Coating base and coating apparatus

Abstract

The application relates to a coating base and a coating device. The coating base has a coating area and a buffer area; the coating area is used for placing a coating base material; the buffer area is used for placing a buffer base material which is the same as the coating base material; the buffer area and the coating area are arranged along a coating direction, and the buffer area is adjacent to the coating area. The coating base is provided with a buffer area on the outer circumferential side of the coating area, the buffer base material which is the same as the coating base material of the coating area is placed in the buffer area, the coating process is the transition of the same material, and no matter single-junction perovskite coating or laminated perovskite coating, the down knife and the up knife can be positioned in the buffer area, the transition from the buffer area to the coating area of the same material is realized, the uniformity of the front end and the rear end of perovskite coating is improved, and the agglomeration of the solution to the area with high wettability in the middle due to the different wettability of the solution on different materials can be avoided.

Description

Technical Field

[0001] This application relates to the field of photovoltaic module manufacturing technology, and in particular to a coating substrate and coating equipment. Background Technology

[0002] Perovskite solar cells are solar cells that use perovskite-type organometal halide semiconductors as light-absorbing materials. They belong to the third generation of solar cells and are also known as new concept solar cells. They have advantages such as high photoelectric conversion efficiency and low manufacturing cost.

[0003] In the large-scale industrial production of perovskite, slot coating equipment is widely used. It can be used for large-area coating of single-junction perovskite modules and also for perovskite tandem solar cells. Regardless of whether it's single-junction or tandem perovskite solar cell coating, the platform of the slot coating equipment and the substrate of the perovskite coating are made of different materials. The varying wettability of the perovskite solution on different materials affects the uniformity of the perovskite coating at the front and rear ends, thus impacting the cell's performance. Utility Model Content

[0004] Therefore, it is necessary to provide a coating substrate and coating equipment to address the aforementioned technical problems.

[0005] A coating substrate, the coating substrate having:

[0006] The coating area is used to place the coating substrate; and

[0007] A buffer area is used to place a buffer substrate of the same material as the coating substrate. The buffer area and the coating area are arranged along the coating direction, and the buffer area is adjacent to the coating area.

[0008] The aforementioned coating platform, by providing a buffer area on one side of the coating area along the coating direction, allows a buffer substrate of the same material as the coating substrate to be placed in the buffer area. This makes the coating process a transition of the same material. Whether it is single-junction perovskite coating or multilayer perovskite coating, the entry and exit points of the blade can be in the buffer area, transitioning from the buffer area to the coating area of ​​the same material, thus improving the uniformity of the front and rear ends of the perovskite coating. At the same time, it can also avoid the aggregation of the solution in the central area with high wettability due to the different wettability of the solution in different materials.

[0009] In one embodiment, a buffer region is disposed around the outer periphery of the coating region.

[0010] In one embodiment, the coating area is provided as a plurality of coating areas, which are spaced apart along the coating direction, and the size of the plurality of coating areas is different;

[0011] The buffer area is also set as multiple, and the buffer area corresponds one-to-one with the coating area.

[0012] In one embodiment, the coating substrate has a first substrate groove in the coating area for accommodating the coating substrate, and a second substrate groove in the buffer area for accommodating the buffer substrate.

[0013] In one embodiment, the first base groove and the second base groove have the same groove depth; and / or, the groove depth of the first base groove and the second base groove is both 90 μm to 200 μm.

[0014] In one embodiment, the coating substrate has a liquid storage groove between the coating area and the buffer area, and the depth of the liquid storage groove is 500 μm to 1000 μm.

[0015] In one embodiment, the coating substrate is provided with a first vacuum adsorption hole in the coating area, and / or a second vacuum adsorption hole in the buffer area.

[0016] In one embodiment, the pore size of the first vacuum adsorption pore and / or the second vacuum adsorption pore is 30 μm to 100 μm.

[0017] A coating apparatus includes a coating substrate, a buffer substrate, and a coating platform as described in any of the preceding claims, wherein the coating substrate is laid on a coating area of ​​the coating platform, and the buffer substrate is laid on a buffer area of ​​the coating platform; wherein the coating substrate and the buffer substrate are made of the same material.

[0018] In one embodiment, the coating equipment is a slot coating equipment.

