Vacuum cavity wafer size self-adaptive positioning device

Abstract

This utility model discloses a vacuum cavity wafer size adaptive positioning device, including several split wafer stages. Each split wafer stage has sliders connected to both sides of its bottom surface. Linear guide rails are provided at the bottom of both sliders. Each linear guide rail is mounted on a fixed disk. The sliders can slide along the linear guide rails. A positioning pin is installed on one side of each split wafer stage. A U-shaped groove is opened on the fixed disk at the position corresponding to the positioning pin. A drive cylinder is installed on the bottom surface of the fixed disk at one end of the U-shaped groove. A telescopic shaft is provided at the output end of the drive cylinder. A moving block is connected to one end of the telescopic shaft. The moving block passes through the U-shaped groove and is connected to the split wafer stage. The drive cylinder drives the split wafer stage to adjust to the corresponding position required by the set wafer outer diameter. This utility model has the characteristics of high versatility and precise positioning.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a vacuum chamber wafer size adaptive positioning device. Background Technology

[0002] In semiconductor manufacturing processes, vacuum chambers are often used for critical processes such as wafer deposition, etching, and ion implantation. During these processes, accurate wafer positioning is a key factor in ensuring product quality.

[0003] However, existing coating trays in vacuum chambers can usually only accommodate a single wafer diameter. When production needs change and different wafer sizes need to be switched, the coating trays must be manually replaced and re-aligned and calibrated. Frequent manual replacement of coating trays is not only time-consuming and labor-intensive, severely reducing production efficiency, but also, if the coating tray is incorrectly changed, it can easily cause the wafer to collide or be squeezed with equipment components during subsequent processing, resulting in wafer damage.

[0004] Therefore, it is essential to design a vacuum chamber wafer size adaptive positioning device that is highly versatile and precise in positioning. Utility Model Content

[0005] The purpose of this invention is to provide a vacuum cavity wafer size adaptive positioning device to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a vacuum cavity wafer size adaptive positioning device, comprising several split wafer stages, each of which has a slider connected to both sides of its bottom surface, and a linear guide rail provided at the bottom of each slider. Each linear guide rail is mounted on a fixed disk, and the slider can slide along the linear guide rail. Each of the split wafer stages has a positioning pin installed on one side, and the fixed disk has a U-shaped groove at the corresponding position of the positioning pin. A drive cylinder is installed on the bottom surface of the fixed disk at one end of the U-shaped groove, and a telescopic shaft is provided at the output end of the drive cylinder. One end of the telescopic shaft is connected to a moving block, which passes through the U-shaped groove and is connected to the split wafer stage. The drive cylinder drives the split wafer stage to adjust to the corresponding position required by the set wafer outer diameter.

[0007] According to the above technical solution, the positioning PIN is connected to the split wafer stage via a mounting base. A fixing base is connected to the bottom of the mounting base. A cavity is formed between the mounting base and the fixing base. The positioning PIN passes through the mounting base and the fixing base. A fixing block is connected to the positioning PIN inside the cavity near the mounting base. A mounting groove is formed inside the cavity. A reset spring is installed in the mounting groove to provide a reset force for the positioning PIN after being squeezed and released by the fixing block.

[0008] According to the above technical solution, several of the split wafer stages are uniformly arranged along the circumference of the fixed disk to form a ring array structure. Each of the split wafer stages is guided by a corresponding linear guide rail, and the extension direction of the linear guide rail is consistent with the radial direction of the fixed disk.

[0009] According to the above technical solution, the top surface of the fixed disc is provided with an L-shaped groove, and the linear guide rail is installed inside the L-shaped groove.

[0010] According to the above technical solution, the fixed disc has a positioning hole at the top of the L-shaped groove to facilitate positioning and connection with external equipment.

[0011] According to the above technical solution, the bottom sides of the split wafer stage are provided with fixing grooves for restricting the lateral movement of the slider at the corresponding positions of the slider, and a connecting hole for connecting bolts is provided between the slider and the split wafer stage.

