A large current field effect transistor testing tool
By combining a converter base, a fixing slot, a bracket, and a clamping assembly, the problems of easy pin damage and low efficiency in high-current MOSFET testing are solved, achieving stable connection and efficient testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEASUREMENT & TESTING TECH RES INST OF HUBEI AEROSPACE TECH RES INST
- Filing Date
- 2025-07-22
- Publication Date
- 2026-07-21
AI Technical Summary
In existing technologies, high-current field-effect transistors are prone to damage to pins and have low testing efficiency during testing.
The device employs a combination structure of conversion base, fixing slot, bracket and clamping assembly. Through the cooperation of L-shaped connecting rod and pressing guide post, it achieves stable fixation of the field effect transistor under test and stable connection between the pin and the plug, avoiding the need to clamp the pin alone.
It solves the pin damage problem, improves testing efficiency and stability, simplifies test preparation procedures, and saves test time.
Smart Images
Figure CN224536124U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of testing fixtures, and in particular to a high-current field-effect transistor testing fixture. Background Technology
[0002] A field-effect transistor (FET) is a device that conducts electricity using a transistor. There are two main types: junction field-effect transistors (JFETs) and metal-oxide-semiconductor (MOS) field-effect transistors (MOSFETs). Because it relies on majority carriers for conduction, it is also called a unipolar transistor. It is a voltage-controlled semiconductor device. It possesses advantages such as high input resistance (10⁷–10¹⁵ Ω), low noise, low power consumption, wide dynamic range, ease of integration, no secondary breakdown, and a wide safe operating area. It has become a strong competitor to bipolar transistors and power transistors and is widely used in practice. Before being put into use, its parameters need to be tested to determine its reliability.
[0003] In existing technologies, testing high-current MOSFETs typically involves clamping the pins with test clips. This approach has several drawbacks: first, MOSFET pins are generally fragile, and test clips, designed for tight contact, can damage the pins when clamped; second, the small contact area with clips leads to inaccurate test results; third, testing high-current MOSFETs individually poses a risk of arcing due to the high current; and fourth, individual testing is labor-intensive and inefficient.
[0004] In existing technologies, high-current field-effect transistors are tested by clamping the pins one by one with test clips, which can easily damage the pins and result in low testing efficiency. Utility Model Content
[0005] This utility model provides a high-current field-effect transistor (FET) testing fixture, which solves the problems of easy damage to pins and low testing efficiency in existing technologies. The technical solution is as follows:
[0006] A high-current MOSFET testing fixture includes: a converter socket,
[0007] The conversion seat is provided with a fixing groove, a bracket, and a clamping assembly. The clamping assembly is mounted on the bracket, which is located on one side of the fixing groove. The clamping assembly includes an L-shaped connecting rod, a connecting handle, a pressing guide post, and a guide rail. The bracket is vertically mounted on the conversion seat. The L-shaped connecting rod includes a first connecting rod and a second connecting rod arranged vertically. The end of the second connecting rod is hinged to the top of the bracket, and the bends of the first and second connecting rods are hinged to one end of the connecting handle. The other end of the connecting handle is hinged to the top of the pressing guide post. The guide rail is vertically arranged above the fixing groove, and the pressing guide post is slidably mounted in the guide rail. A plug is provided at the bottom of the conversion seat, and the plug communicates with the fixing groove.
[0008] Optionally, the top of the bracket is provided with a mounting protrusion, and the end of the second connecting rod is hinged to the mounting protrusion.
[0009] Optionally, two connecting handles are provided, one on each side of the L-shaped connecting rod.
[0010] Optionally, a handle is provided at the other end of the first link.
[0011] Optionally, a pressure head is provided at the bottom of the pressing guide post, and the cross-sectional area of the pressure head is larger than the cross-sectional area of the pressing guide post.
[0012] Optionally, multiple pressure heads are provided, each with a different cross-sectional area, and the pressure heads are detachably connected to the pressing guide post.
[0013] Optionally, an insulating pad is provided at the bottom of the pressure head.
[0014] Optionally, the bracket is provided with a slide plate and a slide rail, the slide rail is arranged vertically on the bracket, the clamping assembly is disposed on the slide plate, and the slide plate is slidably disposed on the slide rail.
[0015] Optionally, the bracket is provided with a weight-reducing groove.
[0016] Optionally, a gold-plated spring pin is provided in the fixing groove, and the gold-plated spring pin is electrically connected to the plug.
