Optical module
By forming sidewall light-blocking components in the optical module and combining them with a package, the problem of light leakage is solved, improving light efficiency and reliability, and realizing miniaturized and low-cost optical module design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LIANCEUTE SEMICON (DONGGUAN) CO LTD
- Filing Date
- 2025-04-18
- Publication Date
- 2026-07-17
AI Technical Summary
In traditional optical modules, light tends to leak out from the cavity walls, resulting in low light efficiency, low reliability, and an overall size that is difficult to meet miniaturization requirements.
Sidewalls are formed around the substrate, which act as light-blocking components to prevent light from escaping. The light-blocking capability is enhanced by a combination of light-absorbing layers, reflective layers, and metal layers. The light-emitting chip assembly is protected by a transparent or semi-transparent encapsulation.
It improves the optical efficiency and reliability of the optical module, meets the miniaturization requirements of modern electronic devices, and reduces costs.
Smart Images
Figure CN224521505U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical semiconductor technology, and in particular to an optical module. Background Technology
[0002] Traditional optical modules consist of a substrate and a cavity structure formed on the substrate. A light-emitting chip assembly is placed within the cavity structure and electrically connected to the substrate at the bottom. Light is emitted by the light-emitting chip assembly and exits outward from the top of the cavity structure. However, with the development of wearable electronics and other miniaturized electronic devices, the requirements for miniaturization, light efficiency, and reliability of optical modules and semiconductor packaging are increasing. In traditional optical modules, light easily leaks from the cavity walls, resulting in low light efficiency and poor reliability. Furthermore, the overall size of traditional optical modules needs improvement to meet miniaturization requirements.
[0003] Therefore, there is an urgent need for an improved optical module to overcome the above defects. Utility Model Content
[0004] The purpose of this invention is to provide an improved optical module that can block light leakage, thereby improving the light efficiency of the light-emitting chip component and thus improving the reliability of the module. It also has the advantages of miniaturization and low cost, meeting the higher requirements of modern electronic devices.
[0005] To achieve the above objectives, this utility model provides an optical module, comprising: a substrate; sidewalls formed around the perimeter of the substrate, the sidewalls and the substrate forming a cavity; and a light-emitting chip assembly located within the cavity, the light-emitting chip assembly being mounted on the surface of the substrate and electrically connected to the substrate. The sidewalls form light-blocking elements to prevent light from the light-emitting chip assembly from escaping through the sidewalls.
[0006] Compared with existing technologies, the optical module of this invention has sidewalls formed around the perimeter of the substrate. The light-emitting chip assembly is mounted on the surface of the substrate and electrically connected to it. Furthermore, the sidewalls form light-blocking elements, which can prevent light from the light-emitting chip assembly from escaping through the sidewalls, thereby improving the light efficiency of the light-emitting chip assembly, enhancing the optical performance of the packaged optical module, and ultimately improving the module's reliability. Moreover, the structure of the sidewalls and substrate offers advantages in miniaturization and low cost, meeting the higher miniaturization requirements of modern electronic devices.
[0007] In a preferred embodiment, the light-blocking element includes a light-absorbing layer coated on the inner surface of the sidewall.
[0008] In a preferred embodiment, the light-blocking element includes a reflective layer formed on the inner surface of the sidewall.
[0009] Preferably, the light-blocking element further includes a metal layer located between the light-absorbing layer and the inner surface of the sidewall, or between the reflective layer and the inner surface of the sidewall.
[0010] In a preferred embodiment, the height of the sidewall is at least twice the height of the light-emitting chip assembly.
[0011] In a preferred embodiment, the surface of the substrate is provided with a solder resist layer.
[0012] In a preferred embodiment, the substrate and the sidewall are connected by an adhesive.
[0013] Preferably, the adhesive is a conductive adhesive. More preferably, the conductive adhesive comprises a conductive epoxy resin.
[0014] In a preferred embodiment, a package for encapsulating the light-emitting chip assembly is formed within the cavity, and the top surface of the package is flush with the top surface of the sidewall.
[0015] Preferably, the encapsulation body is a transparent or translucent compound.
[0016] In a preferred embodiment, the light-emitting chip assembly and the substrate are electrically connected via conductive leads.
[0017] In a preferred embodiment, the light-emitting chip assembly includes an infrared light-emitting chip. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a perspective view of one embodiment of the optical module of this utility model.
[0020] Figure 2 This is a cross-sectional view of one embodiment of the optical module of this utility model.
[0021] Figure 3 This is a cross-sectional view of another embodiment of the optical module of this utility model.
[0022] Figure 4 This is a cross-sectional view of another embodiment of the optical module of this utility model.
