Wafer motion system

Abstract

The utility model provides a kind of wafer motion system.The wafer motion system includes mounting seat;Wafer carrier plate (3), wafer carrier plate (3) is set above mounting seat;Clamping assembly, wafer carrier plate (3) is clamped and fixed on mounting seat by clamping assembly;At least 3 Z direction drive assembly, be set below mounting seat, and with mounting seat movably connected.The wafer motion system provided by the utility model can solve the problem that the existing wafer alignment equipment causes wafer carrier plate instability and wafer deviation during the process of wafer rising to the bonding position, resulting in wafer early alignment failure, bonding error and reduced wafer quality after bonding.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and more specifically, to a wafer motion system. Background Technology

[0002] Semiconductor technology, as the cornerstone of modern information society, plays an immeasurable role in driving technological progress and promoting economic development. In the semiconductor device manufacturing process, wafer bonding is a crucial step in achieving advanced packaging technologies such as 3D integration and heterogeneous integration, while wafer inspection equipment is the core equipment for ensuring bonding accuracy and improving device performance and yield. Precise wafer alignment can effectively reduce alignment errors after bonding, thereby improving the quality and consistency of the final product.

[0003] Although the upper and lower wafers are aligned in the early stage during bonding, the relative positions of the upper and lower wafers may still shift slightly during the wafer transfer process. In particular, during the process of controlling the wafer carrier to lift the wafer to the bonding position, the inertia generated by the acceleration and deceleration during the lifting motion can easily cause the wafer carrier to become unstable and the wafer to shift, thus causing the early alignment of the wafer to fail, resulting in bonding errors and reducing the quality of the bonded wafer. Utility Model Content

[0004] The main objective of this invention is to provide a wafer motion system that can solve the problem that in existing wafer alignment equipment, the inertia generated by acceleration and deceleration during the lifting motion of the wafer to the bonding position causes the wafer carrier to become unstable and the wafer to shift, resulting in early wafer alignment failure, bonding errors, and reduced wafer quality after bonding.

[0005] To achieve the above objectives, according to one aspect of the present invention, a wafer motion system is provided, including a mounting base; a wafer carrier plate disposed above the mounting base; a clamping assembly, wherein the wafer carrier plate is clamped and fixed on the mounting base by the clamping assembly; and at least three Z-axis drive assemblies disposed below the mounting base and movably connected to the mounting base.

[0006] Furthermore, the mounting base includes a central through slot and two side support guide sections, and the clamping assembly includes a pneumatic assembly; when the Z-axis drive assembly drives the mounting base to move, the pneumatic assembly can clamp and fix the wafer carrier onto the support guide sections, or the pneumatic assembly can cooperate with the support guide sections for air flotation when the wafer carrier moves relative to the mounting base.

[0007] Furthermore, the pneumatic assembly includes: a connecting portion comprising a vertical section and a horizontal section, a first end of the vertical section being disposed on a wafer carrier and extending downward, a second end of the vertical section being connected to the first end of the horizontal section, and a second section of the horizontal section extending below a support guide section; a first air cushion disposed on one of the horizontal section and the support guide section; and a first drive member being drivenly connected to the first air cushion; the first drive member is capable of driving the first air cushion to move, thereby providing the first air cushion with a force capable of pressing against the other of the horizontal section and the support guide section.

[0008] Furthermore, the pneumatic assembly also includes a second air cushion and a second driving member connected by a drive. The second air cushion is disposed on one of the wafer carrier and the support guide section. The second driving member can drive the second air cushion to move, so as to provide the second air cushion with a force that can press against the other of the wafer carrier and the support guide section.

[0009] Furthermore, the pneumatic assembly also includes a negative pressure section, which is located on the side of the wafer carrier facing the support guide section or on the top surface of the support guide section. The negative pressure section can generate negative pressure to adsorb and fix the wafer carrier to the top surface of the support guide section.

[0010] Furthermore, the pneumatic assembly also includes a positive pressure section, which is disposed on the side of the wafer carrier facing the support guide section or on the top surface of the support guide section. The positive pressure section enables the wafer carrier to be air-suspended on the support guide section.

