Steel mesh for PCB soldering, PCB, packaging structure, electronic device and movable platform

Abstract

The utility model discloses a steel net, PCB board, packaging structure, electronic equipment and movable platform for PCB board welding, wherein, the steel net for PCB board welding has first area and second area, and the first area can cover the area of the first through -hole of the solder pad of PCB board, and the second area is located at the outside of the first through -hole, and the first area is provided with the second through -hole, and the second area is provided with the third through -hole, and the thickness of first area is less than the thickness of second area. Therefore, when the device is placed on the solder filled in the second through -hole and the third through -hole and placed on the PCB board, the space for gas dissipation between the device and the solder can be reserved, the gas generated in the welding process can be smoothly discharged, the ratio of bubble generation is greatly reduced, the generation of solder joint cavity is reduced, and the product welding quality and product reliability are improved.

Description

Technical Field

[0001] This utility model relates to the field of PCB welding technology, specifically to a stencil, PCB board, packaging structure, electronic device, and mobile platform for PCB board welding. Background Technology

[0002] The pads on a PCB (Printed Circuit Board) typically also serve a heat dissipation function. To achieve good heat dissipation, the soldering area of ​​the pads generally needs to reach more than 80%. To accurately and quickly transfer the appropriate amount of solder paste to the designated pad locations on the PCB, a stencil is usually used. Through-holes in the stencil control the amount of solder paste transferred to the PCB pads.

[0003] However, some problems exist in the actual soldering process. During the flux removal and oxide reduction reaction in the solder paste, gases are generated. At high temperatures, the volatilization of water vapor and flux components in the material also produces gases. These gases are blocked by the component itself and cannot escape to the outside in time. After the solder joint solidifies, bubbles form, which are solder joint voids. The size of the solder joint voids has a certain numerical relationship with the heat dissipation of the device. Typically, the void ratio for this type of material is between 30% and 50%. As the void ratio increases, the thermal resistance increases, and the surface temperature of the device also rises.

[0004] Currently, apart from expensive vacuum reflow soldering equipment, there is no low-cost method that can effectively control welding bubbles and reduce voids in the process. Utility Model Content

[0005] To address at least one of the aforementioned problems, according to one aspect of the present invention, a stencil for PCB board soldering is provided.

[0006] The stencil for PCB board soldering has a first zone and a second zone. The first zone covers the area where the first through hole of the PCB board pad is located. The second zone is located outside the first through hole of the PCB board. The first zone has a second through hole and the second zone has a third through hole. The thickness of the first zone is less than the thickness of the second zone.

[0007] Since the second zone of the stencil is located outside the first through-hole of the PCB board and its thickness is greater than that of the first zone, when the device (e.g., MOS device, metal-oxide-semiconductor device) is placed on the solder (e.g., solder paste) on the PCB board filled in the second and third through-holes, the height of the solder filling in the third through-hole is higher than that in the second through-hole. This allows space to be reserved between the device and the solder for gas to escape, enabling the gas generated during the soldering process to be discharged smoothly, significantly reducing the rate of bubble generation, reducing the generation of voids in the solder joint, and improving the soldering quality and reliability of the product. Moreover, since the outermost first through-hole corresponds to the edge of the soldered device, setting a second zone with a thickness greater than that of the first zone on the outer side of this position can maximize the space reserved for gas escape. The flux structure of this application is particularly suitable for reducing air bubbles in the GND (ground) solder joints of TO (Transistor Outline Package) MOS devices. This is because these GND pads have both grounding and heat dissipation functions. In order to achieve good heat dissipation, the soldering area of ​​these pads needs to reach more than 80%, and special products even require more than 90%. The structure of this application can reserve space between the device and the solder for gas to escape, so that the gas generated during the soldering process can be discharged smoothly, greatly reducing the rate of air bubble generation and ensuring that the soldering area of ​​the pads meets the requirements.

