and air cooling technology and modularly designed heat dissipation components, the problem of high maintenance costs for heat dissipation components in surface-emitting laser projection devices has been solved, achieving efficient heat dissipation and quick disassembly and assembly, thus reducing maintenance time.

CN224438228UActive Publication Date: 2026-06-30SUZHOU OPTONTECH LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU OPTONTECH LTD
Filing Date
2025-08-22
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The heat dissipation components of existing surface-emitting laser projection devices are fixedly connected to the laser housing, resulting in high maintenance costs and long maintenance cycles. Furthermore, the single air-cooling or liquid-cooling method has low compatibility and low heat dissipation efficiency.

Method used

It adopts a combined liquid cooling and air cooling technology, which transfers heat through heat conduction plates and heat conduction pipes, combined with fan components to force airflow, realizes the modular design of heat dissipation components, and uses limiting components to achieve quick assembly and disassembly.

Benefits of technology

It improves heat dissipation efficiency, reduces maintenance costs and time, enables quick disassembly and installation of heat dissipation components, and prevents heat from accumulating at the bottom of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a heat dissipation auxiliary device adapted to a surface-emitting laser projection device, relating to the field of laser equipment heat dissipation technology. The technical solution includes a laser housing, a heat dissipation shell at the bottom of the laser housing, a heat dissipation component inside the heat dissipation shell, and limiting components on both sides of the heat dissipation shell. The heat dissipation component includes multiple retaining frames, with heat-conducting plates inserted inside the retaining frames, and multiple heat-conducting pipes installed on one side of the heat-conducting plates. This utility model employs a combined liquid cooling and air cooling technology. The heat-conducting pipes rapidly dissipate heat from the heat-conducting plates through phase change heat transfer, while the fan component forces airflow to accelerate heat dissipation. The synergistic effect of these two technologies improves heat dissipation efficiency. The heat dissipation component is detachably connected to the heat dissipation shell via retaining frames and retaining shells. The limiting components enable quick assembly and disassembly of the heat dissipation shell and the laser housing. Maintenance does not require destructive disassembly; simply rotating a knob unlocks the limiting components, shortening maintenance time.
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Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for laser equipment, specifically to a heat dissipation auxiliary device adapted to a surface-emitting laser projection device. Background Technology

[0002] Surface-emitting laser projection devices are widely used in laser display, 3D sensing, and industrial inspection due to their good beam uniformity and high integration. However, the core light-emitting unit (such as VCSEL array) of such devices generates a lot of heat when operating at high power.

[0003] Existing heat dissipation components are mostly fixedly connected to the laser housing (such as by welding or riveting), which requires destructive disassembly for later maintenance, resulting in high maintenance costs and long cycles. Furthermore, the compatibility of single air cooling or liquid cooling methods is low, and the heat dissipation efficiency is low. Utility Model Content

[0004] Therefore, this utility model provides a heat dissipation auxiliary device adapted to a surface-emitting laser projection device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation auxiliary device adapted to a surface-emitting laser projection device, comprising a laser housing, a heat dissipation shell at the bottom of the laser housing, a heat dissipation component inside the heat dissipation shell, and limiting components on both sides of the heat dissipation shell;

[0006] The heat dissipation assembly includes multiple card frames, with a heat-conducting plate inserted inside each card frame. Multiple heat-conducting pipes are installed on one side of the heat-conducting plate. Both the output and input ends of the multiple heat-conducting pipes are connected to a housing. A connector is installed on one side of the housing. Two card slots are opened on one side of the heat dissipation housing, and the card slots are engaged with the housings. A fan assembly is provided on one side of the heat dissipation housing.

[0007] Preferably, a heat-conducting pad is provided on the top of the heat-conducting plate, and the heat-conducting pad is located inside the heat dissipation housing.

[0008] Preferably, the fan assembly includes a cylinder, a second ventilation mesh plate is fixedly provided on one side of the cylinder, a motor is installed on one side of the second ventilation mesh plate, and the output end of the motor is connected to fan blades.

[0009] Preferably, a first ventilation mesh is installed on the side of the heat dissipation housing away from the fan assembly.

[0010] Preferably, the bottom of the laser housing has multiple grooves.

[0011] Preferably, the laser housing has an inner sliding groove inside, and multiple sliders are fixed on both sides of the heat dissipation housing. The sliders slide inside the inner sliding groove, and two limiting grooves are provided inside the inner sliding groove.

[0012] Preferably, the laser housing has side grooves on both sides.