[0011] Furthermore, the wafer motion system also includes a drive unit, which is mounted on the mounting base and is capable of driving the wafer carrier to move along the mounting base.

[0012] Furthermore, the support guide section is also provided with guide steps, and the driving device includes a stator and a mover. The stator is set on the guide steps, and the mover is set on the wafer carrier. The stator and the mover drive each other.

[0013] Furthermore, along the Y-axis, the two ends of the mounting base are also provided with limiting parts, which can limit the extreme positions of the wafer carrier sliding.

[0014] Furthermore, the clamping assembly includes a clamping pad that can clamp and secure the wafer carrier to the mounting base.

[0015] Applying the technical solution of this utility model, the mounting base, as the carrier of the entire wafer motion system, primarily supports the wafer carrier and other components, and also serves as the mounting foundation for the Z-axis drive assembly. The wafer carrier carries the wafer and drives its movement. The clamping assembly provides sufficient preload to clamp and fix the wafer carrier to the mounting base. During the process of the mounting base lifting the wafer carrier to the bonding position, it avoids wafer misalignment caused by inertia from acceleration and deceleration during the lifting motion, thus ensuring that the wafer alignment is not disturbed by the transport process, preventing early alignment failures, improving bonding accuracy, and enhancing the product quality of the bonded wafer. The Z-axis drive assembly drives the mounting base and its wafer carrier to move along the Z-axis. At least three Z-axis drive assemblies are positioned below the mounting base, forming a stable triangular support structure. By supporting the mounting base at multiple points and driving its lifting and lowering, the accuracy and stability of the Z-axis drive assembly in driving the mounting base to move along the Z-axis are improved, ensuring the vertical positioning accuracy of the wafer during bonding and inspection.

[0016] The wafer motion system proposed in this invention clamps and fixes the wafer carrier onto the mounting base by setting a clamping component. This avoids the wafer carrier becoming unstable and shifting due to inertia caused by acceleration and deceleration during the lifting motion when the wafer rises to the bonding position. This ensures that the wafer can maintain the accuracy of the initial alignment, reduces the possibility of errors during bonding, and thus improves the quality of the wafer after bonding. Attached Figure Description

[0017] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments and descriptions of this utility model are used to explain this utility model and do not constitute an undue limitation thereof. In the drawings:

[0018] Figure 1 A schematic diagram of the overall structure of the wafer motion system according to an embodiment of the present invention is shown;

[0019] Figure 2 A cross-sectional view of a wafer motion system according to an embodiment of the present invention is shown;

[0020] The above figures include the following reference numerals:

[0021] 21. Through groove; 22. Support guide section; 23. Limiting part; 24. Guide step; 3. Carrier plate; 41. Vertical section; 42. Horizontal section; 43. First air cushion; 5. Drive device; 51. Stator; 52. Mover. Detailed Implementation

[0022] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] See also Figures 1 to 2 As shown, this utility model provides a wafer motion system, which includes a mounting base, a wafer carrier 3, a clamping assembly, and at least three Z-axis drive assemblies. The wafer carrier 3 is positioned above the mounting base; the wafer carrier 3 is clamped and fixed to the mounting base by the clamping assembly; and the at least three Z-axis drive assemblies are positioned below the mounting base and are movably connected to the mounting base.

[0024] In the above technical solution, the mounting base, as the carrier of the entire wafer motion system, primarily supports the wafer carrier 3 and other components, and also serves as the mounting foundation for the Z-axis drive assembly. The wafer carrier 3 carries the wafer and drives its movement. The clamping assembly provides sufficient preload to the wafer carrier 3, clamping it securely to the mounting base. During the process of the mounting base lifting the wafer carrier to the bonding position, it avoids wafer misalignment caused by inertia from acceleration and deceleration during the lifting motion, thus ensuring that the wafer alignment is not disturbed by the transport process, preventing early alignment failures, improving bonding accuracy, and enhancing the product quality of the bonded wafer. The Z-axis drive assembly drives the mounting base and the wafer carrier 3 to move along the Z-axis. At least three Z-axis drive assemblies are positioned below the mounting base, forming a stable triangular support structure. By supporting the mounting base at multiple points and driving its lifting and lowering, the accuracy and stability of the Z-axis drive assembly in driving the mounting base along the Z-axis are improved, ensuring the vertical positioning accuracy of the wafer during bonding and inspection.

