Silicon wafer conveying mechanism and sintering apparatus
By adopting detachable connecting carrier components and transmission structures, the problems of long maintenance time and high cost caused by deformation of the silicon wafer sintering furnace belt have been solved, achieving efficient maintenance and low-energy silicon wafer transportation, thereby improving production efficiency and equipment lifespan.
CN224552067UActive Publication Date: 2026-07-24TONGWEI SOLAR ENERGY (MEISHAN) CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (MEISHAN) CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-07-24
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Figure CN224552067U_ABST
Abstract
The application discloses a silicon wafer conveying mechanism and a sintering device. The silicon wafer conveying mechanism comprises a plurality of bearing members and two conveying structures. The bearing members are arranged at intervals along a conveying direction. The bearing members are provided with a plurality of support portions arranged at intervals along a first direction. The support portions are used for supporting silicon wafers. The two conveying structures are arranged at two ends of the bearing members along the first direction. Each bearing member is detachably connected with the two conveying structures. The conveying structures are used for driving the bearing members to convey the silicon wafers along the conveying direction. The first direction intersects with the conveying direction. The bearing members are arranged at intervals, so that the heat receiving area of the conveying mechanism in the sintering furnace is reduced, and the energy consumption required in the sintering process of the silicon wafers is reduced.
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