[0012] Compared with the prior art, the beneficial effects achieved by this utility model are:

[0013] By incorporating a linkage structure consisting of a drive cylinder, telescopic shaft, moving block, linear guide rail, positioning pins, and a separate wafer stage, the drive cylinder can precisely drive the separate wafer stage to slide along the linear guide rail. Based on the outer diameter of wafers of different specifications, the separate wafer stage is adjusted to the corresponding set position. Subsequently, the stage and positioning pins work together to clamp and position the wafer, thereby achieving adaptive positioning for wafers of various sizes. Compared with traditional single-specification film-mounting trays, frequent manual switching is not required, significantly improving production efficiency, avoiding wafer damage due to manual changeover errors, and effectively reducing production costs and risks. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of the structural composition of this utility model;

[0016] Figure 2 This is a schematic diagram of the bottom structure of this utility model;

[0017] Figure 3 This is an exploded structural diagram of this utility model;

[0018] Figure 4 This is a cross-sectional view of the positioning PIN pin structure of this utility model;

[0019] In the diagram: 10. Split wafer stage; 11. Slider; 12. Linear guide rail; 13. Positioning pin; 131. Mounting base; 132. Fixing base; 133. Cavity; 134. Fixing block; 135. Mounting slot; 136. Return spring; 20. Fixing disk; 21. U-shaped slot; 22. L-shaped slot; 30. Drive cylinder; 31. Telescopic shaft; 32. Moving block. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present invention, the solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0021] This utility model provides a technical solution: a vacuum chamber wafer size adaptive positioning device, comprising several split wafer stages 10, each split wafer stage 10 having a slider 11 connected to both sides of its bottom surface, and a linear guide rail 12 provided at the bottom of each slider 11. Each linear guide rail 12 is mounted on a fixed disk 20, and the slider 11 can slide along the linear guide rail 12. A positioning pin 13 is installed on one side of each split wafer stage 10, and a U-shaped slot 21 is provided on the fixed disk 20 at the corresponding position of the positioning pin 13. A drive cylinder 30 is installed on one end of the bottom surface of the fixed disk 20 corresponding to the U-shaped slot 21, and a telescopic shaft 31 is provided at the output end of the drive cylinder 30. A moving block 32 is connected to one end of the telescopic shaft 31, and the moving block 32 passes through the U-shaped slot 21 and is connected to the split wafer stage 10. The drive cylinder 30 drives the split wafer stage 10 to adjust to the corresponding position required by the set wafer outer diameter.

[0022] Through this technical solution, the drive cylinder 30 precisely controls the stroke of the telescopic shaft 31, driving the moving block 32, which in turn drives the split wafer stage 10 to slide along the linear guide rail 12 via the bottom slider 11. This allows multiple split wafer stages 10 to automatically adjust their stroke to match the target wafer diameter, without manual intervention. The U-shaped slot 21 provides flexible movement space for the drive mechanism. The positioning pin 13 cooperates with the split wafer stage 10 to fix the wafer, thus effectively solving the problem that traditional vacuum chamber film-attachment trays can only accommodate a single wafer size. This significantly improves production efficiency and wafer processing safety, and reduces the risks of manual operation and equipment maintenance costs.

[0023] Furthermore, the positioning pin 13 is connected to the split wafer stage 10 via the mounting base 131. The bottom of the mounting base 131 is connected to the fixing base 132. A cavity 133 is formed between the mounting base 131 and the fixing base 132. The positioning pin 13 passes through the mounting base 131 and the fixing base 132. The positioning pin 13 is connected to the fixing block 134 on the side of the cavity 133 near the mounting base 131. The fixing base 132 is provided with a mounting groove 135 inside the cavity 133. A reset spring 136 is installed in the mounting groove 135 to provide a reset force for the positioning pin 13 after being squeezed and released by the fixing block 134.

[0024] With this technical solution, when the wafer needs to be removed, the positioning pin 13 is pressed down to compress the reset spring 136, releasing the positioning. After the wafer is removed, the pressing is released, the reset spring 136 releases its elastic potential energy, and the positioning pin 13 resets upward under the action of the spring force, returning to the initial positioning state.

[0025] Furthermore, several separate wafer stages 10 are evenly arranged along the circumference of the fixed disk 20 to form a ring array structure. Each separate wafer stage 10 is guided by a corresponding linear guide rail 12, and the extension direction of the linear guide rail 12 is consistent with the radial direction of the fixed disk 20.

[0026] Through this technical solution, the ring array structure makes full use of the circumferential space of the fixed disk 20. Secondly, the linear guide rail 12 is arranged radially along the fixed disk 20 to ensure that the movement trajectory of each split wafer stage 10 is strictly aligned with the center of the circle, thereby reducing the sway error during radial movement.

[0027] Furthermore, an L-shaped groove 22 is provided on the top surface of the fixed disc 20, and the linear guide rail 12 is installed inside the L-shaped groove 22;

[0028] Through this technical solution, the L-shaped groove 22 provides an installation position for the linear guide rail 12. The two inclined surfaces of the L-shaped groove 22 are closely fitted with the two side contours of the linear guide rail 12, ensuring the parallelism of the linear movement trajectory of each split wafer stage 10.