[0025] The wafer motion system proposed in this utility model clamps and fixes the wafer carrier 3 on the mounting base by setting a clamping component. This avoids the wafer carrier 3 becoming unstable and shifting due to the inertia generated by acceleration and deceleration during the lifting motion when the wafer rises to the bonding position. This ensures that the wafer can maintain the accuracy of the initial alignment, reduces the possibility of errors during bonding, and thus improves the quality of the wafer after bonding.

[0026] In one embodiment of this utility model, at least three Z-axis drive components cooperate to drive the mounting base to move along the Z, RX, or RY directions.

[0027] In the above technical solution, at least three Z-axis drive components work together to not only drive the mounting base to move up and down along the Z-axis, but also to rotate the wafer carrier around the X-axis or Y-axis. By coordinating and controlling at least three Z-axis drive components, the system can drive the mounting base to achieve complex three-dimensional movements, including combinations of linear motion and rotational adjustment. This allows for fine-tuning of the wafer alignment position during wafer alignment and bonding, helping to improve wafer positioning accuracy and thus enhancing the quality and efficiency of the wafer bonding and inspection processes.

[0028] In one embodiment of the present invention, the mounting base includes a central through groove 21 and two side support guide sections 22, and the clamping assembly includes a pneumatic assembly; when the Z-axis drive assembly drives the mounting base to move, the pneumatic assembly can clamp and fix the wafer carrier 3 on the support guide section 22, or the pneumatic assembly can cooperate with the support guide section 22 for air flotation when the wafer carrier 3 moves relative to the mounting base.

[0029] In the above technical solution, the slot 21 provides a channel for the clamping assembly to pass through the mounting base, ensuring that one end of the clamping assembly can connect to the wafer carrier, and the other end can pass through the mounting base and extend below it, clamping the mounting base from both the top and bottom sides, thus clamping and fixing the wafer carrier 3 onto the mounting base. The support guide section 22 supports the wafer carrier 3 on one hand and guides its movement on the other. When the Z-axis drive assembly moves the mounting base, the pneumatic assembly, driven by an external air source, clamps and fixes the wafer carrier 3 onto the support guide section 22, ensuring that the inertia generated by acceleration and deceleration during the lifting process of the Z-axis drive assembly will not cause the wafer carrier 3 to become unstable and shift.

[0030] When the wafer carrier 3 moves along the support guide section 22 on the mounting base, the pneumatic components can work with an external air source to blow air into the gap between the wafer carrier 3 and the support guide section 22 to create positive pressure. This causes the wafer carrier 3 to be air-suspended relative to the support guide section 22, preventing the wafer carrier 3 from directly contacting the support guide section 22 during movement. On the one hand, this avoids the processing errors or surface quality of the support guide section 22 from affecting the movement of the wafer carrier 3, improving the accuracy and stability of the wafer carrier 3 in driving the wafer movement. On the other hand, it can reduce the friction between the wafer carrier 3 and the support guide section 22, preventing wear and extending their service life.

[0031] In one embodiment of this utility model, the pneumatic component includes: a connecting part, a first air float 43, and a first driving member. The connecting part includes a vertical section 41 and a horizontal section 42. The first end of the vertical section 41 is disposed on the wafer carrier 3 and extends downward. The second end of the vertical section 41 is connected to the first end of the horizontal section 42. The second section of the horizontal section 42 extends to the bottom of the support guide section 22. The first air float 43 is disposed on one of the horizontal section 42 and the support guide section 22. The first driving member is drivenly connected to the first air float and can drive the first air float 43 to move, thereby providing the first air float 43 with a force that can press against the other of the horizontal section 42 and the support guide section 22.