[0013] Preferably, the limiting component includes a side housing, which is fixedly connected to a heat dissipation housing. A push block is provided inside the side housing, and a threaded rod is fixedly connected to one side of the push block. The threaded rod extends out of the side housing and is threadedly connected to the connection point of the side housing. A knob is fixedly connected to one end of the threaded rod. Through slots are provided on both sides of the side housing. Two connecting plates are provided inside the side housing. The connecting plates are in contact with the push block. A locking block is fixedly provided on one side of the connecting plate and passes through the through slot. Two telescopic rods are fixedly provided on one side of the connecting plate. The telescopic rods are fixedly connected to the inner wall of the side housing, and springs are sleeved on the outside of the telescopic rods.

[0014] The present invention has the following advantages:

[0015] By adopting a combined liquid cooling and air cooling technology, the heat pipe quickly conducts heat from the heat-conducting plate through phase change heat transfer, and the fan assembly forces airflow to accelerate heat dissipation. The synergistic effect of the two improves heat dissipation efficiency. The heat dissipation component is detachably connected to the heat dissipation housing through a clip frame and a clip shell. The limiting component enables quick assembly and disassembly of the heat dissipation housing and the laser housing. Maintenance does not require destructive disassembly; simply rotating the knob unlocks the limit, shortening maintenance time. Attached Figure Description

[0016] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0017] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0018] Figure 1 The overall structural front view provided for this utility model;

[0019] Figure 2 Rear view of the overall structure provided for this utility model;

[0020] Figure 3 The laser housing and heat dissipation housing provided by this utility model are shown in the unfolded view.

[0021] Figure 4 A perspective view of the heat dissipation housing provided by this utility model;

[0022] Figure 5 Exploded view of the heat dissipation component provided by this utility model;

[0023] Figure 6 A sectional view of the side shell provided by this utility model;

[0024] Figure 7 Exploded view of the fan assembly provided by this utility model;

[0025] Figure 8 Provided by this utility model Figure 6 Enlarged view of the structure of section A in the middle;

[0026] Figure 9 A partial cross-sectional view of the laser housing provided by this utility model.

[0027] In the diagram: 1. Laser housing; 2. Heat dissipation housing; 3. First ventilation mesh plate; 4. Side groove; 5. Side housing; 6. Knob; 7. Inner sliding groove; 8. Cylinder; 9. Second ventilation mesh plate; 10. Motor; 11. Clamping case; 12. Connector; 13. Thermal pad; 14. Slider; 15. Thermal plate; 16. Thermal pipe; 17. Clamping frame; 18. Clamping slot; 19. Bottom groove; 20. Fan blade; 21. Threaded rod; 22. Push block; 23. Through groove; 24. Connecting plate; 25. Clamping block; 26. Telescopic rod; 27. Spring; 28. Limiting groove. Detailed Implementation

[0028] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0029] See attached document Figure 1 - Appendix Figure 9The present invention provides a heat dissipation auxiliary device adapted to a surface-emitting laser projection device, including a laser housing 1, a heat dissipation shell 2 at the bottom of the laser housing 1, a heat dissipation component inside the heat dissipation shell 2, and limiting components on both sides of the heat dissipation shell 2.

[0030] The heat dissipation assembly includes multiple retaining frames 17, with a heat-conducting plate 15 inserted inside each retaining frame 17. Multiple heat-conducting pipes 16 are installed on one side of the heat-conducting plate 15. Both the output and input ends of the multiple heat-conducting pipes 16 are connected to retaining cases 11. A connector 12 is installed on one side of the retaining case 11. Two retaining slots 18 are opened on one side of the heat dissipation housing 2. The retaining slots 18 are engaged with the retaining cases 11. A fan assembly is provided on one side of the heat dissipation housing 2. The fan assembly includes a cylinder 8. A second ventilation mesh plate 9 is fixedly provided on one side of the cylinder 8. A motor 10 is installed on one side of the second ventilation mesh plate 9. A fan blade 20 is connected to the output end of the motor 10. A first ventilation mesh plate 3 is installed on the side of the heat dissipation housing 2 away from the fan assembly.

[0031] In this embodiment, during operation, the heat generated by the surface-emitting laser module is transferred to the heat-conducting plate 15 through the heat-conducting pad 13 (the flexible properties of the heat-conducting pad 13 can fill the micro gaps on the contact surface, reducing thermal resistance), and then dispersed by the heat-conducting plate 15 to multiple heat-conducting pipes 16. At this time, the external coolant enters the housing 11 through one of the connectors 12, circulates through the heat-conducting pipes 16, and flows out from the other connector 12. At the same time, the motor 10 is started to drive the fan blades 20 to rotate, forming an airflow path from the second ventilation mesh plate 9, through the heat dissipation housing 2 to remove the heat from the surface of the heat-conducting plate 15 and the heat-conducting pipes 16, and finally out from the first ventilation mesh plate 3, realizing the coordinated heat dissipation of liquid cooling and air cooling.