[0023] Figure 5 This is a cross-sectional view of another embodiment of the optical module of this utility model.
[0024] Figure 6 This is a manufacturing process diagram of one embodiment of the optical module of this utility model.
[0025] Figure 7 This is a schematic diagram of the manufacturing process of the substrate of the optical module of this utility model.
[0026] Figure 8 This is a schematic diagram of the manufacturing process of the sidewall of the optical module of this utility model.
[0027] Figure 9 This is a schematic diagram showing the connection between the sidewall and the substrate of the optical module of this utility model.
[0028] Figure 10 This is a schematic diagram of the mounting process of the light-emitting chip assembly of the optical module of this utility model.
[0029] Figure 11 This is a schematic diagram of the packaging process of the light-emitting chip component of the optical module of this utility model. Detailed Implementation
[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0031] In the description of this application, it should be understood that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may have a component that is centrally positioned. When a component is considered to be "set" on another component, it can be directly set on the other component or may have a component that is centrally positioned.
[0032] Furthermore, the terms "upper," "lower," "inner," "outer," "left," "right," "below," and "above" indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings. These are used solely for the purpose of describing this application and do not indicate or imply that the device or element referred to must have this specific orientation or operate in a specific orientation. Therefore, they should not be construed as limitations of this application. Spatial relative terms can refer to different orientations of the device besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below an element or feature" will be oriented "above other elements or features." Therefore, the example term "below" can encompass both upward and downward orientations.
[0033] The present invention aims to provide an improved optical module that can block light leakage, thereby improving the light efficiency of the light-emitting chip component and thus improving the reliability of the module. It also has the advantages of miniaturization and low cost, meeting the higher requirements of modern electronic devices.
[0034] Figure 1 This is a perspective view of an embodiment of the optical module of this utility model. As shown, the optical module 1 includes a substrate 10, sidewalls 12, and a light-emitting chip assembly 14. The sidewalls 12 are formed around the substrate 10, and the sidewalls 12 and the substrate 10 form a cavity 16. The light-emitting chip assembly 14 is located within the cavity 16, and the light-emitting chip assembly 14 is mounted on the surface of the substrate 10 and electrically connected to the substrate 10. Specifically, the sidewalls 12 form a light-blocking element (…). Figure 1 (Not indicated) When the light-emitting chip assembly 14 emits light, the light-blocking component can block the light from the light-emitting chip assembly 14 from escaping from the side wall 12, thereby improving the light efficiency of the optical module and improving the reliability of the module.
[0035] Figure 2 This is a cross-sectional view of an embodiment of the optical module of this utility model. In this embodiment, the height of the sidewall 12 is optimized, serving as a light-blocking element to prevent light from the light-emitting chip assembly 14 from escaping from the sidewall 12. Specifically, the height of the sidewall 12 is at least twice the height of the light-emitting chip assembly 14 to obtain better light-blocking capability.
[0036] Figure 3 This is a cross-sectional view of another embodiment of the optical module of this utility model. In this embodiment, the light-blocking element is an additional layer formed on the inner surface of the sidewall 12 to achieve the function of blocking light. Specifically, the light-blocking element includes a light-absorbing layer 121 coated on the inner surface of the sidewall 12. Optionally, the light-absorbing layer is a light-absorbing material; preferably, the light-absorbing layer 121 is a dark light-absorbing coating, such as a black light-absorbing coating, to obtain an enhanced light-absorbing effect. The light-absorbing layer 121 can be formed by coating with an adhesive or electroplating, further reducing light penetration through the cavity sidewall and improving optical performance.
[0037] In other embodiments, the light-blocking element is a reflective layer 122 formed on the inner surface of the sidewall 12 to block light from escaping from the sidewall 12. Moreover, the reflective layer 122 can reflect and guide the light towards the upper surface of the cavity, thereby improving light efficiency and utilization. Optionally, the reflective layer 122 can be a metal plating layer formed by processes such as electroplating.
[0038] Figure 4 This is a cross-sectional view of another embodiment of the optical module of this utility model. Figure 3Based on the illustrated embodiment, the light-blocking component of this embodiment further includes a metal layer 123 located between the light-absorbing layer 121 and the inner surface of the sidewall 12. Preferably, the metal layer 123 is a copper layer; however, the metal material is not limited to this and can also be other metals. Through the combination of the light-absorbing layer 121 and the metal layer 123, the light-blocking ability of the light-blocking component is significantly improved, with a light transmittance of less than 1%, even approaching the ideal zero light transmittance effect.