[0008] In some implementations, the thickness of the first zone ranges from 0.1 mm to 0.12 mm. This avoids the soldering effect between the device and the PCB board being affected by an excessively thick stencil.

[0009] In some implementations, the thickness of the second zone ranges from 0.15mm to 0.16mm. This avoids the soldering effect between the device and the PCB board being affected by an excessively thick stencil. Furthermore, when the thickness of the first zone ranges from 0.1mm to 0.12mm, it ensures that when the device is placed on the first and second zones, a space of 0.03mm to 0.06mm in height is provided between the device and the solder for gas to escape. This allows the gas generated during the soldering process to be discharged smoothly, reducing the generation rate of air bubbles and thus reducing the formation of voids in the solder joints. At the same time, controlling the height difference between the second and first zones to 0.03mm to 0.06mm can reduce the impact on soldering (printing).

[0010] In some implementations, the second through-hole is a circular through-hole. Since a circular through-hole has no sharp corners, it facilitates solder application during printing (especially when the solder is solder paste, it makes solder application easier).

[0011] In some embodiments, the third through hole is a rectangular through hole. This allows the third through hole to have a larger cross-sectional area, further improving the welding effect.

[0012] In some embodiments, the second through-hole is spaced apart from the first through-hole so that the first through-hole can be covered by the stencil, and the distance between the second and first through-holes is 0.2mm ± 0.05mm. This prevents the solder from melting too close to the first through-hole, causing excessive liquid solder to flow into the first through-hole and onto the back of the PCB board. Furthermore, if the second through-hole is too far from the first through-hole, the opening of the second through-hole will be too small, affecting the soldering quality and resulting in insufficient soldering area.

[0013] In some embodiments, the distance between the third through-hole and the first through-hole is 0.2mm ± 0.05mm. This prevents the solder from flowing into the first through-hole in large quantities when it melts because it is too close to the first through-hole, and then flowing to the back of the PCB board through the first through-hole; moreover, if the third through-hole is too far from the first through-hole, the opening of the third through-hole will be too small, which will affect the soldering quality and result in insufficient soldering area.

[0014] In some embodiments, the pad with the first through-hole is a GND pad, and the side of the third through-hole furthest from the first region is located outside the GND pad. The distance D1 from the side of the third through-hole furthest from the first region to the side of the nearest GND pad is equivalent to 1 / 4 of the GND pad length D2. Since providing through-holes only in the first region can result in insufficient solder during soldering, providing a suitably sized third through-hole in the second region can avoid both insufficient solder and the problem of solder forming solder balls outside the pad due to excessive solder that cannot retract into the pad.

[0015] According to another aspect of this application, a PCB board is provided. This PCB board is used in conjunction with the aforementioned stencil for PCB soldering, and the PCB board has a first through-hole. Therefore, when a component is placed on solder on the PCB board filled in the second and third through-holes, since the height of the solder filling in the third through-hole is higher than the height of the solder filling in the second through-hole, space can be reserved between the component and the solder for gas escape. This allows gas generated during soldering to escape smoothly, significantly reducing the rate of bubble formation, reducing the generation of solder joint voids, and improving product soldering quality and product reliability.

[0016] In some embodiments, the first through hole is a circular through hole. The first through hole provides an escape channel for gas during welding; when the first through hole is circular, it is easier to process the first through hole; the first through hole can also be processed into a square, elliptical or other polygonal through hole as needed.

[0017] In some embodiments, the diameter of the first through-hole ranges from 0.35 mm to 0.5 mm. This avoids the problem of poor gas dissipation due to a small hole diameter, and also prevents the hole diameter from being too large and affecting the effective soldering area of ​​the pad.

[0018] In some implementations, the hole spacing of the first via is 1.4mm to 1.5mm. This maximizes heat density by increasing the via array coverage, and ensures uniform temperature on the pad surface and excellent solder flow through appropriate hole spacing. Furthermore, suitable hole spacing avoids drilling defects and layer delamination during machining, ensuring high drilling yield. It also prevents thermal stress cracking and uneven electroplating after machining. Additionally, appropriate hole spacing reduces grounding inductance. Moreover, it prevents the effective soldering area of ​​the pads from being affected by excessively small or dense hole spacing, and it prevents solder from flowing from the first via to the back of the PCB, while also ensuring effective gas dissipation.

