A layered, bend-resistant composite substrate light strip

Abstract

This utility model relates to a layered, bend-resistant composite substrate light strip in the field of composite substrate light strips. It includes a PI film layer, LED beads evenly spaced on the upper end of the PI film layer, a wavy stainless steel wire mesh layer on the lower end surface of the PI film layer, a honeycomb-shaped perforated layer on the lower end surface of the wavy stainless steel wire mesh layer, a silicone buffer layer at the lower end of the honeycomb-shaped perforated layer, and V-shaped stress relief grooves evenly distributed at the bending points on the upper end surface of the PI film layer. Semi-circular silicone covers are provided on the solder joints at both ends of the LED beads. This utility model achieves multi-layered buffering and stress dispersion through the wavy stainless steel wire mesh layer, honeycomb-shaped perforated layer, and silicone buffer layer. Combined with the V-shaped stress relief grooves to guide stress and the semi-circular silicone covers to protect the solder joints, it enhances the substrate's bend resistance, solving the problems of easy damage and short lifespan of traditional light strips, and is suitable for complex environments.

Description

Technical Field

[0001] This utility model relates to the field of composite substrate light strips, specifically to a layered, bend-resistant composite substrate light strip. Background Technology

[0002] In modern decorative, lighting and industrial applications, light strips are favored for their flexible installation and diverse shapes, and often need to be bent and installed in complex environments such as narrow spaces and curved structures.

[0003] However, traditional LED strip substrates mostly use a single-layer structure, with poor material toughness and lack of effective buffering and stress release design. When repeatedly bent or in a bent state for a long time, the circuits inside the substrate are very easy to break due to stress concentration, and the LED lamp bead solder joints will also loosen and fall off due to lack of protection.

[0004] Furthermore, as the requirements for the bending frequency and amplitude of light strips in various application scenarios continue to increase, the lifespan and reliability issues of traditional substrates are becoming increasingly prominent, severely limiting the application and development of light strips in high-end decoration, intelligent lighting and other fields. Utility Model Content

[0005] The purpose of this invention is to address the above-mentioned defects and provide a layered, bend-resistant composite substrate light strip. Structurally, it adopts a multi-layered composite design, and through the synergistic effect of structures such as a wavy stainless steel wire mesh layer and a honeycomb hollow layer, it solves the technical problems of easy circuit breakage, easy LED chip detachment, short substrate life, and poor reliability in the existing technology during the bending process of the light strip.

[0006] The objective of this utility model is achieved through the following means:

[0007] A layered, bend-resistant composite substrate light strip includes a PI film layer, LED beads evenly spaced on the upper end of the PI film layer, a wavy stainless steel wire mesh layer on the lower end surface of the PI film layer, a honeycomb-shaped perforated layer on the lower end surface of the wavy stainless steel wire mesh layer, a silicone buffer layer at the lower end of the honeycomb-shaped perforated layer, V-shaped stress relief grooves evenly distributed at the bending points on the upper end surface of the PI film layer, and semi-circular silicone protective covers on the outside of the solder joints at both ends of the LED beads.

[0008] Furthermore, the semi-circular silicone cap is molded with the PI film layer.

[0009] Furthermore, the V-shaped stress relief groove penetrates the PI film layer and extends into the interior of the corrugated stainless steel wire mesh layer, and the V-shaped stress relief groove is integrally formed with the PI film layer and the corrugated stainless steel wire mesh layer.

[0010] Furthermore, the upper surface of the honeycomb-shaped perforated layer is fixedly connected to the wavy stainless steel wire mesh layer, and the lower surface of the honeycomb-shaped perforated layer is fixedly connected to the silicone buffer layer.

[0011] Furthermore, the upper sides of the V-shaped stress relief groove are provided with limiting strips, and the limiting strips are fixedly connected to the PI film layer.

[0012] Furthermore, the lower end of the silicone buffer layer has rubber bumps distributed in an array, and the rubber bumps are fixedly connected to the silicone buffer layer.

[0013] The beneficial effects of this utility model are:

[0014] This utility model achieves multi-layer buffering and stress dispersion effects by setting a wavy stainless steel wire mesh layer, a honeycomb hollow layer, and a silicone buffer layer, which enhances the flexibility and bending resistance of the substrate. The V-shaped stress relief groove can effectively dissipate the stress generated by bending, while the semi-circular silicone cover protects the LED lamp bead solder joints and prevents the solder joints from cracking. It has the advantages of reasonable structure and high reliability, and solves the problems of easy damage and short life of traditional light strip substrates when bent. It is suitable for a variety of complex installation environments. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a layered, bend-resistant composite substrate light strip according to the present invention.