[0019] This coating equipment, by providing a buffer area on one side of the coating area along the coating direction, allows the placement of a buffer substrate of the same material as the coating substrate in the buffer area. This makes the coating process a transition of the same material, whether it is single-junction perovskite coating or multilayer perovskite coating. The entry and exit points of the blade can be in the buffer area, transitioning from the buffer area to the coating area of ​​the same material, thus improving the uniformity of the front and rear ends of the perovskite coating. At the same time, it can also avoid the aggregation of the solution in the central area with high wettability due to the different wettability of the solution in different materials. Attached Figure Description

[0020] Figure 1 This is a top view of a coating substrate provided in an embodiment of this application.

[0021] Figure 2This is a side cross-sectional view of a coating substrate provided in an embodiment of this application.

[0022] The labels in the attached diagram are explained as follows:

[0023] 10. Coating platform; 100. Coating area; 110. First substrate groove; 200. Buffer area; 210. Second substrate groove; 300. Liquid storage groove; 400. First vacuum adsorption hole; 500. Second vacuum adsorption hole. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0025] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0026] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0030] Perovskite solar cells are solar cells that use perovskite-type organometal halide semiconductors as light-absorbing materials. They belong to the third generation of solar cells and are also known as new concept solar cells. They have advantages such as high photoelectric conversion efficiency and low manufacturing cost.

[0031] In the large-scale industrial production of perovskite, slot coating equipment is widely used. It can be used for large-area coating of single-junction perovskite modules and for perovskite tandem solar cells. During coating, a silicon substrate is first placed on the base of the coating equipment. Then, the coating material is extruded from the slot of the slot head under pressure, forming a uniform liquid film on the silicon substrate. For coating of single-junction perovskite modules, the common method is to place the slot head at the bottom of the silicon substrate during coating and at the top of the coating. This results in some silicon substrate not being utilized, and after coating, laser edge cleaning is required to remove the uneven perovskite areas at the front and back ends of the coating. For coating of perovskite tandem solar cells (such as silicon / perovskite tandem), the entire silicon substrate needs to be coated. Therefore, the slot head is placed at both the bottom and top of the slot base. Since the slot base and the coating substrate are made of different materials, the uniformity of the coating at the front and back ends will be affected.

[0032] In this application, one embodiment provides a coating platform. This platform serves as a crucial component of coating equipment (e.g., slot coating equipment), supporting various types of coating substrates, such as glass substrates and silicon wafers. It provides a stable support platform for the coating process, ensuring that the substrate does not deform or move due to external forces during coating, thus guaranteeing the uniformity and accuracy of the coating. This coating equipment can be applied to perovskite solar cell fabrication, semiconductor fabrication, and printed circuit board fabrication.

[0033] The material of the coating substrate 10 generally needs to have good wear resistance, corrosion resistance, and thermal stability to adapt to different coating materials and process environments. At the same time, the coefficient of thermal expansion of the material should be as small as possible to avoid deformation of the substrate when the temperature changes, which would affect the coating accuracy. The material of the coating substrate 10 can be a metal such as aluminum alloy, stainless steel, or titanium alloy, or a ceramic material, or a polymer such as PTFE (Polytetrafluoroethylene) or PI (Polyimide).

[0034] like Figure 1As shown, the coating platform 10 has a coating area 100 and a buffer area 200. The coating area 100 is used to place the coating substrate. In perovskite solar cells, the coating substrate mainly plays a role in support, conductivity, and light transmission. The material of the coating substrate can be glass, such as indium tin oxide glass or fluorine-doped tin oxide glass, or it can be a polymer, such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate dimethyl ether glycol ester), or PI. Of course, the coating substrate can also be a silicon wafer. During coating, the coating material is extruded from the slit of the slit cutter head under pressure, thereby forming a uniform liquid film on the coating substrate.

[0035] The coating platform 10 has multiple coating areas 100, which are spaced apart along the coating direction and have different sizes. It should be noted that the coating direction is the horizontal movement direction of the slit cutter head. Different sized substrates can be placed in the coating areas 100, meeting diverse product manufacturing needs without frequent substrate changes or adjustments to the coating equipment, thus improving production flexibility and efficiency. Furthermore, it allows operators to simultaneously conduct coating experiments on the same coating platform 10 using substrates of different sizes, comparing the impact of different substrate sizes on coating effects and battery performance. This allows for the rapid identification of the most suitable substrate size for specific processes and product requirements, providing a basis for process optimization and contributing to improved battery performance and production efficiency.