[0019] In some implementations, second through holes are provided on the outer sides of the first through hole, and the outermost second through holes are interconnected to form a fourth through hole or interconnected with the third through hole. This avoids excessive obstruction of the solder pad area by the stencil, allowing for the exposure of as much of the other areas of the solder pad as possible while the stencil obscures the first through hole of the PCB board, thereby increasing the solder coverage area and ensuring the stability of the component connections after soldering.

[0020] According to another aspect of this application, a packaging structure is provided, which includes a PCB board, solder, and electronic devices; wherein the PCB board is the aforementioned PCB board; the solder fills the second and third through holes of the aforementioned stencil covering the PCB board to form a first solder area in the second through hole and a second solder area in the third through hole; the electronic devices contact the side of the first and second solder areas away from the PCB board.

[0021] Therefore, when the device is placed on the first solder area and the second solder area on the PCB board, the height of the second area where the third through hole is located is higher than the height of the first area where the second through hole is located, which makes the height of the second solder area higher than the height of the first solder area. This allows space to be reserved between the device and the solder for gas to escape, so that the gas generated during the soldering process can be smoothly discharged, greatly reducing the rate of bubble generation, reducing the generation of solder joint voids, and improving the soldering quality and product reliability.

[0022] According to another aspect of this application, an electronic device is provided, which includes the aforementioned PCB board or package structure.

[0023] According to another aspect of this application, a mobile platform is provided, which includes the aforementioned PCB board, packaging structure or electronic device. Attached Figure Description

[0024] Figure 1 A schematic diagram of the pads and stencil of a PCB board according to one embodiment of the prior art;

[0025] Figure 2 A schematic diagram of the pads and stencil of a PCB board according to another embodiment of the prior art;

[0026] Figure 3 A schematic diagram of the pads and stencil of a PCB board according to another embodiment of the prior art;

[0027] Figure 4 A schematic diagram of the pads and stencil of a PCB board according to another embodiment of the prior art;

[0028] Figure 5 This is a schematic diagram of the packaging structure according to an embodiment of the prior art.

[0029] Figure 6 for Figure 5 A schematic diagram of the encapsulation structure from another perspective;

[0030] Figure 7 A cross-sectional schematic diagram of the solder joint between electronic components and the PCB board;

[0031] Figure 8 This is a schematic diagram of the structure of a stencil for PCB board soldering according to one embodiment of this application;

[0032] Figure 9 for Figure 8 A schematic diagram of the stencil used for PCB board soldering from another perspective;

[0033] Figure 10 This is a schematic diagram of the stencil covering the PCB board for PCB board soldering according to this application.

[0034] Figure 11 This is a schematic diagram of the PCB board structure according to one embodiment of this application;

[0035] Figure 12 This is a schematic diagram of the packaging structure according to one embodiment of this application;

[0036] Figure 13 for Figure 12 A schematic diagram of the encapsulation structure from another perspective;

[0037] Figure 14 This is a cross-sectional schematic diagram of the solder joints between the electronic device and the PCB board in the packaging structure of this application;

[0038] Figure 15This is a schematic diagram of the structure of a domain controller according to one embodiment of this application;

[0039] Figure 16 for Figure 15 A schematic diagram of the cross-sectional structure of the domain controller shown.

[0040] Figure 17 This is a schematic diagram of the structure of a vehicle according to one embodiment of this application;

[0041] Reference numerals: 21, PCB board; 22, pad; 221, first through-hole; 23, stencil through-hole; 24, electronic component; 241, pin; 25, solder; 251, first solder area; 252, second solder area; 30, stencil; 31, first area; 311, second through-hole; 312, fourth through-hole; 32, second area; 321, third through-hole; 40, domain controller; 41, housing; 44, bottom cover; 50, cold plate; 60, vehicle. Detailed Implementation

[0042] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0043] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0044] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship between one element or component and another (or other) element or component as shown in the figure. In addition to the orientation shown in the figure, spatial relative terms are intended to include different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted accordingly.

