Separable substrate structure layer heat conducting film with good heat dissipation

Abstract

The utility model discloses a purpose lies in providing a kind of heat-conducting film product, after realizing the functional structure layer for carrying out reinforcing local heat dissipation in printed film product is fixedly attached in local structure surface, substrate structure layer is separated from separable connecting structure layer boundary relative to functional structure layer quickly and efficiently, not only reduce the thickness of printed film product actual participation work to optimize electronic product internal space layout, but also can improve the working heat dissipation effect of attachment place, it contains separable connecting structure layer in middle, substrate structure layer is provided in one side of the separable connecting structure layer, functional structure layer is provided in the other side of the separable connecting structure layer;Substrate structure layer and the separable connecting structure layer can be collectively peeled off separation relative to the functional structure layer and retain the functional structure layer on the surface of electronic product;Functional structure layer is made of heat-conducting silica gel or graphite material.

Description

Technical Field

[0001] This utility model relates to the field of internal functional film products for electronic products, specifically a separable substrate structure layer thermal conductive film with good heat dissipation properties. Background Technology

[0002] Printed films used inside electronic devices mainly include polyester films (PET films), polyimide films (PI films), PEN films, PC films, and PBT films. Common products in practical applications include flexible printed circuit boards (FPCs), optically transparent films, and electromagnetic shielding films. Flexible printed circuit boards use PI films as the substrate, printing circuits with conductive ink to connect electronic components, achieving thinness and flexibility. Optically transparent films are mainly used in LCD / LED displays, providing functions such as reflection, brightness enhancement, or anti-glare. Electromagnetic shielding films are used to prevent electromagnetic interference and protect the stable operation of internal components in electronic devices. These film products cover functions such as insulation, conductivity, electromagnetic wave shielding, optical control, and protection of electronic components. Their structure typically consists of a substrate layer, a functional coating or printed layer, and a protective layer. Currently, the development of these film products is characterized by market growth, technological advancements, expanded application areas, and accelerated domestic substitution. With the rapid development of consumer electronics, new energy, and other industries, the demand for high-performance film materials is constantly increasing. The maturity of printed electronics technologies, such as roll-to-roll printing, has improved production efficiency, and breakthroughs have been achieved in the research and development of new conductive inks and high-performance thin film materials. In addition to traditional fields, printed film products are gradually expanding into emerging fields such as flexible electronics, wearable devices, and medical electronics.

[0003] As mentioned above, although these printed film products used inside various electronic products usually have various functional structural layers or surface coatings, because these material layers are relatively thin and precise, it is inevitable that some material layers with strong and tough structural properties need to be set as substrate layers during the manufacturing process. On the one hand, this can serve as the basis for setting or coating other structural layers, and on the other hand, it can also effectively protect the functional layers during the actual bonding and setting of these printed film products.

[0004] For example, Chinese invention patent application CN202410726986.4 discloses a light-shielding black electronic printing film, which includes a light-shielding layer, a substrate, an optical adhesive layer, and a release layer. The light-shielding layer is obtained by uniformly coating a light-shielding coating on the side of the substrate away from the optical adhesive layer and then curing it under AM1.5 light. The light-shielding coating includes, according to its raw material composition: carboxyl acrylate copolymer resin-epoxy resin, polyurethane acrylic resin, composite black pigment, photoinitiator, defoamer, leveling agent, deionized water, (E)-4-nitrophenyl 3-(4-nitrophenyl) acrylate, wetting agent, and sodium borohydride solution. The composite black pigment is a mixture of carbon black, polyacrylic acid, and black dendritic silicon-carbon hybrid mesoporous spheres loaded with gold nanoparticles. The light-shielding black electronic printing film given in this scheme has high hardness, good wear resistance, good impact resistance, and good structural properties. For example, Chinese utility model patent application CN201721852942.8 discloses a printable antistatic protective film, comprising a film substrate, with an antistatic printable coating and an antistatic coating respectively coated on both sides of the film substrate. A pressure-sensitive adhesive layer and a release layer are sequentially laminated on the side of the antistatic coating facing away from the film substrate. In practical applications, this type of film product, due to the antistatic treatment on both sides of the film substrate, can effectively release static electricity, preventing static damage to electronic products and avoiding the adsorption of impurities and dust. Simultaneously, the antistatic printable coating can be printed, allowing text or labels to be printed on the coating, achieving the dual function of a label and a protective film, thus offering greater versatility in use.