[0017] The beneficial effects of the technical solution provided by this utility model embodiment include at least the following:
[0018] This invention provides a high-current field-effect transistor (FET) testing fixture. The pins of the FET under test are placed into a fixed slot. Rotating the first link of the L-shaped connecting rod causes the second link to rotate the connecting handle. Due to the limiting sliding effect of the guide rail, the pressing guide post can only move vertically, causing the connecting handle to push the pressing guide post downwards. This causes the bottom of the pressing guide post to abut against the top surface of the FET under test, thus stably fixing the FET under test in the fixed slot. Since the fixed slot is connected to the plug, the FET under test is connected to the plug, and the plug is then connected to the testing equipment to form a test circuit. By controlling the clamping assembly, a stable connection between the FET under test pins and the plug can be achieved. During testing, there is no need to separately connect the FET pins, effectively solving the problems of easy damage to the pins and low testing efficiency in existing technologies. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the overall structure provided in an embodiment of the present utility model;
[0021] Figure 2 This is a schematic diagram of the L-shaped connecting rod structure provided in an embodiment of the present invention;
[0022] Figure 3 This is a schematic front view of the overall structure provided in an embodiment of the present utility model;
[0023] Figure 4 This is a side view of the overall structure provided in an embodiment of the present utility model.
[0024] In the diagram: 1-Converter; 11-Plug; 2-Fixing slot; 21-Gold-plated spring pin; 3-Bracket; 31-Weight reduction slot; 4-Pressure assembly; 401-First hinge point; 402-Second hinge point; 41-L-shaped connecting rod; 411-First connecting rod; 412-Second connecting rod; 42-Connecting handle; 43-Pressing guide post; 44-Guide rail; 45-Mounting protrusion; 46-Handle; 47-Pressure head; 48-Insulating pad; 5-Slide plate; 6-Slide rail. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.
[0026] Figure 1 This is a schematic diagram of the overall structure provided in the embodiment of this utility model. Figure 2 This is a schematic diagram of the L-shaped connecting rod structure provided in an embodiment of the present invention; Figure 3 This is a schematic front view of the overall structure provided in an embodiment of the present utility model; Figure 4 This is a side view of the overall structure provided in an embodiment of this utility model. Figures 1 to 4 The high-current MOSFET testing fixture shown includes: a conversion base 1, a fixing groove 2, a bracket 3, and a clamping assembly 4 on the conversion base 1. The clamping assembly 4 is mounted on the bracket 3, which is located on one side of the fixing groove 2. The clamping assembly 4 includes an L-shaped connecting rod 41, a connecting handle 42, a pressing guide post 43, and a guide rail 44. The bracket 3 is vertically mounted on the conversion base 1. The L-shaped connecting rod 41 includes a vertically arranged first connecting rod 411 and a second connecting rod 412. The end of the second connecting rod 412 is hinged to the top of the bracket 3. The bends of the first connecting rod 411 and the second connecting rod 412 are hinged to one end of the connecting handle 42. The other end of the connecting handle 42 is hinged to the top of the pressing guide post 43. The guide rail 44 is vertically arranged above the fixing groove 2. The pressing guide post 43 is slidably mounted in the guide rail 44. A plug 11 is provided at the bottom of the conversion base 1, and the plug 11 communicates with the fixing groove 2.
[0027] Exemplarily, in this embodiment of the present invention, the guide rail 44 is a cylindrical structure, fixed to the bracket 3 by a support structure, which can provide guiding force for the movement of the pressing guide post 43, so that the pressing guide post 43 can only slide up and down in the vertical direction. First, connect this fixture to the test equipment through the plug 11, and lift the pressing guide post 43 upward by controlling the L-shaped connecting rod 41, and place the field effect transistor under test with its pins facing down and heat dissipation surface facing up into the fixing slot 2. Figure 1 and Figure 2As shown, the hinge point between the end of the second connecting rod 412 and the top of the bracket 3 is the first hinge point 401, and the hinge point between the right angle of the L-shaped connecting rod 41 and one end of the connecting handle 42 is the second hinge point 402. By controlling the first connecting rod 411 to rotate counterclockwise, since the end of the second connecting rod 412 is hinged to the top of the bracket 3, the L-shaped connecting rod 41 rotates counterclockwise around the first hinge point 401. Due to the presence of the second hinge point 402, the connecting handle 42 also rotates counterclockwise. Since the length of the connecting handle 42 is greater than the length of the second connecting rod 412, after the connecting handle 42 rotates, the bottom end of the connecting handle 42 is displaced downward, thereby generating a downward thrust on the pressing guide post 43. Under the guidance of the guide rail 44, the bottom of the pressing guide post 43 presses the top of the field effect tube under test, thereby enabling the field effect tube under test to be stably fixed in the fixing groove 2. Compared to traditional technologies that require clamps to stably hold the pins of the MOSFET under test, this embodiment achieves a stable connection of the test circuit simply by using a clamping component, thus solving the problem of easily damaging the pins in existing technologies. Furthermore, by connecting the pins to the connector 11, multiple pins can be connected to the test circuit simultaneously without the need for individual clamping, simplifying the test preparation process, saving test time, and addressing the low testing efficiency problem in existing technologies.