[0032] In order to achieve the purpose of heat conduction, the device adopts the following technical solution: the top of the heat conduction plate 15 is provided with a heat conduction pad 13, the heat conduction pad 13 is located inside the heat dissipation shell 2, and the heat conduction pad 13 is made of high elastic silicone material to ensure tight contact with the surface emission laser module.

[0033] In order to achieve heat dissipation, the device adopts the following technical solution: the bottom of the laser housing 1 is provided with multiple bottom grooves 19. The design of the bottom grooves 19 provides additional ventilation space for the bottom of the heat dissipation housing 2, so as to avoid heat accumulation at the bottom of the device.

[0034] To achieve the installation purpose, this device adopts the following technical solution: An inner sliding groove 7 is provided inside the laser housing 1; multiple sliders 14 are fixedly provided on both sides of the heat dissipation housing 2, and the sliders 14 slide inside the inner sliding groove 7. Two limiting grooves 28 are provided inside the inner sliding groove 7; side grooves 4 are provided on both sides of the laser housing 1; the limiting assembly includes a side housing 5, which is fixedly connected to the heat dissipation housing 2; a push block 22 is provided inside the side housing 5; a threaded rod 21 is fixedly connected to one side of the push block 22; the threaded rod 21 extends out of the side housing 5 and is threadedly connected to the connection point of the side housing 5; a knob 6 is fixedly connected to one end of the threaded rod 21; through grooves 23 are provided on both sides of the side housing 5; two connecting plates 24 are provided inside the side housing 5; the connecting plates 24 and... The push block 22 contacts each other. A locking block 25 is fixedly provided on one side of the connecting plate 24. The locking block 25 passes through the through groove 23. Two telescopic rods 26 are fixedly provided on one side of the connecting plate 24. The telescopic rods 26 are fixedly connected to the inner wall of the side shell 5. A spring 27 is sleeved on the outside of the telescopic rods 26. The sliders 14 on both sides of the heat dissipation shell 2 are aligned with the inner sliding groove 7 on the inner side of the laser shell 1 and pushed in along the groove to the bottom. At this time, the operator can put his hand into the side grooves 4 on both sides of the laser shell 1 and rotate the knob 6 to drive the threaded rod 21 to rotate. Since the threaded rod 21 is connected to the side shell 5 by threads, its axial movement will push the push block 22 to squeeze the connecting plate 24, so that the connecting plate 24 overcomes the elastic force of the spring 27 and moves outward along the telescopic rod 26. Finally, the locking block 25 passes through the through groove 23 and is locked into the limiting groove 28 of the inner sliding groove 7, thus completing the fixation of the heat dissipation shell 2.

[0035] The usage process of this utility model is as follows: During the installation stage, the modular assembly of the heat dissipation component is completed first. The heat conduction plate 15 is inserted into the card frame 17. Then, multiple heat conduction pipes 16 are inserted into the grooves on the side of the heat conduction plate 15, so that the input end and output end of the heat conduction pipe 16 are respectively connected to the card case 11. Then, the card case 11 is fastened into the card slot 18 of the heat dissipation housing 2. Finally, a heat conduction pad 13 (made of high elastic silicone material to ensure tight contact with the surface-emitting laser module) is laid on the top of the heat conduction plate 15.

[0036] Next, the heat sink housing 2 is connected to the laser housing 1. The sliders 14 on both sides of the heat sink housing 2 are aligned with the inner sliding groove 7 on the inner side of the laser housing 1 and pushed in along the groove to the bottom. At this time, the operator can put his hand into the side grooves 4 on both sides of the laser housing 1 and rotate the knob 6 to drive the threaded rod 21 to rotate. Since the threaded rod 21 is connected to the side housing 5 by threads, its axial movement will push the push block 22 to squeeze the connecting plate 24, so that the connecting plate 24 overcomes the elastic force of the spring 27 and moves outward along the telescopic rod 26. Finally, the locking block 25 passes through the through groove 23 and is locked into the limiting groove 28 of the inner sliding groove 7, thus completing the fixing of the heat sink housing 2.