[0005] After analyzing and comparing numerous printed film products with functional layers on their surfaces, similar to the aforementioned reference solutions, the inventors discovered that while these printed film products inevitably include a substrate layer in their structure during manufacturing to enhance structural strength and provide protection, while also facilitating the coating of other structural layers, when the printed film product is actually adhered to a local surface of the internal structure of an electronic product requiring coverage, the substrate layer is unnecessary for support or protection. In this case, the continued presence of the substrate layer actually occupies the already densely packed internal space of the electronic product and also affects the heat dissipation performance of the local product module during operation. This is especially true for thermally conductive films specifically designed to improve local heat dissipation in electronic products; such a structural design significantly reduces their heat dissipation effect, leading to excessively high local temperatures within the electronic product.

[0006] To address the aforementioned issues, this invention provides a separable substrate structure layer thermal conductive film with excellent heat dissipation properties. This allows for the rapid and efficient separation of the substrate structure layer from the functional structure layer at the separable connection layer boundary after the functional structure layer used for enhanced local heat dissipation in printed film products is fixedly adhered to the surface of the local structure. This not only reduces the actual thickness of the printed film product during operation, thus optimizing the internal space layout of electronic products, but also improves the heat dissipation effect at the bonding point. Utility Model Content

[0007] This invention provides a separable substrate structure layer thermal conductive film with good heat dissipation properties. It can quickly and efficiently separate the substrate structure layer from the functional structure layer at the boundary of the separable connection structure layer after the functional structure layer of the printed film product is fixedly attached to the local structure surface. This not only reduces the thickness of the printed film product when it is actually used to optimize the internal space layout of electronic products, but also improves the heat dissipation effect at the bonding point.

[0008] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0009] A detachable substrate structure layer thermally conductive film with good heat dissipation includes a detachable connecting structure layer in the middle. A substrate structure layer is disposed on one side of the detachable connecting structure layer to support the overall structure of the printed film. A functional structure layer is disposed on the other side of the detachable connecting structure layer. The functional structure layer can be adhered and fixed to the surface of an electronic product and meet the functional requirements when the printed film is attached to the product surface. The substrate structure layer and the detachable connecting structure layer can be peeled off relative to the functional structure layer, leaving the functional structure layer on the surface of the electronic product. The functional structure layer is made of thermally conductive silicone or graphite material.

[0010] As a preferred embodiment of the present invention, an adjustment structure layer for controlling the surface structure state of the functional structure layer is further provided between the substrate structure layer and the separable connection structure layer. The bottom of the adjustment structure layer has a toothed convex portion that corresponds to the toothed concave portion and can be embedded in the toothed concave portion.

[0011] As a preferred embodiment of the present invention, a second light-shielding structural layer is further provided on the outer surface of the functional structural layer.

[0012] As a preferred embodiment of the present invention, a light-shielding structural layer is further provided on the outer surface of the functional structural layer.

[0013] As a preferred embodiment of the present invention, the thickness of the separable connecting structure layer is 0.1-1 μm.

[0014] As a preferred embodiment of the present invention, the thickness of the adjustment structure layer is 1-10 μm.

[0015] As a preferred embodiment of the present invention, the thickness of the light-shielding structure layer is 1-10 μm.

[0016] As a preferred embodiment of the present invention, the substrate structural layer contains PET, BOPP, or PI material.

[0017] In summary, this utility model can achieve the following beneficial effects:

[0018] The detachable substrate structure layer thermally conductive film with excellent heat dissipation provided in this utility model allows for the removal of the substrate structure layer and the detachable connecting structure layer (which are unrelated to heat dissipation in the printed film) from the surface of the functional structure layer after the functional structure layer has been adhered to the interior or surface of an electronic product. Since the substrate structure layer can be removed during application, the thermally conductive silicone or graphite material layer, serving as the functional structure layer, remains solely in the heat-generating areas of the electronic product. Without the obstruction of the substrate structure layer, heat can be transferred more quickly and efficiently from the surface of the heat-generating area to the air via the functional structure layer, thus significantly enhancing the localized heat dissipation capability of the electronic product. Preferably, this application also provides an uneven structure on the surface of the thermally conductive silicone or graphite material layer serving as the functional structure layer to increase the contact area between the functional structure layer and the air, allowing it to absorb and carry away more heat when the same amount of air flows through it at the same flow rate, further improving and optimizing the heat dissipation effect.

