A handle jig for semiconductor cleaning
By designing a handle fixture for semiconductor cleaning, which employs symmetrically arranged lifting arms and arc-shaped connectors, the problem of acid residue retention in the cleaning handle is solved, enabling rapid acid flow and improving the reliability of wafer cleaning and device yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI WEIZHAO SEMICONDUCTOR CO LTD
- Filing Date
- 2025-09-11
- Publication Date
- 2026-07-21
AI Technical Summary
In existing cleaning handles, acid can easily remain when lifting the acid solution, leading to secondary chemical reactions on the wafer surface and affecting device yield.
Design a handle fixture for semiconductor cleaning, including a first handle part and an operating part. The operating part is provided with symmetrically arranged lifting arms and claws, combined with an arc-shaped connector and a preset flow guide angle to ensure that the acid flows down quickly and avoids contact with the wafer.
This effectively avoids acid residue, improves the reliability of wafer cleaning, reduces the risk of secondary chemical reactions, and increases device yield.
Smart Images
Figure CN224538700U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, and more specifically to a handle fixture for semiconductor cleaning. Background Technology
[0002] In semiconductor fabrication processes, back-side metallization (BGBM) of power devices is a critical process. It typically requires the formation of a conductive metal layer on the back of the wafer to reduce the on-resistance of the device and improve heat dissipation performance, thereby ensuring the reliability of the chip in high-current, high-power applications. In the BGBM process flow, the wafer usually needs to be cleaned before back-side metallization to remove surface impurities, residual particles and oxides. This cleaning step often involves acid solution treatment (i.e., acid pickling or acid immersion process), and the cleanliness of the wafer surface is ensured through acid corrosion and cleaning action.
[0003] In actual production, wafers are usually placed in a basket, and then the basket is immersed in acid solution using a cleaning handle. After cleaning, the wafer is lifted out. To improve structural strength, the cleaning handle in related technologies is generally equipped with steps (reinforcing ribs). When the wafer is lifted out of the acid solution, some acid solution is easily retained. The residual acid solution will flow down the handle and come into contact with the cleaned wafer surface again, causing a secondary chemical reaction. This secondary reaction often leads to discoloration defects on the wafer surface. In severe cases, it can also cause the peeling of the wafer surface metal or dielectric layer, affecting the device yield. Utility Model Content
[0004] In view of this, this application provides a handle fixture for semiconductor cleaning to solve the aforementioned technical problems.
[0005] In a first aspect, embodiments of this application disclose a handle fixture for semiconductor cleaning, comprising: A first handle portion and an operating portion, wherein the operating portion is connected to the end of the first handle portion; The operating part includes symmetrically arranged lifting arms. Each lifting arm is provided with a first claw body and a second claw body. The first claw body and the second claw body are integrally connected to the end of the lifting arm away from the first handle part. The first claw body and the end of the lifting arm form a transverse groove, and the second claw body and the end of the lifting arm form a longitudinal groove, which are used to match the basket that carries the wafer to be cleaned. The operating part further includes an arc-shaped connector, which is integrally connected to the ends of the lifting arms between the lifting arms, and the side of the lifting arm away from the arc-shaped connector has a preset flow guide angle with the first handle part. The front and rear sides of the first handle and the operating part are located on the same plane.
[0006] In one possible example, the first handle and the operating part are arranged in a Y-shaped structure.
[0007] In one possible example, the longitudinal groove and the transverse groove are connected and communicate with each other.
[0008] In one possible example, a second handle portion is also included, which is located at the end of the first handle portion away from the operating portion, and a through hole is provided at the center of the second handle portion to form an annular structure.
[0009] In one possible example, the first handle portion, the operating portion, and the second handle portion are integrally connected.
[0010] In one possible example, the first claw body is arranged in an L-shaped structure.
[0011] In one possible example, the first claw and the second claw together form a clamping opening at the end of the lifting arm, including the transverse groove and the longitudinal groove.
[0012] In one possible example, the side wall connection between the first handle portion and the operating portion, as well as the side wall connection between the first handle portion and the second handle portion, are provided with rounded corners.
[0013] In one possible example, the cross-section of the arc-shaped connector has a circular arc transition to bridge the two lifting arms.
[0014] In one possible example, the preset guide angle is an obtuse angle.