[0016] Figure 2 for Figure 1 A magnified view of part A in the diagram;

[0017] Figure 3 This is a three-dimensional view of the bottom structure of a layered, bend-resistant composite substrate light strip according to the present invention.

[0018] In the diagram, 1. PI film layer; 2. Corrugated stainless steel wire mesh layer; 3. Silicone buffer layer; 4. Honeycomb hollow layer; 5. LED beads; 6. Semi-circular silicone cover; 7. V-shaped stress relief groove; 8. Limiting strip; 9. Rubber bumps. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. This embodiment refers to... Figures 1-3The specific implementation of the layered anti-bending composite substrate light strip includes a PI film layer 1, LED beads 5 are equidistantly arranged on the upper end of the PI film layer 1, a wavy stainless steel wire mesh layer 2 is arranged on the lower end surface of the PI film layer 1, a honeycomb hollow layer 4 is arranged on the lower end surface of the wavy stainless steel wire mesh layer 2, a silicone buffer layer 3 is arranged at the lower end of the honeycomb hollow layer 4, V-shaped stress relief grooves 7 are equidistantly distributed at the bending point of the upper end surface of the PI film layer 1, and semi-circular silicone protective covers 6 are arranged on the outside of the solder joints at both ends of the LED beads 5.

[0020] like Figure 1 and Figure 2 As shown, the semi-circular silicone cover 6 is molded with the PI film layer 1. When the light strip bends towards the LED bead 5, the solder joint will be squeezed. The semi-circular silicone cover 6 tightly wraps around the solder joint and absorbs the stress generated by the compression with its own elastic deformation ability, preventing the solder joint from cracking due to local stress concentration. At the same time, the arc-shaped structure of the semi-circular silicone cover 6 fits tightly with the solder joint and can provide uniform support for the solder joint during bending, disperse stress, and protect the electrical connection stability of the solder joint.

[0021] like Figure 1 and Figure 2 As shown, the V-shaped stress relief groove 7 penetrates the PI film layer 1 and extends into the interior of the corrugated stainless steel wire mesh layer 2. The V-shaped stress relief groove 7 is integrally formed with the PI film layer 1 and the corrugated stainless steel wire mesh layer 2.

[0022] like Figure 1 and Figure 2 As shown, the upper end of the honeycomb-shaped hollow layer 4 is fixedly connected to the wavy stainless steel wire mesh layer 2, and the lower end of the honeycomb-shaped hollow layer 4 is fixedly connected to the silicone buffer layer 3. The honeycomb-shaped hollow layer 4 is made of polycarbonate material. The honeycomb structure ensures a certain structural strength, and when the light strip is bent, its unique geometry can guide stress along the honeycomb wall to avoid stress concentration. In addition, the hollow design increases the air circulation channel, which helps to improve the heat dissipation performance of the light strip. Together with other structures, it ensures that the light strip maintains a good working condition while resisting bending.

[0023] like Figure 1 and Figure 2 As shown, the upper sides of the V-shaped stress relief groove 7 are provided with limiting strips 8, and the limiting strips 8 are fixedly connected to the PI film layer 1. When the light strip bends toward the side of the LED bead 5, the V-shaped stress relief groove 7 clamps, and the two limiting strips 8 collide to limit the bending and prevent the light strip from bending too much.

[0024] like Figure 3As shown, the lower end of the silicone buffer layer 3 has rubber protrusions 9 arranged in an array, and the rubber protrusions 9 are fixedly connected to the silicone buffer layer 3. The rubber protrusions 9 are truncated cones and made of soft rubber. When the light strip is bent, the rubber protrusions 9 can generate elastic friction with the contact surface, which not only plays a certain role in preventing slippage and preventing the light strip from sliding on the installation surface and causing additional stress, but also buffers external pressure through its own elastic deformation, and evenly distributes the pressure to the silicone buffer layer 3, further enhancing the light strip's resistance to bending stress.

