Intelligent screening device for esim chip defective products

Abstract

The utility model relates to chip screening technical field, concretely relates to ESIM chip defective product intelligent screening device, including vision detection device and conveying device, vision detection device, conveying device connection industrial computer still include: jacking mechanism, be located vision detection device below, for defective product chip jacking, transfer mechanism is used for the defective product chip jacking transfer, jacking mechanism, transfer mechanism, conveying device and vision detection device with industrial computer connection, the application realizes to the defective product chip's rejection recycling operation, in the rejection process, will not damage the lead frame itself structure, convenient recycling. And the whole rejection process does not need artificial operation intervention, the degree of automation is higher, has improved work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip screening technology, specifically to an intelligent screening device for defective ESIM chips. Background Technology

[0002] In the ESIM chip packaging process, traditional methods rely on manual marking of ink dots against paper maps to manually reject defective products. This method has the following drawbacks: Low efficiency: Rejecting a single chip takes 30 seconds, requiring 4.2 hours per shift to process 855 chips / frame × 900 frames (98% yield), which cannot meet the needs of large-scale production. High misjudgment rate: Manual visual inspection has a significant misjudgment rate, leading to loss of good products or missed defects. Data silos: Reliance on paper records makes it impossible to collect and analyze defective product data in real time, hindering process optimization. High labor intensity: Frequent manual operation can easily lead to fatigue and health problems.

[0003] The device and method for rejecting defective chips disclosed in CN114074228A identify defective chips and then cut them with a laser. However, laser cutting damages the overall structure of the lead frame, which is not conducive to recycling, and the dust generated by laser cutting requires additional cleaning. In addition, human intervention is still required (see paragraph 0138), and there is room for further improvement in the automation of the equipment. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the existing technology and provide an intelligent screening device for defective ESIM chips.

[0005] The technical solution adopted in this application to solve its technical problem is as follows: An intelligent screening device for defective ESIM chips includes a visual inspection device and a conveying device, wherein the visual inspection device and the conveying device are connected to an industrial control computer, and further includes:

[0006] The lifting mechanism, located below the visual inspection device, is used to lift up defective chips;

[0007] A transfer mechanism is used to transfer the defective chips that have been lifted up.

[0008] The lifting mechanism, transfer mechanism, conveying device, and visual inspection device are connected to the industrial control computer.

[0009] When this application is used, the chip to be inspected is transported to the vision inspection device by the conveying device for chip vision inspection. The industrial control computer determines the location information of the defective chip, controls the lifting mechanism to lift the defective chip upward, and then transfers the defective chip by the transfer mechanism to realize the screening operation of defective products.

[0010] The conveying device includes a transverse conveying section, which includes a sheet-bearing platform. The sheet-bearing platform is driven to move by a transverse servo module. The sheet-bearing platform is hollow and has a clamping mechanism on its periphery.

[0011] The lifting mechanism is located below the support platform.

[0012] The clamping mechanism includes a clamping cylinder fixedly installed below the bearing platform, and a clamping plate is provided at the telescopic end of the clamping cylinder passing through the bearing platform. The iron ring of the lead frame rests on the bearing platform, and its structural stability is ensured by clamping it with the clamping cylinder and the clamping plate.

[0013] The conveying device further includes a longitudinal conveying section, which comprises a longitudinal moving platform driven by a longitudinal servo module. The transverse conveying section is mounted on the longitudinal moving platform. To increase operational flexibility and convenience, this application provides both transverse and longitudinal movement directions. To ensure the stability of the device's operation, a support frame can be further installed below the longitudinal moving platform to ensure stability.

[0014] The lifting mechanism includes a lifting cylinder and an adsorption sleeve. The adsorption sleeve is fitted onto the telescopic part of the lifting cylinder. The telescopic part of the lifting cylinder is connected to a push pin. A lifting sensor is connected above the adsorption sleeve.

[0015] The adsorption sleeve is connected to a vacuum pumping device;

[0016] The lifting cylinder is driven by a drive device. The industrial control computer determines the position of the defective product based on feedback signals from the vision inspection device. The conveying device moves the defective product above the lifting cylinder, and then the drive device controls the lifting cylinder to move upwards. The upper surface of the adsorption sleeve contacts the blue film, and the lifting sensor detects the contact signal and sends it back to the industrial control computer. The industrial control computer then controls the drive device to stop moving upwards. Simultaneously, a vacuum adsorption operation is achieved between the adsorption sleeve and the blue film using a vacuum pumping device. The lifting cylinder then extends from the adsorption sleeve and uses a ejector pin to push the chip out of the defective product, separating it from the blue film. The ejected chip is then transferred using a transfer mechanism.

