A pretreatment device for wafer high-temperature degassing

Abstract

The utility model discloses a kind of pretreatment devices for wafer high-temperature degassing, comprising: vacuum chamber, upper cover mechanism is provided on it, the vacuum chamber has water-cooled interlayer;Barrel-shaped heating system, be located in vacuum chamber and be connected with upper cover mechanism;And sample holder is suspendedly installed in vacuum chamber by displacement platform, the sample holder can be lifted in vertical direction by displacement platform, and drive sample holder rotation, the sample holder can be completely entered into barrel-shaped heating system upwards.The utility model simple structure, by adopting barrel-shaped heating system, and cooperate the rotary motion of sample stage, make sample heat more evenly, to significantly improve degassing effect.In addition, vacuum chamber is equipped with water-cooled interlayer, not only can resist higher degassing temperature, also help to compress cavity volume, improve the vacuum degree of pretreatment cavity, to realize the effective balance of multiple performance indicators.

Description

Technical Field

[0001] This utility model relates to the technical field of MBE thin film pretreatment equipment, specifically a pretreatment device for high-temperature degassing of wafers. Background Technology

[0002] In molecular beam epitaxy (MBE) equipment, the vacuum system is a crucial component for ensuring the quality of thin film growth. This system typically consists of three main working chambers: the sample loading chamber, the pretreatment chamber, and the growth chamber. The core function of the pretreatment chamber is to degas the sample at high temperatures to remove adsorbed gases and impurities from within the material, while maintaining a high level of cleanliness on the substrate surface, thus providing a solid foundation for the growth of high-quality thin films.

[0003] However, in existing technologies, pretreatment chamber systems struggle to achieve an effective balance among four key technical indicators: degassing temperature, chamber volume, chamber vacuum level, and the number of substrates that can be processed. Generally, increasing the number of substrates that can be processed or raising the degassing temperature requires increasing the chamber volume, but this often results in a decrease in vacuum pumping speed and ultimate vacuum level, affecting degassing efficiency and system stability. Conversely, pursuing higher vacuum levels and smaller chamber volumes limits the number of substrates that can be processed and may reduce the uniformity and controllability of the degassing temperature. This interplay often necessitates sacrifices in certain performance aspects in practical applications of current similar equipment, thus affecting overall process flexibility and the equipment's applicability. Therefore, a pretreatment device for high-temperature degassing of wafers is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a pretreatment device for high-temperature degassing of wafers, in order to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a pretreatment device for high-temperature degassing of wafers, comprising:

[0006] A vacuum chamber with a top cover mechanism, the vacuum chamber having a water-cooled jacket;

[0007] A barrel-shaped heating system, located within a vacuum chamber and connected to the upper cover mechanism; and

[0008] The sample holder is suspended in the vacuum chamber by a displacement stage. The displacement stage can raise and lower the sample holder in the vertical direction and drive the sample holder to rotate. The sample holder can be fully inserted into the barrel-shaped heating system.

[0009] As a further embodiment of this utility model: the vacuum chamber and the upper cover mechanism are connected by a flange copper ring and a nut.

[0010] As a further embodiment of this utility model, several vacuum flange interfaces are installed on both the vacuum chamber and the upper cover mechanism.

[0011] As a further embodiment of this utility model: a limiting groove is provided on the end face of the sample holder near the upper cover mechanism, and a hook adapted to the limiting groove is provided at the end of the displacement stage. When the hook enters the limiting groove, the displacement stage can drive the sample holder to rise, fall and rotate.

[0012] As a further embodiment of this utility model: the barrel-shaped heating system includes a fixing ring and a plurality of barrel-shaped heating plates disposed inside the fixing ring. A heat insulation cylinder is provided on the outside of the fixing ring. The heat insulation cylinder is provided with conductive rods corresponding one-to-one with the number of barrel-shaped heating plates. The ends of the conductive rods pass through the heat insulation cylinder, the fixing ring and the barrel-shaped heating plates in sequence and are connected thereto. A connecting structure connected to the fixing ring is installed on the heat insulation cylinder, and the connecting structure is connected to the upper cover mechanism.

[0013] As a further embodiment of this utility model: the outer side of the heat insulation cylinder is provided with several horizontal supports, and the connecting structure is located above the horizontal supports.