[0025] The working principle of the layered anti-bending composite substrate light strip in this embodiment is as follows: Stress dispersion is crucial during the bending process of the light strip. The upper PI film layer 1, with its high elasticity and tensile strength, first resists tensile stress, preventing the light strip from breaking due to stretching. The wavy stainless steel wire mesh layer 2 on the lower surface of the PI film layer 1, utilizing its unique wavy shape and mesh structure, disperses stress through its own deformation during bending. The honeycomb-shaped perforated layer 4, connected to the wavy stainless steel wire mesh layer 2, is made of polycarbonate material. Its honeycomb geometry guides stress along the honeycomb walls, avoiding stress concentration. Simultaneously, the perforated design facilitates heat dissipation. The silicone buffer layer 3 at the lower end of the honeycomb-shaped perforated layer 4, with its soft properties, absorbs and buffers the stress generated during bending, protecting the internal structure.

[0026] The semi-circular silicone cover 6 plays a crucial role in protecting the solder joints of the LED beads 5. Molded together with the PI film layer 1, the semi-circular silicone cover 6 absorbs the stress generated by the compression when the LED strip bends towards the LED beads 5, preventing cracking due to localized stress concentration. Its arc-shaped structure fits tightly to the solder joint, providing uniform support during bending and ensuring the stability of the electrical connection.

[0027] In terms of controlling the degree of bending, V-shaped stress relief grooves 7, evenly distributed at the bending point on the upper surface of the PI film layer 1, penetrate the PI film layer 1 and extend into the interior of the corrugated stainless steel wire mesh layer 2, integrally formed with the PI film layer 1 and the corrugated stainless steel wire mesh layer 2. When the light strip bends, the stress in the V-shaped stress relief grooves 7 is released and dispersed at the grooves, achieving a smaller bending radius. At the same time, the limiting strips 8 set on both sides of the upper end of the V-shaped stress relief grooves 7 are fixedly connected to the PI film layer 1. When the light strip bends towards the side of the LED beads 5, the V-shaped stress relief grooves 7 clamp, and the two limiting strips 8 collide to limit the bending, preventing the light strip from bending excessively.

[0028] In addition, the rubber protrusions 9 arranged in an array at the lower end of the silicone buffer layer 3 are soft rubber structures in the shape of a frustum of a cone. When the light strip is bent, the rubber protrusions 9 generate elastic friction with the contact surface, which plays an anti-slip role and prevents the light strip from sliding and generating additional stress. At the same time, the rubber protrusions 9 buffer external pressure through their own elastic deformation and evenly distribute the pressure to the silicone buffer layer 3, further enhancing the light strip's resistance to bending stress. All the structures work together to ensure that the light strip maintains good performance and a long service life even under frequent bending.

[0029] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A layered anti-bending composite substrate light strip comprising a PI film layer, the upper end of the PI film layer is provided with LED lamp beads equidistantly, characterized in that: The lower end face of the PI film layer is provided with a wavy stainless steel wire mesh layer, the lower end face of the wavy stainless steel wire mesh layer is provided with a honeycomb hollow layer, the lower end of the honeycomb hollow layer is provided with a silicone buffer layer, the upper end face of the PI film layer is provided with V-shaped stress relief grooves at equal intervals at the bends, and the solder joints at both ends of the LED lamp bead are provided with semi-circular silicone protective covers.

2. The layered kink-resistant composite substrate light strip of claim 1, wherein: The semi-circular silicone cap is molded with a PI film layer.

3. The layered kink-resistant composite substrate light strip of claim 1, wherein: The V-shaped stress relief groove penetrates the PI film layer and extends into the interior of the corrugated stainless steel wire mesh layer. The V-shaped stress relief groove is integrally formed with the PI film layer and the corrugated stainless steel wire mesh layer.

4. The layered kink-resistant composite substrate light strip of claim 1, wherein: The upper surface of the honeycomb-shaped perforated layer is fixedly connected to the wavy stainless steel wire mesh layer, and the lower surface of the honeycomb-shaped perforated layer is fixedly connected to the silicone buffer layer.

5. The layered, bend-resistant composite substrate light strip according to claim 1, characterized in that: Limiting strips are provided on both sides of the upper inner end of the V-shaped stress relief groove, and the limiting strips are fixedly connected to the PI film layer.

6. The layered kink-resistant composite substrate light strip of claim 1, wherein: The lower end of the silicone buffer layer has rubber bumps arranged in an array, and the rubber bumps are fixedly connected to the silicone buffer layer.

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