Heat dissipating circuit board, circuit board component, and camera module

Abstract

The application relates to a heat-dissipating circuit board, a circuit board component and a camera module. The heat-dissipating circuit board comprises an insulating body, a plurality of metal layers which are arranged in the insulating body in a spaced manner, the plurality of metal layers comprising a first metal layer located at a first side of the insulating body, a second metal layer located at a second side of the insulating body and at least one intermediate metal layer located in the insulating body, the intermediate metal layer extending to the outer periphery of the insulating body, the first metal layer comprising a first working area for electrically connecting electronic components, a heat-dissipating layer arranged at the outer periphery of the insulating body and in thermal contact with the plurality of metal layers, a heat-conducting filling part arranged in the insulating body and in thermal contact with the intermediate metal layer, and a plurality of heat-conducting channels, the heat-conducting channels being arranged in the insulating body, some of the heat-conducting channels being in thermal contact with the first metal layer and the heat-conducting filling part, and the other heat-conducting channels being in thermal contact with the second metal layer and the heat-conducting filling part. The heat-dissipating circuit board can avoid local overheating and can effectively dissipate heat.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to heat-dissipating circuit boards, circuit board components, and camera modules. Background Technology

[0002] Circuit boards are used to mount electronic components, which generate heat during operation. Poor heat dissipation on the circuit board can lead to both localized and overall overheating. Excessive heat can negatively impact the operation of electronic components, such as causing performance degradation and shortened lifespan. Furthermore, uneven or excessively high temperatures can affect the shape of the circuit board, leading to inconsistent thermal expansion and deformation, or different expansion rates between the circuit board and the electronic components.

[0003] With the continuous development of intelligent driving technology, the application of in-vehicle cameras is becoming increasingly widespread, especially pure vision solutions. As the pixel count of in-vehicle cameras increases, the power consumption of the imaging chips also rises. This increased power consumption leads to a surge in heat generation, and insufficient heat dissipation results in significant temperature drift in the camera and impacts the lifespan of the imaging chip. Specifically, uneven expansion in some areas of the circuit board can cause focus misalignment between the lens and the imaging chip, affecting the temperature drift of the in-vehicle camera and reducing image clarity. Furthermore, insufficient heat dissipation capacity of the circuit board, particularly the commonly used FR-4 grade material with high thermal resistance and poor heat dissipation, can cause the junction temperature of the imaging chip to exceed 125°C at an ambient temperature of 95°C, potentially damaging the imaging chip and shortening the lifespan of the in-vehicle camera.

[0004] The aim is to reduce the impact of excessively high local and overall temperatures on the chips. Utility Model Content

[0005] Therefore, it is necessary to provide heat-dissipating circuit boards, circuit board components, and camera modules to address at least one of the above-mentioned problems.

[0006] In a first aspect, this application provides a heat-dissipating circuit board for mounting electronic components. The heat-dissipating circuit board includes: an insulating body; multiple metal layers stacked at intervals on the insulating body, the multiple metal layers including a first metal layer located on a first side of the insulating body, a second metal layer located on a second side of the insulating body, and at least one intermediate metal layer located within the insulating body, the intermediate metal layer extending to the outer periphery of the insulating body; the first metal layer including a first working area for electrically connecting electronic components; a heat-dissipating layer disposed on the outer periphery of the insulating body and in thermally conductive contact with the multiple metal layers; a thermally conductive filler portion disposed within the insulating body and in thermally conductive contact with the intermediate metal layer; and multiple thermally conductive channels penetrating the insulating body, some of the thermally conductive channels in thermally conductive contact with the first metal layer and the thermally conductive filler portion, and other thermally conductive channels in thermally conductive contact with the second metal layer and the thermally conductive filler portion.

[0007] By incorporating thermally conductive filling portions and thermally conductive channels, heat from electronic components installed in the first working area can be rapidly dissipated; multiple metal layers enable rapid heat transfer to the surrounding areas; and the heat dissipation layer dissipates heat from the metal layers outwards. The heat-dissipating circuit board of this application embodiment can avoid localized overheating and ensure overall balance; it can effectively dissipate heat, preventing excessively high local and overall temperatures, thus allowing electronic components to perform their functions better.