[0032] In the above technical solution, the connecting part is used to connect the first air-float 43 and the wafer carrier 3, while ensuring that the first air-float 43 can be firmly fixed to the support guide section 22 from below. The connecting part includes a vertical section 41 and a horizontal section 42, wherein the vertical section 41 is used to connect the horizontal section 42 and the wafer carrier 3, and adjusts the position of the horizontal section 42 in the vertical direction to ensure that the horizontal section 42 can extend below the support guide section 22. The horizontal section 42 is used to support the first air-float 43 and adjust the position of the first air-float 43 in the horizontal direction to ensure that the first air-float 43 can be firmly fixed to the support guide section 22 directly below it. The first air-float is disposed on one of the horizontal section 42 and the support guide section 22, and can move up and down under the driving action of the first driving member, thereby firmly fixing the other of the horizontal section 42 and the support guide section 22, or unlocking by disengaging from the other of the horizontal section 42 and the support guide section 22. The first driving component typically includes a pneumatic cylinder, hydraulic cylinder, or electric push rod, which provides power for the lifting and lowering movement of the first air cushion.

[0033] By setting up the connecting part, the first air cushion 43 and the first driving component, the pneumatic assembly can press and fix the wafer carrier 3 onto the support guide section 22 from the bottom of the support guide section 22, ensuring that the wafer carrier 3 is tightly fixed to the support guide section 22 when the Z-axis drive assembly lifts the mounting base, and avoiding the inertia generated by acceleration and deceleration during the lifting process from causing the wafer carrier 3 to become unstable and cause the wafer to shift.

[0034] In one embodiment of the present invention, the pneumatic assembly further includes a second air float and a second driving member connected by a drive. The second air float is disposed on one of the wafer carrier 3 and the support guide section 22. The second driving member can drive the second air float to move, thereby providing the second air float with a force that can press against the other of the wafer carrier 3 and the support guide section 22.

[0035] In the above technical solution, the connection relationship and function of the second air cushion and the second driving component are the same as those of the first air cushion 43 and the first driving component, and will not be repeated here. The main difference is that the second air cushion is disposed on one of the wafer carrier 3 and the support guide section 22. The second driving component can drive the second air cushion to move, thereby providing the second air cushion with a force that can press against the other of the wafer carrier 3 and the support guide section 22. That is, the second air cushion is disposed between the support guide section 22 and the wafer carrier 3, pressing against the other of the wafer carrier 3 and the support guide section 22 from the top of the support guide section 22, thereby achieving relative fixation between the wafer carrier 3 and the support guide section 22.

[0036] The second air-bearing pad and the second driving component in the above technical solution can be used independently to press the support guide section 22 onto the horizontal section 42 from the top, thereby clamping and fixing the support guide section 22. Alternatively, the second air-bearing pad can be used in conjunction with the first air-bearing pad to simultaneously clamp and fix the support guide section 22 from both the top and bottom sides, further improving the strength and reliability of the relative fixation between the wafer carrier 3 and the support guide section 22, and minimizing the impact of the inertia generated by acceleration and deceleration during the lifting process on the wafer carrier 3 and the wafers on it.

[0037] In one embodiment of this utility model, the surface of the first air float 43 is provided with air holes. Air is injected into the first air float 43 by an air source device such as an air pump. The gas is blown out through the air holes on the surface of the first air float 43, thereby forming an air gap between the horizontal section 42 and the support guide section 22, so that the horizontal section 42 and the support guide section 22 are suspended relative to each other.

[0038] In the above technical solution, by setting air holes on the surface of the first air float 43 and cooperating with air source devices such as air pumps with the first air float 43, an air gap is formed between the horizontal section 42 and the support guide section 22, thereby suspending them relative to each other. This ensures that the wafer carrier 3 will not have rigid contact or friction with the support guide section 22 when it moves along the support guide section 22, avoiding the influence of the processing error or surface quality of the support guide section 22 on the movement of the wafer carrier 3. This improves the accuracy and stability of the wafer carrier 3 in driving the wafer to move. In addition, it can also reduce the friction between the wafer carrier 3 and the support guide section 22, avoid wear between the two, and extend their service life.