[0019] The detachable substrate structure layer thermal conductive film with excellent heat dissipation provided in this invention can provide stable and reliable support for other structural layers during the manufacturing process of printed film products, ensuring sufficient strength and preventing deformation or damage to the film product. After the printed film is bonded and fixed to the surface of the component or product equipment, other structural layers above the functional structural layer can be completely removed, greatly reducing the actual application thickness of the printed film product when participating in equipment operation. This provides designers and developers with the possibility of further optimization and improvement of the extremely complex and precise spatial layout inside electronic products, and is more suitable for the miniaturization and lightweight improvement and optimization needs of the electronic product field. In addition, because this thermal conductive film product adopts a detachable structure, the peeled-off substrate structure layer and the corresponding detachable connecting structural layer can be recycled and reused, reducing the consumption of substrate materials and the generation of waste, thus making the printed film product more suitable for green and environmentally friendly production processes.

[0020] The detachable substrate structure layer thermal conductive film with excellent heat dissipation provided in this utility model covers the actual application surface of the functional structural layer with a high-strength substrate structure layer, thus providing excellent protection and preventing damage to the thin and fragile functional structural layer during transfer or bonding. Simultaneously, because the high-strength substrate structure layer is quickly separated and removed after the thermal conductive printed film is bonded to the target location, even when the thermal conductive film is first bonded as a whole to uneven or bent areas of electronic products, the internal stress at these locations can be greatly reduced by peeling off the substrate structure layer, allowing the functional structural layer to adhere more stably, reliably, and firmly to the working area surface. Furthermore, since the outer application surface of the functional structural layer is only exposed after peeling, the surface flatness of the functional structural layer when bonded to a specific area of ​​the electronic product is further ensured, making it more suitable for subsequent precision processing and improving product quality. Attached Figure Description

[0021] Figure 1 A schematic diagram showing the arrangement of the structural layers of a separable substrate thermal conductive film with good heat dissipation.

[0022] Figure 2 A schematic diagram illustrating the principle that a functional structural layer in a separable substrate structural layer thermal conductive film with good heat dissipation is attached to the product surface and then separated from other structural layers.

[0023] Figure 3 This is a structural arrangement in which an adjustment structure layer and a light-shielding structure layer are added to a separable substrate structure layer thermal conductive film with good heat dissipation.

[0024] Figure 4 A schematic diagram of a structure in which a separable substrate structure layer thermally conductive film with toothed concave portions and toothed convex portions is formed;

[0025] Figure 5 This is a magnified schematic diagram of a portion of the structure of a separable substrate structure layer thermal conductive film product A, which has good heat dissipation properties.

[0026] In the picture:

[0027] 1—The concave part of the tooth shape; 2—The convex part of the tooth shape. Detailed Implementation

[0028] The following specific embodiments are merely illustrative of the present invention and are not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of the present invention.

[0029] This solution is achieved through the following technical means:

[0030] Example 1: This example provides a printed film product with a separable substrate structure layer, the structural layout of which can be referred to the accompanying drawings. The printed film product mainly includes a separable connecting structure layer in the middle. A substrate structure layer is provided on one side of the separable connecting structure layer to support the overall structure of the printed film. A functional structure layer is provided on the other side of the separable connecting structure layer. The functional structure layer can be adhered and fixed to the surface of the electronic product and meets the functional requirements when the printed film is attached to the product surface. The substrate structure layer and the separable connecting structure layer can be peeled off relative to the functional structure layer, leaving the functional structure layer on the surface of the electronic product.

[0031] Specifically, the substrate structural layer can be made of materials such as PET (polyethylene terephthalate), BOPP (biaxially oriented polypropylene), and PI (polyimide), which possess good structural strength, chemical stability, and high-temperature resistance. The functional structural layer, on the other hand, typically needs to be selected and designed based on different application scenarios. For thermally conductive film products, to enhance the heat dissipation performance of the localized bonding areas of electronic products, thermally conductive silicone or graphite materials can be used to create this functional structural layer.