[0008] For example, the heat dissipation layer is a copper plating layer. For example, the thermally conductive filling portion is a copper component, an aluminum component, an aluminum carbide component, or a silicon carbide component. For example, the thermally conductive channel is a copper via. For example, the position of the thermally conductive filling portion corresponds to the first working area.

[0009] This design makes the heat-dissipating circuit board easy to manufacture and provides good heat dissipation. The thermally conductive filler can quickly and effectively dissipate heat from the first working area.

[0010] In some embodiments, the heat-dissipating circuit board further includes a metal block and two solder mask layers, the metal block being disposed on the second metal layer, one solder mask layer covering the first metal layer and exposing the first working area, and the other solder mask layer covering the second metal layer and exposing the metal block.

[0011] With this configuration, the metal block can be used as a support foot; the metal block can facilitate faster heat dissipation at the second metal layer, which is beneficial for the overall heat dissipation of the heat-dissipating circuit board and helps with heat conduction and absorption.

[0012] In some embodiments, the metal block partially corresponds to the first working area, and at least one heat-conducting channel is provided between the metal block and the heat-conducting filling part.

[0013] This configuration results in a shorter heat conduction path from the external electronic components to the metal block, leading to faster heat dissipation; in addition, it facilitates the design of circuit patterns.

[0014] Secondly, this application provides a circuit board component, which includes: the aforementioned heat-dissipating circuit board; and a chip disposed in the first working area of ​​the heat-dissipating circuit board.

[0015] By setting up a heat-dissipating circuit board, the chip can be effectively cooled, ensuring its performance and lifespan.

[0016] In some embodiments, the circuit board component further includes a connector; the second metal layer includes a second working area electrically connected to the first working area; the connector is disposed in the second working area. Optionally, the chip is a ball grid array packaged chip or a bare die chip.

[0017] This configuration allows for more flexible design, manufacturing, installation, and use of circuit board components.

[0018] Thirdly, this application provides a camera module, which includes: a housing; a lens disposed in the housing; and the aforementioned circuit board component disposed in the housing, wherein the chip is an imaging chip located on the imaging surface of the lens.

[0019] By setting up a heat dissipation circuit board to cool the imaging chip, the chip temperature is prevented from becoming too high. At the same time, the heat dissipation circuit board itself generates heat evenly, suppresses deformation, and ensures the proper fit between the imaging chip and the lens, which is beneficial for the camera module to capture images of better quality.

[0020] In some embodiments, the housing is connected to one side of the second metal layer of the heat-dissipating circuit board, and there is a gap between the housing and the heat-dissipating layer; the camera module includes a heat-dissipating filler portion filled between the housing and the heat-dissipating layer.

[0021] With this configuration, the heat from the heat dissipation layer can be transferred to the housing using the heat dissipation filling part, resulting in better heat dissipation of the heat dissipation circuit board, and the camera module can dissipate heat to the outside through the housing.

[0022] In some embodiments, the housing includes a boss for supporting a metal block disposed on a second metal layer of a heat-dissipating circuit board; the camera module also includes a heat-dissipating attachment portion that contacts the boss and the metal block respectively.

[0023] With this configuration, the heat generated by the imaging chip can be quickly transferred downwards through the heat conduction channel and the metal block; the larger surface area of ​​the housing allows the heat dissipation attachment to enhance the ability of the metal block to transfer heat to the housing.

[0024] In some embodiments, the housing includes a first housing and a second housing, with the lens mounted on the first housing and the circuit board component mounted on the second housing; the lens is bonded to the circuit board component; the first housing and the second housing form a stepped fit.

[0025] With this configuration, the camera module is easy to assemble, the lens and circuit board components are firmly connected, and positioning is easy to ensure; the housing can serve as a connection and protection. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of a circuit board component according to one or more embodiments;

[0027] Figure 2 A schematic cross-sectional view of a heat-dissipating circuit board according to one or more embodiments;

[0028] Figure 3 This is a schematic diagram of the structure of a camera module according to one or more embodiments;

[0029] Figure 4 This is a schematic diagram of a partial structure of a camera module according to one or more embodiments;

[0030] Figure 5 for Figure 4 Enlarged view of point A in the middle.