[0015] In summary, compared with the prior art, this application discloses a handle fixture for semiconductor cleaning, comprising: a first handle portion and an operating portion, the operating portion being connected to the end of the first handle portion; the operating portion includes symmetrically arranged lifting arms, each lifting arm having a first claw body and a second claw body, the first claw body and the second claw body being integrally connected to the end of the lifting arm opposite to the first handle portion, and the first claw body and the end of the lifting arm forming a transverse groove, the second claw body and the end of the lifting arm forming a longitudinal groove, for matching the basket carrying the wafer to be cleaned; the operating portion also includes an arc-shaped connector, the arc-shaped connector being integrally connected to the end of the lifting arm between the lifting arms, and the side of the lifting arm opposite to the arc-shaped connector having a preset flow guiding angle with the first handle portion; the front / rear sides of the first handle portion and the operating portion are all located on the same plane, that is, through the above-mentioned arrangement, acid residue on the handle is avoided, and the reliability of wafer cleaning is improved. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a three-dimensional structural diagram of the handle fixture for semiconductor cleaning according to this application; Figure 2 This is a front view structural diagram of the handle fixture for semiconductor cleaning according to this application. Detailed Implementation
[0018] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the claims.
[0019] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.
[0020] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.
[0021] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.
[0022] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.
[0024] This application provides a handle fixture for semiconductor cleaning. This structural design can effectively prevent the secondary outflow of residual liquid during the pickling process from contacting the wafer surface, thereby improving the cleaning effect and reliability.
[0025] Please refer to Figure 1 and Figure 2 The handle fixture for semiconductor cleaning in this application includes a first handle part 1 and an operating part 2.
[0026] In the specific implementation process, the operating part 2 is connected to the end of the first handle part 1. The operating part 2 includes symmetrically arranged lifting arms 3. Each lifting arm 3 is provided with a first claw body 4 and a second claw body 5. The first claw body 4 and the second claw body 5 are integrally connected to the end of the lifting arm 3 away from the first handle part 1. The first claw body 4 and the end of the lifting arm 3 form a transverse groove 6, and the second claw body 5 and the end of the lifting arm 3 form a longitudinal groove 7, which are used to match the basket that carries the wafer to be cleaned, so that the wafer remains stable during acid immersion and cleaning.
[0027] The operating unit 2 also includes an arc-shaped connector 8, which is integrally connected to the ends of the lifting arms 3. This arc-shaped connector 8 creates a stable bridging structure between the lifting arms 3. Simultaneously, a preset guide angle (e.g., 0.5°) is provided between the side of the lifting arm 3 facing away from the arc-shaped connector 8 and the first handle portion 1. Figure 2 The angle indicated by Q allows residual acid or cleaning fluid to flow quickly down the lifting arm as the basket is lifted out of the cleaning solution, thus preventing liquid stagnation and secondary contact with the wafer.
[0028] Furthermore, the front and rear sides of the first handle part 1 and the operating part 2 are located on the same plane. Through such a planar integrated design, the overall shape of the handle fixture is smooth and the transition is natural. It will not form steps or protrusions that easily retain acid. When the wafer basket is lifted after cleaning, the acid can flow quickly along the flat side wall, thereby effectively preventing residual acid from accumulating on the surface or dripping onto the wafer surface, reducing the risk of secondary chemical reactions, and further ensuring the cleaning effect and wafer quality.
[0029] Preferably, the first handle part 1 and the operating part 2 are arranged in a Y-shaped structure, which facilitates the distribution of lifting force and improves the stability of the basket.
[0030] In one example, the longitudinal groove 7 and the transverse groove 6 are connected and interconnected, thereby forming a continuous clamping transition area, which facilitates adaptation to the basket frame.
[0031] In one possible implementation of this application, the handle fixture further includes a second handle portion 9, which is located at the end of the first handle portion 1 away from the operating portion 2. A through hole 10 is provided at the center of the second handle portion 9 to form a ring structure, which facilitates the operator to hang the handle fixture or insert hooks or clamping tools during handling or storage, thereby improving operational flexibility.
[0032] Preferably, the first handle part 1, the operating part 2 and the second handle part 9 are integrally connected and formed, for example, by injection molding, which can further improve the overall strength and avoid the risk of weakening of the splicing structure.