[0032] The specific selection of the separable connecting structural layer disposed between the aforementioned substrate structural layer and functional structural layer can be mainly set as follows:

[0033] ① Organosilicon system

[0034] Main components: Polydimethylsiloxane (PDMS), hydrogen-containing silicone oil, hydroxyl silicone oil;

[0035] ② Non-silicone release agent system

[0036] Main components: polyvinyl alcohol (water-soluble polymer), water, crosslinking agents (such as glyoxal, boric acid);

[0037] ③. Fatty acid and derivative system

[0038] Main components: fatty acids (stearic acid, oleic acid); fatty acid esters (glyceryl stearate, ethyl palmitate); metallic soaps (zinc stearate, calcium stearate);

[0039] ④. Polyolefin systems

[0040] Main components: polyethylene (PE) wax, polypropylene (PP) wax; mineral oil, paraffin wax;

[0041] ⑤ Fluorocarbon modified system

[0042] Main components: Fluorine-modified acrylic resin, fluorine surfactants (such as ammonium perfluorooctyl sulfonate);

[0043] ⑥ Fluoro-based release agent system

[0044] Main ingredients:

[0045] 1. Fluorocarbon polymers (polytetrafluoroethylene (PTFE), perfluoropolyether (PFPE); fluoropolymer emulsions (such as PTFE aqueous dispersions))

[0046] 2. Solvents (Fluorinated solvents (perfluoroheptane, fluoroether solvents): dissolve fluororesins, environmentally friendly (VOC-free))

[0047] 3. Additives (coupling agents (fluorosilanes): enhance the adhesion between the coating and the substrate);

[0048] ⑦ Light-cured release agent

[0049] Main components: silicone oil containing double bonds (such as vinyl silicone oil) and photoinitiator (such as Irgacure 184).

[0050] In the above-described scheme, as a preferred material type, polyvinyl alcohol adhesive is selected as the main component of the separable bonding structural layer in this embodiment. When polyvinyl alcohol adhesive is used as the main component of the separable bonding structural layer, it enables stable bonding with structural layers primarily composed of PET (polyethylene terephthalate), BOPP (biaxially oriented polypropylene), and PI (polyimide), while also allowing for quick and easy separation compared to structural layers primarily composed of single-component thermosetting acrylic resin materials.

[0051] The main reasons are as follows:

[0052] The reason for its stable bonding with PET, BOPP and PI is that—

[0053] Polarity and Wettability: Polyvinyl alcohol (PVA) adhesives possess a certain degree of polarity. The hydroxyl groups on its molecular chains can form hydrogen bonds and other interactions with the polar groups on the surfaces of PET, BOPP, and PI, thereby enhancing adhesion to these materials. Simultaneously, PVA adhesives exhibit good wettability, effectively wetting the surfaces of PET, BOPP, and PI, ensuring close contact between the adhesive and the substrate, and providing a solid foundation for bonding.

[0054] Entanglement and penetration of molecular chains: Polyvinyl alcohol molecular chains are flexible and can entangle and penetrate to a certain extent with the molecular chains on the surfaces of PET, BOPP and PI during the adhesive coating process, forming a structure similar to mechanical interlocking, thereby improving the bonding strength and enabling them to be stably bonded together.

[0055] Curing characteristics: The curing process of polyvinyl alcohol adhesive mainly depends on the evaporation of water and the cross-linking reaction between molecules. The adhesive layer formed after curing has a certain strength and toughness, which can effectively bond structural layers such as PET, BOPP and PI to adjacent layers. Under normal use conditions, this bonding performance is relatively stable and is not easily affected by environmental factors and will fail.

[0056] The principle of "like dissolves like": From a chemical perspective, polyvinyl alcohol (PVA) shares certain structural similarities with materials such as PET, BOPP, and PI, all of which have relatively long carbon chain structures. According to the principle of "like dissolves like," they have good compatibility. This compatibility is beneficial for the spread and adhesion of adhesives on the substrate surface, thereby achieving a stable bonding connection.

[0057] The reason why the structural layers of single-component thermosetting acrylic resin materials can be quickly and easily separated is that—

[0058] Differences in intermolecular forces: The three-dimensional network structure formed after curing of single-component thermosetting acrylic resin results in strong intermolecular forces between it and the substrate, which are difficult to break. In contrast, polyvinyl alcohol adhesive relies mainly on hydrogen bonds and some weaker intermolecular forces to bond with the substrate. These forces are relatively easy to overcome when subjected to external forces, thus achieving rapid separation.