[0045] In this article, the term "TO package" stands for "Transistor Outline package," which refers to a transistor outline package. It is one of the most common, oldest, and most widely used packaging forms for electronic components. It is usually made of metal or plastic; the main body is a cylindrical, rectangular, or flat housing; leads extend from the bottom (or side) of the package, usually in the form of two or more; the leads need to be soldered onto the circuit board.

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0047] In existing technologies, steel mesh is generally not divided into sections, such as... Figures 1 to 4 As shown, through-holes 23 are provided in the area of ​​the stencil corresponding to the pads 22 of the PCB board 21. The shape of the through-holes can be as follows: Figure 1 The image shown is square, or as shown in the image. Figure 2 The shape shown is a rhombus, and it is also like... Figure 3 The diagram shows a parallelogram; it can also be represented as follows: Figure 4 As shown, the shape and position of the solder falling on the pad 22 are circular due to the limitations imposed by the shape and position of the through-hole 23 in the stencil. Figures 1 to 4 The shape and position of the through holes 23 in the steel mesh shown are consistent. For use Figure 1 Taking the form of a stencil through-hole 23 for soldering electronic components 24 onto the PCB board 21 as an example, the resulting package structure is as follows: Figure 5 and Figure 6 As shown, the bottom surface of electronic device 24 and its pins 241 are soldered to the PCB board. However, due to the limitations of the existing stencil 30 structure, the electronic device 24 is tightly attached to the solder 25 after mounting, leaving no gas escape channel. This results in numerous voids within the solder joint after soldering (e.g., ...). Figure 7 (As shown).

[0048] Figures 8 to 10 The diagram schematically shows a stencil 30 for soldering a PCB board 21 according to a first embodiment of the present invention.

[0049] like Figures 8 to 10 As shown, the stencil 30 for soldering the PCB board 21 has a first region 31 and a second region 32. The first region 31 can cover the solder pads 22 of the PCB board 21 (e.g., Figure 10The first through hole 221 (e.g., the area shown by the dashed frame obscured by the steel mesh 30 and the solid frame visible through the third through hole 321) on the area is... Figure 10 The area where the circular hole (shown by the dashed line) is located is the second area 32, which is located outside the first through hole 221 of the PCB board 21. The first area 31 is provided with a second through hole 311, and the second area 32 is provided with a third through hole 321. The thickness W1 of the first area 31 is less than the thickness W2 of the second area 32.

[0050] Since the second region 32 of the stencil 30 is located outside the first through-hole 221 of the PCB board 21, and its thickness is greater than that of the first region 31, when the device is placed on the solder (e.g., solder paste) filled in the second through-hole 311 and the third through-hole 321 on the PCB board 21, the height of the solder filling in the third through-hole 321 is higher than that in the second through-hole 311. This allows space to be reserved between the device and the solder for gas to escape, enabling the gas generated during the soldering process to be discharged smoothly, significantly reducing the rate of bubble formation and reducing the generation of voids in the solder joints (e.g., Figure 14 As shown), this improves the welding quality and reliability of the product; moreover, since the outermost first through hole 221 corresponds to the edge of the welded device, a second zone 32 with a thickness greater than the first zone 31 is set on the outer side of this position, so that a certain gap can be reserved between the device and the solder during welding, maximizing the space reserved for gas escape.

[0051] In some embodiments, such as Figure 9 As shown, the thickness W1 of the first zone 31 ranges from 0.1mm to 0.12mm to avoid the solder being too thick due to the stencil 30 being too thick, which would affect the soldering effect between the device and the PCB board 21.

