A heat conductive paste smearing jig
By using a modular subcarrier design and a precision positioning structure, the problems of compatibility and positioning deviation of existing application tools have been solved, achieving uniform application of thermal paste and efficient production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 昆山威典电子有限公司
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-24
AI Technical Summary
Existing thermal paste application tools are not compatible with different chip packages, posing a risk of positioning deviation, resulting in uneven application and inaccurate thickness control.
The modular subcarrier design, combined with precision positioning and error-proofing structures, enables rapid changeover and precise positioning through tapered fit and asymmetrically distributed positioning pins and bushings, preventing assembly errors.
It enables compatibility with various chip packages, ensures uniform thermal paste application thickness, reduces assembly error rate, and improves production efficiency.
Smart Images
Figure CN224542205U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coating fixture technology, and in particular to a thermal paste coating fixture. Background Technology
[0002] A thermal paste application fixture is a specialized tool or device used to standardize and regulate the application process of thermal paste (also known as heat dissipation paste or thermal grease). Its core function is to ensure, through physical structure design, that the thermal paste is evenly, appropriately, and precisely covered between the contact surface of electronic components (such as CPU and GPU chips) and the heat sink, thereby optimizing heat dissipation efficiency.
[0003] In the current field of heat dissipation for electronic components, there are common problems such as uneven application of thermal paste and inaccurate thickness control. Traditional application tools mostly use a single template structure, which cannot be adapted to different chip packages. There is a risk of positioning deviation when changing molds. Therefore, we propose a thermal paste application fixture. Utility Model Content
[0004] In view of the fact that most of the existing coating tools adopt a single template structure, which cannot be adapted to chip packages of different specifications, and there is a risk of positioning deviation when changing the mold, this utility model is proposed.
[0005] Therefore, the purpose of this utility model is to provide a thermal paste application fixture, which aims to achieve rapid changeover and accurate positioning through modular subcarriers and precision positioning structures, while the error-proof structure can effectively avoid assembly errors.
[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution:
[0007] A thermal paste application fixture includes a mother carrier, on which symmetrically arranged main handles are mounted, and the mother carrier is provided with a male positioning pin and a female positioning bushing.
[0008] A sub-carrier assembly, at least one of the detachable sub-carrier assemblies being positioned and connected to the mother carrier via the sub-locating pin and the mother-locating bushing;
[0009] The misplacement structure includes sub-misplacement posts disposed on the mother vehicle and misplacement prevention holes corresponding to each vehicle component.
[0010] As a technical solution of the thermal paste application fixture described in this utility model, the sub-carrier assembly includes:
[0011] The first sub-carrier is provided with a first positioning post and a first positioning bushing that are positioned and cooperate with the mother carrier.
[0012] The second sub-carrier is provided with a second positioning post and a second positioning bushing that are positioned and cooperate with the mother carrier.
[0013] The third sub-carrier is provided with a third positioning post and a third positioning bushing that are positioned and cooperate with the mother carrier.
[0014] As a technical solution of the thermal paste application fixture of this utility model, each of the sub-carrier components is provided with an independent handle structure, the independent handle structure including a first handle installed on the first sub-carrier, a second handle installed on the second sub-carrier, and a third handle installed on the third sub-carrier.
[0015] As a technical solution of the thermal paste application fixture described in this utility model, the sub-positioning pin and the female positioning bushing are asymmetrically distributed and constitute an anti-reverse installation structure.
[0016] As a technical solution of the thermal paste application fixture described in this utility model, the mother carrier and the daughter carrier assembly adopt a tapered fit, and the tapered angle is 3°-5°.
[0017] As a technical solution of the thermal paste application fixture described in this utility model, the anti-misalignment hole diameters of each of the sub-carrier components are different, and the tolerance range is controlled within ±0.01mm.
[0018] Compared with the prior art, the present invention has at least the following beneficial effects:
[0019] 1. This utility model adapts to various heat dissipation product specifications through modular subcarrier design, and at the same time, combined with tapered fit and positioning structure, it can ensure the uniformity of thermal paste application thickness.
[0020] 2. This utility model reduces the assembly error rate by setting anti-misalignment holes and anti-reverse structure, while the independent handle design simplifies the operation process to improve production efficiency. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:
[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0023] Figure 2 This is a schematic diagram of the exploded structure of this utility model.
[0024] Figure 3 This is a schematic diagram of the mother vehicle structure of this utility model.
[0025] Figure 4 This is a schematic diagram of the first sub-carrier structure of this utility model.
[0026] Figure 5 This is a schematic diagram of the second sub-carrier structure of this utility model.
[0027] Figure 6 This is a schematic diagram of the third sub-carrier structure of this utility model.
[0028] Explanation of reference numerals in the attached figures:
[0029] In the diagram: 1. Mother vehicle; 101. Main handle; 102. Sub-positioning pin; 103. Mother positioning bushing; 104. Sub-positioning post; 21. First sub-vehicle; 211. First handle; 212. First positioning post; 213. First positioning bushing; 22. Second sub-vehicle; 221. Second handle; 222. Second positioning post; 223. Second positioning bushing; 23. Third sub-vehicle; 231. Third handle; 232. Third positioning post; 233. Third positioning bushing. Detailed Implementation
[0030] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0031] Reference Figures 1-6 A thermal paste application fixture is provided, which includes a female carrier 1, a main handle 101 symmetrically arranged on the female carrier 1, a male positioning pin 102 and a female positioning bushing 103 on the female carrier 1.
