Ceramic semiconductor heating sheet structure

By incorporating reinforcement and splicing mechanisms into the ceramic semiconductor heating element, the structural problems of traditional ceramic semiconductor heating elements during splicing and high-load operation are solved, achieving enhanced strength and convenient splicing, and ensuring the stability and reliability of the heating element.

CN224473442UActive Publication Date: 2026-07-07SHENZHEN SHENGLONG ELECTRIC HEATING TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN SHENGLONG ELECTRIC HEATING TECHNOLOGY CO LTD
Filing Date
2025-08-08
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Traditional ceramic semiconductor heating elements are difficult to splice when expanding the heating area or constructing complex heating regions, and are prone to local cracking, deformation or breakage when operating under high load, affecting the stability of heating performance and the reliability of equipment.

Method used

The design employs a reinforcement and splicing mechanism, including a frame, first and second reinforcing ribs, and splicing blocks and slots, which achieves reinforcement and convenient splicing of the heating element through mechanical connection.

Benefits of technology

This improves the structural strength and practicality of the ceramic semiconductor heating element, ensuring its long-term reliable use and temperature uniformity, while reducing maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a kind of ceramic semiconductor heating sheet structures, including heating sheet body, reinforcing mechanism is arranged on the heating sheet body, splicing mechanism is arranged on the heating sheet body, the reinforcing mechanism includes frame, the frame is fixedly installed in the edge of heating sheet body, the inner wall of the frame is fixedly installed with first reinforcing rib, the surface of the first reinforcing rib is fixedly installed with second reinforcing rib, one end of the second reinforcing rib is fixedly connected with the inner wall of frame, the first reinforcing rib and second reinforcing rib are fixedly connected with heating sheet body. By being provided with splicing mechanism, it is convenient for ceramic semiconductor heating sheet to splice installation, it is beneficial to improve the practicability of ceramic semiconductor heating sheet structure, by being provided with reinforcing mechanism, for improving the strength of ceramic semiconductor heating sheet structure, it is beneficial to long-term use of ceramic semiconductor heating sheet structure.
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