[0039] The first air cushion 43 can be used alone or in conjunction with the second air cushion. When the first air cushion 43 and the second air cushion work together, they can simultaneously form air gaps at the top and bottom of the support guide section 22. At this time, the horizontal section 42 is air-floated relative to the support guide section 22, and the wafer carrier 3 is also air-floated relative to the support guide section 22. This ensures that the wafer carrier 3 will not have direct contact with the support guide section 22 during movement, avoiding the impact of processing errors or surface quality of the support guide section 22 on the movement of the wafer carrier 3. This further improves the accuracy and stability of the wafer carrier 3 in driving the wafer.

[0040] In one embodiment of this utility model, the surface of the second air cushion is provided with air holes. Air is injected into the second air cushion by an air source device such as an air pump. The gas is blown out through the air holes on the surface of the second air cushion, thereby forming an air gap between the wafer carrier 3 and the support guide section 22, so that the wafer carrier 3 and the support guide section 22 are suspended relative to each other.

[0041] In the above technical solution, by setting air holes on the surface of the second air cushion and cooperating with air source devices such as air pumps with the second air cushion, an air gap is formed between the wafer carrier 3 and the support guide section 22, thereby suspending them relative to each other. This ensures that the wafer carrier 3 will not have rigid contact or friction with the support guide section 22 when it moves along the support guide section 22, avoiding the influence of the processing error or surface quality of the support guide section 22 on the movement of the wafer carrier 3. This improves the accuracy and stability of the wafer carrier 3 in driving the wafer to move. In addition, it can also reduce the friction between the wafer carrier 3 and the support guide section 22, avoid wear between the two, and extend their service life.

[0042] The second air cushion can be used alone or in conjunction with the first air cushion 43. When the first air cushion 43 and the second air cushion work together, they can simultaneously form air gaps at the top and bottom of the support guide section 22. At this time, the horizontal section 42 is air-floating relative to the support guide section 22, and the wafer carrier 3 is also air-floating relative to the support guide section 22. This ensures that the wafer carrier 3 will not have direct contact with the support guide section 22 during movement, avoiding the impact of processing errors or surface quality of the support guide section 22 on the movement of the wafer carrier 3. This further improves the accuracy and stability of the wafer carrier 3 in driving the wafer.

[0043] In one embodiment of the present invention, the pneumatic component further includes a negative pressure section, which is disposed on the side of the wafer carrier 3 facing the support guide section 22 or on the top surface of the support guide section 22. The negative pressure section can generate negative pressure to adsorb and fix the wafer carrier 3 on the top surface of the support guide section 22.

[0044] In the above technical solution, the negative pressure section is mainly used to extract air to generate negative pressure. The negative pressure section is positioned on the side of the wafer carrier 3 facing the support guide section 22 or on the top surface of the support guide section 22. Under the action of the negative pressure section, negative pressure is generated in the gap between the wafer carrier 3 and the support guide section 22, thereby adsorbing and fixing the wafer carrier 3 to the top of the support guide section 22. The negative pressure section can be used alone or in conjunction with the first air flotation pad. While the negative pressure section adsorbs and fixes the wafer carrier 3 to the top of the support guide section 22, the first air flotation pad applies a pressing force towards the wafer carrier 3 from the bottom of the support guide section 22, thereby further improving the strength and reliability of the relative fixation between the wafer carrier 3 and the support guide section 22.

[0045] In one embodiment of the present invention, the pneumatic component further includes a positive pressure section, which is disposed on the side of the wafer carrier 3 facing the support guide section 22 or on the top surface of the support guide section 22. The positive pressure section enables the wafer carrier 3 to be air-suspended on the support guide section 22.

[0046] In the above technical solution, the positive pressure section typically includes a device such as an air pump that can blow air to form positive pressure. The positive pressure section is set on the side of the wafer carrier 3 facing the support guide section 22 or on the top surface of the support guide section 22. It is mainly used to blow air into the gap between the wafer carrier 3 and the support guide section 22 to form positive pressure, so that the wafer carrier 3 is air-suspended on the support guide section 22. This avoids direct contact between the wafer carrier 3 and the support guide section 22 during movement. On the one hand, it avoids the influence of the processing error or surface quality of the support guide section 22 on the movement of the wafer carrier 3, improving the accuracy and stability of the wafer carrier 3 driving the wafer movement. On the other hand, it can reduce the friction between the wafer carrier 3 and the support guide section 22, avoid wear between the two, and extend their service life.