[0032] The sub-carrier assembly, at least one detachable sub-carrier assembly, is positioned and connected to the mother carrier 1 via a sub-positioning pin 102 and a mother positioning bushing 103;
[0033] The misplacement structure includes a sub-misplacement post 104 set on the mother carrier 1 and a misplacement prevention hole set on each carrier component. In application, through the positioning connection structure (sub-positioning pin 102, mother positioning bushing 103) between the mother carrier 1 and the sub-carrier components and the misplacement prevention post / hole design, the functions of rapid positioning and misplacement prevention can be realized, reducing human operation errors.
[0034] Reference Figure 2 as well as Figures 4-6 The sub-vehicle assembly includes:
[0035] The first sub-carrier 21 is provided with a first positioning post 212 and a first positioning bushing 213 that are positioned and cooperate with the mother carrier 1;
[0036] The second sub-carrier 22 is provided with a second positioning post 222 and a second positioning bushing 223 that are positioned and cooperate with the mother carrier 1.
[0037] The third sub-vehicle 23 is provided with a third positioning post 232 and a third positioning bushing 233 that are positioned and cooperate with the mother vehicle 1;
[0038] Each sub-carrier component is equipped with an independent handle structure, which includes a first handle 211 mounted on the first sub-carrier 21, a second handle 221 mounted on the second sub-carrier 22, and a third handle 231 mounted on the third sub-carrier 23. In application, the multi-specification sub-carriers (first sub-carrier 21, second sub-carrier 22, and third sub-carrier 23) can be adapted to different chip package sizes. The independent handle structure improves the ease of operation and avoids positioning deviations caused by uneven force during replacement.
[0039] Reference Figure 2 and Figure 3 The sub-positioning pin 102 and the female positioning bushing 103 are asymmetrically distributed and form an anti-reverse installation structure. In application, the asymmetrically distributed sub-positioning pin 102 and the female positioning bushing 103 form an anti-reverse structure to ensure that the sub-carrier can only be installed in one direction and avoid reverse errors.
[0040] Reference Figure 1 and Figure 2 The mother carrier 1 and the daughter carrier assembly adopt a tapered fit with a taper of 3°-5°. In application, the 3°-5° tapered fit enhances the contact stability between the mother carrier 1 and the daughter carrier, reducing the risk of displacement caused by vibration or pressure during the coating process.
[0041] Reference Figures 4-6 Each sub-carrier component has a different diameter for its anti-misalignment hole, and the tolerance range is controlled within ±0.01mm, so as to ensure that the sub-carrier can only be installed in one direction and avoid reverse error.
[0042] The working principle of this utility model is as follows: By fixing the mother carrier 1 on the workbench, the position is adjusted using the main handle 101. Then, the sub-carrier is selected according to the type of heat dissipation product. The anti-misalignment hole is used to align and press the sub-carrier into place until the taper fits properly. After applying thermal paste, the sub-carrier is lifted vertically using the independent handle to prevent the paste from sticking. This enables quick model change and precise positioning. At the same time, the anti-misalignment structure can effectively prevent assembly errors.
[0043] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. A heat-conducting paste application fixture, characterized in that: include: The mother carrier (1) is equipped with a symmetrically arranged main handle (101), and the mother carrier (1) is provided with a sub-positioning pin (102) and a mother positioning bushing (103). The sub-carrier assembly, at least one of the detachable sub-carrier assemblies, is positioned and connected to the mother carrier (1) via the sub-positioning pin (102) and the mother positioning bushing (103); The misplacement structure includes a sub-misplacement post (104) disposed on the mother vehicle (1) and a misplacement prevention hole disposed corresponding to each vehicle component.
2. The thermal paste application fixture according to claim 1, characterized in that: The sub-vehicle assembly includes: The first sub-carrier (21) is provided with a first positioning post (212) and a first positioning bushing (213) that are positioned and cooperate with the mother carrier (1). The second sub-carrier (22) is provided with a second positioning post (222) and a second positioning bushing (223) that are positioned and cooperate with the mother carrier (1). The third sub-vehicle (23) is provided with a third positioning post (232) and a third positioning bushing (233) that are positioned and cooperate with the mother vehicle (1).
3. The thermal paste application fixture according to claim 2, characterized in that: Each of the sub-vehicle components is provided with an independent handle structure, which includes a first handle (211) installed on the first sub-vehicle (21), a second handle (221) installed on the second sub-vehicle (22), and a third handle (231) installed on the third sub-vehicle (23).
4. The thermal paste application fixture according to claim 1, characterized in that: The sub-positioning pin (102) and the female positioning bushing (103) are asymmetrically distributed and constitute an anti-reverse installation structure.
5. The thermal paste application fixture according to claim 1, characterized in that: The mother vehicle (1) and the sub-vehicle assembly are fitted with a tapered fit, and the tapered angle is 3°-5°.
6. The thermal paste application fixture according to claim 1, characterized in that: The diameter of the anti-misalignment hole is different for each of the sub-vehicle components, and the tolerance range is controlled within ±0.01mm.