[0036] The shape, quantity, and size of the coating area 100 can be set according to requirements, as long as they meet production or experimental needs. For example, such as... Figure 1 As shown, the coating substrate 10 has two rectangular coating areas 100 along the coating direction, with dimensions of 50mm×50mm and 210mm×105mm respectively.

[0037] The buffer region 200 is used to place the buffer substrate. At least a portion of the buffer region 200 is disposed along the coating direction with the coating region 100, and the buffer region 200 is adjacent to the coating region 100. For example, the buffer region 200 is located on the lower and / or lower side of the coating region 100. The materials of the buffer substrate placed in the buffer region 200 and the coating substrate placed in the coating region 100 can be the same. For example, the materials of the buffer substrate and the coating substrate are both indium tin oxide glass, fluorine-doped tin oxide glass, PET, PEN, or PI. During coating, the lower and lower positions of the slot coating can be in the buffer region 200 of the substrate. For coating of single-junction perovskite modules, it can reduce the area of ​​unusable areas at the edge of the coating substrate and improve the unevenness of the edge of the coating region 100, eliminating the need for laser edge cleaning. For tandem cells, it can avoid the unevenness at the front and rear ends caused by the different wettability of the coating solution on different materials.

[0038] The number of buffer regions 200 can be set to multiple, with each buffer region 200 corresponding one-to-one with a coating region 100. It can be understood that the number and arrangement of buffer regions 200 are the same as those of coating regions 100. The width of the buffer region 200 can be set according to the size of the scalpel head; specifically, the larger the size of the scalpel head, the larger the width of the buffer region 200. For example... Figure 1 As shown, two adjacent buffer areas 200 can be connected together, which makes the structure of the coating substrate 10 more compact.

[0039] The coating platform 10 has a buffer area 200 on one side of the coating area 100 along the coating direction. A buffer substrate of the same material as the coating substrate of the coating area 100 can be placed in the buffer area 200, so that the coating process is a transition of the same material. Whether it is single-junction perovskite coating or multilayer perovskite coating, the starting and ending positions of the blade can be in the buffer area 200, and the transition from the buffer area 200 to the coating area 100 of the same material can be improved, thus improving the uniformity of the front and rear ends of the perovskite coating. At the same time, it can also avoid the aggregation of the solution in the middle area with high wettability due to the different wettability of the solution in different materials.

[0040] like Figure 1 As shown, in some embodiments of this application, a buffer region 200 is arranged around the outer periphery of the coating region 100. By providing a buffer region 200 around the outer periphery of the coating region 100, the down-cut and up-cut positions can be within the buffer region 200 when the coating direction is adjusted, thus improving the versatility of the equipment.

[0041] like Figure 2As shown, in some embodiments of this application, the coating platform 10 has a first substrate groove 110 in the coating area 100 for accommodating the coating substrate. The first substrate groove 110 not only provides a precise placement reference for the coating substrate, ensuring that the coating substrate maintains the correct position and orientation during the coating process, which helps to improve the consistency and accuracy of the coating, especially for the production of perovskite solar cells that require high-precision coating, it can ensure that the coating pattern is accurately aligned with the electrodes or other functional areas on the coating substrate; moreover, the coating substrate is restricted by the edge of the first substrate groove 110, and is not easily displaced during the coating process due to factors such as coating pressure, solution flow or equipment vibration, thereby ensuring the stability of the coating quality.

[0042] The groove depth of the first base groove 110 is 90μm to 200μm, for example, it can be set to 90μm, 100μm, 105μm, 110μm, 115μm, 120μm, 125μm, 130μm, 135μm, 140μm, 145μm, 150μm, 155μm, 160μm, 165μm, 170μm, 175μm, 180μm, 185μm, 190μm, 195μm, 200μm, etc. Setting the groove depth of the first substrate groove 110 to 90μm to 200μm ensures that an appropriate amount of coating liquid is temporarily stored and flows within the first substrate groove 110. This prevents the coating liquid from being too shallow, resulting in insufficient coating volume, or too deep, leading to excessive coating liquid, waste, or reduced coating accuracy. It also helps maintain a suitable distance and angle between the slit cutter head and the coating substrate, allowing the coating liquid to be transferred evenly from the slit cutter head to the coating substrate. If the first substrate groove 110 is too deep or too shallow, it may cause uneven gap between the slit cutter head and the coating substrate, thus affecting the uniformity of coating and ultimately impacting product performance.