[0031] Explanation of reference numerals in the attached drawings: 1. Insulating body; 2. Metal layer; 21. First metal layer; 211. First working area; 22. Second metal layer; 221. Second working area; 23. Intermediate metal layer; 3. Heat dissipation layer; 4. Thermally conductive filler; 5. Thermally conductive channel; 6. Metal block; 7. Solder resist layer;

[0032] 100. Heat-dissipating circuit board; 200. Electronic component; 210. Chip; 2101. Adhesive layer; 2102. Lead wire; 220. Connector;

[0033] 1000, Camera module; 1100, Circuit board component; 1200, Housing; 1210, First housing; 1220, Second housing; 1221, Side wall; 1222, Bottom wall; 1223, Boss; 1300, Lens; 1400, Heat dissipation filling part; 1500, Heat dissipation attachment part; 1600, Glue. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0037] Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. For example, a first metal layer may also be referred to as a second metal layer, and a second metal layer may also be referred to as a first metal layer. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; a flexible connection or a rigid connection along at least one direction; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, or a direct connection with an intermediate medium present; and they can also refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. The terms "installed," "set," "fixed," etc., can be broadly understood as connection. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0039] As used in this application, the terms "layer" and "region" refer to a material portion comprising a defined area and having a defined thickness. A layer can extend horizontally, vertically, and / or along a conical surface. A layer can be a region of uniform or non-uniform continuous structure, and its thickness perpendicular to the direction of extension may not exceed the thickness of the continuous structure. A layer can comprise multiple layers, which can be stacked layers or discretely extending layers. The shapes of the various regions and layers in the accompanying drawings, as well as their relative sizes and positional relationships, are merely illustrative and may deviate from actual dimensions due to manufacturing tolerances or technical limitations, and the design can be adjusted according to actual needs.

[0040] refer to Figure 1 , Figure 1A circuit board component according to an embodiment of this application is shown. In an exemplary embodiment, the circuit board component 1100 includes a heat-dissipating circuit board 100 and at least one electronic component 200. The electronic component 200 is disposed on the heat-dissipating circuit board 100 and is electrically connected to the circuitry of the heat-dissipating circuit board 100. Multiple electronic components 200 can be electrically connected through the heat-dissipating circuit board 100.

[0041] refer to Figure 2 In an exemplary embodiment, this application provides a heat-dissipating circuit board 100. The heat-dissipating circuit board 100 may include an insulating body 1, a plurality of metal layers 2, a heat dissipation layer 3, a thermally conductive filling portion 4, and a plurality of thermally conductive channels 5.

[0042] Multiple metal layers 2 are stacked alternately on the insulating body 1. The metal layers 2 may have a perforated pattern, allowing the insulating body 1 to be tightly connected. In other embodiments, multiple holes penetrating the insulating body 1 and the metal layers 2 may be provided. The insulating body 1 may also be divided into multiple insulating layers, with the insulating layers and metal layers 2 stacked alternately.

[0043] The plurality of metal layers 2 may include a first metal layer 21, a second metal layer 22, and at least one intermediate metal layer 23. For ease of description, a spatial rectangular coordinate system XYZ is established. Figure 2 The diagram shows a cross-section parallel to the XZ plane. The first metal layer 21 is located on the first side of the insulating body 1; specifically, the first metal layer 21 is located on the upper side of the insulating body 1 along the Z-axis. The layer below the first metal layer 21 can be referred to as the first insulating layer. The second metal layer 22 is located on the second side of the insulating body 1; specifically, the second metal layer 22 is located on the lower side of the insulating body 1 along the Z-axis. The layer above the second metal layer 22 can be referred to as the second insulating layer. An intermediate metal layer 23 is located within the insulating body 1. Exemplarily, six metal layers 2 and five insulating layers are provided.