[0047] In one embodiment of the present invention, the wafer motion system further includes a driving device 5, which is mounted on the mounting base and can drive the wafer carrier 3 to move along the mounting base.

[0048] In the above technical solution, the driving device 5 can adopt electric, pneumatic, hydraulic or magnetic drive, etc. It is mainly used to drive the wafer carrier 3 to move precisely along the support guide section 22 on the mounting base 2, so as to accurately transport and position the wafer carrier 3 and the wafers on it to the target position, realize efficient and accurate wafer transport, and help improve wafer bonding efficiency and inspection quality.

[0049] In one embodiment of the present invention, a guide step 24 is further provided on the support guide section 22, and the driving device 5 includes a stator 51 and a mover 52. The stator 51 is provided on the guide step 24, and the mover 52 is provided on the wafer carrier 3. The stator 51 and the mover 52 drive each other.

[0050] In the above technical solution, the guide step 24 is used to support the drive device 5 and guide the movement of the mover 52, ensuring that the mover 52 and the wafer carrier 3 connected to it can move along the guide step 24. In this embodiment, the drive device 5 uses a linear motor, which drives the wafer carrier 3 through the electromagnetic force between the mover 52 and the stator 51. The stator 51 is fixed on the guide step 24 and interacts with the mover 52 by generating an electromagnetic field, achieving a contactless driving effect. The mover 52 is disposed on the wafer carrier 3 and interacts with the electromagnetic field of the stator 51, achieving smooth and precise movement of the wafer carrier 3. The cooperation between the guide step 24 and the linear motor ensures the stability of the wafer carrier 3 during movement, reducing positional deviation and vibration. Furthermore, the linear motor has a very fast response speed, enabling rapid positioning and movement of the wafer carrier 3, which helps improve the efficiency of wafer bonding and inspection.

[0051] In one embodiment of this utility model, along the Y-axis direction, the two ends of the mounting base are also provided with limiting parts 23, which can limit the extreme position of the sliding of the wafer carrier 3.

[0052] In the above technical solution, the main function of the limiting part 23 is to physically restrict the movement range of the wafer carrier 3, ensuring that the sliding of the wafer carrier in the Y-axis direction does not exceed the predetermined safety range, and avoiding excessive movement that could cause the wafer carrier 3 to collide with other components, resulting in equipment damage or even personal injury. By setting the limiting part 23, the safety and reliability of the equipment are significantly improved, the frequency of equipment failure and maintenance is reduced, and the continuous operation of the production line is ensured.

[0053] In one embodiment of this utility model, the limiting part 23 may also be extended to install other components for functions such as adjustment, maintenance, and measurement.

[0054] In the above technical solution, in addition to limiting the movement range of the wafer carrier 3, the limiting part 23 also serves to expand the installation platform, providing an installation base for other components used for assembly, maintenance, measurement and other functions. This allows the motion system to install other components as needed to expand the system's functions, improves the adaptability and expandability of the wafer motion system, and ensures that the wafer motion system can flexibly respond to different production needs and operating scenarios.

[0055] In one embodiment of the present invention, the clamping assembly includes a clamping pad, which can clamp and fix the wafer carrier 3 on the mounting base.

[0056] In the above technical solution, the clamping pad is usually made of a relatively soft material such as rubber. The clamping pad is connected to the wafer carrier 3 and can clamp the support guide section 22 from the upper and lower sides under the drive of the hydraulic cylinder, pneumatic cylinder or motor, thereby achieving the effect of clamping and fixing the wafer carrier 3 on the mounting base.

[0057] In one embodiment of this utility model, when the wafer carrier 3 is controlled to move relative to the mounting base, the activation of the positive pressure section can create positive pressure between the wafer carrier 3 and the support guide section 22, causing the wafer carrier 3 to be air-suspended on the support guide section 22. At the same time, there is a certain gap between the top of the support guide section 22 and the wafer carrier 3, thereby avoiding direct contact between the wafer carrier 3 and the support guide section 22 during the movement. Then, the wafer carrier 3 is driven to move, avoiding the influence of the processing error or surface quality of the support guide section 22 on the movement of the wafer carrier 3, and improving the accuracy and stability of the wafer carrier 3 driving the wafer to move.