[0059] The degree of curing reaction differs: Single-component thermosetting acrylic resins undergo a cross-linking reaction during curing, forming a highly cross-linked network structure. This structure makes its adhesion to the substrate very strong and difficult to separate. In contrast, the curing of polyvinyl alcohol adhesives is mainly a physical process. Although some degree of cross-linking also occurs, the cross-linking density is relatively low, and the cohesive strength of the adhesive layer is relatively small. Therefore, less force is required for separation, making it easier to achieve quick and convenient separation.

[0060] Impact on substrate surface energy: Single-component thermosetting acrylic resins have high requirements for substrate surface energy. Once a good bond is formed with the substrate, it will adhere tightly to the substrate surface and be difficult to separate. Polyvinyl alcohol adhesives, on the other hand, have a wider range of substrate surface energy adaptability. After curing, the surface energy of the adhesive layer is relatively low, and the adhesion between it and the substrate is relatively weak. This makes it easier to peel off from the substrate surface when separation is required without damaging the substrate.

[0061] Differences in temperature sensitivity: Single-component thermosetting acrylic resins have better heat resistance and can maintain good bonding performance even at higher temperatures. Polyvinyl alcohol (PVA) adhesives, on the other hand, have relatively poor heat resistance. When the temperature rises, the strength and adhesion of the adhesive layer decrease significantly, and the mobility of the molecular chain segments increases. This makes the bond between PVA adhesives and the substrate more easily broken under high-temperature conditions, thus enabling rapid and convenient separation.

[0062] Furthermore, the inventors will also provide other optional system categories as main components for the aforementioned non-silicone release agent system—

[0063] Acrylic systems:

[0064] Amino-modified acrylic resin, used as the base resin, forms a release layer through a cross-linking reaction, suitable for ultra-light release applications (such as in the electronic die-cutting industry). Hydroxyl-containing acrylic resin is combined with isocyanate curing agents to adjust the release force range.

[0065] Fluorocarbon systems:

[0066] Fluoride coatings (such as CF series fluorinated release films) utilize low surface energy fluoropolymers to achieve release, making them suitable for processing silicon-sensitive electronic materials.

[0067] Polyolefin systems:

[0068] High-density polyethylene (HDPE), linear low-density polyethylene (LLDPE), and low-density polyethylene (LDPE) blended coatings are used for substrate treatment. Waterborne polyolefin dispersions are used as primers or release layers, offering environmental friendliness and excellent adhesion.

[0069] Polyurethane systems:

[0070] Polyurethane release agents (PU release agents) are used for demolding polyurethane products. They achieve peeling by forming a uniform release film and are suitable for self-skinning, rigid foam, and other processes. Silicone-hybrid polyurethane systems combined with acrylate end caps improve compatibility and residual adhesion.

[0071] Polyether systems:

[0072] Long-chain alkyl polyethers, as the main component of non-silicone release agents, form a stable release layer through cross-linking reactions, making them suitable for release requirements in high-temperature environments.

[0073] Polyimide system:

[0074] Polyimide, as a substrate or release layer, has high temperature resistance and chemical stability, and is used in release films for high-temperature environments.

[0075] Non-reactive, non-silicone release agent:

[0076] The novel release agent avoids reaction with silicone formulations, and by adjusting the release force formulation, it meets different application requirements and solves the silicone transfer problem.

[0077] For separable connection structure layers made using the above-mentioned material system types, the thickness of the separable connection structure layer can be set to 0.1-1μm, preferably 0.2-0.4μm, during the coating or lamination process of actual film product production.

[0078] The inventors also considered that in many cases, printed films with thermal conductivity used inside electronic products require a light-shielding layer to cover the outer side of the functional structural layer. This is necessary for purposes such as: preventing light interference, protecting photosensitive elements from external light affecting performance, or reducing screen reflection to improve display quality; concealing internal structures to protect intellectual property and product design, avoiding exposure of circuit layout details, and enhancing product aesthetics; preventing static electricity buildup to reduce damage to electronic components and dust accumulation; and meeting special functional requirements, such as achieving specific optical effects or assisting in electromagnetic shielding. In these applications, light-shielding localized areas inside electronic products not only helps ensure the performance, stability, and lifespan of the products but also adapts to different usage environments and functional requirements.