[0014] As a further embodiment of this utility model: the connecting structure includes a connecting block disposed on a horizontal support, the connecting block and the fixing ring are connected by bolts, and a lifting lug is provided above the connecting block, the lifting lug is connected to the horizontal support by a screw, and the lifting lug is connected to the upper cover mechanism by bolts.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] This application employs a barrel-shaped heating system, combined with the rotation of the sample stage, to ensure more uniform heating of the sample, thereby significantly improving the degassing effect. Furthermore, the vacuum chamber is equipped with a water-cooled jacket, which not only withstands higher degassing temperatures but also helps compress the chamber volume, increasing the vacuum level of the pretreatment chamber, thus achieving an effective balance among multiple performance indicators. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the vacuum chamber of this utility model;

[0018] Figure 2 This is a schematic diagram showing the connection between the upper cover mechanism and the barrel-shaped heating system of this utility model;

[0019] Figure 3 This is a cross-sectional schematic diagram of the pretreatment device of this utility model;

[0020] Figure 4 This is a schematic diagram of the assembly of the displacement stage and sample holder of this utility model;

[0021] Figure 5This is a schematic diagram of the barrel-shaped heating system of this utility model;

[0022] Figure 6 This is a schematic diagram of the connection structure of this utility model;

[0023] In the diagram: 1. Vacuum chamber; 11. Water-cooled jacket; 2. Top cover mechanism; 3. Barrel-shaped heating system; 3-1. Fixing ring; 3-2. Barrel-shaped heating plate; 3-3. Heat insulation cylinder; 3-4. Conductive rod; 3-5. Connecting structure; 3-5-1. Connecting block; 3-5-2. Lifting lug; 3-5-3. Screw; 31. Horizontal support; 4. Displacement stage; 41. Hook; 5. Sample holder; 51. Limiting groove. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-6 In this embodiment of the present invention, a pretreatment device for high-temperature degassing of wafers includes:

[0026] Vacuum chamber 1, on which a top cover mechanism 2 is provided, and vacuum chamber 1 has a water-cooled jacket 11;

[0027] A barrel-shaped heating system 3 is located inside the vacuum chamber 1 and connected to the upper cover mechanism 2; and

[0028] The sample holder 5 is suspended in the vacuum chamber 1 by the displacement stage 4. The sample holder 5 can be raised and lowered in the vertical direction by the displacement stage 4, and the sample holder 5 can be rotated. The sample holder 5 can be fully inserted into the barrel-shaped heating system 3.

[0029] Specifically, the vacuum chamber 1 is made of 316L stainless steel and undergoes a hydrogen removal process to ensure a preset vacuum level. The inner wall of the vacuum chamber 1 is equipped with a water-cooled jacket 11, which has an inlet and an outlet connecting to the outside. The barrel-shaped heating system 3 is located on the lower surface of the upper cover mechanism 2. The vacuum chamber 1 and the upper cover mechanism 2 are connected by a flange copper ring and a nut. The flange copper ring seals the connection, while the nut and bolts lock the vacuum chamber 1 and the upper cover mechanism 2 together, ensuring a tight connection. The displacement stage 4 is constructed using the CF35 method. The sample holder 5 is mounted on the upper cover mechanism 2, enabling linear and rotary motion. The displacement stage 4 is divided into a vacuum section and a non-vacuum section. The non-vacuum section is located on the side of the upper cover mechanism 2 away from the vacuum chamber 1, while the section inside the vacuum chamber 1 is the vacuum section. The vacuum section of the displacement stage 4 is connected to the sample holder 5. Since the sample holder 5 is located inside the vacuum chamber 1, it is made of tantalum material and can withstand a maximum temperature of 1200℃. The number of layers of the sample holder 5 is not limited. In this embodiment, preferably, the sample holder 5 is divided into 6 layers to realize the overall transport of the sample holder 6, which can process 6 substrates at one time.

[0030] Please see Figure 1-3 In one embodiment, preferably, both the vacuum chamber 1 and the upper cover mechanism 2 are equipped with a plurality of vacuum flange interfaces. The vacuum flange interfaces on the vacuum chamber 1 are used to connect the pump, gauge, valve, viewing window and temperature feeder, respectively, while the vacuum flange interfaces on the upper cover mechanism 2 are used to connect the displacement stage and the power feeder, respectively. All the above flange interfaces are sealed by copper ring sealing to ensure sealing performance.

[0031] Please see Figure 1In one embodiment, preferably, a limiting groove 51 is formed on the end face of the sample holder 5 near the upper cover mechanism 2, and a hook 41 adapted to the limiting groove 51 is provided at the end of the displacement stage 4. Further, the shape of the limiting groove 51 is not limited, and the shape of the hook 41 is adapted to the limiting groove 51. In this embodiment, preferably, both the limiting groove 51 and the hook 41 are rectangular structures, and the length of the hook 41 is greater than the width of the limiting groove 51. When the length direction of the hook 41 is parallel to the length direction of the limiting groove 51, the sample holder 5 can detach from the hook 41; when the length direction of the hook 41 is perpendicular to the length direction of the limiting groove 51... When the limiting pin 42 is inserted into the limiting hole 52, the displacement stage 4 can drive the sample holder 5 to perform lifting or rotating operations. The connection and separation with the sample holder 5 and the displacement stage 4 are achieved by the hook 41. When the hook 41 is inserted into the sample holder 5, rotated 90° and then lifted, the limiting pin 42 enters the limiting hole 52, which can connect with the sample holder 5 and the displacement stage 4, and thus be driven by the displacement stage 4 to achieve linear and rotational movements. When the hook 41 is pressed down, rotated 90° and then lifted, it can be separated from the displacement stage 4, so that the sample holder 5 falls onto the installation platform extending from the sample inlet chamber, realizing the overall transportation of the sample holder 5.