[0039] In other embodiments, the light-blocking element may include a reflective layer 122 formed on the inner surface of the sidewall 12 and a metal layer 123 located between the reflective layer 122 and the inner surface of the sidewall 12. Through the combination of the reflective layer 122 and the metal layer 123, the light-blocking ability of the light-blocking element is significantly improved, with a light transmittance of less than 1%, or even approaching the ideal zero light transmittance effect.
[0040] Figure 5 This is a cross-sectional view of another embodiment of the optical module of this utility model. As shown, the optical module 1 further includes an encapsulation body 18 formed within the cavity 16 to encapsulate the light-emitting chip assembly 14. Specifically, the encapsulation body 18 is a transparent or translucent compound that fully fills the cavity 16 and completely covers the light-emitting chip assembly 14. Therefore, it protects the light-emitting chip assembly 14 without affecting light propagation and enhances its dustproof and waterproof lamp function, thereby enhancing the overall reliability of the product. Preferably, the top surface of the encapsulation body 18 is flush with the top surface of the sidewall 12 to simplify the manufacturing process and facilitate the use and installation of the product.
[0041] The shape of the optical module 1 in this application is not limited. In a preferred embodiment, the overall outline of the optical module 1 is a cuboid or a cube. In other embodiments, it may be other shapes to suit the application.
[0042] In one embodiment, the light-emitting chip assembly 14 of this application includes an LED chip, preferably an infrared LED chip. During operation, the infrared LED chip emits infrared light, which is blocked and / or guided by the light-blocking elements on the sidewalls of the cavity 16. Most of the infrared light is emitted only from the upper surface of the cavity 16, such as the top surface of the package 18, preferably vertically. This infrared light is received by a light receiver mounted outside the optical module 1, thereby generating an optical signal. Of course, different types of light-emitting chips can be used to meet the needs of the product. Specifically, the light-emitting chip assembly 14 is connected via a conductive lead 11 (see...) Figure 5 , Figure 10 It is electrically connected to the substrate 10.
[0043] In one embodiment, the substrate 10 and the sidewall 12 of this application are connected by an adhesive. Preferably, the adhesive is a conductive adhesive, such as a conductive epoxy resin.
[0044] Figure 6 This is a manufacturing process diagram of one embodiment of the optical module of this utility model. The manufacturing process of the optical module includes:
[0045] S1, substrate manufacturing process;
[0046] S2, sidewall manufacturing process;
[0047] S3, lamination of sidewalls and substrate;
[0048] S4, LED chip assembly mounting;
[0049] S5, LED chip component packaging;
[0050] S6, cutting and separating.
[0051] Specifically, in this application, substrate 10 is the bottom carrier board of the circuit board, and a series of processes ensure compliance with product design specifications. As an example, refer to... Figure 7 The S1 step is as follows: First, select and prepare the substrate raw materials to ensure they meet the requirements of subsequent processes. Cut the substrate to the required size, clean the surface to remove impurities, and perform copper cladding on its surface to form a copper-clad board. Next, perform laser drilling to form microvias (through holes, blind holes, or buried holes) on the substrate for interlayer electrical connections. Then, deposit a copper layer in the holes to form conductive channels. Next, use photolithography to coat photoresist, expose, and develop to form circuit patterns. Next, form a solder resist layer 13 on the substrate to cover non-soldering areas and prevent short circuits and oxidation. Next, perform electroless nickel immersion gold plating to protect the pads and provide good soldering and contact performance. Finally, perform functional testing on the substrate to verify its electrical performance and appearance quality, ensuring the product meets design specifications.
[0052] As one embodiment, the sidewall 12 is fabricated using a fiberglass substrate core. (See reference) Figure 8 Step S2 is as follows: First, a fiberglass substrate core is selected, and copper plating is applied to its surface. Next, laser cutting is performed to form the desired cavity portion. Then, etching is performed to remove unwanted layers, forming the sidewall 12. Finally, a light-blocking element (the light-absorbing layer 121 / reflective layer 122 and / or metal layer 123 as described above) is coated onto the inner surface of the sidewall 12, thereby blocking light from escaping from the sidewall 12 and improving optical performance.
[0053] As an example, refer to Figure 9In the lamination and bonding process of the sidewalls and substrate in S3, the sidewalls 12 manufactured in S2 are bonded to the substrate 10 manufactured in S1 using adhesive 17, and then subjected to pressing, curing and other processes to form the cavity frame of the optical module 1. The cavity structure formed by the lamination and bonding process is suitable for small-size packaging, and its size can be as small as 1 mm × 2 mm, meeting the miniaturization requirements of modern electronic devices.