[0044] The first metal layer 21 can be etched into various circuit patterns as needed, and can also be connected to other metal layers 2 via countersunk holes, vias, etc. The first metal layer 21 includes a first working area 211 for electrically connecting electronic components 200, and may also include other working areas. Exemplarily, the second metal layer 22 can be etched into various circuit patterns. The second metal layer 22 may include a second working area 221 for electrically connecting electronic components 200. The second working area 221 may be electrically connected to the first working area 211. The heat-dissipating circuit board 100 of this embodiment is used to mount electronic components 200. The first metal layer 21 and the second metal layer 22 have the ability to transfer heat from the electronic components 200 to their surroundings.

[0045] The metal layer 2 extends generally along the XY plane. At least one intermediate metal layer 23 extends to the outer peripheral edge of the insulating body 1, or all metal layers 2 may extend to the outer periphery of the insulating body 1. For example, the insulating body 1 is generally square, and metal layers 2 may extend to all four sides of the insulating body 1.

[0046] A heat-conducting channel 5 is provided through the insulating body 1. The heat-conducting channel 5 may be connected to at least one metal layer 2. Alternatively, a channel may be considered as multiple segments, each segment being referred to as a heat-conducting channel 5. Some heat-conducting channels 5 are connected to the first metal layer 21, enabling the heat from the first metal layer 21 to be conducted away.

[0047] A thermally conductive filler 4 is disposed within the insulating body 1. Both the upper and lower sides of the thermally conductive filler 4 can be insulating layers, effectively manufacturing and maintaining the structure of the thermally conductive filler 4. Some thermally conductive channels 5 make thermal contact with the first metal layer 21 and the thermally conductive filler 4, while other thermally conductive channels 5 make thermal contact with the second metal layer 22 and the thermally conductive filler 4. The thermally conductive filler 4 makes thermal contact with the intermediate metal layer 23, transferring heat from the thermally conductive channels 5, etc., to the intermediate metal layer 23. The intermediate metal layer 23 then transfers the heat outwards, dispersing it throughout the entire heat-dissipating circuit board 100.

[0048] The thermally conductive filling part 4 can be an integral structure, which can quickly disperse and transfer heat, thus facilitating the uniform heat distribution of the heat dissipation circuit board 100. The thermally conductive filling part 4 can be relatively thick, allowing it to contact the entire intermediate metal layer 23, fully utilizing the entire intermediate metal layer 23 to conduct heat to the entire heat dissipation circuit board 100.

[0049] For example, the position of the thermally conductive filling part 4 corresponds to the first working area 211. The thermally conductive filling part 4 can be thermally coupled to the first working area 211 through multiple thermally conductive channels 5, which is beneficial for quickly dissipating the heat of the first working area 211 and avoiding excessively high ambient temperature of the electronic component 200.

[0050] For example, other electronic components 200 with low heat generation are provided in the second working area 221. The heat conduction channel 5 can transfer the heat from the heat conduction filling part 4 to the second metal layer 22, and also transfer heat to the outer periphery through the second metal layer 22.

[0051] A heat dissipation layer 3 is disposed on the outer periphery of the insulating body 1. The heat dissipation layer 3 has thermally conductive contact with multiple metal layers 2, for example, all of the metal layers 2. The multiple metal layers 2 can rapidly transfer heat to the surroundings. The heat dissipation layer 3 can dissipate the heat of the metal layers 2 outwards. The heat-dissipating circuit board 100 of this application embodiment can avoid local overheating and ensure overall balance; it can effectively dissipate heat and avoid excessive local and overall temperatures; and it is used to enable the electronic components 200 to perform their functions better.

[0052] Conventional circuit boards typically do not expose copper. The copper layer is encased in insulating material. This insulating material is a high thermal resistance material with a thermal conductivity ranging from 0.2 W / (m·K) to 0.3 W / (m·K), resulting in heat being trapped inside the circuit board.

[0053] The heat-dissipating circuit board 100 of this embodiment can be manufactured by milling the circuit board's shape before the electroplating step, ensuring that the intermediate metal layer 23 is exposed from the side of the insulating body 1. Then, copper can be plated on the side, forming a copper layer that connects to the intermediate metal layer 23 and all metal layers 2. Specifically, the heat dissipation layer 3 can be connected to the grounding circuit pattern in the metal layer 2. Copper is a high thermal conductivity material with a thermal conductivity of 386.4 W / (m·K), which can quickly transfer heat from the chip 210.