[0037] During operation, the heat generated by the surface-emitting laser module is transferred to the heat-conducting plate 15 through the heat-conducting pad 13 (the flexible properties of the heat-conducting pad 13 can fill the micro gaps on the contact surface, reducing thermal resistance), and then dispersed by the heat-conducting plate 15 to multiple heat-conducting pipes 16. At this time, the external coolant enters the housing 11 through one of the connectors 12, circulates through the heat-conducting pipes 16, and flows out from the other connector 12. At the same time, the motor 10 is started to drive the fan blades 20 to rotate, forming an airflow path from the second ventilation mesh plate 9, through the heat dissipation housing 2 to remove the heat from the surface of the heat-conducting plate 15 and the heat-conducting pipes 16, and finally out from the first ventilation mesh plate 3, realizing the coordinated heat dissipation of liquid cooling and air cooling.

[0038] When maintenance or replacement of the heat dissipation components is required, rotate the knob 6 in the opposite direction. The push block 22 releases the pressure on the connecting plate 24, and the spring 27 resets, causing the locking block 25 to retract into the through groove 23. The heat dissipation housing 2 can then be pulled out along the inner slide groove 7. Subsequently, the locking shell 11, heat conduction pipe 16, or heat conduction plate 15 can be disassembled separately for maintenance. The design of the bottom groove 19 provides additional ventilation space at the bottom of the heat dissipation housing 2, preventing heat from accumulating at the bottom of the device.

[0039] The above description is merely a preferred embodiment of this utility model. Any person skilled in the art may modify this utility model or modify it into an equivalent technical solution using the technical solutions described above. Therefore, any simple modifications or equivalent substitutions made based on the technical solutions of this utility model are within the scope of protection claimed by this utility model.

Claims

1. A heat dissipation auxiliary device adapted to a surface-emitting laser projection device, comprising a laser housing (1), characterized in that: The laser housing (1) has a heat dissipation housing (2) at the bottom, a heat dissipation component is provided inside the heat dissipation housing (2), and limiting components are provided on both sides of the heat dissipation housing (2); The heat dissipation assembly includes multiple card frames (17), a heat-conducting plate (15) is inserted inside the card frame (17), multiple heat-conducting pipes (16) are installed on one side of the heat-conducting plate (15), and the output and input ends of the multiple heat-conducting pipes (16) are connected to a card case (11). A connector (12) is installed on one side of the card case (11). Two card slots (18) are opened on one side of the heat dissipation housing (2), and the card slots (18) are engaged with the card case (11). A fan assembly is provided on one side of the heat dissipation housing (2).

2. The heat dissipation auxiliary device adapted to a surface-emitting laser projection device according to claim 1, characterized in that: The top of the heat-conducting plate (15) is provided with a heat-conducting pad (13), which is located inside the heat dissipation housing (2).

3. The heat dissipation auxiliary device adapted to a surface-emitting laser projection device according to claim 1, characterized in that: The fan assembly includes a cylinder (8), a second ventilation mesh plate (9) is fixedly provided on one side of the cylinder (8), a motor (10) is installed on one side of the second ventilation mesh plate (9), and a fan blade (20) is connected to the output end of the motor (10).

4. A heat dissipation auxiliary device adapted to a surface-emitting laser projection device according to claim 1, characterized in that: The heat sink housing (2) has a first ventilation mesh plate (3) installed on the side away from the fan assembly.

5. A heat dissipation auxiliary device adapted to a surface-emitting laser projection device according to claim 1, characterized in that: The bottom of the laser housing (1) has multiple bottom grooves (19).

6. A heat dissipation auxiliary device adapted to a surface-emitting laser projection device according to claim 1, characterized in that: The laser housing (1) has an inner sliding groove (7) inside. Multiple sliders (14) are fixed on both sides of the heat dissipation housing (2). The sliders (14) slide inside the inner sliding groove (7). Two limiting grooves (28) are opened inside the inner sliding groove (7).

7. A heat dissipation auxiliary device adapted to a surface-emitting laser projection device according to claim 1, characterized in that: The laser housing (1) has side grooves (4) on both sides.

8. A heat dissipation auxiliary device adapted to a surface-emitting laser projection device according to claim 1, characterized in that: The limiting component includes a side shell (5), which is fixedly connected to the heat dissipation shell (2). A push block (22) is provided inside the side shell (5). A threaded rod (21) is fixedly connected to one side of the push block (22). The threaded rod (21) extends out of the side shell (5) and is connected to the side shell (5) by a thread. A knob (6) is fixedly connected to one end of the threaded rod (21). Through slots (23) are provided on both sides of the side shell (5). Two connecting plates (24) are provided inside the side shell (5). The connecting plates (24) are in contact with the push block (22). A locking block (25) is fixedly provided on one side of the connecting plate (24). The locking block (25) passes through the through slot (23). Two telescopic rods (26) are fixedly provided on one side of the connecting plate (24). The telescopic rods (26) are fixedly connected to the inner wall of the side shell (5). A spring (27) is sleeved on the outside of the telescopic rods (26).