[0054] refer to Figure 10 , Figure 10 This diagram illustrates the mounting process of the light-emitting chip assembly in the optical module of this invention. Specifically, firstly, the light-emitting chip assembly 14 is precisely fixed to the substrate 10, for example, using conductive adhesive, to ensure electrical connection and mechanical stability. Next, the adhesive material is cured by heating or ultraviolet light to form a stable mechanical connection. Then, ion cleaning is performed to remove organic contaminants and oxides from the surfaces of the light-emitting chip assembly 14 and the substrate 10, improving the reliability of subsequent wire bonding or packaging. Finally, conductive leads 11, such as gold wires, connect the top of the light-emitting chip assembly 14 to the bottom circuit board of the substrate 10, achieving electrical connection.
[0055] refer to Figure 11 , Figure 11 This is a schematic diagram of the packaging process for the light-emitting chip assembly of the optical module of this utility model. Specifically, firstly, the installed light-emitting chip assembly, substrate, and sidewalls are pre-baked (S51) to remove moisture from the chip or materials, preventing moisture vaporization during subsequent high-temperature processes that could lead to bubbles or voids inside the package, thus affecting the packaging quality and reliability. Next, ion cleaning (S52) is performed to remove impurities, contaminants, and oxide layers from the surface of the light-emitting chip assembly, ensuring a clean surface and providing good contact and adhesion for subsequent packaging processes. Next, a transparent agent molding process (S53) is performed, where a transparent agent (usually an encapsulation material such as epoxy resin) is pressed into a mold to form a protective layer, preventing the light-emitting chip assembly from being affected by the external environment. It should be noted that the transparent agent mentioned here may include transparent or semi-transparent compounds. Next, a post-molding curing treatment (S54) is performed, forming a robust protective layer in the package, enhancing the mechanical strength and stability of the package. Finally, cutting (S55) separates the individual optical modules, i.e., as shown... Figure 5 The optical module 1 shown. The use of transparent or semi-transparent encapsulation materials can protect the light-emitting chip components from environmental factors, improving the quality and reliability of the encapsulation.
[0056] Preferably, in order to achieve better results and meet product performance specifications, grinding, polishing, cleaning, and tape installation can be performed before cutting.
[0057] In summary, the sidewalls of the optical module of this invention are formed around the perimeter of the substrate. The light-emitting chip assembly is mounted on the surface of the substrate and electrically connected to it. Furthermore, the sidewalls form light-blocking elements, preventing light from the light-emitting chip assembly from escaping through the sidewalls, thereby improving the light efficiency of the light-emitting chip assembly, enhancing the optical performance of the packaged optical module, and ultimately improving the module's reliability. Moreover, the structure of the sidewalls and substrate offers advantages in miniaturization and low cost, meeting the higher miniaturization requirements of modern electronic devices.
[0058] The present invention has been described above in conjunction with the preferred embodiments, but the present invention is not limited to the embodiments disclosed above, but should cover various modifications and equivalent combinations made in accordance with the essence of the present invention.
Claims
1. An optical module, comprising: substrate; Sidewalls are formed around the substrate, and the sidewalls and the substrate form a cavity; as well as A light-emitting chip assembly is located within the cavity, and the light-emitting chip assembly is mounted on the surface of the substrate and electrically connected to the substrate. The sidewall is characterized in that it forms a light-blocking element to prevent light from the light-emitting chip assembly from escaping from the sidewall.
2. The optical module of claim 1, wherein: The light-blocking element includes a light-absorbing layer coated on the inner surface of the sidewall.
3. The optical module of claim 1, wherein: The light-blocking element includes a reflective layer formed on the inner surface of the sidewall.
4. The optical module according to claim 2 or 3, wherein: When claim 2 is cited, the light-blocking element further includes a metal layer located between the light-absorbing layer and the inner surface of the sidewall; when claim 3 is cited, the light-blocking element further includes a metal layer located between the reflective layer and the inner surface of the sidewall.
5. The optical module of claim 1, wherein: The height of the sidewall is at least twice the height of the light-emitting chip assembly.
6. The optical module of claim 1, wherein: The substrate has a solder resist layer on its surface.
7. The optical module of claim 1, wherein: The substrate and the sidewall are connected by an adhesive.
8. The optical module of claim 7, wherein: The adhesive is a conductive adhesive.
9. The optical module of claim 8, wherein: The conductive adhesive includes a conductive epoxy resin.
10. The optical module of claim 1, wherein: The cavity forms a package for encapsulating the light-emitting chip assembly, and the top surface of the package is flush with the top surface of the sidewall.
11. The optical module of claim 10, wherein: The encapsulation body is a transparent or semi-transparent compound.
12. The optical module of claim 1, wherein: The light-emitting chip assembly and the substrate are electrically connected through conductive leads.
13. The optical module of claim 1, wherein: The light-emitting chip assembly includes an infrared light-emitting chip.