[0054] The heat dissipation layer 3 is a copper plating layer. Exemplarily, the heat conduction channel 5 is a copper via. The heat conduction channel 5 can be a copper-plated via, a blind via, or a through-hole; it can also be a blind via with a filled via. The aperture can be from 0.1 mm to 0.25 mm. Exemplarily, each metal layer 2 can be a copper layer. The thickness of the metal layer 2 can be designed according to the heat generation of the electronic component 200. The chip 210 can be configured with a thicker metal layer 2. The heat dissipation circuit board 100 can be manufactured based on printed circuit board technology, is easy to manufacture, and has good heat dissipation capabilities. The heat dissipation circuit board 100 quickly absorbs heat and diffuses it more evenly throughout the structure, thereby also being able to dissipate heat to the outside more effectively.

[0055] For example, the thermally conductive filling portion 4 is made of copper, aluminum, aluminum carbide, or silicon carbide. For instance, the material of the thermally conductive filling portion 4 is copper, and the thermally conductive filling portion 4 is a copper component. The thermally conductive filling portion of the heat-dissipating circuit board 100 can quickly and effectively dissipate heat from the first working area.

[0056] The heat-dissipating circuit board 100 may also include a solder mask layer 7. One solder mask layer 7 covers the first metal layer 21 and exposes the first working area 211, and another solder mask layer 7 covers the second metal layer 22 and exposes the second working area 221. The solder mask layer 7 may be an ink layer.

[0057] refer to Figure 1 The circuit board component 1100 of this application embodiment includes the aforementioned heat-dissipating circuit board 100 and a chip 210. The chip 210 is disposed in the first working area 211 of the heat-dissipating circuit board 100.

[0058] The chip 210 can be a ball grid array (BGA) package. The package structure of the chip 210 is connected to the first working area 211 via solder balls. The solder has good thermal conductivity, which can transfer the heat of the chip 210 to the first working area 211; then the heat dissipation circuit board 100 effectively dissipates heat from the chip, ensuring its performance and service life.

[0059] The circuit board component 1100 may also include a connector 220 for connection to external circuitry. The connector 220 may be disposed in a second working area 221 of the second metal layer 22. The circuit board component 1100 may be an imaging component and capable of transmitting image data. The chip 210 may include a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) device.

[0060] refer to Figure 3 This application provides a camera module 1000. The camera module 1000 includes a lens 1300 and a circuit board component 1100. The lens 1300 transmits light to the circuit board component 1100 to form an image. The chip 210 is an imaging chip and can be located on the imaging surface of the lens 1300.

[0061] The circuit board component 1100 can be the aforementioned circuit board component 1100. Even at high ambient temperatures, it can still dissipate heat for the imaging chip through the heat dissipation circuit board 100, preventing the imaging chip temperature from becoming too high and the junction temperature from exceeding 125°C. At the same time, the heat dissipation circuit board 100 itself has uniform heat distribution, suppresses deformation, ensures the fit between the imaging chip and the lens 1300, and can better control temperature drift, which is beneficial for the camera module 1000 to capture images of better quality.

[0062] The thermally conductive filling part 4 has a greater structural strength than the insulating body 1. The thermally conductive filling part 4 of the projection covering chip 210 helps to reduce deformation and improves the temperature drift of the camera module 1000.

[0063] The camera module 1000 may also include a housing 1200. A lens 1300 is disposed in the housing 1200, and a circuit board component 1100 is disposed in the housing 1200. The object-side end of the lens 1300 is exposed outside the housing 1200, and a connector 220 passes through the housing 1200 and can be used for external connection.

[0064] For example, the lens 1300 is bonded to the circuit board component 1100, for instance, by means of AA adhesive. (See reference) Figure 3The camera module 1000 may include an adhesive 1600, such as 501 or 502 adhesive. Specifically, the image-side end of the lens barrel of the lens 1300 is bonded to the outer periphery of the heat-dissipating circuit board 100. The chip 210 is covered to help avoid stray light interference.