[0058] In one embodiment of this utility model, when the wafer carrier 3 is controlled to move relative to the mounting base, the air pump or other air source device is activated at the same time as the positive pressure section is activated to inflate the first air float 43. This simultaneously forms an air gap at the top and bottom of the support guide section 22, ensuring that the wafer carrier 3 does not come into direct contact with the support guide section 22 during movement. This avoids the processing errors or surface quality of the support guide section 22 affecting the movement of the wafer carrier 3, further improving the accuracy and stability of the wafer carrier 3 in driving the wafer.

[0059] In one embodiment of this utility model, when the wafer carrier 3 moves relative to the mounting base, an air source device such as an air pump is activated to simultaneously inflate the first air cushion 43 and the second air cushion. The first air cushion 43 and the second air cushion work together to form an air gap at the top and bottom of the support guide section 22. At this time, the horizontal section 42 is air-float relative to the support guide section 22, and the wafer carrier 3 is also air-float relative to the support guide section 22. This ensures that the wafer carrier 3 will not come into direct contact with the support guide section 22 during movement, avoiding the influence of processing errors or surface quality of the support guide section 22 on the movement of the wafer carrier 3. This further improves the accuracy and stability of the wafer carrier 3 in driving the wafer.

[0060] In one embodiment of this utility model, when the wafer carrier 3 moves relative to the mounting base, an air source device such as an air pump is activated to inflate the second air float. By setting air holes on the surface of the second air float and cooperating with the air source device such as the air pump in the second air float, an air gap is formed between the wafer carrier 3 and the support guide section 22, thereby suspending them relative to each other. This ensures that the wafer carrier 3 does not have rigid contact or friction with the support guide section 22 when it moves along the support guide section 22, avoiding the influence of the processing error or surface quality of the support guide section 22 on the movement of the wafer carrier 3. This improves the accuracy and stability of the wafer carrier 3 in driving the wafer to move. In addition, it can also reduce the friction between the wafer carrier 3 and the support guide section 22, avoid wear between the two, and extend their service life.

[0061] In one embodiment of this utility model, when the mounting base drives the wafer carrier 3 to move together along the Z-axis, the negative pressure part is activated at the same time as the first driving component drives the first air float to move. While the negative pressure part adsorbs and fixes the wafer carrier 3 to the top of the support guide section 22, the first air float applies a pressing force towards the wafer carrier 3 to the support guide section 22 from the bottom of the support guide section 22, thereby further improving the strength and reliability of the relative fixation between the wafer carrier 3 and the support guide section 22.

[0062] In one embodiment of this utility model, when the mounting base drives the wafer carrier 3 to move together along the Z-axis, the first driving component and the second driving component are activated simultaneously, thereby driving the first air cushion and the second air cushion to simultaneously clamp and fix from the upper and lower sides of the support guide section 22. This further improves the strength and reliability of the relative fixation between the wafer carrier 3 and the support guide section 22, and minimizes the impact of the inertia generated by acceleration and deceleration during the lifting process on the wafer carrier 3 and the wafers on it.

[0063] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects: The mounting base, as the carrier of the entire wafer motion system, primarily supports the wafer carrier 3 and other components, and also serves as the mounting foundation for the Z-axis drive assembly. The wafer carrier 3 carries the wafer and drives its movement. The clamping assembly provides sufficient preload to the wafer carrier 3, clamping it securely to the mounting base. During the process of the mounting base lifting the wafer carrier to the bonding position, the inertia generated by acceleration and deceleration during the lifting motion prevents wafer misalignment, thus ensuring that the wafer alignment is not disturbed by the transfer process, avoiding early alignment failures, improving bonding accuracy, and enhancing the product quality of the bonded wafer. The Z-axis drive assembly is responsible for driving the mounting base and the wafer carrier 3 on it to move along the Z-axis. At least three Z-axis drive assemblies are set below the mounting base to form a stable triangular support structure. By supporting the mounting base at multiple points and driving the mounting base to rise and fall, the accuracy and stability of the Z-axis drive assembly driving the mounting base to rise and fall along the Z-axis are improved, ensuring the vertical positioning accuracy of the wafer during bonding and inspection.