[0017] The driving device includes an electric cylinder. The bottom of the lifting cylinder is connected to the electric cylinder via a transmission connection, and the electric cylinder controls the up and down movement of the lifting cylinder. In this embodiment, the electric cylinder is fixedly connected to the longitudinal moving platform via a vertical plate.

[0018] The transfer mechanism includes a slide cylinder, the telescopic end of which is connected to a vacuum adsorption head, and the vacuum adsorption head is connected to a vacuum pumping device.

[0019] The slide cylinder is driven to move by a transfer servo module.

[0020] It also includes a support body, on which the industrial control computer, vision inspection device, conveying device and transfer mechanism are mounted.

[0021] The visual inspection device and the transfer mechanism are respectively mounted on the supporting body via connecting frames;

[0022] The transfer mechanism is located below and on one side of the vision inspection device. This arrangement prevents the vision inspection device from obstructing the chip during inspection.

[0023] A recycling bin is installed on the support structure corresponding to the transfer mechanism. Defective products picked up by the transfer mechanism are moved above the recycling bin by the transfer servo module and then placed inside the recycling bin for recycling.

[0024] This application implements signal processing and command control through an industrial control computer. This part uses existing technology and has not been improved, so it will not be described in detail here.

[0025] Compared with the prior art, this application has the following beneficial effects:

[0026] This application enables the rejection and recycling of defective chips. A lifting mechanism elevates the defective chips, and a transfer mechanism moves them to a recycling bin for recycling. The rejection process does not damage the lead frame structure, facilitating recycling. Furthermore, the entire rejection process requires no human intervention, resulting in a higher degree of automation and improved work efficiency. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of this utility model;

[0028] Figure 2 This is a schematic diagram of the conveying device structure;

[0029] Figure 3 This is a schematic diagram of the lifting mechanism.

[0030] Figure 4 This is a schematic diagram of the transfer mechanism.

[0031] In the diagram: 1. Industrial computer; 2. Vision inspection device; 3. Conveying device; 301. Support platform; 302. Lateral servo module; 303. Clamping cylinder; 304. Clamping plate; 305. Longitudinal moving platform; 306. Longitudinal servo module; 307. Support frame; 4. Lifting mechanism; 401. Lifting cylinder; 402. Adsorption sleeve; 403. Ejector pin; 404. Lifting sensor; 405. Electric cylinder; 406. Vertical plate; 5. Transfer mechanism; 501. Slide cylinder; 502. Vacuum adsorption head; 503. Transfer servo module; 6. Support body; 7. Recycling bin; 8. Connecting frame. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0034] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] Reference Figures 1-4 The ESIM chip defective intelligent screening device includes a visual inspection device 2 and a conveying device 3, wherein the visual inspection device 2 and the conveying device 3 are connected to an industrial control computer 1, and further includes:

[0036] The lifting mechanism 4, located below the visual inspection device 2, is used to lift up defective chips;

[0037] Transfer mechanism 5 is used to transfer the lifted defective chips;

[0038] The lifting mechanism 4, the transfer mechanism 5, the conveying device 3, and the visual inspection device 2 are connected to the industrial control computer 1.

[0039] The conveying device 3 includes a transverse conveying section, which includes a sheet-bearing platform 301. The sheet-bearing platform 301 is driven to move by a transverse servo module 302. The sheet-bearing platform 301 is hollow and a clamping mechanism is provided on its periphery.

[0040] The lifting mechanism 4 is located below the support platform 301. (Refer to...) Figure 2In this application, an iron ring with lead frames is placed on the wafer support platform 301. In this embodiment, each iron ring has three lead frames attached to its surface, and each lead frame contains multiple diced chips located on a blue film. A clamping mechanism clamps the iron ring around its periphery, thereby achieving fixed positioning and ensuring the reliability of the mechanical fixation, avoiding detection errors or chip damage caused by vibration or movement. Subsequently, the wafer support platform 301 is moved below the vision inspection device 2 via the horizontal servo module 302 for vision inspection. The detection of defective chips based on the vision inspection device 2 uses existing technology and is not a key point covered in this application, therefore it will not be described further.