[0052] In some embodiments, continue to refer to Figure 9 As shown, the thickness of the second zone 32 ranges from 0.15mm to 0.16mm to avoid the solder being too thick due to the stencil 30 being too thick, which would affect the soldering effect between the device and the PCB board 21. Moreover, when the thickness of the first zone 31 ranges from 0.1mm to 0.12mm, it can also ensure that when the device is placed on the first zone 31 and the second zone 32, a space with a height range of 0.03mm to 0.06mm is reserved between the device and the solder 25 for gas to escape, so that the gas generated during the soldering process can be smoothly discharged. By reducing the rate of bubble generation, the generation of voids in the solder joint is reduced. At the same time, controlling the height difference between the second zone 32 and the first zone 31 to 0.03mm to 0.06mm can reduce the impact on the soldering.

[0053] In some embodiments, such as Figure 8 and Figure 10As shown, the second through hole 311 is a circular through hole. Since a circular through hole has no sharp corners, it facilitates solder feeding during printing.

[0054] In some embodiments, continue to refer to Figure 8 and Figure 10 As shown, the third through hole 321 is a rectangular through hole. This allows the third through hole 321 to have a larger cross-sectional area, further improving the welding effect.

[0055] In some embodiments, such as Figure 10 As shown, the second through hole 311 is spaced apart from the first through hole 221, and the distance d1 between the second through hole 311 and the first through hole 221 is 0.2mm ± 0.05mm. This prevents the solder from being too close to the first through hole 221 when melting, which would cause a large amount of liquid solder to flow into the first through hole 221 and then flow to the back of the PCB board 21, leading to short circuits and other problems. Moreover, if the second through hole 311 is too far from the first through hole 221, the opening of the second through hole 311 will be too small, affecting the soldering quality and resulting in insufficient soldering area.

[0056] In some embodiments, continue to refer to Figure 10 As shown, the distance d2 between the third through hole 321 and the first through hole 221 is 0.2mm ± 0.05mm. This prevents the solder from flowing into the first through hole 221 in large quantities when it is too close to it, and from flowing into the back of the PCB board 21 through the first through hole 221, causing short circuits and other problems. Moreover, if the third through hole 321 is too far from the first through hole 221, the opening of the third through hole 321 will be too small, which will affect the soldering quality and result in insufficient soldering area.

[0057] In some embodiments, continue to refer to Figure 10 As shown, the pad 22 with the first through-hole 221 is a GND pad 22. The side of the third through-hole 321 away from the first region 31 is located outside the GND pad 22, and the distance D1 from the side of the third through-hole 321 away from the first region 31 to the side of the nearest GND pad 22 is equivalent to 1 / 4 of the length D2 of the GND pad 22. Since setting through-holes only in the first region 31 will result in less solder during soldering, setting a properly sized third through-hole 321 in the second region 32 can avoid the situation of insufficient solder, and also avoid the problem of solder forming solder balls outside the pad 22 due to excessive solder that cannot retract into the pad 22.

[0058] In some embodiments, such as Figure 8 and Figure 10As shown, second through holes 311 are provided on the outer side of the first through hole 221, and the outermost second through holes 311 are interconnected to form a fourth through hole 312 or interconnected with the third through hole 321. This avoids excessive obstruction of the area where the solder pads 22 are located by the stencil 30, allowing as much of the other areas of the solder pads 22 as possible to be exposed while the stencil 30 obstructs the first through hole 221 of the PCB board 21, thereby increasing the solder coverage area and ensuring the stability of the component connections after soldering.

[0059] Figure 11 The PCB board 21 according to the first embodiment of the present invention is shown schematically.

[0060] like Figure 11 As shown, the PCB board 21 is used in conjunction with the aforementioned stencil 30 for soldering the PCB board 21. The PCB board 21 is provided with a plurality of first through holes 221, which are spaced apart and covered by the stencil 30. Therefore, when a component is placed on the solder filling the second through hole 311 and the third through hole 321 on the PCB board 21, because the height of the solder filling the third through hole 321 is higher than the height of the solder filling the second through hole 311, space is reserved between the component and the solder for gas to escape. This allows the gas generated during the soldering process to be smoothly discharged, significantly reducing the rate of bubble formation, reducing the generation of solder joint voids, and improving the soldering quality and reliability of the product.