[0032] Please see Figure 1 In one embodiment, preferably, the barrel heating system 3 includes a fixing ring 3-1 and several barrel heating plates 3-2 disposed inside the fixing ring 3-1. A heat insulation cylinder 3-3 is disposed outside the fixing ring 3-1. The heat insulation cylinder 3-3 is provided with conductive rods 3-4 corresponding one-to-one with the number of barrel heating plates 3-2. The ends of the conductive rods 3-4 pass through the heat insulation cylinder 3-3, the fixing ring 3-1 and the barrel heating plates 3-2 in sequence and are connected, and are insulated by ceramic parts. A connecting structure 3-5 connected to the fixing ring 3-1 is installed on the heat insulation cylinder 3-3, and the connecting structure 3-5 is connected to the upper cover mechanism 2. Several horizontal supports 31 are disposed outside the heat insulation cylinder 3-3. The connecting structure 3-5 is disposed above the horizontal supports 31. The power supply and temperature supply are installed on the flange interface of the upper cover mechanism 2. The vacuum internal part is respectively connected to the conductive rods 3-4 and the fixing ring 3-1 to realize the power supply and temperature measurement of the barrel heating system 3.

[0033] Please see Figure 1 In one embodiment, preferably, the connecting structure 3-5 includes a connecting block 3-5-1 disposed on the horizontal support 31. The connecting block 3-5-1 is connected to the fixing ring 3-1 by bolts, and a lifting lug 3-5-2 is provided above the connecting block 3-5-1. The lifting lug 3-5-2 is connected to the horizontal support 31 by a screw 3-5-3, and the lifting lug 3-5-2 is connected to the upper cover mechanism 2 by bolts, so as to better connect the barrel heating system 3 and the upper cover mechanism 2 together.

[0034] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0035] Therefore, the above description is only a preferred embodiment of this application and is not intended to limit the scope of this application; that is, all equivalent modifications made in accordance with the scope of the claims of this application shall be within the protection scope of the claims of this application.

Claims

1. A pretreatment apparatus for high-temperature degassing of wafers, characterized in that, include: A vacuum chamber with a top cover mechanism, the vacuum chamber having a water-cooled jacket; A barrel-shaped heating system, located within a vacuum chamber and connected to the upper cover mechanism; and The sample holder is suspended in the vacuum chamber by a displacement stage. The displacement stage can raise and lower the sample holder in the vertical direction and drive the sample holder to rotate. The sample holder can be fully inserted into the barrel-shaped heating system.

2. The pretreatment apparatus for high-temperature degassing of wafers according to claim 1, characterized in that, The vacuum chamber is connected to the upper cover mechanism via a flange, copper ring, and nut.

3. The pretreatment apparatus for high-temperature degassing of wafers according to claim 1, characterized in that, Both the vacuum chamber and the upper cover mechanism are equipped with several vacuum flange interfaces.

4. The pretreatment apparatus for high-temperature degassing of wafers according to claim 1, characterized in that, The sample holder has a limiting groove on its end face near the upper cover mechanism. The end of the displacement stage is provided with a hook that matches the limiting groove. When the hook enters the limiting groove, the displacement stage can drive the sample holder to rise, fall and rotate.

5. The pretreatment apparatus for high-temperature degassing of wafers according to claim 1, characterized in that, The barrel-shaped heating system includes a fixing ring and several barrel-shaped heating plates located inside the fixing ring. A heat insulation cylinder is provided on the outside of the fixing ring. The heat insulation cylinder is provided with conductive rods that correspond one-to-one with the number of barrel-shaped heating plates. The ends of the conductive rods pass through the heat insulation cylinder, the fixing ring, and the barrel-shaped heating plates in sequence and are connected. A connecting structure connected to the fixing ring is installed on the heat insulation cylinder, and the connecting structure is connected to the upper cover mechanism.

6. The pretreatment apparatus for high-temperature degassing of wafers according to claim 5, characterized in that, The outer side of the heat insulation cylinder is provided with several horizontal supports, and the connecting structure is located above the horizontal supports.

7. The pretreatment apparatus for high-temperature degassing of wafers according to claim 6, characterized in that, The connection structure includes a connecting block disposed on a horizontal support. The connecting block is connected to the fixing ring by bolts, and a lifting lug is provided above the connecting block. The lifting lug is connected to the horizontal support by a screw, and the lifting lug is connected to the upper cover mechanism by bolts.

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