[0065] The housing 1200 may include a first housing 1210 and a second housing 1220. A lens 1300 is mounted on the first housing 1210, and a sealing ring may be provided between them. A circuit board component 1100 is mounted on the second housing 1220. The first housing 1210 and the second housing 1220 form a stepped fit. The split housing 1200 facilitates the assembly and manufacturing of the camera module 1000, and the housing 1200 provides a certain degree of connection and protection. The strong adhesion between the lens 1300 and the circuit board component 1100 easily ensures the positional alignment between the chip 210 and the lens 1300.

[0066] The second housing 1220 may include a sidewall 1221 and a bottom wall 1222. Exemplarily, the bottom wall 1222 of the second housing 1200 has a boss 1223 to support a portion of the heat-dissipating circuit board 100, and to allow most of it to be suspended relative to the bottom wall 1222. The housing 1200 is connected to one side of the second metal layer 22 of the heat-dissipating circuit board 100, i.e. Figure 3 As shown on the lower side. The boss 1223 can be aligned with the lens 1300 on the upper side of the heat dissipation circuit board 100.

[0067] There is a gap between the housing 1200 and the heat dissipation layer 3. Figure 3 As shown, the sidewall 1221 and the heat-dissipating circuit board 100 are spaced apart. The camera module 1000 may include a heat-dissipating filler 1400 filled between the housing 1200 and the heat-dissipating layer 3. The material of the heat-dissipating filler 1400 may be thermally conductive adhesive. The heat-dissipating filler 1400 can transfer the heat of the heat-dissipating layer 3 to the housing 1200, resulting in better heat dissipation of the heat-dissipating circuit board 100. The camera module 1000 can dissipate heat to the outside through the housing 1200, and the heat of the chip 210 can be quickly transferred away.

[0068] refer to Figure 4 and Figure 5 This application also provides a circuit board component 1100. The chip 210 of the circuit board component 1100 can be a die-on-die (DIE) chip. The chip 210 can be bonded to a heat-dissipating circuit board 100, with an adhesive layer 2101 between the chip 210 and the heat-dissipating circuit board 100. The chip 210 is electrically connected to a first working area 211, with one end of a lead 2102 bonded to the chip 210 and the other end bonded to the first working area 211. The chip 210 can cover some heat-conducting channels 5 for direct downward heat transfer. The circuit board component 1100 can be flexibly designed, manufactured, and installed according to usage requirements.

[0069] For example, the heat-dissipating circuit board 100 may further include a metal block 6 disposed on the second metal layer 22. The solder mask layer 7 covers the second metal layer 22 while exposing the metal block 6. The metal block 6 is thicker than the solder mask layer 7. The metal block 6 can serve as a support foot, enabling faster heat dissipation at the second metal layer 22, which is beneficial for the overall heat dissipation of the heat-dissipating circuit board 100 and helps with heat conduction and absorption.

[0070] The position of metal block 6 can be slightly towards the outer perimeter. For example... Figure 4 As shown, the metal block 6 can partially correspond to the first working area 211, and specifically, it also partially corresponds to the thermally conductive filling part 4. At least one thermally conductive channel 5 is provided between the metal block 6 and the thermally conductive filling part 4. The thermal path from the external electronic component 200 to the metal block at the first working area 211 is shorter, which can facilitate faster heat dissipation; in addition, it is also convenient for designing circuit patterns.

[0071] The heat-dissipating circuit board 100 provided in this application embodiment is applied to the circuit board component 1100 and the camera module 1000. (See reference...) Figure 3 The boss 1223 is connected to the side wall 1221. (Reference) Figure 4 The boss 1223 may be spaced from the sidewall 1221. Exemplarily, the boss 1223 included in the housing 1200 is used to support the metal block 6 of the heat-dissipating circuit board 100 disposed on the second metal layer 22. The heat generated by the chip 210 can be transferred downwards through the adhesive layer 2101, the first working area 211, some heat-conducting channels 5, the heat-conducting filling portion 4, other heat-conducting channels 5, the second metal layer 22, and the metal block 6. Due to its small size along the Z-axis and high thermal conductivity of each part, the chip 210 can dissipate heat quickly.

[0072] refer to Figure 4 The thickness of the housing 1200 is relatively uniform, and the cross-sectional shape of the boss 1223 can be approximately Z-shaped or N-shaped. The large surface area of ​​the housing 1200 helps with heat dissipation.