[0043] See also Figure 2 The substrate has a second substrate groove 210 in the buffer area 200 for accommodating the buffer substrate. The second substrate groove 210 provides a precise placement reference for the coating substrate, ensuring that the coating substrate maintains the correct position and orientation during the coating process, which helps to improve the consistency and accuracy of the coating. This is especially important for the production of perovskite solar cells that require high-precision coating, as it ensures that the coating pattern is accurately aligned with the electrodes or other functional areas on the coating substrate. It also allows the coating substrate to be constrained by the edge of the second substrate groove 210, making it less prone to displacement due to factors such as coating pressure, solution flow, or equipment vibration during the coating process, thereby ensuring the stability of the coating quality.

[0044] The second substrate groove 210 has the same depth as the first substrate groove 110. This design ensures uniformity of coating thickness, consistent photoelectric conversion efficiency, and avoids unstable current and voltage output caused by localized excessive thickness or thinness. The depth of the second substrate groove 210 can also be set from 90μm to 200μm, for example, it can be set to 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm, 200μm, etc.

[0045] In some embodiments of this application, such as Figure 2 As shown, the coating substrate 10 has a liquid storage groove 300 between the coating area 100 and the buffer area 200. When the flow rate of the coating liquid output by the coating equipment fluctuates, the reservoir 300 can temporarily hold excess coating liquid to prevent excessive flow from impacting the substrate and causing uneven coating thickness. When the flow rate of the coating liquid is low, the coating liquid in the reservoir 300 can be replenished to maintain a certain pressure and ensure that the coating liquid can flow evenly to the coating substrate or buffer substrate. The reservoir 300 can also act as a protective barrier to collect coating liquid that may overflow from the first substrate reservoir 110 or the second substrate reservoir 210. During the coating process, due to factors such as coating pressure and substrate surface characteristics, the coating liquid may overflow from the edges of the first substrate reservoir 110 or the second substrate reservoir 210. The reservoir 300 can collect this overflowing coating liquid to prevent it from flowing to other parts of the base or equipment, reducing pollution to the equipment and impact on the working environment. It can also prevent coating liquid from splashing onto the operator, improving work safety. After coating is completed, the reservoir 300 can easily collect the remaining coating liquid, facilitating cleaning of the base.

[0046] The depth of the liquid storage groove 300 can be set from 500μm to 1000μm, for example, it can be set to 500μm, 600μm, 700μm, 800μm, 900μm, 1000μm, etc. The depth of the liquid storage groove 300 is sufficient to store a certain amount of coating liquid without causing excessive turbulence or splashing due to excessive space. This allows the coating liquid to flow relatively smoothly from the liquid storage groove 300 to the surface of the coating substrate in the first substrate groove 110 or the surface of the buffer substrate in the second substrate groove 210.

[0047] In some embodiments of this application, such as Figure 1As shown, the substrate has a first vacuum adsorption hole 400 in the coating area 100. During coating, the substrate in the coating area 100 can be adsorbed and positioned to prevent displacement due to coating pressure, solution flow or equipment vibration, thus ensuring the stability of coating quality; the substrate can also be removed and replaced at any time.

[0048] The pore size of the first vacuum adsorption pore 400 is 30μm to 100μm, for example, it can be set to 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, etc. This setting can ensure a suitable adsorption capacity.

[0049] Multiple first vacuum adsorption pores 400 can be configured, and these pores can be arranged in a matrix. This configuration ensures uniform adsorption onto the coated substrate and guarantees adsorption stability.

[0050] In some embodiments of this application, such as Figure 1 As shown, the substrate has a second vacuum adsorption hole 500 in the buffer area 200. During coating, the buffer substrate in the buffer area 200 can be adsorbed and positioned, so that the buffer substrate is not easily displaced by factors such as coating pressure, solution flow or equipment vibration, thereby ensuring the stability of coating quality; the buffer substrate can also be removed and replaced at any time.

[0051] The pore size of the second vacuum adsorption pore 500 is from 30μm to 100μm, for example, it can be set to 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, etc. This setting can ensure a suitable adsorption capacity.