[0028] This utility model provides a high-current field-effect transistor (FET) testing fixture. The pins of the FET under test are placed into a fixing slot 2. By rotating the first link 411 of the L-shaped connecting rod 41, the second link 412 drives the connecting handle 42 to rotate. Due to the limiting sliding effect of the guide rail 44, the pressing guide post 43 can only move vertically, causing the connecting handle 42 to push the pressing guide post 43 downwards. This causes the bottom of the pressing guide post 43 to abut against the top surface of the FET under test, thus stably fixing the FET under test in the fixing slot 2. Since the fixing slot 2 is connected to the plug 11, the FET under test is connected to the plug 11. The plug 11 is then connected to the testing equipment to form a test circuit. By controlling the clamping assembly 4, a stable connection between the pins of the FET under test and the plug 11 can be achieved. During testing, there is no need to separately connect the pins of the FET under test, thus effectively solving the problems of easy damage to the pins and low testing efficiency in the prior art.
[0029] Optionally, the top of the bracket 3 is provided with a mounting protrusion 45, and the end of the second connecting rod 412 is hinged to the mounting protrusion 45.
[0030] For example, in this embodiment of the present invention, the mounting protrusion 45 protrudes from the side of the bracket 3. By setting the mounting protrusion 45, a clearance space can be provided for the rotation of the L-shaped connecting rod 41, preventing the L-shaped connecting rod 41 from interfering with the side wall of the bracket 3 and affecting the operation when it rotates. By setting this structure, the ease of operation of this tooling is improved.
[0031] Optionally, two connecting handles 42 are provided, respectively located on both sides of the L-shaped connecting rod 41.
[0032] For example, in this embodiment of the present invention, the connecting handle 42 can be configured as a curved structure, the curved part provides clearance space for the rotation of the L-shaped connecting rod 41, and at the same time, the connecting handle 42 is provided on both sides of the L-shaped connecting rod 41 to prevent the L-shaped connecting rod 41 from shifting laterally during rotation, thereby improving the structural stability of the tooling.
[0033] Optionally, a handle 46 is provided at the other end of the first link 411.
[0034] For example, in this embodiment of the present invention, by providing a handle 46 at the other end of the first connecting rod 411, the rotational lever arm of the first connecting rod 411 can be increased, thereby facilitating the operator to rotate the L-shaped connecting rod 41 by holding the handle 46, further improving the ease of operation of this tooling.
[0035] Optionally, a pressure head 47 is provided at the bottom of the pressing guide post 43, and the cross-sectional area of the pressure head 47 is larger than the cross-sectional area of the pressing guide post 43.
[0036] For example, in this embodiment of the present invention, by setting a pressure head 47 with a larger cross-sectional area, the contact area between the pressing component 4 and the field-effect transistor under test can be increased, thereby enabling the field-effect transistor under test to be pressed more stably in the fixing groove 2, further improving the stability of the tooling.
[0037] Optionally, multiple pressure heads 47 are provided, each with a different cross-sectional area, and the pressure heads 47 are detachably connected to the pressing guide post 43.
[0038] For example, in this embodiment of the present invention, by setting pressure heads 47 with different cross-sectional areas, the appropriate pressure head 47 can be selected according to the different sizes of the field-effect transistors to be tested, thereby enabling the clamping assembly 4 to more stably clamp the field-effect transistors to be tested in the fixing groove 2, further improving the stability of the tooling.
[0039] Optionally, an insulating pad 48 is provided at the bottom of the pressure head 47.
[0040] For example, in this embodiment of the present invention, by providing an insulating pad 48 at the bottom of the pressure head 47, the clamping assembly 4 is clamped to the field-effect transistor under test through the insulating pad 48, thereby preventing the current from conducting through the clamping assembly 4 during the test and causing a safety accident, and also preventing the clamping assembly 4 from being connected to the test circuit and affecting the test results, thereby improving the accuracy of the test results of this fixture.