[0061] In some embodiments, continue to refer to Figure 11 As shown, the first through hole 221 is a circular through hole. The first through hole 221 provides an escape channel for gas during welding; when the first through hole 221 is a circular through hole, it is easier to process the first through hole 221; the first through hole 221 can also be processed into a square, elliptical or other polygonal through hole as needed.

[0062] In some embodiments, continue to refer to Figure 11 As shown, the diameter D3 of the first through hole 221 ranges from 0.35mm to 0.5mm. This avoids the problem of gas escape being hindered by a small hole diameter, and also prevents the hole diameter from being too large and affecting the effective soldering area of ​​the pad 22.

[0063] In some embodiments, continue to refer to Figure 11As shown, the hole spacing d3 of the first through-hole 221 is 1.4mm to 1.5mm. Therefore, heat density can be maximized by increasing the coverage of the via array, and the appropriate hole spacing can ensure temperature uniformity and excellent solder flow on the surface of the pad 22. Furthermore, an appropriate hole spacing can prevent drilling damage and layer delamination during machining, ensuring drilling yield, and also prevent thermal stress cracking and uneven electroplating after processing. Simultaneously, an appropriate hole spacing can reduce grounding inductance. In addition, it can prevent the effective soldering area of ​​the pad 22 from being affected by too small a hole spacing or too dense holes, and can also prevent solder from flowing from the first through-hole 221 to the back of the PCB board 21, causing a short circuit. It can also ensure effective gas dissipation.

[0064] Figures 12 to 14 The packaging structure according to the first embodiment of the present invention is shown schematically.

[0065] like Figure 12 and Figure 13 As shown, the package structure includes a PCB board 21, solder, and electronic device 24; wherein, the PCB board 21 is the aforementioned PCB board 21; the solder fills the second through-hole 311 and the third through-hole 321 of the aforementioned stencil 30 covering the PCB board 21, so as to form a first solder area 251 in the second through-hole 311 and a second solder area 252 in the third through-hole 321; the electronic device 24 contacts the side of the first solder area 251 and the second solder area 252 opposite to the PCB board 21. Furthermore, when the electronic device 24 is surface-mounted, zero-pressure surface mounting or surface mounting height is increased to match the height of the solder in the second area 32 is used for surface mounting. This prevents the surface mounting pressure from collapsing the solder, reducing the gas escape space, thereby improving the soldering effect of both the bottom surface of the electronic device 24 and the pins 241 of the electronic device 24 being soldered onto the PCB board.

[0066] Therefore, when the device is placed on the first solder area 251 and the second solder area 252 on the PCB board 21, since the height of the second area 32 where the third through hole 321 is located is higher than the height of the first area 31 where the second through hole 311 is located, the height of the second solder area 252 is higher than the height of the first solder area 251. This allows space to be reserved between the device and the solder for gas to escape, enabling the gas generated during the soldering process to be discharged smoothly, significantly reducing the rate of bubble formation and reducing the generation of voids in the solder joints (e.g., Figure 14 As shown), this improves the welding quality and reliability of the product; moreover, using zero-pressure patch or increasing the patch height to match the height of the solder in the second zone 32 can prevent the reserved gas escape space from disappearing due to the pressure of the patch crushing the solder, thus preventing the gas from escaping effectively during the welding process.

[0067] According to another aspect of this application, an electronic device is provided, which includes the aforementioned PCB board or package structure. As one embodiment of the electronic device, the electronic device may be a domain controller.