[0033] In one example, the first claw 4 has an L-shaped structure, which can effectively hold the edge of the basket and prevent it from slipping in the cleaning fluid. Furthermore, the first claw 4 and the second claw 5 form an enclosure at the end of the lifting arm 3, constituting a clamping opening 11 including a transverse groove 6 and a longitudinal groove 7. The clamping opening 11 can fit the basket more tightly and improve the fixation reliability.
[0034] To reduce local stress concentration and improve safety, preferably, rounded corners are provided at the connection between the side wall of the first handle part 1 and the operating part 2, and at the connection between the side wall of the first handle part 1 and the second handle part 9.
[0035] In one example, the cross-section of the arc-shaped connector 8 is a circular arc transition, which enhances the flow guiding effect while connecting the lifting arm 3, allowing residual liquid to be discharged smoothly.
[0036] In addition, the preset flow guide angle is preferably an obtuse angle, which is greater than 90°. This ensures the structural strength between the operating part 2 and the handle part 1, and also forms a good flow guide path, further avoiding liquid residue.
[0037] Preferably, the preset guide angle is 135° or 145°.
[0038] In summary, the handle fixture of this application, through structural optimization, namely, the operation part 2 is connected to the end of the first handle part 1, each lifting arm 3 of the operation part 2 is provided with a first claw body 4 and a second claw body 5, the first claw body 4 and the second claw body 5 are integrally connected to the end of the lifting arm 3 opposite to the first handle part 1, and the first claw body 4 and the end of the lifting arm 3 form a transverse groove 6, the second claw body 5 and the end of the lifting arm 3 form a longitudinal groove 7, and the arc-shaped connecting body 8 is integrally connected to the end of the lifting arm 3 between the lifting arms 3 respectively, and a preset flow guiding angle is set between the side of the lifting arm 3 opposite to the arc-shaped connecting body 8 and the first handle part 1, and the front / rear sides of the first handle part 1 and the operation part 2 are located on the same plane, realizing stable clamping of the wafer basket and efficient flow guiding of the handle fixture, significantly reducing the risk of residual acid secondary contact with the wafer, and improving the reliability of semiconductor cleaning.
[0039] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.
Claims
1. A handle fixture for semiconductor cleaning, characterized in that, include: A first handle portion and an operating portion, wherein the operating portion is connected to the end of the first handle portion; The operating part includes symmetrically arranged lifting arms. Each lifting arm is provided with a first claw body and a second claw body. The first claw body and the second claw body are integrally connected to one end of the lifting arm away from the first handle part. The first claw body and the end of the lifting arm form a transverse groove, and the second claw body and the end of the lifting arm form a longitudinal groove, which are used to match the basket that carries the wafer to be cleaned. The operating part further includes an arc-shaped connector, which is integrally connected to the ends of the lifting arms between the lifting arms, and the side of the lifting arm away from the arc-shaped connector has a preset flow guide angle with the first handle part. The front and rear sides of the first handle and the operating part are located on the same plane.
2. The handle fixture for semiconductor cleaning as described in claim 1, characterized in that, The first handle and operating part are arranged in a Y-shaped structure.
3. The handle fixture for semiconductor cleaning as described in claim 1, characterized in that, The longitudinal groove and the transverse groove are connected and communicate with each other.
4. The handle fixture for semiconductor cleaning as described in claim 1, characterized in that, It also includes a second handle portion, which is located at the end of the first handle portion away from the operating portion. A through hole is provided at the center of the second handle portion to form a ring structure.
5. The handle fixture for semiconductor cleaning as described in claim 4, characterized in that, The first handle portion, the operating portion, and the second handle portion are integrally connected and formed.
6. The handle fixture for semiconductor cleaning as described in claim 1, characterized in that, The first claw body is designed in an L-shape.
7. The handle fixture for semiconductor cleaning as described in claim 1, characterized in that, The first claw and the second claw together form a clamping opening at the end of the lifting arm, including the transverse groove and the longitudinal groove.
8. The handle fixture for semiconductor cleaning as described in claim 4, characterized in that, The side wall connection between the first handle portion and the operating portion, as well as the side wall connection between the first handle portion and the second handle portion, are provided with rounded corners.
9. The handle fixture for semiconductor cleaning as described in claim 1, characterized in that, The cross-section of the arc-shaped connector is a circular arc transition to bridge the two lifting arms.
10. The handle fixture for semiconductor cleaning as described in any one of claims 1 to 9, characterized in that, The preset guide angle is an obtuse angle.