[0064] The wafer motion system proposed in this utility model clamps and fixes the wafer carrier 3 on the mounting base by setting a clamping component. This avoids the wafer carrier 3 becoming unstable and shifting due to the inertia generated by acceleration and deceleration during the lifting motion when the wafer rises to the bonding position. This ensures that the wafer can maintain the accuracy of the initial alignment, reduces the possibility of errors during bonding, and thus improves the quality of the wafer after bonding.

[0065] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0066] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0067] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer motion system, characterized by, include: Mounting base; A wafer carrier (3) is disposed above the mounting base; The wafer carrier (3) is clamped and fixed on the mounting base by the clamping assembly; At least three Z-axis drive components are disposed below the mounting base and are movably connected to the mounting base.

2. The wafer motion system according to claim 1, characterized in that, The mounting base includes a central through groove (21) and two side support guide sections (22), and the clamping assembly includes a pneumatic assembly; When the Z-axis drive assembly drives the mounting base to move, the pneumatic assembly can clamp and fix the wafer carrier (3) on the support guide section (22), or the pneumatic assembly can air-float with the support guide section (22) when the wafer carrier (3) moves relative to the mounting base.

3. The wafer motion system of claim 2, wherein, The pneumatic assembly includes: The connecting part includes a vertical section (41) and a horizontal section (42). The first end of the vertical section (41) is disposed on the wafer carrier (3) and extends downward. The second end of the vertical section (41) is connected to the first end of the horizontal section (42). The second section of the horizontal section (42) extends to the bottom of the support guide section (22). A first air-floating cushion (43) is disposed on one of the horizontal section (42) and the support guide section (22); A first driving member is driven to connect with the first air cushion; the first driving member can drive the first air cushion (43) to move, so as to provide the first air cushion (43) with a force that can press against the other of the horizontal section (42) and the support guide section (22).

4. The wafer motion system according to claim 3, characterized in that, The pneumatic assembly further includes a second air cushion and a second driving member connected by a drive. The second air cushion is disposed on one of the wafer carrier (3) and the support guide section (22). The second driving member can drive the second air cushion to move, so as to provide the second air cushion with a force that can press against the other of the wafer carrier (3) and the support guide section (22).

5. The wafer motion system according to claim 3, characterized in that, The pneumatic assembly also includes a negative pressure section, which is disposed on the side of the wafer carrier (3) facing the support guide section (22) or on the top surface of the support guide section (22). The negative pressure section can generate negative pressure to adsorb and fix the wafer carrier (3) on the top surface of the support guide section (22).

6. The wafer motion system according to claim 3, characterized in that, The pneumatic assembly further includes a positive pressure section, which is disposed on the side of the wafer carrier (3) facing the support guide section (22) or on the top surface of the support guide section (22). The positive pressure section enables the wafer carrier (3) to be air-suspended on the support guide section (22).

7. The wafer motion system according to claim 2, characterized in that, The wafer motion system further includes a drive device (5), which is disposed on the mounting base and is capable of driving the wafer carrier (3) to move along the mounting base.

8. The wafer motion system according to claim 7, characterized in that, The support guide section (22) is also provided with a guide step (24). The driving device (5) includes a stator (51) and a mover (52). The stator (51) is provided on the guide step (24), and the mover (52) is provided on the wafer carrier (3). The stator (51) and the mover (52) drive each other.

9. The wafer motion system according to claim 1, characterized in that, Along the Y-axis, the mounting base is also provided with limiting parts (23) at both ends, which can limit the extreme position of the sliding of the wafer carrier (3).

10. The wafer motion system according to claim 1, characterized in that, The clamping assembly includes a clamping pad that can clamp and fix the wafer carrier (3) on the mounting base.

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