[0041] The clamping mechanism includes a clamping cylinder 303 fixedly installed below the bearing platform 301. The telescopic end of the clamping cylinder 303 passes through the bearing platform 301 and is provided with a clamping plate 304. The iron ring of the lead frame rests on the bearing platform 301, and its structural stability is ensured by clamping it with the clamping cylinder 303 and the clamping plate 304.

[0042] The conveying device 3 further includes a longitudinal conveying section, which includes a longitudinal moving platform 305. The longitudinal moving platform 305 is driven to move by a longitudinal servo module 306, and the transverse conveying section is disposed on the longitudinal moving platform 305. (Refer to...) Figure 2 To increase operational flexibility and convenience, this application provides both horizontal and vertical movement directions. To ensure the stability of the device's operation, a support frame 307 can be further installed below the vertical movement platform 305 to provide additional support and ensure stability.

[0043] The conveyor device 3, driven by horizontal and vertical servo modules, can flexibly adjust the chip position to adapt to different workstation requirements, thereby improving the versatility and adaptability of the device.

[0044] The lifting mechanism 4 includes a lifting cylinder 401 and an adsorption sleeve 402. The adsorption sleeve 402 is sleeved on the telescopic part of the lifting cylinder 401. The telescopic part of the lifting cylinder 401 is connected to a pin 403. A lifting sensor 404 is connected above the adsorption sleeve 402.

[0045] The adsorption sleeve 402 is connected to a vacuum pumping device;

[0046] The lifting cylinder 401 is driven by a drive device. (See reference...) Figure 3The top of the lifting cylinder 401 is connected to the drive device via a connecting plate. The industrial control computer 1 determines the position of the defective product based on the feedback signal from the vision inspection device 2. The conveying device 3 moves the defective product above the lifting cylinder 401, and then the drive device controls the lifting cylinder 401 to move upwards. The upper surface of the adsorption sleeve 402 contacts the blue film, and the lifting sensor 404 senses the contact signal and sends it back to the industrial control computer 1. The industrial control computer 1 then controls the drive device to stop moving upwards. Simultaneously, a vacuum adsorption operation is achieved between the adsorption sleeve 402 and the blue film using a vacuum pumping device. The lifting cylinder 401 then extends from the adsorption sleeve 402 and uses the ejector pin 403 to eject the chip from the defective product, separating it from the blue film. The ejected chip is then transferred using a transfer mechanism 5. The lifting sensor 404 provides real-time position information to ensure accurate positioning of the defective chip during the lifting action, avoiding damage to the blue film or other good products. The vacuum adsorption function between the adsorption sleeve 402 and the blue film further fixes the chip position, preventing the chip from sliding or falling off during the lifting process and improving the separation success rate.

[0047] The driving device includes an electric cylinder 405. The bottom of the lifting cylinder 401 is connected to the electric cylinder 405, and the electric cylinder 405 controls the up and down movement of the lifting cylinder 401. In this embodiment, the electric cylinder 405 is fixedly connected to the longitudinal moving platform 305 via a vertical plate 406.

[0048] Reference Figure 4 The transfer mechanism 5 includes a slide cylinder 501, the telescopic end of which is connected to a vacuum adsorption head 502, and the vacuum adsorption head 502 is connected to a vacuum pumping device.

[0049] The slide cylinder 501 is driven to move by the transfer servo module 503.

[0050] The transfer mechanism 5 can quickly transfer defective products to the recycling bin. Combined with the precise movement of the transfer servo module, it can achieve contactless and high-precision collection of defective products, reducing the risk of secondary pollution.

[0051] It also includes a support body 6, on which the industrial control computer 1, vision inspection device 2, conveying device 3 and transfer mechanism 5 are mounted.

[0052] The visual inspection device 2 and the transfer mechanism 5 are respectively mounted on the support body 6 via a connecting frame 8. The connecting frame 8 includes two vertically arranged columns, which are connected by a horizontal plate.

[0053] The transfer mechanism 5 is located below one side of the vision inspection device 2. Furthermore, the transfer servo module 503 is fixedly mounted on the horizontal plate, and the vision inspection device can be fixedly connected to the horizontal plate based on a mounting bracket. This arrangement of the transfer mechanism 5 avoids obstructing the chip during the inspection process by the vision inspection device 2.