[0041] Optionally, the bracket 3 is provided with a slide plate 5 and a slide rail 6. The slide rail 6 is arranged vertically on the bracket 3, and the clamping component 4 is provided on the slide plate 5. The slide plate 5 is slidably provided on the slide rail 6.
[0042] For example, in this embodiment of the present invention, by setting up a slide plate 5 and a slide rail 6, and fixing the clamping component 4 on the slide plate 5, the relative distance between the clamping component 4 and the field-effect transistor under test can be adjusted by adjusting the position of the slide plate 5 on the slide rail 6, so that the fixture can be applied to field-effect transistors of different heights, thereby improving the versatility of the fixture.
[0043] Optionally, the bracket 3 is provided with a weight reduction groove 31.
[0044] For example, in this embodiment of the present invention, by setting the weight reduction groove 31, the manufacturing cost of the bracket 3 can be saved, and the weight of the tooling can be reduced. It is also more convenient to connect the tooling to the testing equipment, thereby further improving the ease of operation of the tooling.
[0045] Optionally, a gold-plated spring pin 21 is provided in the fixing groove 2, and the gold-plated spring pin 21 is electrically connected to the plug 11.
[0046] For example, in this embodiment of the invention, the gold-plated spring pin 21 has improved conductivity due to the gold plating, and the gold-plated spring pin 21 has a certain elasticity, which can ensure that the pin of the field-effect transistor under test is stably connected to the connector 11. By setting the gold-plated spring pin 21 to be plugged into the pin of the field-effect transistor under test, the pin can be more stably connected to the test circuit, thereby further improving the stability of the fixture.
[0047] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0048] The above description is only an optional embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-current field-effect transistor testing fixture, characterized in that, include: Converter (1) The conversion seat (1) is provided with a fixing groove (2), a bracket (3) and a clamping assembly (4). The clamping assembly (4) is disposed on the bracket (3). The bracket (3) is disposed on one side of the fixing groove (2). The clamping assembly (4) includes an L-shaped connecting rod (41), a connecting handle (42), a pressing guide post (43) and a guide rail (44). The bracket (3) is vertically disposed on the conversion seat (1). The L-shaped connecting rod (41) includes a vertically arranged first connecting rod (411) and a second connecting rod (412). The second connecting rod (411) The end of the first connecting rod (412) is hinged to the top of the bracket (3), the bend of the first connecting rod (411) and the second connecting rod (412) is hinged to one end of the connecting handle (42), the other end of the connecting handle (42) is hinged to the top of the pressing guide post (43), the guide rail (44) is vertically arranged above the fixing groove (2), the pressing guide post (43) is slidably arranged in the guide rail (44), and the bottom of the conversion seat (1) is provided with a plug (11), which communicates with the fixing groove (2).
2. The high-current MOSFET testing fixture according to claim 1, characterized in that, The bracket (3) is provided with a mounting protrusion (45) on the top, and the end of the second connecting rod (412) is hinged to the mounting protrusion (45).
3. The high-current MOSFET testing fixture according to claim 1, characterized in that, Two connecting handles (42) are provided, respectively located on both sides of the L-shaped connecting rod (41).
4. The high-current MOSFET testing fixture according to claim 1, characterized in that, The other end of the first link (411) is provided with a handle (46).
5. The high-current MOSFET testing fixture according to claim 1, characterized in that, The bottom of the pressing guide post (43) is provided with a pressing head (47), and the cross-sectional area of the pressing head (47) is larger than the cross-sectional area of the pressing guide post (43).
6. The high-current field-effect transistor test fixture according to claim 5, characterized in that, Multiple pressure heads (47) are provided, and the cross-sectional areas of the multiple pressure heads (47) are different. The pressure heads (47) are detachably connected to the pressing guide post (43).
7. The high-current MOSFET testing fixture according to claim 5, characterized in that, An insulating pad (48) is provided at the bottom of the pressure head (47).
8. The high-current MOSFET testing fixture according to claim 1, characterized in that, The bracket (3) is provided with a slide plate (5) and a slide rail (6). The slide rail (6) is arranged vertically on the bracket (3). The clamping component (4) is provided on the slide plate (5). The slide plate (5) is slidably provided on the slide rail (6).
9. A high-current field-effect transistor testing fixture according to claim 1, characterized in that, The bracket (3) is provided with a weight reduction groove (31).
10. A high-current MOSFET testing fixture according to claim 1, characterized in that, A gold-plated spring pin (21) is provided in the fixing groove (2), and the gold-plated spring pin (21) is electrically connected to the plug (11).