[0029] Furthermore, the fixed disc 20 has a positioning hole at the top of the L-shaped groove 22 to facilitate positioning and connection with external equipment;

[0030] This technical solution provides a positioning interface for the positioning device to connect with external equipment, thereby enabling quick disassembly and installation of the equipment.

[0031] Furthermore, the bottom sides of the split wafer stage 10 are provided with fixing grooves for limiting the lateral movement of the slider 11 at the corresponding positions of the slider 11, and a connecting hole for connecting bolts is provided between the slider 11 and the split wafer stage 10.

[0032] This technical solution uses a fixed slot to position the slider 11, and connects the bolts through the connecting hole and tightens them, so that the slider 11 and the split wafer stage 10 form a rigid whole, thus achieving stronger structural reliability.

[0033] Working principle: When a wafer needs to be placed for processing, the control system first sends a command to the drive cylinder 30 according to the diameter of the target wafer. The drive cylinder 30 drives the moving block 32 to move by precisely controlling the stroke of the telescopic shaft 31. Since the moving block 32 passes through the U-shaped slot 21 on the fixed disk 20 and is connected to the split wafer stage 10, when the moving block 32 moves, it will drive the split wafer stage 10 to slide along the linear guide rail 12 via the bottom slider 11. The L-shaped slot 22 on the fixed disk 20 fits tightly with the linear guide rail 12, ensuring the parallelism of the moving trajectory of the split wafer stage 10. Each split wafer stage 10 moves synchronously until it is adjusted to the corresponding position suitable for the outer diameter of the target wafer. The positioning pin 13 cooperates with the split wafer stage 10 to position and fix the wafer, thus constructing a carrier platform that is adapted to the wafer size.

[0034] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation or specific orientation structure and operation, and therefore should not be construed as a limitation of this utility model; the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0035] In the description of this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this utility model, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, those skilled in the art can combine different embodiments or examples and features of different embodiments or examples described in this utility model without contradiction.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vacuum cavity wafer size adaptive positioning device, comprising a plurality of separate wafer stages (10), characterized in that: Each of the split wafer stage (10) has sliders (11) connected to both sides of its bottom surface. Linear guide rails (12) are provided at the bottom of each slider (11). Each linear guide rail (12) is mounted on a fixed disk (20). The sliders (11) can slide along the linear guide rails (12). A positioning pin (13) is installed on one side of each split wafer stage (10). The fixed disk (20) has a U-shaped slot (21) at the corresponding position of the positioning pin (13). A drive cylinder (30) is installed on the bottom surface of the fixed disk (20) at one end of the U-shaped slot (21). The output end of the drive cylinder (30) is provided with a telescopic shaft (31). One end of the telescopic shaft (31) is connected to a moving block (32). The moving block (32) passes through the U-shaped slot (21) and is connected to the split wafer stage (10). The drive cylinder (30) drives the split wafer stage (10) to adjust to the corresponding position required by the set wafer outer diameter.

2. The vacuum chamber wafer size self-adaptive positioning device according to claim 1, wherein: The positioning pin (13) is connected to the split wafer stage (10) via a mounting base (131). A fixing base (132) is connected to the bottom of the mounting base (131). A cavity (133) is formed between the mounting base (131) and the fixing base (132). The positioning pin (13) passes through the mounting base (131) and the fixing base (132). A fixing block (134) is connected to the positioning pin (133) near the mounting base (131). The fixing base (132) has a mounting groove (135) inside the cavity (133). A reset spring (136) is installed in the mounting groove (135) to provide a reset force for the positioning pin (13) after being squeezed and released by the fixing block (134).

3. The vacuum chamber wafer size self-adapting positioning device according to claim 1, wherein: Several of the separate wafer stages (10) are evenly arranged along the circumference of the fixed disk (20) to form a ring array structure. Each of the separate wafer stages (10) is guided by a corresponding linear guide (12), and the extension direction of the linear guide (12) is consistent with the radial direction of the fixed disk (20).

4. The vacuum chamber wafer size self-adaptive positioning device according to claim 1, wherein: The top surface of the fixed disc (20) is provided with an L-shaped groove (22), and the linear guide rail (12) is installed inside the L-shaped groove (22).

5. The vacuum chamber wafer size self-adapting positioning device according to claim 4, wherein: The fixed disc (20) has a positioning hole at the top of the L-shaped groove (22) to facilitate positioning and connection with external equipment.

6. The vacuum chamber wafer size self-adapting positioning device of claim 1, wherein: The bottom sides of the split wafer stage (10) are provided with fixing grooves for restricting the lateral movement of the slider (11) at the corresponding positions of the slider (11). A connecting hole for connecting bolts is provided between the slider (11) and the split wafer stage (10).

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