[0073] refer to Figure 5 The camera module 1000 also includes a heat dissipation attachment 1500, which can contact the boss 1223 and the metal block 6 respectively. The heat dissipation attachment 1500 can enhance the ability of the metal block 6 to transfer heat to the housing 1200.

[0074] The heat-dissipating circuit board 100 provided in this application embodiment can also be applied to other circuit boards, providing uniform heating and good heat dissipation, thus ensuring the use of electronic components 200.

[0075] The technical features of the above-disclosed embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] In the embodiments disclosed above, unless otherwise explicitly specified and limited, the execution order of each step is not restricted. For example, they can be executed in parallel or sequentially in different orders. The sub-steps of each step can also be executed alternately. Various forms of processes described above can be used, and steps can be reordered, added, or deleted, as long as the desired result of the technical solution provided in this application can be achieved, and this application does not impose any restrictions here.

[0077] The embodiments disclosed above merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of patent protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of patent protection claimed by this application. Therefore, the scope of patent protection of this application should be determined by the appended claims.

Claims

1. A heat-dissipating circuit board for mounting electronic components, characterized in that, include: Insulating body; Multiple metal layers are stacked at intervals on the insulating body. The multiple metal layers include a first metal layer located on a first side of the insulating body, a second metal layer located on a second side of the insulating body, and at least one intermediate metal layer located within the insulating body. The intermediate metal layer extends to the outer periphery of the insulating body. The first metal layer includes a first working area for electrically connecting the electronic component. A heat dissipation layer is disposed on the outer periphery of the insulating body and makes thermal contact with the plurality of metal layers; A thermally conductive filling portion is disposed within the insulating body and makes thermally conductive contact with the intermediate metal layer; as well as Multiple heat-conducting channels are provided through the insulating body. Some heat-conducting channels make thermal contact with the first metal layer and the heat-conducting filling portion, while other heat-conducting channels make thermal contact with the second metal layer and the heat-conducting filling portion.

2. The heat-dissipating circuit board according to claim 1, characterized in that, The heat dissipation layer is a copper plating layer; the heat-conducting filling part is a copper component, an aluminum component, an aluminum carbide component, or a silicon carbide component; the heat-conducting channel is a copper via; The thermally conductive filling portion is located in the first working area.

3. The heat-dissipating circuit board according to claim 1, characterized in that, It also includes a metal block and two solder mask layers, the metal block being disposed on the second metal layer, one solder mask layer covering the first metal layer and exposing the first working area, and the other solder mask layer covering the second metal layer and exposing the metal block.

4. The heat-dissipating circuit board according to claim 3, characterized in that, The metal block partially corresponds to the first working area, and at least one heat-conducting channel is provided between the metal block and the heat-conducting filling part.

5. A circuit board component, characterized in that, include: Heat-dissipating circuit board as described in any one of claims 1 to 4; as well as The chip is located in the first working area of ​​the heat-dissipating circuit board.

6. The circuit board component according to claim 5, characterized in that, It also includes connectors; The second metal layer includes a second working area electrically connected to the first working area; the connector is disposed in the second working area; The chip is either a ball grid array packaged chip or a bare die chip.

7. A camera module, characterized in that, include: case; The lens is mounted on the housing; as well as The circuit board component as described in claim 5 or 6 is disposed in the housing, and the chip is an imaging chip located on the imaging surface of the lens.

8. The camera module according to claim 7, characterized in that, The housing is connected to one side of the second metal layer of the heat dissipation circuit board, and the housing and the heat dissipation layer are spaced apart. The camera module includes a heat dissipation filler portion that is filled between the housing and the heat dissipation layer.

9. The camera module according to claim 7, characterized in that, The housing includes a boss for supporting a metal block disposed on the second metal layer of the heat-dissipating circuit board. The camera module also includes a heat dissipation attachment, which contacts the protrusion and the metal block respectively.

10. The camera module according to claim 7, characterized in that, The housing includes a first housing and a second housing. The lens is mounted on the first housing, and the circuit board component is mounted on the second housing. The lens is bonded to the circuit board component. The first housing and the second housing form a stepped fit.

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