[0054] A recycling bin 7 is provided on the support body 6 corresponding to the transfer mechanism 5. Defective products picked up by the transfer mechanism 5 are moved above the recycling bin 7 by the transfer servo module 503 and then placed in the recycling bin 7 for recycling.

[0055] This application uses an industrial control computer 1 to implement signal processing and command control. This part adopts existing technology and has not been improved, so it will not be described in detail.

[0056] Working principle: A person or a robotic arm places the chip to be inspected on the wafer support platform 301, clamps it using a clamping mechanism, and then the conveying device 3 transports the chip to the visual inspection device 2 for defect detection. Based on the detection results from the visual inspection device 2, the industrial control computer 1 determines the location of the defective chip and moves it to the top of the lifting mechanism 4 via a horizontal conveying section. Then, a vertical conveying section aligns the defective chip with the transfer mechanism 5. The lifting mechanism 4 lifts the chip, and the vacuum suction head 502 on the transfer mechanism 5 picks up the defective chip and transfers it to the waste bin, thus achieving the screening and recycling of the defective chip.

[0057] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present utility model.

Claims

1. An intelligent screening device for defective ESIM chips, comprising a visual inspection device (2) and a conveying device (3), wherein the visual inspection device (2) and the conveying device (3) are connected to an industrial control computer (1), characterized in that, Also includes: The lifting mechanism (4), located below the visual inspection device (2), is used to lift up defective chips; Transfer mechanism (5) is used to transfer the raised defective chip; The lifting mechanism (4), the transfer mechanism (5), the conveying device (3) and the vision inspection device (2) are connected to the industrial control computer (1).

2. The intelligent screening device for defective ESIM chips according to claim 1, characterized in that, The conveying device (3) includes a transverse conveying section, which includes a plate-bearing platform (301). The plate-bearing platform (301) is driven to move by a transverse servo module (302). The plate-bearing platform (301) is hollow and a clamping mechanism is provided on its periphery. The lifting mechanism (4) is located below the support platform (301).

3. The intelligent screening device for defective ESIM chips according to claim 2, characterized in that, The clamping mechanism includes a clamping cylinder (303) fixedly installed below the support platform (301), and the telescopic end of the clamping cylinder (303) is provided with a clamping plate (304) passing through the support platform (301).

4. The intelligent screening device for defective ESIM chips according to claim 2 or 3, characterized in that, The conveying device (3) further includes a longitudinal conveying section, which includes a longitudinal moving platform (305). The longitudinal moving platform (305) is driven to move by a longitudinal servo module (306), and the transverse conveying section is disposed on the longitudinal moving platform (305).

5. The intelligent screening device for defective ESIM chips according to claim 1, characterized in that, The lifting mechanism (4) includes a lifting cylinder (401) and an adsorption sleeve (402). The adsorption sleeve (402) is sleeved on the telescopic part of the lifting cylinder (401). The telescopic part of the lifting cylinder (401) is connected to a push pin (403). A lifting sensor (404) is connected above the adsorption sleeve (402). The adsorption sleeve (402) is connected to a vacuum pumping device; The lifting cylinder (401) is driven by a drive device.

6. The intelligent screening device for defective ESIM chips according to claim 5, characterized in that, The drive unit includes an electric cylinder (405).

7. The intelligent screening device for defective ESIM chips according to claim 1, characterized in that, The transfer mechanism (5) includes a slide cylinder (501), the telescopic end of which is connected to a vacuum adsorption head (502), and the vacuum adsorption head (502) is connected to a vacuum pumping device. The slide cylinder (501) is driven to move by the transfer servo module (503).

8. The intelligent screening device for defective ESIM chips according to claim 1, characterized in that, It also includes a support body (6), on which the industrial control computer (1), vision inspection device (2), conveying device (3) and transfer mechanism (5) are mounted.

9. The intelligent screening device for defective ESIM chips according to claim 8, characterized in that, The visual inspection device (2) and the transfer mechanism (5) are respectively mounted on the support body (6) via a connecting frame (8); The transfer mechanism (5) is located below the visual inspection device (2) on one side.

10. The intelligent screening device for defective ESIM chips according to claim 9, characterized in that, A recycling bin (7) is provided on the supporting body (6) corresponding to the transfer mechanism (5).

Images