Earphone pressure detection sensor

Abstract

This utility model relates to an earphone pressure detection sensor, including a pressure-sensitive deformation layer capable of reflecting pressure through deformation and capable of deformation itself. The pressure-sensitive deformation layer has pressure-transmitting structural components and deformation spaces on both sides, allowing the layer to deform. The deformation spaces are located between the pressure-sensitive deformation layer and the earphone circuit board, with the structural components positioned above the deformation spaces. The pressure-sensitive deformation layer and the earphone circuit board are electrically connected to transmit electrical signals. When a user presses the earphone shell, the force on the shell is transmitted to the pressure-sensitive deformation layer via the structural components. The layer deforms within the deformation space under this force, and the deformation signal is converted into an electrical signal, which is then transmitted to the earphone circuit board. This application uses deformation signals to express pressure, has no special requirements for the earphone shell material, and can still be triggered normally when other media are present on the earphone shell surface, thus achieving the purpose of normal triggering of pressure signals.

Description

Technical Field

[0001] This utility model relates to the field of smart earphone technology, and in particular to an earphone pressure detection sensor. Background Technology

[0002] With the rapid development of smart 3C devices, people have placed higher demands on wireless Bluetooth headsets, making enhanced human-computer interaction a hot research and development area. Researchers are incorporating pressure sensors into wireless Bluetooth headsets to receive the amount of pressure applied by the user, thereby generating different responses or implementing different functions based on varying pressure levels.

[0003] Conventional pressure-sensing headphones often use capacitive pressure sensing, which relies on changes in capacitance to detect external pressure or deformation. However, capacitive pressure sensing is often dependent on the surface being pressed; if other media are present on the headphone shell, the signal may not trigger correctly. Therefore, there is a pressing need for a headphone pressure sensor that is unaffected by the media on the headphone shell surface. Utility Model Content

[0004] To address the limitation that capacitive pressure detection schemes may fail to trigger properly when other media are present on the earphone shell surface, this invention proposes an earphone pressure detection sensor.

[0005] The technical solution adopted by this utility model is an earphone pressure detection sensor, including a pressure-sensitive deformation layer. One side of the pressure-sensitive deformation layer is electrically connected to the earphone circuit board and a deformation space is formed between the two. The other side of the pressure-sensitive deformation layer is fixedly connected to a structural component, and the structural component is located above the deformation space. The end of the structural component away from the pressure-sensitive deformation layer abuts against the earphone shell.

[0006] Preferably, the pressure-sensitive deformation layer and the headphone circuit board are electrically connected by solder points, and the solder points create a gap between them to form a deformation space.

[0007] Preferably, a deformation space is formed between the two welding points, and the structural component is positioned in the middle above the deformation space. This allows the headphone pressure sensor to function as a component that can be directly soldered onto the circuit board, simplifying the assembly process.

[0008] Preferably, the pressure-sensitive deformation layer includes an elastic substrate layer and a polymer material oil film printing layer, wherein the polymer material oil film printing layer is printed on the elastic substrate layer to form a Wheatstone bridge. The pressure-sensitive deformation layer can incorporate other pressure-sensitive solutions, such as various pressure-sensitive modules including metal strain gauges, silicon strain gauges, and piezoelectric ceramics.

[0009] Preferably, the elastic base layer is fixed by bonding the adhesive layer and structural components.

[0010] Preferably, the structural component is a T-shaped structure, with the wider side of the T-shaped structure abutting against the earphone shell. Compared to the previous direct adhesive-backed pressure-sensitive solution, the T-shaped structure allows for greater strain transmission and better pressure sensitivity.

[0011] Preferably, the end of the structural component away from the pressure-sensitive deformation layer is abutted against the headphone shell by a compressible elastic element.

[0012] Preferably, the compressible elastic element has an initial preload after loading.

[0013] Preferably, the contact surface of the compressible elastic element is spherical.