[0079] Therefore, as a preferred structure, the separable substrate structure layer thermally conductive film with good heat dissipation provided in this embodiment also has a light-shielding structure layer covering the outer surface of the functional structure layer. Specifically, the light-shielding layer structure here uses nano black pigment with a particle size <1μm or ordinary black pigment for coloring treatment, and the thickness of the light-shielding structure layer is set to 1-10μm, preferably 2-5μm. Of course, similar to the aforementioned structure, other light-shielding structures can be further provided on the outer surface of the functional structure layer or substrate structure layer given above by coating or covering according to actual working scenarios or usage requirements, which will not be elaborated here.

[0080] Furthermore, the inventors also considered that, depending on the actual working scenarios of various functional structural layers, it is necessary to adjust and control their surface structure. However, since the functional structure itself is relatively thin and precise, if its surface roughness, texture, or local unevenness is to be controlled through independent process steps, it will greatly increase the processing difficulty and easily increase the product defect rate.

[0081] Therefore, in this embodiment, as a preferred structural form, an adjustment structural layer is provided between the aforementioned substrate structural layer and the separable connection structural layer, which can control the surface structural state of the functional structural layer when it is finally exposed.

[0082] For example, the adjustment structure layer here uses a combination of hydroxyl resin, isocyanate and matting agent, the processing temperature is between 70-150°C, microgravure or gravure printing is used, the roughness is generally between 0.2-1.4, preferably 0.3-0.6, and the thickness of the adjustment structure layer can be set to 1-10μ, preferably 3-5μ.

[0083] The adjustment structure layer formed in the above manner possesses higher strength and a greater ability to maintain its surface structure morphology compared to other structure layers. Furthermore, because this adjustment structure layer employs micro-recessed or gravure printing, it can effectively maintain its pre-formed roughness and uneven structure that meets practical requirements. Since the thickness of the aforementioned separable connecting structure layer is significantly less than other structure layers, and its overall thickness is uniform with good ductility and deformation capacity, when this separable connecting structure layer is adhered to the surface of the adjustment structure layer, the surface structure of the adjustment structure layer can be transmitted downwards through the separable connecting structure layer. That is, the separable connecting structure layer exhibits a controllable structural state similar to or the same as the surface of the adjustment structure layer. Therefore, in this structural state, when the functional structure layer is further adhered to the surface of the separable connecting structure layer, only a certain relative compressive force needs to be applied to the two separated parts during the adhesion process. The surface structure of the adjustment structure layer will then deform due to the downward compressive force applied by the separable connecting structure layer. This processing method enables precise control over the surface roughness and unevenness of the aforementioned functional structural layer, while not affecting the connection or separation effect of the separable connecting structural layer and the functional structural layer in different application scenarios.

[0084] Furthermore, in this embodiment, the inventors also provide a process method for manufacturing the aforementioned separable substrate structure layer thermally conductive film with good heat dissipation, as follows:

[0085] s1. Set the substrate structural layer;

[0086] s2. An adjustment structure layer is provided on the surface of the substrate structure layer;

[0087] s3. A separable connecting structure layer is provided on the surface of the adjustment structure layer;

[0088] s4. A functional structural layer is provided on the surface of the separable connecting structural layer;

[0089] s5. A light-shielding structural layer is provided on the surface of the functional structural layer.

[0090] Furthermore, considering that the polyvinyl alcohol adhesive applied to the surface of the adjusting structural layer as a separable connecting structural layer is extremely thin, and to improve the flatness and coverage of this structural layer during application, and to prevent the adjusting structural layer from being deformed due to compression or collision when the functional structural layer above it is applied, thus causing the separable structural layer to shift or break, affecting subsequent bonding consistency and ease of peeling, the adjusting structural layer can be cured before applying the separable connecting structural layer. The curing method here can vary depending on the type of material used as the adjusting structural layer, and can include various forms such as light curing or heat curing, which will not be elaborated here.

[0091] Example 2: This example provides a product structure for a separable substrate structure layer thermally conductive film with good heat dissipation, further optimized from the example solution. It should be noted that this example solution includes all the technical content of Example 1. For the sake of overall simplicity and clarity, repeated content will not be elaborated upon here.