[0052] Multiple second vacuum adsorption pores 500 can be configured, and these pores can be arranged in a matrix. This configuration allows for uniform adsorption of the buffer substrate, ensuring adsorption stability.

[0053] On the other hand, one embodiment of this application also provides a coating apparatus, which includes a coating substrate, a buffer substrate, and a coating platform 10 as described in any of the above claims. The coating substrate is laid on the coating area 100 of the coating platform 10, and the buffer substrate is laid on the buffer area 200 of the coating platform 10. The coating substrate and the buffer substrate are made of the same material.

[0054] This coating equipment can be applied to the fields of perovskite solar cell fabrication, semiconductor fabrication, and printed circuit board fabrication.

[0055] The material of the buffer substrate can be glass, such as indium tin oxide glass or fluorine-doped tin oxide glass, or it can be a polymer, such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate dimethyl acid glycol ester), or PI.

[0056] The buffer base is made of the same material as the buffer base. The buffer base can be made up of multiple bases spliced ​​together or it can be made up of a single base.

[0057] This coating equipment, by setting a buffer zone 200 around the outer periphery of the coating area 100 on the coating platform 10, allows a buffer substrate of the same material as the coating substrate in the coating area 100 to be placed in the buffer zone 200, making the coating process a transition of the same material. Whether it is single-junction perovskite coating or multilayer perovskite coating, the entry and exit points of the blade can be in the buffer zone 200, transitioning from the buffer zone 200 to the coating area 100 of the same material, improving the uniformity of the front and rear ends of the perovskite coating; at the same time, it can also avoid the agglomeration of the solution in the central area with high wettability due to the different wettability of the solution in different materials.

[0058] In some embodiments of this application, the coating apparatus may be a slot coating apparatus.

[0059] In some embodiments of this application, the coating apparatus further includes a vacuum mechanism, which is connected to the first vacuum adsorption hole 400 and the second vacuum adsorption hole 500 of the coating substrate 10. The vacuum mechanism can evacuate the first substrate groove 110 and the second substrate groove 210 to adsorb the coating substrate and the buffer substrate. The vacuum mechanism can be a vacuum pump. Alternatively, the vacuum mechanism may only be connected to either the first vacuum adsorption hole 400 or the second vacuum adsorption hole 500.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A coating substrate, characterized in that, The coating substrate has: The coating area is used to place the coating substrate; and A buffer area is provided for placing a buffer substrate of the same material as the coating substrate. The buffer area is disposed along the coating direction with the coating area and is adjacent to the coating area.

2. The coating substrate according to claim 1, characterized in that, The buffer area is arranged around the outer periphery of the coating area.

3. The coating substrate according to claim 1, characterized in that, The coating area is set as multiple, and the multiple coating areas are spaced apart along the coating direction, and the multiple coating areas have different sizes; The buffer area is also set as multiple, and the buffer area corresponds one-to-one with the coating area.

4. The coating substrate according to claim 1, characterized in that, The coating substrate has a first substrate groove in the coating area for accommodating the coating substrate, and a second substrate groove in the buffer area for accommodating the buffer substrate.

5. The coating substrate according to claim 4, characterized in that, The first base groove and the second base groove have the same groove depth; and / or, the first base groove and the second base groove both have a groove depth of 90 μm to 200 μm.

6. The coating substrate according to any one of claims 1 to 5, characterized in that, The coating substrate has a liquid storage groove between the coating area and the buffer area, and the depth of the liquid storage groove is 500μm to 1000μm.

7. The coating substrate according to any one of claims 1 to 5, characterized in that, The coating substrate is provided with a first vacuum adsorption hole in the coating area, and / or a second vacuum adsorption hole in the buffer area.

8. The coating substrate according to claim 7, characterized in that, The pore size of the first vacuum adsorption pore and / or the second vacuum adsorption pore is 30 μm to 100 μm.

9. A coating device, characterized in that, The system includes a coating substrate, a buffer substrate, and a coating platform as described in any one of claims 1 to 8, wherein the coating substrate is laid on the coating area of ​​the coating platform, and the buffer substrate is laid on the buffer area of ​​the coating platform; wherein the coating substrate and the buffer substrate are made of the same material.

10. The coating equipment according to claim 9, characterized in that, The coating equipment is a slot coating equipment.

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