[0014] Preferably, the compressible elastic element is silicone or foam.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] This application discloses an earphone pressure detection sensor, including a pressure-sensitive deformation layer capable of reflecting pressure magnitude through deformation and capable of deformation itself. The pressure-sensitive deformation layer has pressure-transmitting structural components and deformation spaces on both sides, allowing the layer to deform. The deformation spaces are located between the pressure-sensitive deformation layer and the earphone circuit board, with the structural components positioned above the deformation spaces. The pressure-sensitive deformation layer and the earphone circuit board are electrically connected to transmit electrical signals. When a user presses the earphone shell, the force on the earphone shell is transmitted to the pressure-sensitive deformation layer via the structural components. The pressure-sensitive deformation layer deforms within the deformation space under this force, and the deformation signal is converted into an electrical signal, which is then transmitted to the earphone circuit board. This application uses deformation signals to express pressure magnitude. Compared to capacitive pressure detection, it has no special requirements for the earphone shell material and can still be triggered normally when other media are present on the earphone shell surface.

[0017] Compared with the prior art, the headphone pressure detection sensor disclosed in this application can achieve the purpose of normal triggering of pressure signals. Attached Figure Description

[0018] The present invention will now be described in detail with reference to the embodiments and accompanying drawings, wherein:

[0019] Figure 1 A schematic diagram of the structure of an earphone pressure detection sensor according to an embodiment of the present invention is shown.

[0020] Label Explanation:

[0021] 10. Earphone shell; 20. Compressible elastic component; 30. Structural component; 40. Elastic base layer; 50. Soldering point; 60. Polymer material oil film printing layer; 70. Earphone circuit board. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Examples of embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0023] This utility model discloses an earphone pressure detection sensor. Please refer to [reference needed]. Figure 1 It includes a pressure-sensitive deformation layer, one side of which is electrically connected to the headphone circuit board 70 and a deformation space is formed between them. The other side of the pressure-sensitive deformation layer is fixedly connected to the structural member 30 and the structural member 30 is located above the deformation space. The end of the structural member 30 away from the pressure-sensitive deformation layer abuts against the headphone shell 10.

[0024] The device includes a pressure-sensitive deformation layer that reflects pressure magnitude through deformation and is capable of deformation itself. Each side of the pressure-sensitive deformation layer has a pressure-transmitting structural component 30 and a deformation space for deformation. The deformation space is located between the pressure-sensitive deformation layer and the headphone circuit board 70, with the structural component 30 positioned above the deformation space. The pressure-sensitive deformation layer and the headphone circuit board 70 are electrically connected to transmit electrical signals. When a user presses the headphone shell 10, the force on the headphone shell 10 is transmitted to the pressure-sensitive deformation layer via the structural component 30. The pressure-sensitive deformation layer deforms within the deformation space under this force, and the deformation signal is converted into an electrical signal, which is then transmitted to the headphone circuit board 70. This application uses a deformation signal to express pressure magnitude. Compared to capacitive pressure detection, this method does not have special requirements for the material of the headphone shell 10 and can still trigger normally even when other media are present on the surface of the headphone shell. Compared to existing technologies, the headphone pressure detection sensor disclosed in this application can achieve the purpose of normal triggering of pressure signals.

[0025] Since the headphone pressure sensor disclosed in this application can be located entirely inside the headphone, and there are no special requirements for the material of the headphone housing 10, it is not necessary to drill holes in the headphone housing 10 for the position where the headphone pressure sensor is installed, nor is it necessary to change the material used at the installation position. This allows the headphone housing 10 manufactured in this way to have higher waterproof performance, and also provides greater overall structural strength.

[0026] It should be noted that deformation space can be formed in various ways. For example, if the pressure-sensitive deformation layer and / or the headphone circuit board 70 has an arched structure, deformation space can be formed at the arched structure; or if there is a protruding structure, deformation space can be formed between the protruding structures. In addition to forming deformation space through its own structure, deformation space can also be formed by adding a partition structure such as a mounting block between the two.

[0027] The pressure-sensitive deformation layer refers to a structure that can react to pressure through its own deformation and convert the deformation into an electrical signal, which is then transmitted to the headphone circuit board 70. Electrical connections can be made by directly surface-mounting the pressure-sensitive deformation layer onto the headphone circuit board 70 without using wires or connectors. Alternatively, flexible wiring can be used to provide an electrical connection between the pressure-sensitive deformation layer and the headphone circuit board 70.