[0092] To facilitate explanation of the solution, the thermally conductive film product presented in this embodiment specifically selects thermally conductive silicone as the functional structural layer. (Refer to the appendix of the instruction manual.) Figure 4 and 5 The provided structural diagram shows several downward-facing, tooth-shaped recesses formed on the top of the functional structural layer. Since the diagram shown is a cross-sectional view, the actual recesses formed on the thermally conductive film product present as elongated strips running through both ends of the film. This structural design allows for a larger surface area on the exposed top of the functional structure after the upper substrate and separable connecting layers are peeled off, providing better contact with the air flowing through it. This significantly improves the heat dissipation effect in the localized area of ​​the electronic product with this structural layer attached. Of course, the density and shape of adjacent tooth-shaped recesses can be adjusted according to actual heat dissipation requirements, which will not be elaborated upon here.

[0093] On the other hand, the inventors considered that the connecting structure layer set above the functional structure layer is relatively soft and made of extremely thin materials, making it unsuitable for further processing on the structure layer. However, in the actual production and application of the product, it is necessary to fit and fill the aforementioned toothed concave portion to prevent external dust and impurities from entering. Therefore, in this embodiment, the bottom of the adjustment structure layer set between the substrate structure layer and the separable connecting structure layer is designed to include a toothed convex portion that corresponds to the toothed concave portion and can be embedded in the toothed concave portion. For example, similar to Embodiment 1, the adjustment structure layer here can also adopt a combination of hydroxyl resin, isocyanate, and matting agent, and the toothed convex portion structure on its surface can be obtained by using microgravure or gravure printing. Because the toothed convex structure formed in this way is harder than the various materials used in the aforementioned thermally conductive silicone material and separable connecting structure layer, in the actual production of thermal conductive film products, it is only necessary to first form a structure containing toothed convex parts in the adjusting structure layer through processing technology. Then, by sequentially attaching and covering the separable connecting structure layer and the functional structure layer on its surface, a compressive force acting between the upper and lower surfaces of the preliminarily integrated structure layers can be applied to each structure layer. This allows the separable connecting structure layer to be firmly and stably attached to the surface of the adjusting structure layer. At the same time, the corresponding toothed concave part is directly formed on the surface of the functional structure layer through this compressive force. This is very efficient and convenient, greatly reducing the manufacturing difficulty of thermal conductive film products with this structure.

[0094] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A separable substrate structure layer thermally conductive film with good heat dissipation properties, characterized in that: The device includes a detachable connecting structural layer in the middle. A substrate structural layer is provided on one side of the detachable connecting structural layer to support the overall structure of the printed film. A functional structural layer is provided on the other side of the detachable connecting structural layer. The functional structural layer can be adhered and fixed to the surface of the electronic product and meet the functional requirements when the printed film is attached to the product surface. The substrate structural layer and the detachable connecting structural layer can be peeled off relative to the functional structural layer, leaving the functional structural layer on the surface of the electronic product. The functional structural layer is made of thermally conductive silicone or graphite material.

2. The separable substrate structure layer thermal conductive film with good heat dissipation as described in claim 1, characterized in that: The top of the functional structural layer has several toothed recesses (1) for increasing the surface area in contact with the air phase.

3. The separable substrate structure layer thermal conductive film with good heat dissipation as described in claim 2, characterized in that: An adjustment structure layer for controlling the surface structure state of the functional structure layer is provided between the substrate structure layer and the separable connection structure layer. The bottom of the adjustment structure layer has a toothed convex portion (2) that corresponds to the toothed concave portion (1) and can be embedded in the toothed concave portion (1).

4. The separable substrate structure layer thermal conductive film with good heat dissipation as described in claim 3, characterized in that: A light-shielding structural layer is also provided on the outer surface of the functional structural layer.

5. The separable substrate structure layer thermal conductive film with good heat dissipation as described in claim 4, characterized in that: The thickness of the separable connecting structure layer is 0.1-1 μm.

6. The separable substrate structure layer thermal conductive film with good heat dissipation as described in claim 5, characterized in that: The thickness of the adjustment structure layer is 1-10 μm.

7. The separable substrate structure layer thermal conductive film with good heat dissipation according to claim 6, characterized in that: The thickness of the light-shielding structure layer is 1-10 μm.

8. The separable substrate structure layer thermal conductive film with good heat dissipation as described in claim 1, characterized in that: The substrate structural layer contains PET, BOPP, or PI materials.

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