一种模块化散热机箱

By using a modular heat dissipation chassis design, combined with a cooling circulation mechanism and fans, efficient heat exchange and air circulation are achieved, solving the problem of low heat dissipation efficiency in existing technologies and improving system reliability.

CN224519247UActive Publication Date: 2026-07-17GUIZHOU SPACE APPLIANCE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUIZHOU SPACE APPLIANCE CO LTD
Filing Date
2025-06-30
Publication Date
2026-07-17

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Abstract

本实用新型提供了一种模块化散热机箱，包括机壳和冷循环机构；所述冷循环机构安装在机壳内，所述机壳的两侧分别通过一块侧板封闭，所述冷循环机构包括冷却板，冷却板的下端安装有若干相互平行的蒸发器,蒸发器的顶部与冷却板联通，蒸发器的底部通过循环管与冷却板连接，所述冷却板顶部安装有风扇,所述发热器件安装在蒸发器的一侧。本实用新型将制冷系统与机箱集成化设计，使其制造难度降低，并且通过冷媒直接带走每个模块的热量然后集中在冷却板上进行热交换，大大提高了散热效率，提高了系统可靠运行。
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Claims

1. A modular heat dissipation cabinet comprising a cabinet (1) and a cold circulation mechanism (2), characterized in that: The cold circulation mechanism (2) is installed inside the casing (1). The two sides of the casing (1) are respectively closed by a side plate (3). The cold circulation mechanism (2) includes a cooling plate (22). Several parallel evaporators (21) are installed at the lower end of the cooling plate (22). The top of the evaporator (21) is connected to the cooling plate (22). The bottom of the evaporator (21) is connected to the cooling plate (22) through a circulation pipe (24). A fan (23) is installed on the top of the cooling plate (22). A heating device (4) is also installed on one side of the evaporator (21).

2. The modular heat-dissipating enclosure of claim 1, wherein: The spacing between the evaporators (21) is greater than the thickness of the heating element (4).

3. The modular heat-dissipating enclosure of claim 1, wherein: One end of the circulation pipe (24) is connected to the side wall of the cooling plate (22), and the other end is connected to the bottom of one side of the evaporator (21).

4. The modular heat dissipation chassis as described in claim 1, characterized in that: The bottom of the housing (1) is also equipped with several positioning strips (13). The spacing between two adjacent positioning strips (13) is the same as the thickness of the evaporator (21) and each corresponds to one evaporator (21).

5. The modular heat-dissipating enclosure of claim 1, wherein: The upper part of the inner wall of the housing (1) is also equipped with an upper limit frame (11). The upper limit frame (11) surrounds the inner wall of the housing (1) and has an opening on the side opposite to any side plate (3). The width between the two sides of the upper limit frame (11) is the same as the width of the cold circulation mechanism (2).

6. The modular heat-dissipating enclosure of claim 1, wherein: The top of the housing (1) is also machined with a through hole opposite to the fan (23), and a dustproof mesh (12) is installed in the through hole.