[0028] It should be explained that the deformation space between the headphone circuit board 70 and the pressure-sensitive deformation layer does not mean that there are no other structures in the headphone between the headphone circuit board 70 and the pressure-sensitive deformation layer. It is also possible that other structures in the headphone form a deformation space with the pressure-sensitive deformation layer. In this case, the other structures in the headphone can also be considered as part of the headphone circuit board 70.

[0029] In some embodiments, please refer to Figure 1 The pressure-sensitive deformation layer and the headphone circuit board 70 are electrically connected by solder points 50, and the solder points 50 create a gap between them to form a deformation space.

[0030] Specifically, the pressure-sensitive deformation layer and the headphone circuit board 70 are electrically connected via solder points 50. The soldering material used for solder points 50 is solder, etc. Since solder points 50 require a certain amount of space, a gap is formed between the pressure-sensitive deformation layer and the headphone circuit board 70, thus creating a deformation space. It should be explained that the range of adjustable deformation of the pressure-sensitive deformation layer under the required pressure can accommodate deformation spaces of different heights and sizes. Electrically connecting and forming a deformation space through solder points 50 minimizes the thickness of the headphone pressure sensor, reducing its size within the headphone. It also avoids the need for additional structures or processes to achieve the electrical connection and deformation space formation, thereby minimizing product manufacturing costs.

[0031] In some specific embodiments, please refer to Figure 1 A deformation space is formed between the two welding points 50, and the structural component 30 is positioned in the middle above the deformation space.

[0032] Specifically, a deformation space is formed between the two welding points 50, and the structural component 30 is positioned in the middle above the deformation space. This arrangement allows the user to obtain a uniform pressing sensation when pressing on the earphone shell 10; the symmetrical structure makes the overall structure more stable; and it reduces the amount of calculation required when the placement is asymmetrical, resulting in a more accurate output of electrical signals.

[0033] In some embodiments, please refer to Figure 1 The pressure-sensitive deformation layer includes an elastic substrate layer 40 and a polymer material oil film printing layer 60, which is printed on the elastic substrate layer 40 to form a Wheatstone bridge.

[0034] It should be noted that, in order to further reduce the size of the headphone pressure sensor, a polymer material film is printed on the elastic substrate layer 40, forming a Wheatstone bridge. This avoids directly mounting the Wheatstone bridge on the elastic substrate layer 40, while still achieving a smaller size. The structural component 30 disclosed in this application can adjust its thickness and height according to specific needs to adapt to use in different headphone models.

[0035] In other embodiments, the pressure-sensitive deformation layer can be made of strain gauge pressure sensors or piezoelectric pressure sensors. The pressure-sensitive deformation layer can incorporate other pressure-sensing solutions, such as various pressure-sensing modules including metal strain gauges, silicon strain gauges, and piezoelectric ceramics.

[0036] In some specific embodiments, the elastic base layer 40 is bonded and fixed to the structural member 30 by an adhesive layer.

[0037] In order to achieve a tight connection between the elastic base layer 40 and the structural component 30 without increasing the size or thickness, the elastic base layer 40 is bonded and fixed to the structural component 30 by other types of adhesives such as epoxy film, polyurethane film, or acrylic film.

[0038] In some embodiments, please refer to Figure 1 The structural component 30 is a T-shaped structure, with the wide side of the T-shaped structure abutting against the headphone shell 10.

[0039] It should be noted that, in order to increase the stability between the structural component 30 and the earphone shell 10, the structural component 30 is T-shaped, and the wide side of the T-shaped structure abuts against the earphone shell 10, thereby obtaining a larger contact area. The wide side of the T-shaped structure can match the shape of the inner wall of the earphone shell 10, which still falls within the defined range of a T-shaped structure.

[0040] In other embodiments, the structural member 30 may also be rod-shaped, column-shaped, square-shaped, or other similar shapes.

[0041] In some embodiments, please refer to Figure 1 The end of the structural component 30 away from the pressure-sensitive deformation layer is abutted against the earphone shell 10 through the compressible elastic element 20.

[0042] Specifically, the structural component 30, the compressible elastic component 20, and the earphone shell 10 are connected sequentially, so that the structural component 30 abuts against the earphone shell 10 through the compressible elastic component 20. This arrangement makes the user's pressing action smoother and increases the stroke of the pressing action. Compared to directly making the pressing distance equal to the deformation depth of the pressure-sensitive deformation layer, the compressible elastic component 20 can provide a buffering effect for the deformation of the pressure-sensitive deformation layer and make the deformation process of the pressure-sensitive deformation layer smoother, thereby improving the service life and stability of the pressure-sensitive deformation layer. In addition, the compressible elastic component 20 can also absorb some assembly tolerances during assembly, reducing the difficulty of the assembly process.