[0068] Figure 15 and Figure 16 A domain controller 40 according to one embodiment of the present invention is schematically shown. For example... Figure 15 As shown, the domain controller includes a housing 41 and a bottom cover 44. The housing 41 is equipped with a heat dissipation device, such as a cold plate 50, to cool the electronic components 24 between the housing 41 and the bottom cover 44. A PCB board or package structure, such as..., is accommodated between the housing 41 and the bottom cover 44. Figure 16 As shown, a PCB board 21 and electronic components 24 are housed between the outer casing 41 and the bottom cover 44, and the electronic components 24 are cooled by a cold plate 50.

[0069] According to another aspect of this application, a mobile platform is provided, which includes the aforementioned PCB board, packaging structure, or electronic device. As one embodiment of the mobile platform, the mobile platform can be a vehicle 60. In other embodiments, the mobile platform can be a drone, robot, or other equipment.

[0070] Figure 17 A vehicle 60 according to one embodiment of the present invention is schematically shown. For example... Figure 17 As shown, the vehicle 60 is equipped with electronic devices such as a domain controller 40.

[0071] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A stencil (30) for PCB board soldering, characterized in that, The stencil (30) has a first region (31) and a second region (32). The first region (31) can cover the area where the first through hole (221) of the pad (22) of the PCB board (21) is located. The second region (32) is located outside the first through hole (221). The first region (31) is provided with a second through hole (311), and the second region (32) is provided with a third through hole (321). The thickness of the first region (31) is less than the thickness of the second region (32).

2. The stencil for PCB board soldering according to claim 1, characterized in that, The thickness of the first region (31) ranges from 0.1 mm to 0.12 mm; and / or The thickness of the second region (32) ranges from 0.15 mm to 0.16 mm.

3. The stencil for PCB board soldering according to claim 1 or 2, characterized in that, The second through hole (311) is a circular through hole; and / or The third through hole (321) is a rectangular through hole.

4. The stencil for PCB board soldering according to claim 3, characterized in that, The second through hole (311) is spaced apart from the first through hole (221), and the distance between the second through hole (311) and the first through hole (221) is 0.2mm ± 0.05mm; and / or The distance between the third through hole (321) and the first through hole (221) is 0.2mm ± 0.05mm.

5. The stencil for PCB board soldering according to claim 3, characterized in that, The pad (22) with the first through-hole (221) is a GND pad, the side of the third through-hole (321) away from the first region (31) is located outside the GND pad, and the distance D1 from the side of the third through-hole (321) away from the first region (31) to the side of the nearest GND pad is equivalent to 1 / 4 of the length D2 of the GND pad; and / or A second through hole (311) is provided on the outer side of the first through hole (221), and the outermost second through holes (311) are interconnected to form a fourth through hole (312) or interconnected with the third through hole (321).

6. A PCB board (21), characterized in that, The PCB board (21) is used in conjunction with the stencil (30) for PCB board welding as described in any one of claims 1 to 5, and the PCB board (21) is provided with a first through hole (221).

7. The PCB board according to claim 6, characterized in that, The diameter of the first through hole (221) ranges from 0.35 mm to 0.5 mm; and / or The hole spacing of the first through hole (221) is 1.4mm to 1.5mm.

8. A packaging structure, characterized in that, Includes PCB board (21), solder and electronic components (24); among which, The PCB board (21) is the PCB board (21) as described in claim 6 or 7; The solder is filled in the second through-hole (311) and the third through-hole (321) of the stencil (30) of any one of claims 1 to 5 covering the PCB board (21) to form a first solder area (251) in the second through-hole (311) and a second solder area (252) in the third through-hole (321); The electronic device (24) is in contact with the side of the first solder area (251) and the second solder area (252) opposite to the PCB board (21).

9. An electronic device, characterized in that, The electronic device includes the PCB board (21) as described in claim 6 or 7; Alternatively, it may include the packaging structure described in claim 8.

10. A mobile platform, characterized in that, The movable platform includes the PCB board (21) as described in claim 6 or 7; Alternatively, the mobile platform may include the packaging structure of claim 8; Alternatively, the mobile platform may include the electronic device of claim 9.

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