[0043] In some specific embodiments, the compressible elastic element 20 has an initial preload after loading.

[0044] It should be noted that setting the initial preload helps keep the headphone pressure sensor in its initial state, which is beneficial for sensitively identifying the amount of pressure applied by the user.

[0045] In some specific embodiments, please refer to Figure 1 The contact surface of the compressible elastic element 20 is spherical.

[0046] It should be noted that since the compressible elastic element 20 only abuts against the earphone shell 10, the earphone shell 10 will tilt slightly relative to the compressible elastic element 20 when the user's pressure is not applied directly above it. To ensure stable contact even when tilted, the contact surface of the compressible elastic element 20 is spherical.

[0047] In some specific embodiments, the compressible elastic element 20 is silicone or foam.

[0048] Silicone or foam is fixed to structural component 30 by means of dispensing and injection molding.

[0049] In the description of this specification, the terms "Embodiment 1," "this embodiment," or "in one embodiment," etc., indicate that the specific features, structures, materials, or characteristics described in connection with that embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example; moreover, the specific features, structures, materials, or characteristics described may be combined in any appropriate manner in one or more embodiments or examples.

[0050] In the description of this specification, the terms "connection," "installation," "fixing," "setting," and "having" are interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0051] In the description of this specification, relational terms such as “first” and “second” are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase “comprising one…” does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0052] The above description of the embodiments is intended to enable those skilled in the art to understand and apply the technology of this invention. Those skilled in the art can readily make various modifications to these examples and apply the general principles described herein to other embodiments without creative effort. Therefore, this invention is not limited to the above embodiments. Modifications in the following situations should be within the scope of protection of this invention: ① New technical solutions implemented based on the technical solution of this utility model and combined with existing common knowledge, where the technical effects of the new technical solution do not exceed the technical effects of this utility model; ② Equivalent substitutions of some features of the technical solution of this utility model using known technology, resulting in the same technical effects as those of this utility model; ③ Extendable technical solutions based on the technical solution of this utility model, where the substantive content of the extended technical solution does not exceed the technical solution of this utility model; ④ Equivalent transformations made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields.

Claims

1. An earphone pressure detection sensor, characterized by, The device includes a pressure-sensitive deformation layer, one side of which is electrically connected to the headphone circuit board and a deformation space is formed between them. The other side of the pressure-sensitive deformation layer is fixedly connected to a structural component, which is located above the deformation space. The end of the structural component away from the pressure-sensitive deformation layer abuts against the headphone housing.

2. The earphone pressure detection sensor of claim 1, wherein, The pressure-sensitive deformation layer and the headphone circuit board are electrically connected by solder joints, and the solder joints create a gap between them to form the deformation space.

3. The earphone pressure detection sensor of claim 2, wherein, The deformation space is formed between the two welding points, and the structural member is positioned at the middle above the deformation space.

4. The earphone pressure detection sensor of claim 1, wherein, The pressure-sensitive deformation layer includes an elastic substrate layer and a polymer material oil film printing layer, wherein the polymer material oil film printing layer is printed on the elastic substrate layer to form a Wheatstone bridge.

5. The earphone pressure detection sensor according to claim 4, wherein The elastic base layer is bonded and fixed to the structural component by an adhesive layer.

6. The earphone pressure detection sensor of claim 1, wherein, The structural component is a T-shaped structure, with the wide side of the T-shaped structure abutting against the earphone shell.

7. The earphone pressure detection sensor according to any one of claims 1 to 6, characterized in that, The end of the structural member away from the pressure-sensitive deformation layer is abutted against the earphone shell by a compressible elastic element.

8. The earphone pressure detection sensor of claim 7, wherein, The compressible elastic element has an initial preload after loading.

9. The earphone pressure detection sensor of claim 7, wherein, The contact surface of the compressible elastic element is spherical.

10. The earphone pressure detection sensor of claim 7, wherein, The compressible elastic element is made of silicone or foam.

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